CN213749564U - Automatic optical detection system - Google Patents
Automatic optical detection system Download PDFInfo
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- CN213749564U CN213749564U CN202022524481.XU CN202022524481U CN213749564U CN 213749564 U CN213749564 U CN 213749564U CN 202022524481 U CN202022524481 U CN 202022524481U CN 213749564 U CN213749564 U CN 213749564U
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Abstract
The application discloses an automatic optical detection system, which comprises a first image acquisition device, a transparent support film and a second image acquisition device; the first image acquisition device and the second image acquisition device are respectively arranged on two opposite sides of the transparent support film, and the lens of the first image acquisition device and the lens of the second image acquisition device respectively face the transparent support film. In this application, through set up image acquisition equipment respectively in the top and the below of transparent support membrane, after the chip that awaits measuring is placed on transparent support membrane, first image acquisition equipment and second image acquisition equipment can acquire the image at the chip back and positive image respectively, can accomplish outward appearance according to the image at the back and detect, can accomplish photoelectric property according to positive image and detect. Therefore, the method realizes that images on two sides of the chip are acquired in one process, and further can achieve the purpose of detecting two sides of the chip at one time, reduce production processes, accelerate production beats and save production resources.
Description
Technical Field
The application relates to the technical field of automatic detection, in particular to an automatic optical detection system.
Background
Wafers (also called epitaxy, wafer, sapphire substrate or epitaxial wafer) are carriers used for producing integrated circuits, and are often used in the display lighting industry, especially in the light-emitting diode (LED) display industry, where the wafers are used to produce LED chips.
When the wafer is used for producing the LED chip, in order to improve the product yield, it is indispensable to carry out photoelectric property detection on the front surface of the LED chip and carry out appearance detection on the back surface. Specifically, in the chip processing process, after the die reversing is completed, appearance detection is performed on the back face of the chip, and sorting is performed once after the appearance detection is completed. Then the front surface of the chip is subjected to photoelectric performance detection, and then the chip is sorted again.
However, the above-mentioned detection method for the front and back of the chip requires two sorting processes, which seriously affects the production process and wastes production resources.
SUMMERY OF THE UTILITY MODEL
In view of the defects of the prior art, the present application aims to provide an automatic optical detection system, which aims to solve the problem that when the front and the back of a chip are detected, the detection needs to be performed twice, so that twice sorting is needed, the production process is affected, and the production resources are wasted.
The present application provides an automated optical inspection system comprising: a first image acquisition device, a transparent support film, and a second image acquisition device; the first image acquisition device and the second image acquisition device are respectively arranged on two opposite sides of the transparent support film, and the lens of the first image acquisition device and the lens of the second image acquisition device respectively face the transparent support film; the transparent supporting film is used for placing a chip to be tested, the first image acquisition equipment is used for acquiring an image of the back face of the chip to be tested, and the second image acquisition equipment is used for acquiring an image of the front face of the chip to be tested.
In this embodiment, by respectively arranging the image acquisition devices above and below the transparent support film, after the chip to be tested is placed on the transparent support film, the first image acquisition device and the second image acquisition device can respectively acquire the image of the back surface and the image of the front surface of the chip, the appearance detection can be completed according to the image of the back surface, and the photoelectric performance detection can be completed according to the image of the front surface. Therefore, the method realizes that images on two sides of the chip are acquired in one process, and further can achieve the purpose of detecting two sides of the chip at one time, reduce production processes, accelerate production beats and save production resources.
Optionally, the automatic optical inspection system further comprises: a first light source device and a first half mirror; the first half mirror is arranged between the lens of the first image acquisition device and the transparent support film, the reflecting surface of the first half mirror faces the transparent support film, and an included angle of 45 degrees is formed between the reflecting surface of the first half mirror and the transparent support film; the light emitting surface of the first light source device faces the reflecting surface of the first half mirror, and the light emitting surface of the first light source device is perpendicular to the plane where the lens of the first image acquisition device is located. The light beam that first light source equipment jetted out is through first half speculum reflection back, and perpendicular directive is transparent to support the membrane to with the back illumination of chip, provide the light source for first image acquisition equipment, make the image of acquireing more clear, with the improvement utilize the accurate degree when chip back image detection outward appearance.
