CN214567095U

CN214567095U - Pin-connected panel chip transport case

Info

Publication number: CN214567095U
Application number: CN202120642420.5U
Authority: CN
Inventors: 张明进; 李旭
Original assignee: Shenzhen Future Intelligent Technology Service Co ltd
Current assignee: Shenzhen Future Intelligent Technology Service Co ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2021-11-02
Anticipated expiration: 2031-03-30

Abstract

The utility model discloses an assembled chip transport case, which comprises an assembled case, a placing case, a sealing plate and a cover plate, wherein one end of the assembled case is provided with a splicing groove, the inner cavity of the placing case is divided into a plurality of chip placing areas by a baffle plate, two side ends of the baffle plate and the inner side wall of the placing case are both provided with elastic convex films, one end of the placing case and one end of the implementing sealing plate are both provided with a plurality of cushions, two ends of the cover plate are connected with splicing clamping blocks matched with the splicing groove, the assembled chip transport case can realize the combined stacking of the assembled case by the matching of the splicing groove and the splicing clamping blocks, the elastic convex films in the chip placing areas can extrude two sides of the chips to fix the chips, and the two ends of the chips are abutted against one side of the cushions to play the role of protecting the chips, and during the transportation, different placing cases can be selectively replaced according to the sizes of the chips to be assembled, is very convenient.

Description

Pin-connected panel chip transport case

Technical Field

The utility model relates to a chip transportation equipment technical field specifically is a pin-connected panel chip transport case.

Background

Electronic chip is precision device, and the chip that arouses for preventing to vibrate in the transportation damages, generally places the chip in the transport case or transport case to avoid the chip in the transportation, arouse the damage.

The current transportation during operation that carries out the chip through the transport case, only divide the simple interlayer of a plurality of in the transport case usually, place the chip in the interlayer, and can't stabilize the centre gripping to the chip, and in the transportation, the chip produces the collision damage because of rocking of transport case very easily, when carrying out the simultaneous transportation to a plurality of transport cases, and the transport case is difficult for integrating and accomodates.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pin-connected panel chip transport case to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a pin-connected panel chip transport case, comprising:

the splicing box is provided with an opening at one end and a splicing groove at the other end;

the chip placing device comprises a placing box, a chip placing device and a chip placing device, wherein one end of the placing box is provided with an opening, the inner cavity of the placing box is divided into a plurality of chip placing areas through partition plates, two side ends of each partition plate and the inner side wall of the placing box are respectively provided with an elastic convex film, and the other end of the placing box is provided with a plurality of soft pads;

the sealing plate is connected with a plurality of soft pads at one end;

and the two ends of the cover plate are connected with splicing fixture blocks, and the sizes of the splicing fixture blocks are matched with the sizes of the splicing grooves.

As a further aspect of the present invention: the cushion sets up quantity with the district is placed to the chip sets up quantity phase-match, the cushion is made by high gas permeability sponge.

As a further aspect of the present invention: the splicing box is characterized in that two vertical plates are connected to the bottom of the inner cavity of the splicing box, the placing box is arranged between the two vertical plates, and electrostatic adsorption blocks are arranged between the vertical plates and the side walls of the splicing box.

As a further aspect of the present invention: the bottom of the inner cavity of the assembly box is provided with a vent plate, the vertical section of the vent plate is in a concave shape, and the vent plate is provided with a plurality of vent holes.

As a further aspect of the present invention: and a plurality of drying agent bags are arranged on the inner periphery of the ventilation plate.

Compared with the prior art, the beneficial effects of the utility model are that: this pin-connected panel chip transport case accessible splice groove and concatenation fixture block's cooperation realizes that the combination of piece together case piles up, the protruding membrane of elasticity in the chip is placed the district can extrude the chip both sides and realize the fixing to the chip, and the both ends of chip offset with cushion one side, in order to play the effect of protection chip, during the transportation, can select to change the case of placing that is equipped with the protruding membrane of elasticity of different protruding degree and assemble with the shrouding that is equipped with different thickness cushions according to the chip size, whole transport case space utilization is high, and be convenient for make up and accomodate, it is very convenient.

Drawings

Fig. 1 is a schematic view of an internal structure combination of an assembled chip transport case.

Fig. 2 is an exploded view of the internal structure of a split chip transport case.

Fig. 3 is a top view of a storage case in a pin-connected chip transport case.

Fig. 4 is a schematic view of the stacking of assembled cases in an assembled chip transport case.

Fig. 5 is a schematic view of an internal structure combination of another embodiment of the assembled chip transport case.

Fig. 6 is an exploded view of the internal structure of another embodiment of a pin-connected chip transport case.

Fig. 7 is a schematic structural diagram of a gas permeable plate in an assembled chip transport case.

Wherein: the packaging box comprises a splicing box-1, a cover plate-2, a splicing clamping block-3, a splicing groove-4, a sealing plate-5, a soft cushion-6, a placing box-7, an elastic convex film-8, a ventilating plate-9, a drying agent bag-10, a vertical plate-11, an electrostatic adsorption block-12 and a ventilating hole-13.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Example one

Referring to fig. 1 and 2, an assembled chip transport case comprises an assembled case 1, a placing case 7, a sealing plate 5 and a cover plate 2, wherein one end of the assembled case 1 is provided with an opening, a splicing groove 4 is formed in the outer end face of the other end of the assembled case 1, one end of the placing case 7 is provided with an opening, an inner cavity of the placing case 7 is divided by a partition plate to form a plurality of chip placing areas, elastic convex films 8 are arranged on the two side ends of the partition plate and the inner side wall of the placing case 7, a plurality of soft pads 6 are arranged at the other end of the placing case 7, one end of the sealing plate 5 is connected with the plurality of soft pads 6, and two ends of the cover plate 2 are connected with splicing fixture blocks 3.

