CN211979371U

CN211979371U - Backlight source structure and display device

Info

Publication number: CN211979371U
Application number: CN202020234915.XU
Authority: CN
Inventors: 黎明权; 孙平如; 许文钦; 金中华; 高四清
Original assignee: Shenzhen Jufei Optoelectronics Co Ltd
Current assignee: Shenzhen Jufei Optoelectronics Co Ltd
Priority date: 2019-12-25
Filing date: 2020-02-28
Publication date: 2020-11-20
Anticipated expiration: 2030-02-28

Abstract

The utility model provides a backlight source structure and a display device, which comprises a plurality of LED luminous chips, a plurality of LED control chips and a PCB board; the LED control chip and the LED light-emitting chip are attached to the same surface of the PCB; and the LED control chip and the LED light emitting chip are packaged. The utility model discloses a backlight structure pastes the dress with LED control chip at the same face that LED sent out light chip, can reduce backlight structure's thickness, and LED control chip and LED send out light chip are protected by the encapsulation simultaneously, and stable in structure is reliable.

Description

Backlight source structure and display device

Technical Field

The utility model relates to a LED field of being shaded especially relates to a light source structure and display device are shaded.

Background

As a backlight source of a liquid crystal display screen, an LED backlight is widely used today. In the LED backlight light source structure, the LED chip is controlled by the control chip. As shown in fig. 1, in the related art, a direct-type LED backlight is generally formed by arranging an LED bead array on one surface of a circuit board, and arranging an LED control chip on the other surface; or the LED lamp bead plate is connected with the control panel through a flat cable. With the increasing demand of people for display devices, it is difficult to manufacture thinner and lighter display devices with the backlight light source structure in the related art.

SUMMERY OF THE UTILITY MODEL

The utility model provides a backlight source structure and display device, the main technical problem who solves is: the backlight source structure in the related art occupies a large thickness.

In order to solve the above technical problem, the utility model provides a backlight source structure, include: the LED light-emitting device comprises a plurality of LED light-emitting chips, a plurality of LED control chips and a PCB;

the LED control chip and the LED light-emitting chip are attached to the same surface of the PCB;

the LED control chip and the LED light emitting chip are packaged.

Optionally, the LED light emitting chip is an unpackaged bare chip LED, and/or the LED control chip is an unpackaged bare chip control chip;

the backlight source structure is provided with a protective adhesive, and the LED control chip and the LED light-emitting chip are integrally packaged by the protective adhesive.

Optionally, the thickness of the protective adhesive is greater than the heights of the LED control chip and the LED light emitting chip.

Optionally, the surface of the protective adhesive is roughened.

Optionally, a quantum dot film is arranged on the glue surface of the protective glue.

Optionally, the LED light emitting chip on the PCB is divided into a plurality of LED partitions;

each LED control chip is connected with at least one LED light-emitting chip in one LED partition and controls the LED partition.

Optionally, the LED partition includes at least two LED light emitting chips.

Optionally, two adjacent rows and/or two adjacent columns of LED light emitting chips are arranged in a staggered manner.

Optionally, in the LED subareas, subarea regions of two adjacent rows and/or two adjacent columns are arranged in a staggered manner.

Further, the utility model also provides a display device, display device includes as above light source structure is shaded.

Advantageous effects

The utility model provides a backlight source structure and a display device, which comprises a plurality of LED luminous chips, a plurality of LED control chips and a PCB board, wherein the LED control chips and the LED luminous chips are directly attached to the same surface of the PCB board, and the LED control chips and the LED luminous chips are packaged; the utility model discloses an among the light source structure in a poor light, LED control chip pastes the dress and is in the same side at LED luminescence chip, and LED control chip and LED luminescence chip are protected by the encapsulation, make the utility model discloses a light source structure in a poor light thickness is low, and is more frivolous.

