CN210467795U

CN210467795U - Transportation device for semiconductor packaging structure

Info

Publication number: CN210467795U
Application number: CN201921821764.1U
Authority: CN
Inventors: 李国琪
Original assignee: Hubei Fangjing Electronic Technology Co ltd
Current assignee: Hubei Fangjing Electronic Technology Co ltd
Priority date: 2019-10-28
Filing date: 2019-10-28
Publication date: 2020-05-05
Anticipated expiration: 2029-10-28

Abstract

The utility model discloses a transportation device for a semiconductor packaging structure, which comprises a conveyor belt, a bracket and a base; the support is a horizontally arranged rectangular frame structure, one end of the support is connected with a driving roller, and the other end of the support is connected with a driven roller; the conveyor belt surrounds the driving roller and the driven roller; a conveying plate is laid on the upper surface of the conveying belt; the side surface of the bracket is connected with a fixing device which is matched with the conveying plate; the base is connected to the bottom of the support. The device carries out pressure fixation to semiconductor encapsulation piece through setting up but height-adjusting's pulley gear to set up pressure sensor and carry out the effect feedback, it is not good to have solved the fixed effect of prior art, harms material itself easily, can't effectively carry out the problem of fixed effect feedback, has simple structure, and fixed effectual, do not harm the material, characteristics that can real-time effect feedback.

Description

Transportation device for semiconductor packaging structure

Technical Field

The utility model belongs to the technical field of the semiconductor package processing, a conveyer for semiconductor packaging structure is related to.

Background

In the semiconductor material packaging process, one of the important steps is the transportation of the wafer material as well as the packaging sheet. Unlike the transportation of traditionally processed products, semiconductor-related finished products and materials tend to be small in size, thin in thickness and light in weight, and there is a great risk of transportation using a common conveyor system: semiconductor materials and products can shift position due to vibration and bumping during transportation and even fall off a conveyor belt system. Such risks cause cost loss and have certain adverse effects on subsequent processes, and therefore, it is common practice in the industry to apply a fixing and limiting device during the transportation of the semiconductor, for example, to clamp the semiconductor by using a clamp or the like. The mode has certain risk, because semiconductor packaging piece structure is fragile, uses the centre gripping mode to cause the damage of the inside microcircuit of semiconductor because of the improper application of force easily, consequently, derives some novel designs and fixes the semiconductor.

For example, patent No. CN 209461432U discloses a conveyor for semiconductor packages, which adopts a method of forming fine meshes on the surface of a conveyor belt, arranging an air pump at the bottom, and adsorbing and fixing the semiconductor structure on the surface of the conveyor belt by air flow suction force, and states that dust can be removed by the air pump. There are a number of problems with this design: firstly, an effective limiting structure is not arranged on the surface of the conveyor belt according to the size of the material, so that the packaging sheet still has the risk of displacement; secondly, the fixing effect of the airflow suction force lacks an effective evaluation means, operators cannot effectively obtain accurate feedback of the fixing effect, and the problem of poor actual effect is easily caused by only observing to carry out fuzzy estimation; thirdly, the way of air flow suction has larger noise pollution, which is not beneficial to the work of operators; fourthly, the mode of adopting below absorption not only can't effectively remove dust, on the contrary makes the upper surface of conveyer belt of dust gathering in the air easily, is similar to the phenomenon that the back lid of electric fan is deposition of dust more easily, and the dust of gathering can block up the mesh on conveyer belt surface, causes the inconvenient problem of clearance.

In summary, it is necessary to design a transportation device that can effectively fix the semiconductor package structure during transportation, does not damage the material itself, and can provide effective effect feedback.

Disclosure of Invention

The utility model aims to solve the technical problem that a conveyer for semiconductor packaging structure is provided, but the device carries out pressure fixation to semiconductor package piece through setting up height-adjusting's pulley gear to set up pressure sensor and carried out the effect feedback, it is not good to have solved the fixed effect of prior art, injures material itself easily, can't effectively carry out the problem of fixed effect feedback, has simple structure, and fixed effectual, do not injure the material, can the real-time characteristics of effect feedback.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: a transportation device for a semiconductor packaging structure comprises a conveyor belt, a bracket and a base; the support is a horizontally arranged rectangular frame structure, one end of the support is connected with a driving roller, and the other end of the support is connected with a driven roller; the conveyor belt surrounds the driving roller and the driven roller; a conveying plate is laid on the upper surface of the conveying belt; the side surface of the bracket is connected with a fixing device which is matched with the conveying plate; the base is connected to the bottom of the support.

