CN216648227U - Chip side detection device - Google Patents
Chip side detection device Download PDFInfo
- Publication number
- CN216648227U CN216648227U CN202123213869.9U CN202123213869U CN216648227U CN 216648227 U CN216648227 U CN 216648227U CN 202123213869 U CN202123213869 U CN 202123213869U CN 216648227 U CN216648227 U CN 216648227U
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- chip
- slide glass
- inspection apparatus
- detection device
- reflection
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- 238000001514 detection method Methods 0.000 title claims abstract description 25
- 239000011521 glass Substances 0.000 claims abstract description 30
- 238000007689 inspection Methods 0.000 claims description 14
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model discloses a chip side detection device which comprises a slide glass platform and at least two reflection modules, wherein the at least two reflection modules are arranged corresponding to the slide glass platform and are arranged in the circumferential direction of the slide glass platform at a certain angle so as to reflect the side mirror image of a chip to be detected.
Description
Technical Field
The utility model relates to the field of semiconductor chip detection, in particular to a chip side surface detection device.
Background
In the prior art, a chip product is normally placed in a tray, usually only the front and the back of the product are inspected, the side surfaces of the chip product do not need to be required, the substrate part on the side surface of the sputtered product is exposed by an internal circuit and is connected with a sputtering layer on the outer surface through a sputtering process to form a shielding loop, the side surface of the product needs to be inspected to ensure that the internal circuit of the substrate is completely wrapped, and the oxidation of a copper layer circuit is avoided.
Some existing packaging plants generally use equipment for side inspection, but the opening of the side inspection function increases the time for using a single product for the equipment inspection, so that the use efficiency of the equipment is reduced, and therefore, a plurality of production units do not perform side inspection on the product, so that the side quality of the product is not reasonably controlled, and particularly, the sputtering product has quality risks.
If the side faces of the product are to be inspected manually, the product is generally clamped, the side faces are upward according to each side face and are turned over one by one, each side face is inspected under a microscope, and in the turning process, the appearance of scratches is prone to being poor; the efficiency of this kind of mode inspection is very low, very extravagant human cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a side surface detection device of a chip, which avoids overturning a product, has high detection efficiency and saves cost.
In order to achieve the above object, the chip side detecting device provided by the present invention includes a slide platform and at least two reflection modules, wherein the at least two reflection modules are disposed corresponding to the slide platform and arranged at a certain angle in the circumferential direction of the slide platform to reflect the side mirror image of the chip to be detected.
Preferably, the detection device further comprises a fixing seat, a chip placing opening is formed in the fixing seat, the chip placing opening extends towards the inside of the fixing seat to form an accommodating cavity, and the slide glass platform and the at least two reflection modules are arranged at the bottom of the accommodating cavity.
Preferably, the slide glass platform is convexly arranged on the slide glass base, the four reflection modules are uniformly arranged in the circumferential direction of the slide glass platform, one end of each reflection module is fixedly connected with the chip placing port, and the other end of each reflection module is fixedly connected with the slide glass base.
Preferably, the chip placing opening is in an octagonal structure.
Preferably, the chip placing opening is of a quadrilateral structure.
Preferably, the certain angle is 45 degrees.
Preferably, the reflecting module is a plane mirror.
Preferably, the working surface of the slide platform is further provided with a vacuum hole, and the fixed seat is internally provided with a channel for connecting the vacuum hole with the outside.
Preferably, the detection device further comprises a vacuum generator, and the vacuum generator is connected with the channel of the fixing seat through a pipeline.
Preferably, the detection device further comprises a display module, and the display module is arranged above the slide platform.
Compared with the prior art, the chip side surface detection device has the chip carrying platform and the at least two reflection modules, the at least two reflection modules are arranged corresponding to the chip carrying platform and are arranged in the circumferential direction of the chip carrying platform at a certain angle so as to reflect the side surface mirror image of the chip, the mirror image of the side surface of the chip can be directly observed, the product does not need to be turned over, the detection efficiency is high, and the cost is saved.
Drawings
FIG. 1 is a schematic structural diagram of a chip side detection device according to an embodiment of the present invention in a use state.
Fig. 2 is a schematic perspective view of a fixing base of a chip side detection apparatus according to an embodiment of the utility model.
Fig. 3 is a schematic top view of a cavity of a holder of a chip side detection apparatus according to an embodiment of the utility model.