Drawings

FIG. 1 is a schematic cross-sectional view of a backlight source structure provided in the prior art;

fig. 2 is a schematic structural diagram of a backlight source structure according to a first embodiment of the present invention;

fig. 3 is a schematic layout view of an LED light emitting chip of a backlight source structure according to a first embodiment of the present invention;

fig. 4 is a schematic circuit diagram of a backlight source structure according to a first embodiment of the present invention;

fig. 5 is a schematic diagram of a serial-connection partitioning circuit of a backlight source structure according to a first embodiment of the present invention;

fig. 6 is a schematic diagram of a parallel partition circuit of a backlight source structure according to a first embodiment of the present invention;

fig. 7 is a schematic diagram of a hybrid circuit partition of a backlight source structure according to a first embodiment of the present invention;

fig. 8 is a schematic view of a sectional layout of a backlight source structure according to a first embodiment of the present invention;

fig. 9 is a schematic view of another partition layout of a backlight source structure according to a first embodiment of the present invention;

fig. 10 is a partial schematic view of a backlight source structure according to a second embodiment of the present invention.

Detailed Description

In order that the contents of the present invention may be more readily understood, the present invention will now be described in further detail with reference to the following detailed description taken in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

in order to solve the problem that the backlight light source structure separately sets the LED light emitting chip and the LED control chip, and the thickness is difficult to reduce, as shown in fig. 2, this embodiment provides a backlight light source structure, and the LED control chip 1 and the LED light emitting chip 2 are directly attached to the same surface of the PCB board 3. In the related art, the LED control chip 1 is usually mounted on the other side of the PCB3 where the LED light emitting chip 2 is disposed, and the thickness is not easily controlled; under the condition that the LED subareas 4 are more, the circuits are complex and the number of the LED control chips 1 is small, the requirement cannot be met by using a single panel, and the double-sided PCB3 is adopted mostly. Preferably, the PCB3 in this embodiment may be a single-sided PCB3, where the conditions allow it. In the backlight light source structure provided by this embodiment, the LED control chip 1 and the LED light emitting chip 2 are disposed on the same plane, so that the overall thickness of the structure is reduced. And in some implementation processes, only one side of the PCB is needed for mounting elements and wiring, the single-side PCB3 is adopted, so that the cost can be saved, and the single-side PCB3 is thinner and thinner. Wherein, LED control chip 1 and LED luminescence chip 2 are all packaged.

It should be noted that the LED control chip 1 and the LED light emitting chip 2 in the present embodiment may be packaged in various forms. For example, a packaged LED control chip 1 and a packaged LED chip in a forward or flip-chip structure may be used as the LED light emitting chip 2. An unpackaged bare chip control chip can be used as the LED control chip 1, an unpackaged bare chip LED can be used as the LED light-emitting chip 2, or both the LED control chip 1 and the LED light-emitting chip 2 use corresponding unpackaged bare chips. As shown in fig. 2, when an unpackaged bare chip is used as at least one of the LED control chip 1 and the LED light-emitting chip 2, the LED control chip 1 and the LED light-emitting chip 2 are entirely packaged by the protective adhesive 5. It should be noted that, when the LED control chip 1 and the LED light emitting chip 2 are both packaged chips, the protection adhesive may be covered to perform the packaging of the whole structure again.

When an unpackaged bare chip control chip is used as the LED control chip 1 and/or an unpackaged bare chip LED is used as the LED light emitting chip 2, the unpackaged bare chip LED may be attached to the PCB board 3 by solder paste soldering or silver paste insulating adhesive.

Under the condition that the packaged LED light-emitting chip 2 and the packaged LED control chip 1 which are in a normal mounting structure also adopt packaged chips, the LED light-emitting chip and the packaged LED control chip can be mounted on the PCB3 through a routing process. When the routing process is adopted, the protective adhesive can be covered in a spraying mode. And the LED light-emitting chip 2 with the inverted structure is fixedly attached to the PCB3 through solder paste welding or silver adhesive insulating glue. The protective glue can be covered by means of mould pressing or spraying.

In this embodiment, the thickness of the protective adhesive 5 is greater than the heights of the LED control chip 1 and the LED light emitting chip 2, that is, the protective adhesive completely wraps the LED control chip 1 and the LED light emitting chip 2 on the PCB3, so that the protective effect is better. The surface of the protective glue 5 is roughened, and the uneven glue surface enables light emitted by the LED light-emitting chip 2 to be diffusely reflected, so that the light is more uniform, and the light-emitting effect is better.