One side of the driving roller is connected with a motor.

A plurality of rectangular grooves are formed in the surface of the transport plate, and a semiconductor packaging sheet is placed in each rectangular groove.

A partition plate is laid at the bottom of the rectangular groove, and a pressure sensor is connected between the partition plate and the bottom surface of the rectangular groove.

The bottom surface of the conveying plate is connected with a rubber pad which is in contact fit with the conveying belt.

One side of the upper surface of the base is connected with a first cylinder, the other side of the upper surface of the base is connected with a second cylinder, and the output ends of the first cylinder and the second cylinder are connected with the support.

The fixing device comprises a telescopic motor, a push rod, a lever and a support rod; the telescopic motor is connected to the side face of the bracket, and the push rod is connected with the output end of the telescopic motor; the support rod is connected to the upper surface of the bracket; the middle part of the lever is hinged at the top of the supporting rod through a pin, and one end of the lever is hinged with the top of the push rod and can rotate around the pin.

The other end of the lever is connected with a pulley, and the sliding direction of the pulley is parallel to the moving direction of the conveyor belt.

The surface of the pulley is wrapped with a rubber gasket.

The side surface of the bracket is connected with a controller; the pressure sensor and the telescopic motor are electrically connected with the controller; the motor, the first cylinder and the second cylinder are connected with an external power supply.

A transportation device for a semiconductor packaging structure comprises a conveyor belt, a bracket and a base; the support is a horizontally arranged rectangular frame structure, one end of the support is connected with a driving roller, and the other end of the support is connected with a driven roller; the conveyor belt surrounds the driving roller and the driven roller; a conveying plate is laid on the upper surface of the conveying belt; the side surface of the bracket is connected with a fixing device which is matched with the conveying plate; the base is connected to the bottom of the support. The device carries out pressure fixation to semiconductor encapsulation piece through setting up but height-adjusting's pulley gear to set up pressure sensor and carry out the effect feedback, simple structure, it is fixed effectual, do not harm the material, can effect feedback in real time.

In a preferred scheme, one side of the driving roller is connected with a motor. Simple structure, during the use, motor drive initiative gyro wheel rotates, and the initiative gyro wheel passes through the conveyer belt and drives driven roller rotation, simple structure, convenient operation.

In a preferred scheme, a plurality of rectangular grooves are formed in the surface of the conveying plate, and a semiconductor packaging sheet is placed in each rectangular groove. The structure is simple, when the semi-conductor material transportation device is used, the size of the rectangular groove on the surface of the transportation plate is matched with that of a semi-conductor structure to be transported, and the transported semi-conductor material can be effectively limited; the transport plate can be remade as required to be changed in the later stage so as to adapt to the sizes of different materials, and the whole conveying device does not need to be reworked, so that the labor and the cost are saved.

In a preferred scheme, a partition plate is laid at the bottom of the rectangular groove, and a pressure sensor is connected between the partition plate and the bottom surface of the rectangular groove. Simple structure, during the use, the pressure sensor monitoring semiconductor structure receives the pressure restraint condition, adjusts the pressure size of exerting through feedback control fixing device's height, both can effectively feed back fixed effect, has avoided too big damage semiconductor material of pressure again.

In a preferable scheme, a rubber pad is connected to the bottom surface of the conveying plate and is in contact fit with the conveying belt. Simple structure, during the use, the rubber pad has increased frictional force, can prevent that transport plate and conveyer belt from taking place relative displacement.

In the preferred scheme, base upper surface one side is connected with first cylinder, and the opposite side is connected with the second cylinder, and the output and the leg joint of first cylinder and second cylinder. Simple structure, during the use, the cylinder can control the height of conveyer belt, is convenient for adjust the height according to operating condition.

