CN216698289U - A paste dress equipment for semiconductor chip processing - Google Patents
A paste dress equipment for semiconductor chip processing Download PDFInfo
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- CN216698289U CN216698289U CN202121890711.2U CN202121890711U CN216698289U CN 216698289 U CN216698289 U CN 216698289U CN 202121890711 U CN202121890711 U CN 202121890711U CN 216698289 U CN216698289 U CN 216698289U
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- hydraulic rod
- fixed
- semiconductor chip
- suction nozzle
- chip processing
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Abstract
The utility model discloses mounting equipment for processing a semiconductor chip, which comprises a base, wherein a lifting hydraulic rod is arranged on the base, a workbench is arranged at the upper end of the lifting hydraulic rod, and a conveying mechanism, an adsorption mechanism, a chip table and a cleaning mechanism are arranged on the workbench; the conveying mechanism comprises a motor, a roller, a belt and baffles, the roller is arranged on an output shaft of the motor, the belt is arranged outside the roller, and the baffles are symmetrically arranged on the front side and the rear side of the belt; the adsorption mechanism comprises a support frame, a horizontal hydraulic rod, a vertical hydraulic rod, a first vacuum pump and a suction nozzle, wherein the horizontal hydraulic rod is arranged on the front side of the support frame. Has the advantages that: the cleaning mechanism is arranged, so that the suction nozzle can be cleaned, and the suction nozzle is prevented from being blocked to influence the next use; the height of the workbench can be adjusted by arranging the lifting hydraulic rod.
Description
Technical Field
The utility model relates to the field of semiconductors, in particular to mounting equipment for processing a semiconductor chip.
Background
A semiconductor chip: etching and wiring are performed on the semiconductor wafer to obtain a semiconductor device capable of realizing a certain function. Semiconductor materials such as gallium arsenide and germanium are also commonly included, not just silicon chips.
The chip production link has a process and is installed the dress, can use the subsides dress equipment in the dress link, and present dress equipment can't adjust the workstation height, and the suction nozzle can't obtain in time clearing up to influence next use.
SUMMERY OF THE UTILITY MODEL
The present invention provides a mounting apparatus for semiconductor chip processing, which can effectively solve the problems of the prior art proposed in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: a mounting device for processing a semiconductor chip comprises a base, wherein a lifting hydraulic rod is arranged on the base, a workbench is arranged at the upper end of the lifting hydraulic rod, and a conveying mechanism, an adsorption mechanism, a chip table and a cleaning mechanism are arranged on the workbench;
the conveying mechanism comprises a motor, a roller, a belt and baffles, the roller is arranged on an output shaft of the motor, the belt is arranged outside the roller, and the baffles are symmetrically arranged on the front side and the rear side of the belt;
the adsorption mechanism comprises a support frame, a horizontal hydraulic rod, a vertical hydraulic rod, a first vacuum pump and a suction nozzle, wherein the horizontal hydraulic rod is arranged on the front side of the support frame, the vertical hydraulic rod is arranged on the lower side of the horizontal hydraulic rod, the suction nozzle is arranged on the lower side of the vertical hydraulic rod, and the first vacuum pump is arranged on the suction nozzle;
clean mechanism includes fixing base, No. two vacuum pumps and outlet duct, the fixing base top is provided with No. two vacuum pumps with the outlet duct.
Preferably, a rectangular tidy is arranged on the base, and a partition board is arranged inside the rectangular tidy.
Preferably, an oval tidy is arranged on the base, and a partition plate is arranged inside the oval tidy.
Preferably, the base and the lifting hydraulic rod are fixed through bolts, the lifting hydraulic rod and the workbench are fixed through bolts, and the workbench and the chip platform are fixed through bolts.
Preferably, the output shaft of the motor and the roller are fixed through a coupler, the roller is in rolling connection with the belt, and the baffle is fixed with the workbench through a bolt.
Preferably, the support frame and the horizontal hydraulic rod are fixed through bolts, the horizontal hydraulic rod and the vertical hydraulic rod are fixed through a connecting block, the vertical hydraulic rod and the suction nozzle are fixed through a connecting block, and the suction nozzle and the first vacuum pump are fixed through bolts.
Preferably, the fixing seat and the second vacuum pump are fixed through bolts.
Preferably, the rectangular glove box and the partition plate are welded.
Preferably, the oval glove box and the partition plate are welded.
Compared with the prior art, the utility model has the beneficial effects that:
1. the cleaning mechanism is arranged, so that the suction nozzle can be cleaned, and the influence on the next use caused by the blockage of the suction nozzle is prevented.
2. The lifting hydraulic rod is arranged, so that the height of the workbench can be adjusted.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
fig. 1 is an isometric view of embodiment 1 of a mounting apparatus for semiconductor chip processing according to the present invention;
fig. 2 is an isometric view of embodiment 2 of a mounting apparatus for semiconductor chip processing according to the present invention;
fig. 3 is an isometric view of a transfer mechanism of a mounting apparatus for semiconductor chip processing according to the present invention;
fig. 4 is an isometric view of a suction mechanism of a mounting apparatus for semiconductor chip processing according to the present invention;
fig. 5 is an isometric view of a cleaning mechanism of a placement machine for semiconductor chip processing according to the present invention.
