CN216647305U

CN216647305U - Microcontroller heat radiation structure based on FLASH

Info

Publication number: CN216647305U
Application number: CN202220164221.2U
Authority: CN
Inventors: 张玉祥; 史凯旋
Original assignee: Langrui Semiconductor Technology Nanjing Co ltd
Current assignee: Langrui Semiconductor Technology Nanjing Co ltd
Priority date: 2022-01-21
Filing date: 2022-01-21
Publication date: 2022-05-31
Anticipated expiration: 2032-01-21

Abstract

The utility model discloses a microcontroller heat dissipation structure based on FLASH, belonging to the technical field of chip heat dissipation, the microcontroller heat dissipation structure based on FLASH comprises a water tank, a chip body, a first heat dissipation assembly and a second heat dissipation assembly, wherein the first heat dissipation assembly comprises a plurality of heat dissipation fins, an upper mounting plate and a lower mounting plate are respectively mounted on the heat dissipation fins at two ends, rotating shaft seats are respectively mounted on the upper surfaces of the mounting plates at the two ends, a rectangular frame is arranged between the mounting plates at the two ends, a rotating shaft is slidably mounted at one side of the rectangular frame, a fan is fixedly mounted on the rectangular frame, the rotating shaft is pulled by a connecting rod to retract into a first chute by poking two poking plates, the rectangular frame is placed on the upper mounting plate, a pair of poking plates are loosened, the rotating shaft is pushed to be inserted into the rotating shaft seat in a spring elastic potential energy reset state, the rectangular frame is fixed, and the fan is convenient to disassemble and clean through the quick mounting method, the heat dissipation capacity of the fan is improved.

Description

Microcontroller heat radiation structure based on FLASH

Technical Field

The utility model belongs to the field, and particularly relates to a microcontroller heat dissipation structure based on FLASH.

Background

The FLASH memory has the characteristics of high speed, convenience and the like, and is a necessary tool for people to use computers for office and entertainment.

The existing chip can only radiate through self or is additionally provided with a fan to radiate, but after the chip is used for a long time, the fan is troublesome to disassemble, so that dust is seriously blocked, the radiating effect is poor, the chip is directly burnt down seriously, and the service life of the chip is greatly reduced.

SUMMERY OF THE UTILITY MODEL

Aiming at the problems mentioned in the background technology, the utility model aims to provide a microcontroller heat dissipation structure based on FLASH to solve the problems mentioned in the background technology.

The technical purpose of the utility model is realized by the following technical scheme:

a microcontroller heat radiation structure based on FLASH comprises a water tank, a chip body, a first heat radiation assembly and a second heat radiation assembly, wherein the water tank, the chip body, the first heat radiation assembly and the second heat radiation assembly are sequentially mounted together through bolts, the first heat radiation assembly comprises a plurality of heat radiation fins, an upper mounting plate and a lower mounting plate are mounted on the heat radiation fins at two ends of the first heat radiation assembly, the upper mounting plate and the lower mounting plate are parallel to each other, a rotating shaft seat is mounted on the upper surface of the upper mounting plate at two ends, the rotating shaft seat is fixedly mounted at two ends of any upper mounting plate along the length direction, a rectangular frame is arranged between the upper mounting plates at two ends, a rotating shaft is slidably mounted at one side of the rectangular frame close to the rotating shaft seat, a fan is fixedly mounted on the rectangular frame, two oppositely-arranged stirring plates are stirred to enable the two stirring plates to be close to each other, the poking plates pull the rotating shaft to retract into the first sliding groove through the connecting rod, the rectangular frame is placed on the upper mounting plate, the pair of poking plates are loosened, the rotating shaft is pushed to be inserted into the rotating shaft seat in the reset state of the elastic potential energy of the spring, the rectangular frame is fixed, the fan is conveniently disassembled and cleaned through the quick installation method, and the heat dissipation capacity of the fan is improved.

Preferably, the rectangular frame is internally provided with a first sliding groove, the surface of the rectangular frame is provided with a second sliding groove, the rotating shaft is slidably connected in the first sliding groove on the rectangular frame, one end of the rotating shaft, which is close to the rotating shaft seat, penetrates through the rectangular frame and is rotatably connected in the rotating shaft seat, the rotating shaft is integrally and vertically provided with a connecting rod, and one end of the connecting rod, which is far from the rotating shaft, penetrates through the second sliding groove and is provided with a poking plate.

Preferably, a spring is connected between the other end of the rotating shaft and the inner wall of the first sliding groove on the rectangular frame.

Preferably, the rectangular frame is internally provided with a first filter screen, and one surface of the fan, which is far away from the first filter screen, is provided with a second filter screen.

Preferably, the second heat dissipation assembly comprises a cooling pipe which is installed between the plurality of heat dissipation fins in a serpentine shape, openings at two ends of the cooling pipe are communicated with the inside of the water tank, a water pump is installed in the water tank, and an output end of the water pump is connected with an opening at one end of the cooling pipe.

Preferably, a plurality of shock pads are installed on one side, close to the chip body, of the water tank, and heat dissipation grooves are formed in the shock pads.