In a preferred scheme, the fixing device comprises a telescopic motor, a push rod, a lever and a support rod; the telescopic motor is connected to the side face of the bracket, and the push rod is connected with the output end of the telescopic motor; the support rod is connected to the upper surface of the bracket; the middle part of the lever is hinged at the top of the supporting rod through a pin, and one end of the lever is hinged with the top of the push rod and can rotate around the pin. The structure is simple, when the device is used, the telescopic motor pushes the push rod to rise, the lever rotates around the pin, the pulley connected with the other end of the lever moves downwards to pressurize and fix the semiconductor packaging sheet below, the operation is simple, and the applied pressure can be accurately controlled by utilizing the lever principle.

In a preferred scheme, the other end of the lever is connected with a pulley, and the sliding direction of the pulley is parallel to the moving direction of the conveyor belt. The structure is simple, when the pulley is used, the design of the direction of the pulley can ensure that only downward pressure is applied, sliding friction is changed into rolling friction, and the phenomenon that the semiconductor packaging sheet is displaced or the surface of the semiconductor packaging sheet is damaged due to the fact that the sliding friction force rubs with the contacted semiconductor packaging sheet is avoided.

In a preferred scheme, the surface of the pulley is wrapped with a rubber gasket. The structure is simple, and when the semiconductor packaging piece is used, the rubber gasket can be used as a buffer to prevent the surface of the semiconductor packaging piece from being damaged due to pressure intensity.

In a preferred scheme, a controller is connected to the side surface of the bracket; the pressure sensor and the telescopic motor are electrically connected with the controller; the motor, the first cylinder and the second cylinder are connected with an external power supply. Simple structure, during the use, motor, first cylinder and second cylinder open and close through on-off control, and flexible motor is through the real-time feedback control of the pressure sensor who corresponds for adjust the height of pulley, greatly reduced operating personnel's intensity of labour.

In a preferred scheme, the controller is a Siemens S7-200PLC controller; the pressure sensor is selected from a loose DP-102A model; the telescopic motor is of a model of JS-TGZ-U1.

A transportation device for a semiconductor packaging structure comprises a conveyor belt, a bracket and a base; the support is a horizontally arranged rectangular frame structure, one end of the support is connected with a driving roller, and the other end of the support is connected with a driven roller; the conveyor belt surrounds the driving roller and the driven roller; a conveying plate is laid on the upper surface of the conveying belt; the side surface of the bracket is connected with a fixing device which is matched with the conveying plate; the base is connected to the bottom of the support. The device carries out pressure fixation to semiconductor encapsulation piece through setting up but height-adjusting's pulley gear to set up pressure sensor and carry out the effect feedback, it is not good to have solved the fixed effect of prior art, harms material itself easily, can't effectively carry out the problem of fixed effect feedback, has simple structure, and fixed effectual, do not harm the material, characteristics that can real-time effect feedback.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a front view of the present invention.

Fig. 3 is a schematic structural view of the middle fixing device of the present invention.

Fig. 4 is a schematic side view of the rectangular groove of the present invention.

Fig. 5 is a connection diagram and a ladder diagram of the controller portion according to the present invention.

Fig. 6 is a wiring diagram of the middle motor and the cylinder of the present invention.

The reference numbers in the figures are: the device comprises a conveyor belt 1, a support 2, a base 3, a first air cylinder 31, a second air cylinder 32, a driving roller 41, a driven roller 42, a conveying plate 5, a rectangular groove 51, a partition plate 52, a pressure sensor 53, a fixing device 6, a telescopic motor 61, a push rod 62, a lever 63, a support rod 64, a pin 65, a pulley 66, a motor 7 and a controller 8.

Detailed Description

As shown in fig. 1 to 6, a transportation device for a semiconductor package structure includes a conveyor 1, a support 2 and a base 3; the support 2 is a horizontally arranged rectangular frame structure, one end of the support 2 is connected with a driving roller 41, and the other end of the support 2 is connected with a driven roller 42; the conveyor belt 1 is wound around a driving roller 41 and a driven roller 42; a conveying plate 5 is laid on the upper surface of the conveyor belt 1; the side surface of the bracket 2 is connected with a fixing device 6, and the fixing device 6 is matched with the conveying plate 5; the base 3 is connected to the bottom of the bracket 2. The device carries out pressure fixation to the semiconductor packaging piece through setting up but height-adjusting's pulley 66 device to set up pressure sensor 53 and carry out the effect feedback, simple structure, it is fixed effectual, do not harm the material, can effect feedback in real time.

