CN216698361U - Display module and display screen - Google Patents
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- CN216698361U CN216698361U CN202122699980.7U CN202122699980U CN216698361U CN 216698361 U CN216698361 U CN 216698361U CN 202122699980 U CN202122699980 U CN 202122699980U CN 216698361 U CN216698361 U CN 216698361U
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Abstract
The utility model provides a display module and a display screen, wherein the display module comprises a plurality of pixel units arranged on the front surface of a display back plate, each pixel unit comprises a plurality of light-emitting chips, a black layer covered on the front surface of the display back plate, the black layer covers a first area between the pixel units on the front surface of the display back plate and a second area between the light-emitting chips in the pixel units, the light-emitting surfaces of the light-emitting chips are exposed out of the black layer, and a light-transmitting packaging layer is arranged on the front surface of the display back plate and covers the black layer and the pixel units.
Description
Technical Field
The utility model relates to the field of display, in particular to a display module and a display screen.
Background
With the development of small-pitch technology of COB (Chip On Board) packaging, COB display packaging products gradually become hot spots, and the most important reason is that compared with the currently mainstream small-pitch surface-mounted technology, the COB integrated packaging can achieve smaller dot pitch, and can bring more excellent display effect. The technical advantages of the COB display packaging product are mainly two points: the COB belongs to modular packaging, the surface of the whole product is completely protected by colloid packaging, the packaging interface is effectively reduced, and the reliability of the product is improved; secondly, the technology of COB integrated packaging has natural technical advantages in the field of smaller spacing.
However, for the current flip Chip On Board (COB) display packaging products, the industrial pain problems of poor contrast of the products and a black display effect after the products are installed into a screen, inconsistent ink color after the screen is turned off and the like are prominent. At present, the common practice of the industry is to add black components into the packaging glue to achieve the high contrast effect after packaging, but the problem of inconsistent ink colors among modules is often brought. The contrast and brightness of the whole screen of the COB display packaging product are low, and the display effect is poor.
Therefore, how to improve contrast, brightness and display effect is an urgent problem to be solved.
Disclosure of Invention
In view of above-mentioned correlation technique not enough, the utility model aims at providing a display module assembly and display screen, aim at solving contrast and luminance on the low side among the current COB encapsulation product, the not good problem of display effect.
A display module, comprising:
a display backplane;
the display back plate comprises a plurality of pixel units arranged on the front surface of the display back plate, wherein each pixel unit comprises a plurality of light-emitting chips;
the black layer covers a first area between the pixel units and a second area between the light-emitting chips in the pixel units on the front surface of the display back plate, and light-emitting surfaces of the light-emitting chips are exposed out of the black layer;
and the transparent packaging layer is arranged on the front surface of the display back plate and covers the black layer and the pixel units.
It should be noted that, the black layer in this application covers the whole area between the front surface of the display backplane and each pixel unit and each light emitting chip, and through the above structure, the contrast, brightness and display effect are improved, and the problems of low contrast and brightness and poor display effect in the existing COB package product are solved. Meanwhile, no black layer is arranged on the light emitting surface of the light emitting chip, so that normal light emitting of the light emitting surface of the light emitting chip is ensured, and the display effect of the light emitting chip is improved.
Optionally, the display module further includes a moisture barrier, and the moisture barrier includes at least one of the following:
the first moisture-proof layer is arranged between the black layer and the front surface of the display back plate;
and a second moisture-proof layer covering each of the light-emitting chips.
It should be noted that, through setting up the dampproof course respectively between the front of black layer and demonstration backplate to and cover on the luminescence chip surface, make during steam can't the light-emitting chip of invasion easily, solved current display module assembly because of the problem that wets and lead to inefficacy, promoted the quality and the competitiveness of product.
Optionally, the top surface of the black layer located in the first region is parallel to the front surface of the display backplane, or the top surface of the black layer is an inclined surface or a curved surface.
It should be noted that, by arranging the black layer parallel to the front surface of the display backplane or having an inclined or curved top surface between the pixel units, the contrast, brightness and display effect between the pixel units are improved.