Reference numbers in the figures:
1. a base; 2. a rectangular glove compartment; 3. a partition plate; 4. an oval glove compartment; 5. lifting a hydraulic rod; 6. A work table; 7. a transport mechanism; 701. a motor; 702. a drum; 703. a belt; 704. a baffle plate; 8. an adsorption mechanism; 801. a support frame; 802. a horizontal hydraulic rod; 803. a vertical hydraulic rod; 804. a vacuum pump I; 805. a suction nozzle; 9. a chip stage; 10. a cleaning mechanism; 1001. a fixed seat; 1002. a second vacuum pump; 1003. and an air outlet pipe.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example 1
As shown in fig. 1, 3, 4, and 5, the present invention provides a technical solution, a mounting apparatus for semiconductor chip processing, including a base 1, a lifting hydraulic rod 5 disposed on the base 1, a worktable 6 disposed at an upper end of the lifting hydraulic rod 5, a conveying mechanism 7 disposed on the worktable 6, an adsorption mechanism 8, a chip stage 9, and a cleaning mechanism 10; the base 1 fixes the lifting hydraulic rod 5, the lifting hydraulic rod 5 adjusts the height of the workbench 6, the conveying mechanism 7 conveys a circuit board, the adsorption mechanism 8 adsorbs a chip, and the cleaning mechanism 10 cleans the suction nozzle 805.
The transmission mechanism 7 comprises a motor 701, a roller 702, a belt 703 and baffles 704, the roller 702 is arranged on an output shaft of the motor 701, the belt 703 is arranged outside the roller 702, and the baffles 704 are symmetrically arranged on the front side and the rear side of the belt 703; the motor 701 drives the roller 702 to rotate, the roller 702 drives the belt 703 to rotate, the belt 703 conveys the circuit board to a working area, and the baffle 704 prevents the circuit board from falling down.
The adsorption mechanism 8 comprises a support frame 801, a horizontal hydraulic rod 802, a vertical hydraulic rod 803, a first vacuum pump 804 and a suction nozzle 805, wherein the horizontal hydraulic rod 802 is arranged on the front side of the support frame 801, the vertical hydraulic rod 803 is arranged on the lower side of the horizontal hydraulic rod 802, the suction nozzle 805 is arranged on the lower side of the vertical hydraulic rod 803, and the first vacuum pump 804 is arranged on the suction nozzle 805; the supporting frame 801 supports the adsorption mechanism 8, the horizontal hydraulic rod 802 and the vertical hydraulic rod 803 are matched for use, the position of the suction nozzle 805 can be adjusted, and the first vacuum pump 804 and the suction nozzle 805 are matched for use, so that a chip can be adsorbed.
The cleaning mechanism 10 comprises a fixed seat 1001, a second vacuum pump 1002 and an air outlet pipe 1003, wherein the second vacuum pump 1002 and the air outlet pipe 1003 are arranged above the fixed seat 1001; the second vacuum pump 1002 is fixed to the fixing base 1001, and the second vacuum pump 1002 and the air outlet pipe 1003 are matched for use, so that the suction nozzle 805 can be cleaned.
A rectangular sundry box 2 is arranged on the base 1, and a partition plate 3 is arranged inside the rectangular sundry box 2; the rectangular sundries box 2 and the partition plate 3 are matched for use, and sundries can be placed in the rectangular sundries box.
Preferably, the base 1 and the lifting hydraulic rod 5 are fixed through bolts, the lifting hydraulic rod 5 and the workbench 6 are fixed through bolts, and the workbench 6 and the chip platform 9 are fixed through bolts; an output shaft of the motor 701 is fixed with the roller 702 through a coupling, the roller 702 is connected with the belt 703 in a rolling manner, and the baffle 704 is fixed with the workbench 6 through a bolt; the supporting frame 801 and the horizontal hydraulic rod 802 are fixed through bolts, the horizontal hydraulic rod 802 and the vertical hydraulic rod 803 are fixed through a connecting block, the vertical hydraulic rod 803 and the suction nozzle 805 are fixed through a connecting block, and the suction nozzle 805 and the first vacuum pump 804 are fixed through bolts; the fixing seat 1001 and the second vacuum pump 1002 are fixed through bolts; the rectangular glove box 2 and the partition plate 3 are welded.
Example 2
The main difference between example 2 and example 1 is that, as shown in fig. 2: an oval sundry box 4 is arranged on the base 1, and a partition plate 3 is arranged inside the oval sundry box 4; the elliptic sundry box 4 is welded with the clapboard 3; the oval sundry box 4 and the clapboard 3 are matched for use, so that sundries can be put in.
