CN216660999U

CN216660999U - Packaging structure of large-size substrate

Info

Publication number: CN216660999U
Application number: CN202121466759.0U
Authority: CN
Inventors: 李星星; 兰伟
Original assignee: Radium Asia Electronics Suzhou Co ltd; Leia Inc
Current assignee: Radium Asia Electronics Suzhou Co ltd; Leia Inc
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2022-06-03
Anticipated expiration: 2031-06-30

Abstract

The present disclosure relates to the field of display technologies, and in particular, to a package structure of a large-sized substrate. The packaging structure of the large-size substrate comprises: a substrate; a plurality of protective layers with through holes respectively disposed on the upper and lower surfaces of the substrate; and a first quantity of desiccant disposed over the top protective layer of the upper surface of the substrate. The packaging structure can ensure a constant temperature and humidity environment required in the substrate transportation process.

Description

Packaging structure of large-size substrate

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a package structure of a large-sized substrate.

Background

With the wide application of naked eye 3D display devices, the market demand for light guide plates is also increasing. Generally, in the packaging process of the light guide plate, the light guide plate is only sealed and stored for transportation, so that the surface of the light guide plate is easily oxidized, and the light guide plate is inevitably affected by damp due to the fact that the constant temperature and humidity environment in the production and transportation processes of the light guide plate cannot be guaranteed, so that the performance of the light guide plate is affected.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present disclosure provides a package structure of a large-sized substrate.

The packaging structure of the large-size substrate of the present disclosure includes: a substrate; a plurality of protective layers with through holes respectively disposed on the upper and lower surfaces of the substrate; and a first quantity of desiccant disposed over the top protective layer of the upper surface of the substrate.

According to an example of the present disclosure, each protection layer includes a second number of sub-protection layers, and two adjacent sub-protection layers are fixed together by a concave-convex clamping plate at the edge.

According to an example of the present disclosure, the through holes of the plurality of protective layers correspond one-to-one in a direction perpendicular to the upper and lower surfaces of the substrate.

According to one example of the present disclosure, the protective layer is constructed of a foamed polypropylene EPP material.

According to one example of the present disclosure, the first amount of desiccant is predetermined according to a humidity requirement.

According to an example of the present disclosure, the package structure further includes cushion pads laid between the upper surface of the substrate and the protective layer, and between the lower surface and the protective layer.

According to an example of the present disclosure, the package structure is obtained by sealing the substrate with the protective layer and the desiccant.

The packaging structure can ensure a constant temperature and humidity environment required in the substrate transportation process.

Drawings

The above and other objects, features and advantages of the present disclosure will become more apparent by describing in more detail embodiments of the present disclosure with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the principles of the disclosure and not to limit the disclosure. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 shows a schematic view of a package structure of a large-sized substrate according to an embodiment of the present disclosure;

fig. 2(a) - (b) show schematic diagrams of protective layers laid on the upper and lower surfaces of a substrate according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. It is to be understood that the described embodiments are merely exemplary of some, and not all, of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without any creative effort, shall fall within the protection scope of the present disclosure.

Fig. 1 is a schematic view illustrating a package structure of a large-sized substrate according to an embodiment of the disclosure. For example, the large-sized substrate may have a substrate size of 10.8 and more. The substrate may be a light guide plate LGP, for example.

As shown in fig. 1, the package structure of the large-sized substrate of the present disclosure includes: a substrate; a plurality of protective layers 41 with through holes respectively disposed on the upper and lower surfaces of the substrate 30; and a first amount of desiccant (not shown) disposed over the top protective layer 41 on the upper surface of the substrate.

As shown in fig. 2(a) - (b), a plurality of protective layers with through holes (a 1, a2, A3, a4, a5, a6 shown in fig. 2(a) - (b)) are laid on the upper and lower surfaces of the substrate. As shown in fig. 2(a) - (b), each protective layer may include a second number of sub-protective layers, and two adjacent sub-protective layers may be fixed together, for example, by concave-convex snap-in boards at the edges. It should be appreciated that the number of each sub-protection layer can be set according to the humidity requirement, and is not limited herein.

For example, the protective layer may be constructed of a foamed polypropylene EPP material.

