CN216696114U - Chip surface defect detection device - Google Patents

Chip surface defect detection device Download PDF

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Publication number
CN216696114U
CN216696114U CN202220169793.XU CN202220169793U CN216696114U CN 216696114 U CN216696114 U CN 216696114U CN 202220169793 U CN202220169793 U CN 202220169793U CN 216696114 U CN216696114 U CN 216696114U
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China
Prior art keywords
connecting block
bottom plate
chip
plate
driving mechanism
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CN202220169793.XU
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Chinese (zh)
Inventor
曾省金
杨惠雄
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Shenzhen Xinhuiquan Technology Co ltd
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Shenzhen Xinhuiquan Technology Co ltd
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Priority to CN202220169793.XU priority Critical patent/CN216696114U/en
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Abstract

The utility model belongs to the technical field of detection equipment, and particularly relates to a chip surface defect detection device which comprises a bottom plate and a control panel, wherein the bottom plate is provided with a collection mechanism and a placing plate; the collecting mechanism comprises a driving mechanism, a connecting block, a mounting plate and a plurality of collecting cameras, a rear baffle and a protective cover are respectively arranged on the rear side and the side surface of the bottom plate, the driving mechanism is arranged on the rear baffle, the connecting block is connected with the driving mechanism, the mounting plate is connected with the connecting block, and the collecting cameras are uniformly arranged at the lower end of the mounting plate; open the bottom plate upper end has the locating frame, place the board and locate in the locating frame, it has a plurality of standing grooves to place the board upper end and evenly open, the backstop rotates through the damping pivot and is equipped with the protective cover, and this device can carry out the defect detection to the chip more convenient and fast efficient, improves the efficiency and the quality of production.