The protective adhesive 5 may be transparent adhesive or fluorescent adhesive. Optionally, a quantum dot film is added on the glue surface of the protective glue 5 to provide a better backlight effect.

In this embodiment, the LED control chip 1 may use a packaged LED control chip, or may use an unpackaged bare chip control chip; meanwhile, the LED light emitting chip 2 may use a packaged LED chip of a forward or flip structure, or may use an unpackaged bare LED. It will be appreciated that for the same chip, the thickness tends to be lower in the unpackaged state, which is advantageous for achieving a thinner backlight source structure. Optionally, the plurality of LED light emitting chips 2 on the PCB3 board are divided into a plurality of LED partitions 4, and the LED control chip 1 is connected to at least one LED light emitting chip 2 in the LED partitions 4 and controls the LED partitions 4, thereby implementing partition control.

In this embodiment, the LED light emitting chip 2 mounted on the PCB3 is divided into a plurality of LED partitions 4, and the LED control chip 1 is connected to at least one LED light emitting chip 2 in the LED partitions 4 so as to control the LED partitions 4. The LED control chip 1 is directly connected to at least one LED light emitting chip 2 in the corresponding LED partition 4, and can control all the LED light emitting chips 2 in the LED partition 4, that is, the light emitting control of the LED light emitting chips 2 in one LED partition 4 is uniform.

It should be noted that the LED partition 4 may include 1 LED light emitting chip 2, or may include a plurality of LED light emitting chips 2. The LED subareas 4 may be flexibly configured, for example, the LED light emitting chips 2 may be uniformly arranged in a matrix arrangement, and the LED light emitting chips 2 in the same row may be divided into one LED subarea 4 in a manner of being adjacent to each other. In this embodiment, the LED light emitting chips 2 in two adjacent rows and/or two adjacent columns may be arranged in a staggered manner, as shown in fig. 3, in some cases, the light distribution of the LED light emitting chips 2 arranged in a staggered manner is more uniform, and the dark area between the LED light emitting chips 2 can be reduced. It will be appreciated that when only one LED light emitting chip 2 is included in the LED sub-section 4, the staggered arrangement of the LED light emitting chips 2 allows the LED sub-section 4 to also be staggered.

Preferably, the LED control chip 1 is disposed on the PCB3 at a position close to the LED sub-area 4 controlled by the LED control chip. It can be understood that, various manners of reasonably dividing the LED sub-areas 4 are possible, such as dividing the adjacent LED light emitting chips 2 in the same column into the same LED sub-area 4, or one LED sub-area 4 is formed by N × N LED light emitting chips 2 in a small rectangular area. The number of the LED light emitting chips 2 in each LED partition 4 and the area occupied by each LED partition 4 can be flexibly set as required. In some implementations, all of the LED light emitting chips 2 in the same LED partition 4 may not be adjacent, or all of the LED light emitting chips may not be adjacent. In addition, the arrangement of the light emitting LEDs on the PCB3 may also be flexibly set, may be uniformly distributed, or may be non-uniform.

As shown in fig. 4, fig. 4 is a circuit schematic diagram illustrating a backlight light source structure provided in this embodiment. Using a plurality of LED control chips 1, one LED control chip 1 controls one LED partition 4 (the specific circuitry of the LED partition 4 is not shown in fig. 4). Compared with the mode of controlling a plurality of partitions by adopting one packaged chip in the related art, the mode of controlling a plurality of LED control chips is adopted in the embodiment, the structure of the embodiment disperses the circuit layout and reduces the routing density. Preferably, the LED control chip 1 can be attached near the LED subarea 4 controlled by the LED control chip, and the circuit layout is simple and is beneficial to production and maintenance. The LED control chip 1 can also be mounted at a more remote location, if desired, using more remote wiring.