For example, the upper surface of the substrate may be stacked with a third number of protective layers, and the lower surface of the substrate may be stacked with a fourth number of protective layers. For example, the third number may be set equal to the fourth number, or the third number may be set unequal to the fourth number, as desired. As one example, 7 protective layers may be stacked on the upper surface of the substrate, and 8 protective layers may be stacked on the lower surface of the substrate.

Returning to fig. 2, a first quantity of desiccant (a 0 as shown in fig. 2(a) - (b)) may be placed over the top protective layer on the upper surface of the substrate. The package structure of the large-sized substrate is formed by sealing the substrate with the desiccant.

For example, as shown in fig. 2(b), the through holes of the plurality of protective layers (a 1, a2, A3, a4, a5, a6 shown in fig. 2(a) - (b)) correspond one-to-one in the direction perpendicular to the upper and lower surfaces of the substrate.

Returning to fig. 1, the package structure may further include a physical protection pad 43 and a buffer pad 42 symmetrically disposed between the substrate 30 and the protection layer 41 to prevent the substrate from being damaged by physical compression.

For example, for the package structure of the large-sized substrate, a constant temperature and humidity transportation environment (e.g., a constant temperature and humidity truck, etc.) can be customized during transportation so that the transportation of the package structure is in a desired constant temperature and humidity environment.

It should be appreciated that the first number, the second number, the third number, and the fourth number may be predetermined as desired. For example, the desiccant may be calcium chloride.

It should be appreciated that the packaging structure of the large-sized substrate of the present disclosure can ensure a constant temperature and humidity environment required during the transportation of the substrate.

The embodiments and modes described in this specification may be used alone or in combination, or may be switched during execution. Note that, as long as there is no contradiction between the processing steps, sequences, flowcharts, and the like of the embodiments and the embodiments described in the present specification, the order may be changed. For example, with respect to the methods described in this specification, various elements of the steps are presented in an exemplary order and are not limited to the particular order presented.

The term "according to" used in the present specification does not mean "according only" unless explicitly stated in other paragraphs. In other words, the statement "according to" means both "according to only" and "according to at least".

Any reference to elements using the designations "first", "second", etc. used in this specification is not intended to be a comprehensive limitation on the number or order of such elements. These names may be used in this specification as a convenient way to distinguish between two or more elements. Thus, references to a first unit and a second unit do not imply that only two units may be employed or that the first unit must precede the second unit in several ways.

When the terms "including", "including" and "comprising" and variations thereof are used in the present specification or claims, these terms are open-ended as in the term "including". Further, the term "or" as used in the specification or claims is not exclusive or.

This application uses specific words to describe embodiments of the application. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the present application is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

While the present disclosure has been described in detail above, it will be apparent to those skilled in the art that the present disclosure is not limited to the embodiments described in the present specification. The present disclosure can be implemented as modifications and variations without departing from the spirit and scope of the present disclosure defined by the claims. Accordingly, the description of the present specification is for the purpose of illustration and is not intended to be in any way limiting of the present disclosure.

Claims

1. An encapsulation structure of a large-size substrate, comprising:

a substrate;

a plurality of protective layers with through holes respectively disposed on the upper and lower surfaces of the substrate; and

a first quantity of desiccant disposed over the top protective layer of the upper surface of the substrate.

2. The package structure according to claim 1, wherein each of the protective layers comprises a second number of sub-protective layers, and two adjacent sub-protective layers are fixed together by a concave-convex clamping plate at the edge.

3. The package structure according to claim 1 or 2, wherein the through holes of the plurality of protective layers correspond one-to-one in a direction perpendicular to the upper and lower surfaces of the substrate.

4. The package structure of claim 1, wherein the protective layer is formed of an expanded polypropylene (EPP) material.

5. The package structure of claim 1, wherein the first amount of desiccant is predetermined based on a humidity requirement.

6. The package structure of claim 1, further comprising a cushion pad disposed between the upper surface of the substrate and the protective layer and between the lower surface and the protective layer.

7. The package structure according to claim 1, wherein the package structure is obtained by sealing the substrate, the protective layer, and the desiccant.