Optionally, the first light source device comprises a monochromatic light emitting diode light source. The appearance of the back of the chip is detected only by detecting gray scale difference, so that the monochromatic light emitting diode light source is arranged, and when the image of the back of the chip is obtained, the monochromatic light source is provided, so that the requirement can be met, and the energy can be saved.
Optionally, the brightness of the light beam emitted by the first light source device is adjustable. The brightness of the light beam emitted by the first light source device is adjustable, so that the first light source device can provide a light source for the first image acquisition device when photographing, and can also provide a background light source for the second image acquisition device when photographing, so that the backlight brightness of the second image acquisition device when photographing is ensured, the definition of the acquired image on the front surface of the chip is improved, and the detection precision of the photoelectric performance of the front surface is improved.
Optionally, the automatic optical inspection system further comprises: a first light homogenizing plate; the first dodging plate is arranged around a beam path of the first light source device. The first light homogenizing plate can improve the uniformity of light beams emitted by the first light source equipment, and reduce the probability that bright spots or dark spots may appear when the light beams irradiate the back of the chip.
Optionally, the automatic optical inspection system further comprises: a clamp; the clamp comprises a first arc-shaped clamp and a second arc-shaped clamp; the two sides of the transparent supporting film are respectively fixed by the first arc-shaped clamp and the second arc-shaped clamp, and the first arc-shaped clamp and the second sliding clamp enclose a circular area so that the transparent supporting film is circular. The fixture only fixes the edge of the transparent support film, so that the transparent support film can be kept flat, and the chip can be kept flat after being placed on the transparent support film. In addition, because of the anchor clamps only the centre gripping transparent support membrane's border, can not shelter from the middle part of transparent support membrane, consequently first image acquisition equipment can see through the image that transparent support membrane obtained the chip back, does not have any other separator, can increase the definition of image to promote detection accuracy.
Optionally, the automatic optical inspection system further comprises: a second light source device and a second half mirror; the second half mirror is arranged between the lens of the second image acquisition device and the transparent support film, the reflecting surface of the second half mirror faces the transparent support film, and an included angle of 45 degrees is formed between the reflecting surface of the second half mirror and the transparent support film; the light emitting surface of the second light source device faces the reflecting surface of the second half mirror, and the light emitting surface of the second light source device is perpendicular to the plane where the lens of the second image acquisition device is located. The light beam emitted by the second light source device can vertically irradiate to the transparent support film after being reflected by the second half mirror so as to illuminate the front of the chip, so that the image of the front of the chip obtained by the second image acquisition device is clearer, and the detection precision of photoelectric performance is improved.
Optionally, the second light source device comprises a three-colour light emitting diode light source.
Optionally, the automatic optical inspection system further comprises: a second light homogenizing plate; the second light unifying plate is disposed around a beam path of the second light source apparatus. The second light homogenizing plate can improve the uniformity of light beams emitted by the second light source equipment, and reduce the probability that bright spots or dark spots may appear when the light beams irradiate the front surface of the chip.
Optionally, the automatic optical inspection system further comprises: an annular light source device; the annular light source device is arranged between the transparent support film and the second image acquisition device, and a light emergent surface of the annular light source device faces the transparent support film. The annular light source device can emit light beams in 360 degrees, so that the chip is illuminated in 360 degrees, and the image acquired by the second image acquisition device is clearer.
Drawings
FIG. 1 is a schematic structural diagram of an automatic optical inspection system according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of another automatic optical inspection system according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a clamp according to an embodiment of the present disclosure;
fig. 4 is another schematic structural diagram of a clamp according to an embodiment of the present application.
Description of reference numerals:
100-a first image acquisition device, 200-a transparent support film, 210-a clamp, 210 a-an upper clamp, 210 b-a lower clamp, 220-a first arc clamp, 230-a second arc clamp, 300-a second image acquisition device, 400-a first light source device, 500-a first half mirror, 600-a second light source device, 700-a second half mirror, 800-a ring light source device, 900-a first light homogenizing plate, 910-a second light homogenizing plate.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
As shown in fig. 1, an automatic optical inspection system provided in an embodiment of the present application includes: a first image capturing device 100, a transparent support film 200 and a second image capturing device 300.
Specifically, the first image capturing device 100 and the second image capturing device 300 are disposed on opposite sides of the transparent support film 200, respectively, and the lens of the first image capturing device 100 and the lens of the second image capturing device 300 face the transparent support film 200, respectively.