FIG. 4 is a schematic diagram of the connection between the vacuum generator and the fixing base of the chip side detecting device according to the embodiment of the utility model.
Detailed Description
In order to explain technical contents, structural features, and effects achieved by the present invention in detail, the following detailed description is given with reference to the embodiments and the accompanying drawings.
As shown in fig. 1 to 3, a chip side detecting apparatus according to an embodiment of the present invention includes a chip carrying platform 1 and at least two reflection modules 6, where the at least two reflection modules 6 are disposed corresponding to the chip carrying platform 1 and arranged in a circumferential direction of the chip carrying platform 1 at a certain angle to reflect a side mirror image of a chip to be detected.
As shown in fig. 2 to 3, the detection device further includes a fixing base 2, the fixing base 2 is a rectangular block, a chip placing opening 3 is formed in the fixing base 2, the chip placing opening 3 extends towards the inside of the fixing base 2 to form a containing cavity 4, and the slide glass platform 1 and the at least two reflection modules 6 are arranged at the bottom of the containing cavity 4.
Specifically, in this embodiment, the top of the fixing base 2 is provided with a chip placement opening 3, the inside of the fixing base is of a hollow structure, the accommodating cavity 4 corresponds to an area of orthographic projection of the chip placement opening 3 to the inside of the fixing base 2, and the slide glass platform 1 and the at least two reflection modules 6 are arranged in the middle of the bottom of the accommodating cavity 4.
In some other embodiments of the present invention, the top surface of the fixing base is provided with a groove, the chip placement opening corresponds to the notch of the groove, the accommodating cavity corresponds to the inner space of the groove, and the slide platform and the at least two reflection modules 6 are disposed at the middle position of the bottom of the groove.
As shown in fig. 2 to 3, the slide glass platform 1 is convexly arranged on the slide glass base 5, the reflection modules 6 are four and are uniformly arranged in the circumferential direction of the slide glass platform 1, one end of each reflection module 6 is fixedly connected with the chip placing port 3, the other end of each reflection module is fixedly connected with the slide glass base 5, and the mirror image 11 of the slide glass platform can be seen in the reflection module 6.
Specifically, the chip placing port 3 is of an octagonal structure and comprises a first edge 31, a second edge 32, a third edge 33 and a fourth edge 34 which are arranged at intervals, the reflection module 6 is a plane reflector and comprises four first reflectors 61, second reflectors 62, third reflectors 63 and fourth reflectors 64, the angle between the reflection module 6 and the slide glass base 5 is 45 degrees, when a chip to be detected is placed on the slide glass platform 1, the first reflectors 61 are aligned to the first side surface of the chip, the second reflectors 62 are aligned to the second side surface of the chip, the third reflectors 63 are aligned to the third side surface of the chip, the fourth reflectors 64 are aligned to the fourth side surface of the chip, one end of the first reflectors 61 is fixedly connected with the slide glass base 5, the other end of the first reflectors is fixedly connected with the first edge 31, one end of the second reflectors 62 is fixedly connected with the slide glass base 5, the other end is fixedly connected with the second edge 32, one end of the third reflector 63 is fixedly connected with the slide glass base 5, the other end is fixedly connected with the third edge 33, one end of the fourth reflector 64 is fixedly connected with the slide glass base 5, and the other end is fixedly connected with the fourth edge 34. Set up into four with reflection module, can directly see the mirror image of every side, need not to remove the chip, simple structure, and greatly practiced thrift the human cost, the chip is placed mouthful 3 and is octagonal structure in addition, and the length on every limit is unanimous with every reflection module's width, plays the positioning action when the installation speculum module, and the installation is more accurate.
In other embodiments of the present invention, the chip placement opening has a quadrilateral structure, and the four reflection modules are respectively installed on four sides of the quadrilateral; the number of the reflection modules can be 2, the mirror images of two side surfaces can be seen at one time, the mirror images of the other two side surfaces can be seen only by rotating the chip to be detected once, and the operation is simple; in addition, the angle between the reflection module and the slide base can be other angles, such as 60 degrees, as long as a clear mirror image of the side of the chip can be seen.
As shown in fig. 2 to 4, in the embodiment of the present invention, a vacuum hole 7 is further formed in the top surface of the slide platform 1, i.e., the working surface on which the chip is placed, a channel for connecting the vacuum hole 7 with an external pipeline is formed in the fixing base 2, the detection device further includes a vacuum generator 8, and the vacuum generator 8 is connected with the channel of the fixing base 2 through a pipeline 9.