Optionally, the top surface of the black layer located in the second region is parallel to the front surface of the display backplane, or the top surface of the black layer is an inclined surface or a curved surface.
It should be noted that, by arranging the black layer parallel to the front surface of the display backplane or having an inclined or curved top surface between the light emitting chips, the contrast, brightness and display effect between the light emitting chips are improved.
Optionally, the top surface of the black layer located in the first region is higher than the light-emitting surface of the light-emitting chip.
It should be noted that the top surface of the black layer between each pixel unit is higher than the light ejection surface of the light emitting chip, so that light channeling between each pixel unit is prevented, the display effect and the experience satisfaction of a user are improved, and the market competitiveness of a product is increased.
Optionally, the top surface of the black layer located in the second region is not higher than the light-emitting surface of the light-emitting chip.
It should be noted that the top surface height of the black layer between the light emitting chips is not higher than the light ejection surface of the light emitting chip, so that the light emitting chips are more uniform in light mixing, and the display effect of the light emitting chips is improved.
Based on the same inventive concept, the present application further provides a display screen, including:
the display module is provided.
Above-mentioned display screen is through setting up the black layer in display module assembly for between its pixel unit and the black colour between the luminescence chip unanimous, this black layer will cover except that other regions of going out the plain noodles, its contrast has been promoted, luminance and display effect, set up the dampproof course simultaneously between black layer and demonstration backplate openly and between the side of black layer and luminescence chip, the invasion of steam has been prevented, the inefficacy problem because of weing the result in has been solved, the quality and the competitiveness of the product have been promoted.
Drawings
Fig. 1 is a schematic cross-sectional structure view of a display module according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view illustrating a moisture barrier of a display module according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view illustrating a moisture barrier of another display module according to an embodiment of the present disclosure;
fig. 4 is a schematic cross-sectional view illustrating a moisture barrier of another display module according to an embodiment of the present disclosure;
fig. 5 is a schematic cross-sectional view illustrating a black layer structure of a display module according to an embodiment of the present disclosure;
fig. 6 is a schematic cross-sectional view illustrating a black layer structure of another display module according to an embodiment of the present disclosure;
fig. 7 is a schematic cross-sectional view illustrating a black layer structure of another display module according to an embodiment of the present disclosure;
fig. 8 is a schematic cross-sectional view illustrating a black layer structure of a display module according to another embodiment of the present disclosure;
fig. 9 is a schematic top view structure diagram of a display screen according to a second embodiment of the present application.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
COB product has contrast and luminance among the prior art and is on the low side, and black color is inconsistent after putting out the screen, and the not good problem of display effect.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The first embodiment is as follows:
in order to solve the problems of low contrast and brightness and poor display effect in the conventional COB package product, the embodiment provides a display module, for example, as shown in fig. 1, a schematic cross-sectional structure of the display module is shown. The display module of the embodiment comprises a display back plate 1 and a plurality of pixel units 2 arranged on the front surface of the display back plate 1, wherein each pixel unit 2 comprises a plurality of light-emitting chips 3; the black layer 4 covers the front surface of the display back panel 1, the black layer 4 covers a first area 5 between the pixel units 2 and a second area 6 between the light emitting chips 3 in the pixel units 2 on the front surface of the display back panel 1, and the light emitting surfaces of the light emitting chips 3 are exposed out of the black layer 4; and a light-transmitting encapsulating layer 7 provided on the front surface of the display back sheet 1 to cover the black layer 4 and each pixel unit 2. It should be noted that, as shown in fig. 1, an electronic component 8 is disposed on the back surface of the display backplane to drive the light emitting chip 3 to emit light. It is understood that, in practical applications, the light emitting chip may be disposed on the front surface of the display backplane by soldering or mounting, and the specific disposition of the light emitting chip is not limited in the present disclosure as long as the light emitting chip can be correctly disposed on the front surface of the display backplane. The light-transmitting encapsulation layer can be formed on the substrate by means of injection molding, dispensing, molding and the like, so that the light-transmitting encapsulation layer is tightly combined with the black layer and the pixel unit. In some examples, the light-transmitting encapsulation layer may cover only all the pixel units on the front surface of the display backplane, and may also cover all the front surface of the display backplane while covering the pixel units on the front surface of the display backplane.