In detail, the transparent support film 200 is used for placing a chip to be tested, the first image capturing device 100 is used for capturing an image of the back surface of the chip to be tested, and the second image capturing device 300 is used for capturing an image of the front surface of the chip to be tested.
In the Automatic Optical Inspection (AOI) system provided in the embodiment of the present application, the first image capturing apparatus 100 is disposed below the transparent support film 200, the second image capturing apparatus 300 is disposed above the transparent support film 200, and respective lenses of the first image capturing apparatus 100 and the second image capturing apparatus 300 face the transparent support film 200, respectively. When in use, a chip to be tested is placed on the transparent support film 200, and the front surface of the chip to be tested faces upwards and the back surface of the chip to be tested faces downwards. Then, the first image acquiring apparatus 100 acquires an image of the back surface of the chip to be tested, and the second image acquiring apparatus 300 acquires an image of the front surface of the chip to be tested. And then, judging the appearance of the back surface of the chip to be detected according to the image of the back surface of the chip to be detected, and judging the photoelectric performance according to the image of the front surface of the chip to be detected. Therefore, the operation of detecting the front side and the back side of the chip is finished in one process, so that the chip is sorted for one time subsequently, the production process is accelerated, and the production resources are saved. In addition, only one detection operation and only one sorting operation are needed, so that a large number of crystal grains cannot be directly sorted, the accuracy of the test can be improved, the probability of storing the original point can be improved, and the possibility of correct point alignment can be increased.
It can be seen from above that, the AOI system that this application embodiment provided sets up an image acquisition device respectively through the transparent supporting film 200 both sides placing the chip to realize that a process gathers the image on chip two sides, and then can reach the purpose that once only detects chip two sides, reduced production processes, accelerated the production beat, practiced thrift manufacturing resource.
It will be understood by those skilled in the art that the image of the chip may be acquired by the first image acquisition apparatus 100 first acquiring the image of the back side of the chip and then acquiring the image of the front side of the chip by the second image acquisition apparatus 300. Or conversely, the second image capturing device 300 first captures an image of the front side of the chip, and the first image capturing device 100 then captures an image of the back side of the chip.
It will also be appreciated by those skilled in the art that each of the first image acquisition device 100 and the second image acquisition device 300 may be a Charge Coupled Device (CCD) camera having characteristics of small size, light weight, immunity to magnetic fields, vibration resistance, and impact resistance. Therefore, the CCD camera adopted in the embodiment of the application can reduce the volume of the whole system, reduce the weight of the whole system and increase the stability of the system in working.
In an alternative embodiment, referring to fig. 3 and 4, the AOI system further includes a clamp 210, wherein the clamp 210 includes a first arc-shaped clamp 220 and a second arc-shaped clamp 230, the first arc-shaped clamp 220 and the second arc-shaped clamp 230 respectively fix two sides of the transparent support film 200, and the first arc-shaped clamp 220 and the second sliding clamp enclose a circular area so that the transparent support film 200 is circular.
The jig 210 fixes only the edge of the transparent support film 200, and may keep the transparent support film 200 flat, thereby keeping the chip flat after being placed on the transparent support film 200. In addition, because the clamp 210 only clamps the edge of the transparent support film 200, the middle of the transparent support film 200 is not blocked, so that the first image acquisition device 100 can acquire the image of the back surface of the chip through the transparent support film 200 without any other spacer, thereby increasing the definition of the image and improving the detection precision. It will be appreciated by those skilled in the art that the fixture 210 may be made of teflon, thereby reducing the weight of the fixture 210 and reducing damage to the transparent support film 200.
The first and second arc clips 220 and 230 each include an upper clip 210a and a lower clip 210b, and the upper and lower clips 210a and 210b are hinged so that the first and second arc clips 220 and 230 can be opened or closed to clamp the transparent support film 200 when closed. In order to ensure that the first arc-shaped clips 220 and the second arc-shaped clips 230 can be smoothly opened and closed, the radian of each of the first arc-shaped clips 220 and the second arc-shaped clips 230 is set to be 170 degrees to 175 degrees, so that the first arc-shaped clips 220 and the second arc-shaped clips 230 do not interfere with each other when being opened and closed while the transparent support film 200 can be clamped.