The size of the splicing fixture block 3 is matched with that of the splicing groove 4, and the splicing box 1 can be combined and stacked as shown in fig. 3 through the splicing groove 4 and the splicing fixture block 3.

In this embodiment, as shown in fig. 4, the elastic convex film 8 is disposed at the middle position of the inner sidewall of the partition board or the placing box 7, so that when the chip is placed in the chip placing area, the elastic convex film 8 can clamp the middle portion of the chip, and the clamping stability is improved, and the material of the elastic convex film 8 may be selected from elastic materials such as rubber.

The quantity that sets up of cushion 6 is according to the chip is placed the district and is set for the quantity and decide, and when piecing together case 1 and placing 7 combinations of case and finishing, the one end of cushion 6 on the shrouding 5 extends to the chip and places the district in and offset with the one end of placing the chip, and the other end of placing the chip offsets with the 6 one end of cushion of placing 7 one end settings of case, the material of cushion 6 is selected to highly permeable sponge, can improve the ventilation effect of placing case 7 to a certain extent.

In this embodiment, the length and the width size of placing case 7 and shrouding 5 all are unanimous with 1 inner chamber length of assembly case and width size, and assembly case 1 finishes with placing case 7 equipment back, and the both ends of shrouding 5 offset with the one end of placing case 7 and the one end of concatenation fixture block 3 respectively.

The device is when using, place the chip and place the district in the chip, carry out the centre gripping on the horizontal direction to the chip through elasticity convex membrane 8, later will place 7 combinations of case to assembling 1 inner chambers of case again, then cover shrouding 5, cushion 6 on the shrouding 5 stretches into the chip and places the district in, the both ends of chip respectively with place 7 in the case and 6 one sides offsets of cushion on the shrouding 5, in order to carry out the ascending centre gripping of vertical side to the chip, later cover apron 2 again can, it piles up with splicing fixture block 3 realization combination to assemble case 1 and assemble between the case 1 accessible splice groove 4.

Example two

Referring to fig. 5 and 6, on the basis of embodiment 1, the protection effect on the chip is further improved, that is, two vertical plates 11 are connected and arranged at the bottom of the inner cavity of the assembly box 1, the placement box 7 is arranged between the two vertical plates 11, and an electrostatic adsorption block 12 is arranged between the vertical plates 11 and the side wall of the assembly box 1.

Further, the bottom of the inner cavity of the assembling box 1 is also provided with a vent plate 9 as shown in fig. 5-7, the vertical section of the vent plate 9 is concave, the vent plate 9 is provided with a plurality of vent holes 13, and the inner periphery of the vent plate 9 is provided with a plurality of drying agent bags 10.

In this embodiment, the length of the placing box 7 is consistent with the length of the distance between the two vertical plates 11, and after the assembling of the assembling box 1 and the placing box 7 is completed, the two ends of the placing box 7 respectively abut against one end of the sealing plate 5 and one end of the air-permeable plate 9.

The desiccant bag 10 and the electrostatic adsorption block 12 respectively play a role in keeping the inside of the assembled box 1 dry and preventing static electricity from affecting the chips, and the protection effect of the whole device on the chips during transportation is improved.

In the above embodiment, the protruding degree of the elastic convex film 8 and the thickness of the soft pad 6 can be changed and adjusted according to the thickness and length of the transported chips, and different types of chips can be selectively placed in one placing box 7 according to the adjustment.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The utility model provides a pin-connected panel chip transport case which characterized in that includes:

the splicing box (1) is provided with an opening at one end of the splicing box (1), and a splicing groove (4) is formed at the other end of the splicing box (1);

the chip packaging box comprises a placing box (7), wherein one end of the placing box (7) is provided with an opening, the inner cavity of the placing box (7) is divided into a plurality of chip placing areas through partition plates, elastic convex films (8) are arranged at two side ends of each partition plate and on the inner side wall of the placing box (7), and a plurality of cushions (6) are arranged at the other end of the placing box (7);

the sealing plate (5), one end of the sealing plate (5) is connected with a plurality of soft pads (6);

and the cover plate (2), the two ends of the cover plate (2) are connected with splicing fixture blocks (3), and the size of the splicing fixture blocks (3) is matched with that of the splicing grooves (4).

2. The assembled chip transport case according to claim 1, wherein the number of the soft pads (6) is matched with the number of the chip placement areas, and the soft pads (6) are made of highly air-permeable sponge.

3. The assembled chip transport case according to claim 1, wherein two vertical plates (11) are connected to the bottom of the inner cavity of the assembled case (1), the placement case (7) is arranged between the two vertical plates (11), and an electrostatic adsorption block (12) is arranged between the vertical plates (11) and the side walls of the assembled case (1).

4. The assembled chip transport case according to any one of claims 1 to 3, wherein the bottom of the inner cavity of the assembled case (1) is provided with a vent plate (9), the vertical section of the vent plate (9) is in a concave shape, and the vent plate (9) is provided with a plurality of vent holes (13).

5. The assembled chip transport case according to claim 4, wherein the gas permeable plate (9) is surrounded by a plurality of desiccant bags (10).