In some embodiments, the display module further comprises a moisture barrier 9, the moisture barrier 9 comprising at least one of: a first moisture barrier 901 disposed between the black layer 4 and the front surface of the display backplane 1; and a second moisture-proof layer 902 covering each light-emitting chip 3. For example, as shown in fig. 2, a schematic cross-sectional structure of a moisture-proof layer of a display module is shown, it should be noted that fig. 2 is a schematic cross-sectional structure of a moisture-proof layer 901 disposed between a black layer 4 and a front surface of a display backplane 1, as shown in fig. 3, another schematic cross-sectional structure of a moisture-proof layer of a display module is shown, as shown in fig. 3, a second moisture-proof layer 902 of fig. 3 covers each light-emitting chip 3, the moisture-proof layer 9 may include, but is not limited to, being formed by molding and hot pressing, and of course, the arrangement of the moisture-proof layer 9 may also include being disposed between the black layer and the front surface of the display backplane and covering each light-emitting chip, as shown in fig. 4, for example, a schematic cross-sectional structure of a moisture-proof layer of another display module is shown, as shown in fig. 4, the moisture-proof layer 9 is disposed between the black layer and the front surface of the display backplane 1 and covering each light-emitting chip 3, the side surface of the light-emitting chip 3 is located between a top light-emitting surface 10 and a bottom surface 11 thereof, it should be noted that the light-emitting chip 3 has two light-emitting surfaces 10 and a bottom surface 11, which are oppositely disposed, and the bottom surface 11 is disposed on the front surface of the display back plate 1.
It should be noted that, as shown in fig. 4, the moisture-proof layer 9 includes a first moisture-proof layer 901 and a second moisture-proof layer 902, the first moisture-proof layer 901 and the second moisture-proof layer 902 may include, but are not limited to, an integral molding, and may also be a non-integral molding, and it should be noted that, when the first moisture-proof layer 901 and the second moisture-proof layer 902 are non-integral molding, when the first moisture-proof layer 901 and the second moisture-proof layer 902 are provided, the junction between the two should be tightly connected to prevent moisture from entering. It should be noted that the moisture-proof layer 9 may include, but is not limited to, a polymer nano-layer, which can completely prevent intrusion of water molecules, and can also be well combined with the wafer, the PCB board and the packaging glue, so as to improve the mechanical strength thereof, and at the same time, it will not affect the display effect, thereby improving the use satisfaction of the user.
In some embodiments, for example as shown in fig. 2, the top surface 12 of the black layer 4 located in the first area 5 is parallel to both the front surface of the display backplane 1 and the top surface 13 of the black layer 4 located in the second area 6. It should be noted that, for example, as shown in fig. 5, a schematic cross-sectional view of a black layer structure of a display module is shown, a top surface 12 of a black layer 4 located in a first region 5 may also be an inclined surface or a curved surface, and a maximum height of the top surface 12 of the black layer 4 is smaller than a height of an out-light emitting surface 10 of a light emitting chip 3, so that a covered area of a side surface of the light emitting chip 3 is larger, thereby significantly reducing crosstalk between pixel units, as a matter of course, as shown in fig. 6, another schematic cross-sectional view of a black layer structure of a display module is shown, in which a height of the top surface 12 of the black layer 4 is larger than an out-light emitting surface 10 of the light emitting chip 3, so as to prevent crosstalk between pixel units and affect a display effect, and by setting a height of the black layer between pixel units to be higher than a height of the out-light emitting surface of the light emitting chip, so that each pixel unit does not affect other pixel units during light mixing, so that the display effect is better. It should be noted that the top surface 12 of the black layer 4 may also be a curved surface recessed toward the front surface of the display backplane 1, and the maximum height of the top surface 12 of the black layer is the same as the height of the light-emitting surface 10 of the light-emitting chip, for example, as shown in fig. 7, a schematic cross-sectional view of a black layer structure of another display module is shown.