Optionally, the LED partition 4 may include at least two LED light emitting chips 2, and the LED light emitting chips 2 in the same LED partition 4 may be connected in series, taking two LED light emitting chips 2 as an example, fig. 5 shows a schematic circuit diagram in which two LED light emitting chips 2 are connected in series to form a partition and are controlled by one LED control chip 1; the LED light-emitting chips 2 are attached to the PCB3, the two adjacent LED light-emitting chips 2 are connected in series, one LED light-emitting chip 2 is connected with the LED control chip 1, and the LED control chip 1 can control the LED light-emitting chips 2 by providing high level or low level for the LED light-emitting chips 2. In the specific implementation process, the LED control chip 1 can also control the brightness emitted by the LED light emitting chip 2 by adjusting the duty ratio of the high and low levels. Optionally, the LED light emitting chips 2 may also be connected in parallel to form one LED partition 4, and fig. 6 shows a schematic circuit diagram of a circuit in which two LED light emitting chips 2 are connected in parallel to form one partition and are controlled by one LED control chip 1. Alternatively, when more than three LED light emitting chips 2 form one LED partition 4, a serial-parallel connection is also a feasible way, and fig. 7 shows a schematic circuit diagram of a circuit in which three LED light emitting chips 2 are connected in series-parallel to form one LED partition 4 and are controlled by one LED control chip 1. In this embodiment, the LED sub-areas 4 may be formed in various ways, but each LED sub-area 4 is connected to and controlled by only one LED control chip 1.

When the LED sub-areas 4 include at least two LED light emitting chips 2, the LED sub-areas 4 in two adjacent rows and/or two adjacent columns can also be arranged in a staggered manner, fig. 8 shows a schematic view of a sub-area layout of the backlight light source structure provided in this embodiment, the LED sub-areas 4 in two adjacent rows are arranged in a staggered manner (the LED sub-areas 4 at the edge portions may be incomplete), that is, the LED light emitting chips 2 at the edges of the left and right sides of one LED sub-area 4 and the LED light emitting chips 2 at the edges of the left and right sides of the LED sub-area 4 in the adjacent row are. In some embodiments, the LED sub-regions 4 between adjacent rows and columns may be arranged in a staggered layout, as shown in fig. 9, two adjacent rows of LED light emitting chips 2 may also be arranged in a staggered manner (the LED sub-regions 4 at the edge portion may be incomplete), the LED sub-regions 4 are divided in a honeycomb-like manner, and each LED sub-region 4 at the non-edge portion is adjacent to the other six LED sub-regions 4. It should also be noted that in some embodiments, the LED light emitting chips 2 may be arranged in a staggered manner, and the LED partitions 4 may also be arranged in a staggered manner, which can achieve the corresponding technical effects.

The embodiment provides a backlight source structure, including a plurality of LED control chip 1, a plurality of LED luminescence chip 2 and PCB board 3, LED control chip 1 and LED luminescence chip 2 paste dress on the same face of PCB board 3 to encapsulate LED control chip 1 and LED luminescence chip 2. The backlight source structure provided by the embodiment is simple, the LED control chip 1 and the LED light-emitting chip 2 are attached to the same surface of the PCB3, the overall thickness of the backlight source structure is reduced, and the formation of a thinner and lighter display device is facilitated.

Example two:

referring to fig. 10, fig. 10 is a partial schematic view of the backlight light source structure provided in this embodiment.

In the embodiment, the PCB3 adopts a single-sided PCB3, and the LED control chip 1 and the LED light-emitting chip 2 are attached to one side of the PCB3 where the elements are arranged. The LED control chip 1 is an unpackaged bare chip control chip, the LED light-emitting chip 2 is an unpackaged bare chip LED, and compared with a packaged chip, the bare chip has the advantages of being thinner and lower in cost. The LED control chip 1 and the LED light-emitting chip 2 are both welded on the surface of the PCB3 through solder paste. In the embodiment, the surface of the PCB3, on which the components are attached, is covered with the layer of the protective adhesive 5, so that the LED control chip 1 and the LED light emitting chip 2 are integrally packaged, and the PCB3 and the components thereon are integrally packaged under the action of the protective adhesive 5. The protective glue 5 can adopt fluorescent glue, the layer of protective glue 5 covers the PCB3 through the die pressing process, it should be noted that the protective glue 5 is a whole, and all cover the elements pasted on the PCB3, the surface of the protective glue 5 in the embodiment is roughened, and a more uniform light effect can be provided. In some embodiments, a quantum dot film is further added on the glue surface of the protective glue 5 to obtain better optical effect.