Specifically, there are two vacuum holes 7, and in some other embodiments, there may be one, three or four vacuum holes, etc., which may be determined according to actual needs.
The detection device further comprises a display module, and the display module is arranged above the slide glass platform 1. Specifically, as shown in fig. 1, the display module is a microscope 10, and the microscope 10 is disposed above the slide platform 1. In other embodiments, the display module may also be a camera, and the side image of the chip is projected onto the screen film through the camera for viewing.
As shown in fig. 1, the working principle of the testing device of the present invention is as follows: open vacuum generator 8, produce tiny vacuum in the fixing base 2, press from both sides and get and treat that the chip is placed on two vacuum holes 7 of slide glass platform 1, treat that the chip is adsorbed, under microscope 10, the adjustment focus for the side image of clear chip can be seen in reflection module to the people's eye, thereby carry out chip side and detect.
According to the chip side surface detection device in the off-line state, the chip to be detected is placed on the slide glass platform, the reflection module is arranged on the periphery of the slide glass platform to reflect the side surface mirror image of the chip to be detected, so that the side surface detection by turning the chip is avoided, the structure is simple, the chip is greatly protected, and the labor cost is saved.
The above disclosure is only a preferred embodiment of the present invention, and certainly should not be taken as limiting the scope of the present invention, which is therefore intended to cover all equivalent changes and modifications within the scope of the present invention.
Claims (10)
1. A chip side detection device is characterized in that: the detection device comprises a slide glass platform and at least two reflection modules, wherein the at least two reflection modules are arranged corresponding to the slide glass platform and are arranged in the circumferential direction of the slide glass platform at a certain angle so as to reflect the side mirror image of the chip to be detected.
2. A chip side inspection apparatus as claimed in claim 1, wherein: the detection device further comprises a fixing seat, a chip placing opening is formed in the fixing seat, a containing cavity is formed in the chip placing opening and extends towards the inside of the fixing seat, and the slide glass platform and the at least two reflection modules are arranged at the bottom of the containing cavity.
3. A chip side inspection apparatus as claimed in claim 2, wherein: the chip carrying platform is convexly arranged on the chip carrying base, the four reflection modules are uniformly arranged in the circumferential direction of the chip carrying platform, one end of each reflection module is fixedly connected with the chip placing port, and the other end of each reflection module is fixedly connected with the chip carrying base.
4. A chip side inspection apparatus as claimed in claim 3, wherein: the chip placing opening is of an octagonal structure.
5. A chip side inspection apparatus as claimed in claim 3, wherein: the chip placing opening is of a quadrilateral structure.
6. The chip side inspection apparatus of any of claims 1-5, wherein: the certain angle is 45 degrees.
7. The chip side inspection apparatus of claim 6, wherein: the reflecting module is a plane reflecting mirror.
8. A chip side inspection apparatus as claimed in claim 2, wherein: the detection device further comprises a vacuum generator, and the vacuum generator is connected with the channel of the fixed seat through a pipeline.
9. The chip side inspection apparatus of claim 8, wherein: the vacuum holes are two.
10. The chip side inspection apparatus of claim 6, wherein: the detection device further comprises a display module, and the display module is arranged above the slide glass platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123213869.9U CN216648227U (en) | 2021-12-16 | 2021-12-16 | Chip side detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123213869.9U CN216648227U (en) | 2021-12-16 | 2021-12-16 | Chip side detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216648227U true CN216648227U (en) | 2022-05-31 |
Family
ID=81744417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123213869.9U Active CN216648227U (en) | 2021-12-16 | 2021-12-16 | Chip side detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216648227U (en) |
-
2021
- 2021-12-16 CN CN202123213869.9U patent/CN216648227U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231026 Address after: 523000 No. 7, Zhenyuan West Road, Chang'an Town, Dongguan City, Guangdong Province Patentee after: Liance Youte semiconductor (Dongguan) Co.,Ltd. Address before: 523000 Zhen'an science and Technology Industrial Park, Zhen'an Road, Chang'an Town, Dongguan City, Guangdong Province Patentee before: Lewin semiconductor (Dongguan) Co.,Ltd. |
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| TR01 | Transfer of patent right |