In some embodiments, for example, as shown in fig. 8, a schematic cross-sectional view of a black layer structure of another display module is shown, the top surface 13 of the black layer 4 located in the second area 6 may also be a curved surface that is concave toward the front surface of the display backplane 1. It should be noted that, the top surface 13 of the black layer in the second area is not higher than the light-emitting surfaces 10 of the light-emitting chips, because the second area is located between the light-emitting chips in the pixel unit 2, if the top surface of the black layer in the second area is higher than the light-emitting surfaces of the light-emitting chips, the light-mixing effect of the light-emitting chips will be greatly affected, or even the light cannot be mixed, and in order to improve the light-mixing effect and the display effect thereof, the top surface of the black layer in the second area should not be higher than the light-emitting surfaces of the light-emitting chips.
It should be noted that, in this embodiment, the top surfaces of the black layer in the first area and the black layer in the second area may be both parallel to the front surface of the display backplane, or both curved surfaces or inclined surfaces that are recessed toward the front surface of the display backplane, or the top surfaces of the black layer in the first area may be parallel, the top surfaces of the black layer in the second area may be curved surfaces or inclined surfaces that are recessed toward the front surface of the display backplane, or the top surfaces of the black layer in the first area may be curved surfaces or inclined surfaces that are recessed toward the front surface of the display backplane, or the top surfaces of the black layer in the second area are parallel, or certainly, part of the top surfaces of the black layer in the first area and the top surfaces of the black layer in the second area may be parallel, and the other part of the black layer may be curved surfaces or inclined surfaces that are recessed toward the front surface of the display backplane, which those skilled in the art may set up according to actual situations and needs, and the application is not limited.
It should be noted that, in the present embodiment, but not limited to, the height of the top surface of the black layer in the first area is higher than the height of the light-emitting chip, and the height of the top surface of the black layer in the second area is lower than the height of the light-emitting chip, and the height of the top surface of the black layer in the first area is lower than the height of the light-emitting chip, and the height of the top surface of the black layer in the second area is lower than the height of the light-emitting chip, of course, the height of the top surface of the black layer in the first area is equal to the height of the light-emitting chip, and the height of the top surface of the black layer in the second area is equal to the height of the light-emitting chip, etc., and those skilled in the art can set the height of the top surfaces of the black layer in the first area and the top surface of the black layer in the second area according to actual situations and requirements, as long as the height of the top surface of the black layer in the second region is not higher than the height of the light-emitting surface of the light-emitting chip, the application is not limited. Preferably, in this embodiment, the top surface of the black layer in the first region is higher than the top light-emitting surface of the light-emitting chip, so as to prevent light crosstalk between the pixel units. It should be noted that the top surface of the black layer is higher than the top light-emitting surface of the light-emitting chip, that is, at least a portion of the top surface of the black layer is higher than the top light-emitting surface of the light-emitting chip, and the top surface of the black layer is not higher than the top light-emitting surface of the light-emitting chip, that is, any portion of the top surface of the black layer is not higher than the top light-emitting surface of the light-emitting chip, but may include at least a portion thereof being flush with the top light-emitting surface of the light-emitting chip. It should be noted that the black layer in the first region and the second region is parallel to the front surface of the display backplane or is recessed toward the front surface of the display backplane, and there are various combinations of the heights of the black layer in the first region and the second region, and those skilled in the art can set the heights according to actual situations and requirements, and the application is not limited.
In some embodiments, it should be noted that one pixel unit supports emission of red light, green light, and blue light, so in this example, at least a portion of the plurality of light emitting chips may emit red light, at least a portion of green light, and a portion of blue light. In the present example, the light emitting chips include a blue LED chip, a red LED chip, and a green LED chip. For example, the blue LED chip and the green LED chip may be gallium nitride-based LED chips, and the red LED chip may be gallium arsenide-based LED chips. In some other examples, all the light emitting chips in the pixel unit may also be blue LED chips, and in order to allow a part of the LED chips to emit green light and red light, a corresponding light conversion layer may be disposed on the light emitting surface of the light emitting chips, where the light conversion layer may include, but is not limited to, a phosphor layer, a quantum thin film layer, and the like. It should be understood that the above describes only the case where one pixel unit supports emission of three colors of red, green, and blue, but in some examples, the light emitting chip at one and the same pixel unit may emit at least one of cyan, white, and yellow light in addition to the three colors of red, green, and blue. Therefore, in some examples of the present embodiment, three light emitting chips are included in one pixel unit, and in other examples, a greater number of light emitting chips may be included in one pixel unit.