In a preferred scheme, one side of the driving roller 41 is connected with a motor 7. Simple structure, during the use, motor 7 drive initiative gyro wheel 41 rotates, and initiative gyro wheel 41 passes through conveyer belt 1 and drives driven roller 42 and rotate, simple structure, convenient operation.

In a preferred embodiment, the surface of the transport plate 5 is provided with a plurality of rectangular grooves 51, and each rectangular groove 51 is provided with a semiconductor package chip. The structure is simple, when in use, the size of the rectangular groove 51 on the surface of the transport plate 5 is adapted to the semiconductor structure to be transported, and the transported semiconductor material can be effectively limited; the transport plate 5 can be remade and replaced at a later stage as required to adapt to the sizes of different materials, the whole conveying device does not need to be remade, and labor and cost are saved.

In a preferred scheme, a partition plate 52 is laid at the bottom of the rectangular groove 51, and a pressure sensor 53 is connected between the partition plate 52 and the bottom surface of the rectangular groove 51. Simple structure, during the use, the pressure sensor 53 monitors the pressure restraint condition that semiconductor structure received, adjusts the pressure size of exerting through the height of feedback control fixing device 6, both can effectively feed back fixed effect, has avoided too big damage semiconductor material of pressure again.

In a preferable scheme, a rubber pad is connected to the bottom surface of the conveying plate 5 and is in contact fit with the conveyor belt 1. Simple structure, during the use, the rubber pad has increased frictional force, can prevent that transport plate 5 and conveyer belt 1 from taking place relative displacement.

In the preferred scheme, one side of the upper surface of the base 3 is connected with a first cylinder 31, the other side of the upper surface of the base is connected with a second cylinder 32, and the output ends of the first cylinder 31 and the second cylinder 32 are connected with the bracket 2. Simple structure, during the use, the cylinder can control conveyer belt 1's height, is convenient for adjust the height according to operating condition.

In a preferred scheme, the fixing device 6 comprises a telescopic motor 61, a push rod 62, a lever 63 and a support rod 64; the telescopic motor 61 is connected to the side surface of the bracket 2, and the push rod 62 is connected with the output end of the telescopic motor 61; the supporting rod 64 is connected to the upper surface of the bracket 2; the lever 63 is hinged at the middle to the top of the strut 64 by a pin 65 and at one end to the top of the push rod 62, rotatable about the pin 65. The structure is simple, when the device is used, the telescopic motor 61 pushes the push rod 62 to ascend, so that the lever 63 rotates around the pin 65, the pulley 66 connected with the other end of the lever 63 moves downwards to pressurize and fix the semiconductor packaging sheet below, the operation is simple, and the applied pressure can be accurately controlled by utilizing the principle of the lever 63.

In a preferred scheme, the other end of the lever 63 is connected with a pulley 66, and the sliding direction of the pulley 66 is parallel to the moving direction of the conveyor belt 1. The structure is simple, and when the semiconductor packaging piece is used, the design of the direction of the pulley 66 can ensure that only downward pressure is applied, sliding friction is changed into rolling friction, and the phenomenon that the semiconductor packaging piece is displaced or the surface of the semiconductor packaging piece is damaged due to the friction between the sliding friction force and the contacted semiconductor packaging piece is avoided.

Preferably, the surface of the pulley 66 is covered with a rubber gasket. The structure is simple, and when the semiconductor packaging piece is used, the rubber gasket can be used as a buffer to prevent the surface of the semiconductor packaging piece from being damaged due to pressure intensity.

In a preferred scheme, a controller 8 is connected to the side surface of the bracket 2; the pressure sensor 53 and the telescopic motor 61 are electrically connected with the controller 8; the motor 7, the first cylinder 31 and the second cylinder 32 are connected to an external power source. Simple structure, during the use, motor 7, first cylinder 31 and second cylinder 32 open and close through on-off control, and flexible motor 61 is through the real-time feedback control of pressure sensor 53 that corresponds for adjust pulley 66's height, greatly reduced operating personnel's intensity of labour.