Description

Chip surface defect detection device
Technical Field
The utility model belongs to the technical field of detection equipment, and particularly relates to a chip surface defect detection device.
Background
With the development of modern informatization, electronization and intellectualization, the chip is used as the core of modern electronic products and production equipment, the using amount of the chip rises year by year, and the performance requirement of the chip is continuously improved along with the requirements of production and life, so the chip is an indispensable important component in the modern industry.
At present in the chip production link, in order to ensure that the chip does not receive external disturbance and breaks down, often can encapsulate chip itself, wrap up key component and only leave the pin externally, and effective in order to ensure the chip encapsulation, then need carry out the surface detection to the chip, in order to ensure the quality, present general detection mode often adopts single camera to carry out image acquisition and judges, such mode not only efficiency is lower, and lack corresponding protection, the chip easily receives external disturbance and causes the machine erroneous judgement, unsatisfied chip quick, accurate chip detects the needs.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model is: the device for detecting the surface defects of the chip is capable of detecting the chip more conveniently and rapidly, improving detection efficiency, reducing interference of an external environment to the chip and improving image acquisition clarity.
In order to achieve the technical purpose, the technical scheme adopted by the utility model is as follows:
a chip surface defect detection device comprises a bottom plate and a control panel, wherein the bottom plate is provided with a collection mechanism and a placing plate;
the collecting mechanism comprises a driving mechanism, a connecting block, a mounting plate and a plurality of collecting cameras, a rear baffle and a protective cover are respectively arranged on the rear side and the side surface of the bottom plate, the driving mechanism is arranged on the rear baffle, the connecting block is connected with the driving mechanism, the mounting plate is connected with the connecting block, and the collecting cameras are uniformly arranged at the lower end of the mounting plate;
the bottom plate upper end is opened there is the locating frame, place the board and locate in the locating frame, it has a plurality of standing grooves to place the board upper end and evenly open, the backstop is rotated through the damping pivot and is equipped with the protective cover.
The driving mechanism comprises a motor and a screw rod, the rear baffle is provided with a T-shaped mounting groove, the screw rod is rotatably arranged in the T-shaped mounting groove, the motor is arranged on the side surface of the rear baffle and is rotatably connected with the screw rod, and the connecting block is in threaded connection with the screw rod and is matched with the T-shaped mounting groove; can drive the collection camera fast steadily like this.
A plurality of groups of light supplement lamps are uniformly arranged at the lower end of the mounting plate, the plurality of light supplement lamps correspond to the plurality of acquisition cameras one by one, and the plurality of acquisition cameras are in electric signal connection with the control panel; this can improve the accuracy of image acquisition.
The bottom of the placing groove is provided with a plurality of indicating lamps, the indicating lamps correspond to the positioning frames of the placing plate one by one, and the indicating lamps are in electric signal connection with the control panel; therefore, the chips with defects can be more accurately indicated, and the processing is convenient for workers.
Handles are arranged on two sides of the upper end of the placing plate; it is convenient to carry and take to placing the board like this.
A display is arranged on the side face of the protective cover and is in electric signal connection with the control panel; therefore, the chip image information can be conveniently observed by external workers.
The plate is placed in the cooperation of setting up through gathering the mechanism, can carry out quick image acquisition to more chip by the single fast to indicate the chip that has the defect, improve and detect work efficiency and improve and detect the rate of accuracy, reduce the consumption of human cost, satisfy more and detect production needs.
Drawings
The utility model is further illustrated by the non-limiting examples given in the figures.
Fig. 1 is a schematic structural diagram of an embodiment of a device for detecting a chip surface defect according to the present invention.
Fig. 2 is a schematic structural diagram of the utility model with the protective cover removed.
Fig. 3 is a schematic structural view of the present invention with the placement board removed.
Fig. 4 is a structural sectional view of an embodiment of the present invention.
Bottom plate 1, control panel 11, locating frame 12, pilot lamp 13, place board 2, standing groove 21, handle 22, connecting block 3, mounting panel 31, gather camera 32, light filling lamp 321, backstop 33, protection casing 34, protective cover 35, motor 4, screw rod 41, T shape mounting groove 42, display 5.
Detailed Description
In order that those skilled in the art can better understand the present invention, the following technical solutions are further described with reference to the accompanying drawings and examples.
As shown in fig. 1-4, a chip surface defect detecting apparatus comprises a bottom plate 1 and a control panel 11, wherein the bottom plate 1 is provided with a collecting mechanism and a placing plate 2;
the collecting mechanism comprises a driving mechanism, a connecting block 3, a mounting plate 31 and a plurality of collecting cameras 32, a rear baffle 33 and a protective cover 34 are respectively arranged on the rear side and the side surface of the bottom plate 1, the driving mechanism is arranged on the rear baffle 33, the connecting block 3 is connected with the driving mechanism, the mounting plate 31 is connected with the connecting block 3, and the plurality of collecting cameras 32 are uniformly arranged at the lower end of the mounting plate 31;
open at 1 upper end of bottom plate has locating frame 12, places board 2 and locates in locating frame 12, places 2 upper ends of board and evenly opens and have a plurality of standing grooves 21, and backstop 33 rotates through the damping pivot and is equipped with protective cover 35.
When the appearance defects of the chips are detected, the chips are firstly uniformly placed in the placing grooves 21 on the placing plate 2, and the placing plate 2 can be placed in the positioning frame 12 of the bottom plate 1 after the placing is finished, so that the position of the placing plate 2 is limited, and the situation that the collected images are fuzzy due to displacement cannot occur in the detecting process of the placing plate 2 is ensured;
when the chips on one placing plate 2 are detected, the next batch of chips can be placed on the other placing plate 2 for detection, the waiting time is utilized separately, so that the production efficiency is improved, when the detection is carried out, the control panel 11 opens the driving mechanism, the driving mechanism drives the mounting plate 31 to move through the connecting block 3, as the placing grooves 21 on the placing plate 2 are uniformly distributed in a grid shape, the control panel 11 controls the mounting plate 31 to move until the mounting plate 31 is aligned with the placing grooves 21 on the placing plate 2, so that the collecting cameras 32 can correspond to the placing grooves 21 in one column, the image information of the chips in the placing grooves 21 in one column can be quickly and accurately collected, the image information is transmitted to the control panel 11 for judgment and analysis, after the judgment and the collection of the information in one column are finished, the driving mechanism is started again to drive the mounting plate 31 to move, until moving next chip department, after all chip detection were accomplished, actuating mechanism just can reset the position of mounting panel 31 and make in its income protection casing 34, make like this that gather camera 32 income protection casing 34 not only can avoid influencing the getting of placing board 2 and put, but also can provide certain protection to gathering camera 32, avoid receiving external influence, protective cover 35 can shield the protection to the chip in the testing process simultaneously, further prevent external disturbance and detect, improve and detect the precision.
The driving mechanism comprises a motor 4 and a screw rod 41, the rear baffle 33 is provided with a T-shaped mounting groove 42, the screw rod 41 is rotatably arranged in the T-shaped mounting groove 42, the motor 4 is arranged on the side surface of the rear baffle 33 and is rotatably connected with the screw rod 41, and the connecting block 3 is in threaded connection with the screw rod 41 and is matched with the T-shaped mounting groove 42; when gathering camera 32 and carrying out image acquisition, motor 4 starts and will drive screw rod 41 and rotate, because connecting block 3 and screw rod 41 threaded connection just receive the restriction of T shape mounting groove 42, mounting panel 31 is connected with connecting block 3 simultaneously, consequently when carrying out image acquisition, motor 4 drive screw rod 41 drives mounting panel 31 through connecting block 3 and removes, and then make and gather camera 32 and remove, because standing groove 21 on placing board 2 is field word check evenly distributed, consequently via control panel 11 control, it can stop moving just to gather camera 32 and remove behind every standing groove 21, remove again after gathering the image completion, image acquisition's is efficient and stable like this.
A plurality of groups of light supplement lamps 321 are uniformly arranged at the lower end of the mounting plate 31, the plurality of light supplement lamps 321 correspond to the plurality of collecting cameras 32 one by one, and the plurality of collecting cameras 32 are in electric signal connection with the control panel 11; in the process of collecting the image by the collecting camera 32, the light supplementing lamp 321 can be turned on to supplement light to the chip on the lower side, so that the collecting camera 32 is more beneficial to collecting image information, and the judgment accuracy is improved.
The bottom of the placing groove 21 is provided with a plurality of indicating lamps 13, the indicating lamps 13 correspond to the positioning frames 12 of the placing plate 2 one by one, and the indicating lamps 13 are in electric signal connection with the control panel 11; the setting of pilot lamp 13 can cooperate and gather camera 32, after gathering camera 32 and gathering chip image information, judge the back via control panel 11, if there is appearance defect in the target chip of judgement, then pilot lamp 13 that corresponds lights, otherwise then does not light, is detecting the completion back like this, can make staff convenient and fast more get rid of the chip that has the defect.
Handles 22 are arranged on both sides of the upper end of the placing plate 2; the arrangement of the handle 22 is more convenient for the lifting and holding of the placing plate 2, and the operation convenience is improved.
The display 5 is arranged on the side face of the protective cover 34, and the display 5 is in electric signal connection with the control panel 11; display 5's setting can be when gathering camera 32 and carrying out image acquisition to placing the single chip of board 2 on, with image information synchronous transmission to display 5 on, and then the outside staff of being convenient for observes.
The foregoing embodiments are merely illustrative of the principles of the present invention and its efficacy, and are not to be construed as limiting the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (6)