In some embodiments, the black layer 4 is a molded black glue layer molded on the front surface of the display backplane or a hot pressed black glue layer hot pressed on the front surface of the display backplane. In some examples, if the black layer 4 is a molded black adhesive layer molded on the front surface of the display backplane, the display backplane made of PCB material is selected first, the light emitting chips are fixed on the front surface of the PCB substrate after cleaning and moisture removal, electronic components are attached to the back surface of the PCB, aging verification is performed for a period of time to ensure that all the light emitting chips can be normally lighted, then the molded black adhesive layer is molded to cover the surfaces of the light emitting chips and baked for curing, the surface black adhesive is etched by chemical etching and physical etching until the surfaces of the chips are completely exposed, and finally a light-transmitting packaging layer is further molded on the molded black adhesive layer and the surfaces of the light emitting chips to improve the reliability of the product and achieve the effect of light mixing. In some examples, if the black layer 4 is a hot-pressed black adhesive layer hot-pressed on the front surface of the display backplane, first, selecting a display backplane made of a PCB material, cleaning and removing moisture, fixing the light-emitting chips on the front surface of the PCB substrate, attaching electronic components on the back surface of the PCB, performing aging verification for a period of time to ensure that all the light-emitting chips can be normally lighted, then hot-pressing a pre-manufactured hot-pressed black adhesive film to the surfaces of the display backplane and the light-emitting chips, baking and curing, forming a shape concave towards the front surface of the display backplane with the peripheries of the light-emitting chips after the hot-pressed black adhesive film is hot-pressed, etching the hot-pressed black adhesive film on the surface of the light-emitting chips by means including but not limited to chemical etching and physical etching until the surfaces of the light-emitting chips are completely exposed, ensuring that the light-emitting surfaces of the light-emitting chips are normally emitted, and finally, further molding a light-transmitting packaging layer on the surfaces of the hot-pressed black adhesive film and the light-emitting chips, to improve the reliability of the product and achieve the effect of mixing light
The display module provided by this embodiment includes a plurality of pixel units disposed on the front surface of a display backplane, each pixel unit includes a plurality of light emitting chips, a black layer covering the front surface of the display backplane, the black layer covers a first region between the pixel units on the front surface of the display backplane and a second region between the light emitting chips in the pixel units, and light emitting surfaces of the light emitting chips are exposed out of the black layer, a light-transmitting encapsulation layer is disposed on the front surface of the display backplane and covers the black layer and the pixel units, in this embodiment, black layers with different heights and different shapes are disposed between the pixel units on the front surface of the display backplane and between the light emitting chips in the pixel units to increase contrast and brightness thereof and improve display effect thereof, and meanwhile, moisture-proof layers are disposed on the front surfaces of the black layer and the display backplane and on the surfaces of the light emitting chips, the problem of inefficacy that the black and white uniformity of having solved display module assembly is poor, contrast is poor, the moisture causes is solved in order to prevent the invasion of steam, has promoted contrast and display effect, has improved user's use satisfaction greatly.
Example two
The present embodiment provides a display screen, for example, as shown in fig. 9, a schematic top view structure diagram of the display screen is provided. In order to express the structure of the display screen more clearly, the transparent packaging layer is processed transparently in the figure.
In some embodiments, the display screen 13 includes at least one display module described above, for example, as shown in fig. 9, the display screen is formed by splicing 3 display modules, and two adjacent display modules are fixed by a fixing bracket, a screw, and glue, it should be noted that the display screen may be set as a plane or a curved surface, and a specific setting manner may be set by a person skilled in the art according to actual situations and needs, which is not limited in this application.