In the preferred scheme, the controller 8 is a Siemens S7-200PLC controller; the pressure sensor 53 is selected from a Panasonic DP-102A model; the telescopic motor 61 is made of JS-TGZ-U1.

When the transportation device for the semiconductor packaging structure is installed and used, the bracket 2 is a horizontally arranged rectangular frame structure, one end of the bracket 2 is connected with the driving roller 41, and the other end of the bracket 2 is connected with the driven roller 42; the conveyor belt 1 is wound around the driving roller 41 and the driven roller 42; a conveying plate 5 is laid on the upper surface of the conveyor belt 1; the side surface of the bracket 2 is connected with a fixing device 6, and the fixing device 6 is matched with the conveying plate 5; the base 3 is connected to the bottom of the bracket 2. The device carries out pressure fixation to the semiconductor packaging piece through setting up but height-adjusting's pulley 66 device to set up pressure sensor 53 and carry out the effect feedback, simple structure, it is fixed effectual, do not harm the material, can effect feedback in real time.

When the automatic belt conveyor is used, one side of the driving roller 41 is connected with the motor 7, the motor 7 drives the driving roller 41 to rotate, the driving roller 41 drives the driven roller 42 to rotate through the conveyor belt 1, and the automatic belt conveyor is simple in structure and convenient to operate.

When the semiconductor packaging device is used, the surface of the conveying plate 5 is provided with a plurality of rectangular grooves 51, a semiconductor packaging sheet is placed in each rectangular groove 51, the size of each rectangular groove 51 on the surface of the conveying plate 5 is matched with a semiconductor structure to be conveyed, and the conveyed semiconductor material can be effectively limited; the transport plate 5 can be remade and replaced at a later stage as required to adapt to the sizes of different materials, the whole conveying device does not need to be remade, and labor and cost are saved.

During the use, rectangle recess 51 bottom is laid and is equipped with baffle 52, is connected with pressure sensor 53 between baffle 52 and the rectangle recess 51 bottom surface, and pressure sensor 53 monitors the pressure restraint condition that semiconductor structure received, adjusts the pressure size of applying through the height of feedback control fixing device 6, both can effectively feed back fixed effect, has avoided too big damage semiconductor material of pressure again.

When the conveyer belt device is used, the bottom surface of the conveyer plate 5 is connected with a rubber pad which is in contact fit with the conveyer belt 1, the rubber pad increases friction force, and the conveyer plate 5 and the conveyer belt 1 can be prevented from relative displacement.

During the use, base 3 upper surface one side is connected with first cylinder 31, and the opposite side is connected with second cylinder 32, and the output and the support 2 of first cylinder 31 and second cylinder 32 are connected, and the cylinder can control the height of conveyer belt 1, is convenient for adjust the height according to operating condition.

When in use, the fixing device 6 comprises a telescopic motor 61, a push rod 62, a lever 63 and a support rod 64; the telescopic motor 61 is connected to the side surface of the bracket 2, and the push rod 62 is connected with the output end of the telescopic motor 61; the supporting rod 64 is connected to the upper surface of the bracket 2; the middle part of the lever 63 is hinged to the top of the supporting rod 64 through a pin 65, one end of the lever is hinged to the top of the push rod 62 and can rotate around the pin 65, the telescopic motor 61 pushes the push rod 62 to ascend, the lever 63 rotates around the pin 65, the pulley 66 connected to the other end of the lever 63 moves downwards to pressurize and fix the semiconductor packaging sheet below, the operation is simple, and the applied pressure can be accurately controlled by utilizing the principle of the lever 63.

When the device is used, the other end of the lever 63 is connected with the pulley 66, the sliding direction of the pulley 66 is parallel to the moving direction of the conveyor belt 1, the design of the direction of the pulley 66 can ensure that only downward pressure is applied to change sliding friction into rolling friction, and the phenomenon that the semiconductor packaging sheet is displaced or the surface of the semiconductor packaging sheet is damaged due to the fact that the sliding friction force rubs with the contacted semiconductor packaging sheet is avoided.