In an alternative embodiment, referring to fig. 2, the AOI system further includes: a first light source device 400 and a first half mirror 500. The first half mirror 500 is disposed between the lens of the first image capturing apparatus 100 and the transparent support film 200, with the reflective surface of the first half mirror 500 facing the transparent support film 200 and the reflective surface of the first half mirror 500 and the transparent support film 200 forming a 45-degree angle. And, the light emitting surface of the first light source device 400 faces the reflection surface of the first half mirror 500, and the light emitting surface of the first light source device 400 is perpendicular to the plane where the lens of the first image pickup device 100 is located. Therefore, after being reflected by the first half mirror 500, the light beam emitted by the first light source device 400 vertically irradiates to the transparent support film 200, that is, vertically irradiates to the back of the chip to illuminate the back of the chip, so that the image of the back of the chip obtained by the first image acquisition device 100 is clearer, and the appearance detection precision is improved. Of course, the first half mirror 500 has a certain light transmittance, and thus the first image pickup apparatus 100 can pick up an image of the back surface of the chip through the first half mirror 500.
Optionally, the first light source device 400 comprises a monochromatic light emitting diode light source. The appearance of the back of the chip is detected only by detecting gray scale difference, so that the monochromatic light emitting diode light source is arranged, and when the image of the back of the chip is obtained, the monochromatic light source is provided, so that the requirement can be met, and the energy can be saved.
Optionally, the brightness of the light beam emitted by the first light source device 400 is adjustable. The brightness of the light beam emitted by the first light source device 400 is adjustable, so that the first light source device 400 can provide a light source for the first image acquisition device 100 when taking a picture, and can also provide a background light source for the second image acquisition device 300 when taking a picture, so as to ensure the backlight brightness of the second image acquisition device 300 when taking a picture, improve the definition of the acquired image on the front surface of the chip, and improve the detection precision of the photoelectric performance on the front surface of the chip. Specifically, the first light source device 400 may be set to a high light state when the first image capturing device 100 takes a picture, and the first light source device 400 may be set to a low light state when the second image capturing device 300 takes a picture. The illumination intensity of the specific highlight state may be between 1000 lux (lux, lx) and 5000 lx; the illumination intensity in the low light state may be between 200lx and 1000 lx. Of course, the illumination intensities of the actual highlight state and the low-highlight state need to be combined with the light sensing capabilities of the first image acquisition apparatus 100 and the second image acquisition apparatus 300.
In an alternative embodiment, continuing to refer to fig. 2, the AOI system further comprises a first smoothing plate 900, the first smoothing plate 900 being arranged around the beam path of the first light source apparatus 400. That is, the light beam emitted from the first light source apparatus 400 is surrounded by the first light uniformizing plate 900, thereby improving the uniformity of the light beam and reducing the probability of bright spots or dark spots that may occur when the light beam irradiates the back surface of the chip.
In an alternative embodiment, continuing to refer to FIG. 2, the AOI system further includes a second light source apparatus 600 and a second half mirror 700. The second half mirror 700 is disposed between the lens of the second image capturing apparatus 300 and the transparent support film 200, the reflecting surface of the second half mirror 700 faces the transparent support film 200, and the reflecting surface of the second half mirror 700 and the transparent support film 200 form an angle of 45 degrees. And the light emitting surface of the second light source device 600 faces the reflection surface of the second half mirror 700, and the light emitting surface of the second light source device 600 is perpendicular to the plane where the lens of the second image capturing device 300 is located. After the light beam emitted by the second light source device 600 is reflected by the second half mirror 700, the light beam can vertically irradiate to the transparent support film 200 to illuminate the front surface of the chip, so that the image of the front surface of the chip obtained by the second image acquisition device 300 is clearer, and the detection precision of the photoelectric performance is improved. Of course, the second half mirror 700 has a light transmittance, so that the second image pickup apparatus 300 can pick up an image of the front surface of the chip through the second half mirror 700.
Optionally, the second light source device 600 comprises a three-color light emitting diode light source. Because the chip to be detected is provided with various different materials, the emissivity of the various materials to the light sources with different colors is different, and the materials need to be selected according to the characteristics of the materials to be detected on the chip to be detected. For example, the chip surface has a zinc material, and the zinc material has a high reflectivity to red light, so that red light can be selected for illumination when a zinc material module needs to be detected. Of course, red light may be selected as the main light, and blue light or green light may be used as the supplementary light. Therefore, the light source with the proper color can be selected in a targeted mode, the definition of the shot picture is increased, and the detection accuracy is enhanced.