The display screen of this embodiment, through set up the black layer of co-altitude between the pixel unit in the display module assembly and between the luminescence chip and set up the dampproof course between black layer and display back plate front and black layer and luminescence chip side, make display screen 13's contrast and luminance promote greatly, the invasion of steam has been prevented simultaneously, the inconsistent problem of black color when having solved the display screen and turning off the screen, make its luminance increase, the consumption reduction, the inefficacy problem because of the steam invasion leads to has been solved simultaneously, the quality and the user experience satisfaction of product have been promoted.
The display module and the display screen provided in the foregoing embodiments can be applied to various light-emitting and display fields, for example, the display module can be manufactured to be applied to a display field (which can be a display module of a terminal such as a television, a display, a mobile phone, and the like). The display backlight module can also be applied to the display backlight module. The display backlight module can be applied to the fields of display backlight, key backlight, shooting, household lighting, medical lighting, decoration, automobiles, traffic and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured. The above applications are only a few applications exemplified by the present embodiment, and it should be understood that the application of the light emitting device in the present embodiment is not limited to the above exemplified fields.
It should be noted that the number, shape and size relationships of the elements in the drawings do not represent the actual condition of the elements, but are merely schematic diagrams for ease of understanding. While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (10)
1. A display module, comprising:
a display backplane;
the display back plate comprises a plurality of pixel units arranged on the front surface of the display back plate, wherein each pixel unit comprises a plurality of light-emitting chips;
the black layer covers a first area between the pixel units and a second area between the light-emitting chips in the pixel units on the front surface of the display backboard, and the light-emitting surfaces of the light-emitting chips are exposed out of the black layer;
and the transparent packaging layer is arranged on the front surface of the display back plate and covers the black layer and the pixel units.
2. The display module of claim 1, wherein the display module further comprises a moisture barrier comprising at least one of:
the first moisture-proof layer is arranged between the black layer and the front surface of the display back plate;
and a second moisture-proof layer covering each of the light-emitting chips.
3. The display module of claim 2, wherein the moisture barrier is a polymer nanolayer.
4. The display module according to any one of claims 1 to 3, wherein the top surface of the black layer in the first region is parallel to the front surface of the display backplane, or the top surface of the black layer is an inclined surface or a curved surface.
5. The display module according to any one of claims 1 to 3, wherein the top surface of the black layer in the second region is parallel to the front surface of the display backplane, or the top surface of the black layer is an inclined surface or a curved surface.
6. The display module according to any one of claims 1-3, wherein a top surface of the black layer in the first region is higher than a top light-emitting surface of the light-emitting chip.
7. The display module according to any one of claims 1 to 3, wherein a top surface of the black layer located in the second region is not higher than a top light-emitting surface of the light-emitting chip.
8. The display module according to any one of claims 1-3, wherein the plurality of light emitting chips included in each pixel unit comprises: the LED chip comprises a red LED chip, a green LED chip and a blue LED chip.
9. The display module of any one of claims 1-3 wherein the black layer is a layer of embossed black glue embossed on the front surface of the display backplane or a layer of hot-pressed black glue embossed on the front surface of the display backplane.
10. A display screen comprising a display module according to any one of claims 1 to 9.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122699980.7U CN216698361U (en) | 2021-11-05 | 2021-11-05 | Display module and display screen |
| DE212022000297.0U DE212022000297U1 (en) | 2021-09-30 | 2022-09-30 | Display module and optical LED device |
| PCT/CN2022/123579 WO2023051823A1 (en) | 2021-09-30 | 2022-09-30 | Display module and manufacturing method therefor |
| JP2024001817U JP3248216U (en) | 2021-09-30 | 2024-06-04 | Display Module |
| JP2024002172U JP3248220U (en) | 2021-09-30 | 2024-07-01 | Display module and LED light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122699980.7U CN216698361U (en) | 2021-11-05 | 2021-11-05 | Display module and display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216698361U true CN216698361U (en) | 2022-06-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122699980.7U Active CN216698361U (en) | 2021-09-30 | 2021-11-05 | Display module and display screen |
Country Status (1)
| Country | Link |
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| CN (1) | CN216698361U (en) |
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2021
- 2021-11-05 CN CN202122699980.7U patent/CN216698361U/en active Active
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