Referring to fig. 10, in the backlight source structure provided in this embodiment, the LED light emitting chips 2 arranged in a matrix are divided into a plurality of matrix LED partitions 4 including two rows and two columns of LED light emitting chips 2 (the LED partitions 4 at the edge portion may be incomplete). In one partition, two LED light emitting chips 2 in the same row are connected in series, and two LED light emitting chips 2 in series in two rows are connected in parallel. In one LED subarea 4, the area of the LED subarea 4 other than the edge portion is equal. The LED subareas 4 in this embodiment are arranged in a staggered manner, and the distance of half LED subarea 4 is staggered between the LED subarea 4 of each row and the LED subarea 4 of the adjacent row, so that the LED subareas 4 of the non-edge portion are adjacent to 6 other LED subareas 4, and the backlight mosaic phenomenon is more easily weakened when the light brightness of each subarea is adjusted by software. It will be appreciated that other possible LED partition 4 schemes are possible.

The LED control chip 1 is mounted at the lower right corner of the LED subarea 4 controlled by the LED control chip 1 and is connected with the LED subarea 4, namely the LED control chip 1 is directly connected with one or more LED light-emitting chips 2 in the LED subarea 4 and can control the LED light-emitting chips 2 in the whole LED subarea 4. The arrangement in the position close to the individually controlled LED zones 4 makes the wiring simpler and facilitates production and maintenance. It is understood that the LED control chip 1 may be disposed at other positions as long as the wiring can be implemented on the single-sided PCB 3.

The present embodiment further provides a display device, including the backlight source structure as described in the first embodiment or the second embodiment.

In the backlight light source structure provided by this embodiment, the LED control chip 1 and the LED light emitting chip 2 are attached to the same surface of the PCB board 3, and the LED control chip 1 and the LED light emitting chip 2 are encapsulated by the protective adhesive 5, so that the backlight light source structure with low thickness is realized, and the light and thin display device is facilitated to be realized.

It should be noted that the number, shape and size relationships of the elements in the drawings do not represent the actual condition of the elements, but are merely schematic diagrams for ease of understanding. While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

The backlight source structure provided in the foregoing embodiments can be applied to various light emitting fields, for example, it can be manufactured into a backlight module applied to a display backlight field (which can be a backlight module of a terminal such as a television, a display, a mobile phone, etc.). It can be applied to a backlight module at this time. The display backlight module can be applied to the fields of display backlight, key backlight, shooting, household lighting, medical lighting, decoration, automobiles, traffic and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured. The above applications are only a few applications exemplified by the present embodiment, and it should be understood that the application of the backlight light source structure in the present embodiment is not limited to the above exemplified fields.

Claims

1. A backlight source structure comprising: a plurality of LED control chip, a plurality of LED luminescence chip and PCB board, its characterized in that:

the LED control chip and the LED light emitting chip are packaged.

2. The backlight source structure of claim 1, wherein the LED light emitting chip is an unpackaged bare-die LED, and/or the LED control chip is an unpackaged bare-die control chip;

3. The backlight source structure of claim 2, wherein the thickness of the protective paste is greater than the heights of the LED control chip and the LED light emitting chip.

4. The backlight source structure of claim 3, wherein the surface of the protective paste is roughened.

5. The backlight source structure of claim 4, wherein the glue side of the protective glue has a quantum dot film thereon.

6. The backlight source structure of claim 1, wherein the LED light emitting chip on the PCB board is divided into a plurality of LED partitions;

7. The backlight source structure of claim 6, wherein the LED sub-section comprises at least two LED light emitting chips.

8. The backlight source structure of claim 6, wherein two adjacent rows and/or two adjacent columns of LED light emitting chips are arranged in a staggered manner.

9. The backlight source structure of claim 6, wherein the LED subareas are arranged in a staggered manner in the subarea areas of two adjacent rows and/or two adjacent columns.

10. A display device comprising a backlight source structure according to any one of claims 1 to 9.