When the semiconductor packaging piece is used, the rubber gasket is wrapped on the surface of the pulley 66 and can be used as a buffer to prevent the surface of the semiconductor packaging piece from being damaged due to pressure intensity.

When in use, the side surface of the bracket 2 is connected with a controller 8; the pressure sensor 53 and the telescopic motor 61 are electrically connected with the controller 8; motor 7, first cylinder 31 and second cylinder 32 are connected with external power source, and motor 7, first cylinder 31 and second cylinder 32 open and close through on-off control, and flexible motor 61 is through the real-time feedback control of pressure sensor 53 that corresponds for adjust the height of pulley 66, greatly reduced operating personnel's intensity of labour.

When in use, the controller 8 adopts a Siemens S7-200PLC controller; the pressure sensor 53 is selected from a Panasonic DP-102A model; the telescopic motor 61 is made of JS-TGZ-U1.

The above embodiments are merely preferred technical solutions of the present invention, and should not be considered as limitations of the present invention, and the features in the embodiments and the examples in the present application may be arbitrarily combined with each other without conflict. The protection scope of the present invention shall be defined by the claims and the technical solutions described in the claims, including the technical features of the equivalent alternatives as the protection scope. Namely, equivalent alterations and modifications within the scope of the invention are also within the scope of the invention.

Claims

1. A transportation device for a semiconductor packaging structure is characterized in that: the device comprises a conveyor belt (1), a bracket (2) and a base (3); the support (2) is of a rectangular frame structure, one end of the support (2) is connected with the driving roller (41), and the other end of the support is connected with the driven roller (42); the conveyor belt (1) surrounds a driving roller (41) and a driven roller (42); a conveying plate (5) is laid on the upper surface of the conveying belt (1); the side surface of the bracket (2) is connected with a fixing device (6), and the fixing device (6) is matched with the conveying plate (5); the base (3) is connected to the bottom of the bracket (2).

2. The transportation device for semiconductor packages according to claim 1, wherein: one side of the driving roller (41) is connected with a motor (7).

3. The transportation device for semiconductor packages according to claim 1, wherein: the surface of the conveying plate (5) is provided with a plurality of rectangular grooves (51), and a semiconductor packaging sheet is placed in each rectangular groove (51).

4. The transportation device for semiconductor packages according to claim 3, wherein: a partition plate (52) is laid at the bottom of the rectangular groove (51), and a pressure sensor (53) is connected between the partition plate (52) and the bottom surface of the rectangular groove (51).

5. The transportation device for semiconductor packages according to claim 1, wherein: the bottom surface of the conveying plate (5) is connected with a rubber pad which is in contact fit with the conveying belt (1).

6. The transportation device for semiconductor packages according to claim 1, wherein: one side of the upper surface of the base (3) is connected with a first air cylinder (31), the other side of the upper surface of the base is connected with a second air cylinder (32), and the output ends of the first air cylinder (31) and the second air cylinder (32) are connected with the support (2).

7. The transportation device for semiconductor packages according to claim 1, wherein: the fixing device (6) comprises a telescopic motor (61), a push rod (62), a lever (63) and a support rod (64); the telescopic motor (61) is connected to the side face of the support (2), and the push rod (62) is connected with the output end of the telescopic motor (61); the supporting rod (64) is connected to the upper surface of the bracket (2); the middle part of the lever (63) is hinged on the top of the support rod (64) through a pin (65), and one end of the lever is hinged on the top of the push rod (62) and can rotate around the pin (65).

8. The transportation device for semiconductor packages according to claim 7, wherein: one end of the lever (63) is connected with a pulley (66), and the sliding direction of the pulley (66) is parallel to the moving direction of the conveyor belt (1).

9. The transportation device for semiconductor packages according to claim 8, wherein: the surface of the pulley (66) is wrapped with a rubber gasket.

10. The transportation device for semiconductor packages according to claim 1, wherein: the side surface of the bracket (2) is connected with a controller (8); the pressure sensor (53) and the telescopic motor (61) are electrically connected with the controller (8); the motor (7), the first cylinder (31) and the second cylinder (32) are connected with an external power supply.