1. The utility model provides a chip surface defect detection device, includes bottom plate and control panel, its characterized in that: the bottom plate is provided with a collecting mechanism and a placing plate;
the collecting mechanism comprises a driving mechanism, a connecting block, a mounting plate and a plurality of collecting cameras, a rear baffle and a protective cover are respectively arranged on the rear side and the side surface of the bottom plate, the driving mechanism is arranged on the rear baffle, the connecting block is connected with the driving mechanism, the mounting plate is connected with the connecting block, and the collecting cameras are uniformly arranged at the lower end of the mounting plate;
the bottom plate upper end is opened there is the locating frame, place the board and locate in the locating frame, it has a plurality of standing grooves to place the board upper end and evenly open, the backstop is rotated through the damping pivot and is equipped with the protective cover.
2. The apparatus for detecting surface defects of a chip according to claim 1, wherein: actuating mechanism includes motor and screw rod, the back is kept off and is opened there is T shape mounting groove, the screw rod rotates to be located in the T shape mounting groove, the motor is located the back keep off the side and with the screw rod rotates to be connected, the connecting block with screw rod threaded connection and with T shape mounting groove phase-match.
3. The apparatus for detecting surface defects of a chip according to claim 1, wherein: the mounting panel lower extreme evenly is equipped with a plurality of groups light filling lamp, and is a plurality of the light filling lamp is with a plurality of gather the camera one-to-one, it is a plurality of gather the camera with control panel electric signal connects.
4. The apparatus for detecting surface defects of a chip according to claim 1, wherein: the bottom of the placing tank is provided with a plurality of indicating lamps, the indicating lamps correspond to the positioning frames of the placing plate one to one, and the indicating lamps are in electric signal connection with the control panel.
5. The apparatus for detecting surface defects of a chip according to claim 1, wherein: handles are arranged on two sides of the upper end of the placing plate.
6. The apparatus for detecting surface defects of a chip according to claim 1, wherein: and a display is arranged on the side surface of the protective cover and is in electric signal connection with the control panel.
CN202220169793.XU 2022-01-21 2022-01-21 Chip surface defect detection device Active CN216696114U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220169793.XU CN216696114U (en) 2022-01-21 2022-01-21 Chip surface defect detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220169793.XU CN216696114U (en) 2022-01-21 2022-01-21 Chip surface defect detection device

Publications (1)

Publication Number Publication Date
CN216696114U true CN216696114U (en) 2022-06-07

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ID=81826245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220169793.XU Active CN216696114U (en) 2022-01-21 2022-01-21 Chip surface defect detection device

Country Status (1)

Country Link
CN (1) CN216696114U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115032208A (en) * 2022-08-10 2022-09-09 弘润半导体(苏州)有限公司 Semiconductor chip detection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115032208A (en) * 2022-08-10 2022-09-09 弘润半导体(苏州)有限公司 Semiconductor chip detection device

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