The working principle and the using process of the utility model are as follows:
sundries are placed in the rectangular sundries box 2 or the oval sundries box 4; the height of the workbench 6 can be adjusted by adjusting the height of the lifting hydraulic rod 5 until the height of the workbench is adapted to the height of a person; the circuit board is placed on a belt 703, a motor 701 drives the belt 703 to rotate through a roller 702, and the belt 703 conveys the circuit board to a working area; the horizontal hydraulic rod 802 of the adsorption mechanism 8 can adjust the front and back positions of the suction nozzle 805, the vertical hydraulic rod 803 can adjust the height of the suction nozzle 805, the support frame 801 can move in the chute to adjust the left and right positions of the suction nozzle 805, the adsorption mechanism 8 sucks the chip from the chip table 9 and then brings the chip to a working area, and at the moment, the vertical hydraulic rod 803 extends to mount the chip on a circuit board through the suction nozzle 805; after the work is finished, the second vacuum pump 1002 is started, the operator holds the air outlet pipe 1003 to face the suction nozzle 805, and cleans the suction nozzle 805 to prevent the suction nozzle 805 from being blocked.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A mounting equipment for semiconductor chip processing, comprising a base (1), characterized in that: a lifting hydraulic rod (5) is arranged on the base (1), a workbench (6) is arranged at the upper end of the lifting hydraulic rod (5), and a conveying mechanism (7), an adsorption mechanism (8), a chip platform (9) and a cleaning mechanism (10) are arranged on the workbench (6);
the conveying mechanism (7) comprises a motor (701), a roller (702), a belt (703) and baffles (704), the roller (702) is arranged on an output shaft of the motor (701), the belt (703) is arranged outside the roller (702), and the baffles (704) are symmetrically arranged on the front side and the rear side of the belt (703);
the adsorption mechanism (8) comprises a support frame (801), a horizontal hydraulic rod (802), a vertical hydraulic rod (803), a first vacuum pump (804) and a suction nozzle (805), the horizontal hydraulic rod (802) is arranged on the front side of the support frame (801), the vertical hydraulic rod (803) is arranged on the lower side of the horizontal hydraulic rod (802), the suction nozzle (805) is arranged on the lower side of the vertical hydraulic rod (803), and the first vacuum pump (804) is arranged on the suction nozzle (805);
the cleaning mechanism (10) comprises a fixed seat (1001), a second vacuum pump (1002) and an air outlet pipe (1003), wherein the second vacuum pump (1002) and the air outlet pipe (1003) are arranged above the fixed seat (1001).
2. The mounting apparatus for semiconductor chip processing according to claim 1, wherein: the base (1) is provided with a rectangular sundry box (2), and a partition plate (3) is arranged inside the rectangular sundry box (2).
3. The mounting apparatus for semiconductor chip processing according to claim 1, wherein: the base (1) is provided with an oval sundry box (4), and a partition plate (3) is arranged inside the oval sundry box (4).
4. The mounting apparatus for semiconductor chip processing according to claim 1, wherein: the base (1) and the lifting hydraulic rod (5) are fixed through bolts, the lifting hydraulic rod (5) and the workbench (6) are fixed through bolts, and the workbench (6) and the chip platform (9) are fixed through bolts.
5. The mounting apparatus for semiconductor chip processing according to claim 1, wherein: the output shaft of the motor (701) is fixed with the roller (702) through a coupler, the roller (702) is connected with the belt (703) in a rolling mode, and the baffle (704) is fixed with the workbench (6) through bolts.
6. The mounting apparatus for semiconductor chip processing according to claim 1, wherein: the supporting frame (801) and the horizontal hydraulic rod (802) are fixed through bolts, the horizontal hydraulic rod (802) and the vertical hydraulic rod (803) are fixed through a connecting block, the vertical hydraulic rod (803) and the suction nozzle (805) are fixed through a connecting block, and the suction nozzle (805) and the first vacuum pump (804) are fixed through bolts.
7. The mounting apparatus for semiconductor chip processing according to claim 1, wherein: the fixing seat (1001) and the second vacuum pump (1002) are fixed through bolts.
8. A mounting apparatus for semiconductor chip processing according to claim 2, wherein: the rectangular sundries box (2) and the partition plate (3) are welded.
9. A mounting apparatus for semiconductor chip processing according to claim 3, wherein: the oval sundry box (4) is welded with the partition plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121890711.2U CN216698289U (en) | 2021-08-13 | 2021-08-13 | A paste dress equipment for semiconductor chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121890711.2U CN216698289U (en) | 2021-08-13 | 2021-08-13 | A paste dress equipment for semiconductor chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216698289U true CN216698289U (en) | 2022-06-07 |
Family
ID=81814685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121890711.2U Active CN216698289U (en) | 2021-08-13 | 2021-08-13 | A paste dress equipment for semiconductor chip processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216698289U (en) |
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2021
- 2021-08-13 CN CN202121890711.2U patent/CN216698289U/en active Active
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