In an alternative embodiment, continuing to refer to fig. 2, the AOI system further includes a ring light source apparatus 800; the ring-shaped light source device 800 is disposed between the transparent support film 200 and the second image capturing device 300 with the light-emitting surface of the ring-shaped light source device 800 facing the transparent support film 200. As the name implies, the ring-shaped light source device 800 can emit light beams in 360 degrees, so that the chip is illuminated in 360 degrees, and the image acquired by the second image acquisition device 300 is clearer.
In an alternative embodiment, continuing to refer to fig. 2, the AOI system further comprises a second smoothing plate 910, the second smoothing plate 910 being disposed around the beam path of the second light source apparatus 600. That is, the light beam emitted from the second light source device 600 is surrounded by the second light homogenizing plate 910, thereby improving the uniformity of the light beam and reducing the probability of bright spots or dark spots when the light beam irradiates the front surface of the chip.
It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.
Claims (10)
1. An automated optical inspection system, comprising: a first image acquisition device, a transparent support film, and a second image acquisition device;
the first image acquisition device and the second image acquisition device are respectively arranged on two opposite sides of the transparent support film, and the lens of the first image acquisition device and the lens of the second image acquisition device respectively face the transparent support film;
the transparent supporting film is used for placing a chip to be tested, the first image acquisition equipment is used for acquiring an image of the back face of the chip to be tested, and the second image acquisition equipment is used for acquiring an image of the front face of the chip to be tested.
2. The automated optical inspection system of claim 1, further comprising: a first light source device and a first half mirror;
the first half mirror is arranged between the lens of the first image acquisition device and the transparent support film, the reflecting surface of the first half mirror faces the transparent support film, and an included angle of 45 degrees is formed between the reflecting surface of the first half mirror and the transparent support film;
the light emitting surface of the first light source device faces the reflecting surface of the first half mirror, and the light emitting surface of the first light source device is perpendicular to the plane where the lens of the first image acquisition device is located.
3. The automated optical inspection system of claim 2, wherein the first light source device comprises a monochromatic light emitting diode light source.
4. The automated optical inspection system of claim 2, wherein the first light source device emits a light beam having an adjustable brightness.
5. The automated optical inspection system of claim 2, further comprising: a first light homogenizing plate; the first dodging plate is arranged around a beam path of the first light source device.
6. The automated optical inspection system of any of claims 1 to 5, further comprising: a clamp; the clamp comprises a first arc-shaped clamp and a second arc-shaped clamp;
the first arc-shaped clamp and the second arc-shaped clamp are fixed on two sides of the transparent support film respectively, and a circular area is enclosed by the first arc-shaped clamp and the second arc-shaped clamp, so that the transparent support film is circular.
7. The automated optical inspection system of any of claims 1 to 5, further comprising: a second light source device and a second half mirror;
the second half mirror is arranged between the lens of the second image acquisition device and the transparent support film, the reflecting surface of the second half mirror faces the transparent support film, and an included angle of 45 degrees is formed between the reflecting surface of the second half mirror and the transparent support film;
and the light-emitting surface of the second light source device faces the reflecting surface of the second half mirror, and the light-emitting surface of the second light source device is perpendicular to the plane where the lens of the second image acquisition device is located.
8. The automated optical inspection system of claim 7, wherein the second light source device comprises a tri-color light emitting diode light source.
9. The automated optical inspection system of claim 7, further comprising: a second light homogenizing plate; the second light unifying plate is disposed around a beam path of the second light source apparatus.
10. The automated optical inspection system of any of claims 1 to 5, further comprising: an annular light source device;
the annular light source device is arranged between the transparent support film and the second image acquisition device, and a light emitting surface of the annular light source device faces the transparent support film.
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| CN202022524481.XU CN213749564U (en) | 2020-11-04 | 2020-11-04 | Automatic optical detection system |
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| CN202022524481.XU CN213749564U (en) | 2020-11-04 | 2020-11-04 | Automatic optical detection system |
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| CN213749564U true CN213749564U (en) | 2021-07-20 |
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