In summary, the utility model mainly has the following beneficial effects:

firstly, the two oppositely arranged poking plates are poked to enable the two poking plates to be close to each other, the poking plates pull the rotating shaft to retract into the first sliding groove through the connecting rod, the rectangular frame is placed on the upper mounting plate, the pair of poking plates are loosened, the rotating shaft is pushed to be inserted into the rotating shaft seat in the spring elastic potential energy reset state, the rectangular frame is fixed, the fan can be conveniently detached and cleaned through the quick mounting method, and the heat dissipation capacity of the fan is improved;

the second, install the shock pad between water tank and chip body and improved chip body antidetonation effect, protected the integrality of chip body, seted up the radiating groove on a plurality of shock pads, the radiating groove is used for the circulation of inside air, takes away the produced partial heat of chip body, improves the radiating effect.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;

FIG. 3 is a schematic view of the internal structure of the first sliding chute of the present invention;

fig. 4 is a schematic view of the internal structure of the water tank of the present invention.

Reference numerals: 1. a water tank; 2. a chip body; 3. heat dissipation fins; 4. an upper mounting plate; 5. a lower mounting plate; 6. a rotating shaft seat; 7. a first filter screen; 8. a rotating shaft; 9. a fan; 10. a rectangular frame; 1001. A first chute; 1002. a second chute; 11. a spring; 12. a connecting rod; 13. a poking plate; 14. a second filter screen; 15. a cooling tube; 16. a water pump; 17. a shock pad; 18. a heat dissipation groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-3, a microcontroller heat dissipation structure based on FLASH includes a water tank 1, a chip body 2, a first heat dissipation assembly and a second heat dissipation assembly, the water tank 1, chip body 2, first radiator unit and second radiator unit pass through the bolt and install in proper order together, first radiator unit includes a plurality of radiator fin 3, radiator fin 3 material is the copper sheet, the heat that chip body 2 produced can be conducted fast to the copper product heat conduction piece, all install mounting panel 4 and lower mounting panel 5 on the radiator fin 3 that is located first radiator unit both ends, it is parallel to each other with lower mounting panel 5 to go up mounting panel 4, mounting panel 4 upper surface all installs pivot seat 6 on both ends, pivot seat 6 fixed mounting is at arbitrary mounting panel 4 along length direction's both ends of going up, be provided with rectangular frame 10 between the mounting panel 4 on both ends, one side slidable mounting that rectangular frame 10 is close to pivot seat 6 has pivot 8.

Wherein, rectangular frame 10 has seted up first spout 1001 inside, rectangular frame 10 has seted up second spout 1002 on the surface, first spout 1001 is the notch cuttype with second spout 1002, pivot 8 sliding connection is in first spout 1001 on rectangular frame 10, and the one end that pivot 8 is close to pivot seat 6 runs through rectangular frame 10 and rotate and connect in pivot seat 6, connecting rod 12 is installed perpendicularly to the integrated into one piece formula in the pivot 8, connecting rod 12 is kept away from the one end of pivot 8 and is run through second spout 1002 and install stirring board 13, through stirring two stirring boards 13 that set up relatively, make two stirring boards 13 be close to each other, stirring board 13 stimulates pivot 8 through connecting rod 12 and controls being connected between rectangular frame 10 and the last mounting panel 4 at the gliding distance of first spout 1001.

Wherein, the rectangular frame 10 is fixedly provided with a fan 9, the fan 9 works to drive air to blow through the heat dissipation fins 3 quickly to take away heat on the chip body 2, and the heat dissipation effect of the chip body 2 is improved.

Specifically, referring to the drawing, a spring 11 is connected between the other end of the rotating shaft 8 and the inner wall of the first sliding groove 1001 on the rectangular frame 10, and after the rectangular frame 10 is placed between the rotating shaft seats 6 which are oppositely arranged, the pair of toggle plates 13 is loosened, and the rotating shaft 8 is pushed to be inserted into the rotating shaft seats 6 in a state that the spring 11 is reset by elastic potential energy, so as to fix the rectangular frame 10.

Specifically, referring to the drawing, a first filter screen 7 is installed in the rectangular frame 10, a second filter screen 14 is installed on one side of the fan 9 far away from the first filter screen 7, and the filter screens on the two sides play a role in double dust prevention for the fan 9.

Specifically, please refer to fig. the second heat dissipation assembly includes a cooling pipe 15 installed in a serpentine shape between a plurality of heat dissipation fins 3, both openings at both ends of the cooling pipe 15 are communicated with the inside of the water tank 1, a water pump 16 is installed in the water tank 1, an output end of the water pump 16 is connected with an opening at one end of the cooling pipe 15, the water pump 16 conveys the cooling liquid in the water tank 1 to the cooling pipe 15, the cooling pipe 15 increases a cooling liquid circulation path due to the serpentine shape, so that the cooling liquid in the cooling pipe 15 improves a self-cooling effect through a long path when carrying away heat on the heat dissipation fins 3, and finally flows back to the water tank 1 to complete water path circulation.

Specifically, please refer to the figure, a plurality of shock pads 17 are installed on one side of the water tank 1 close to the chip body 2, the shock pads 17 are made of rubber materials, the shock-proof effect of the chip body 2 is improved, the integrity of the chip body 2 is protected, heat dissipation grooves 18 are formed in the shock pads 17, the heat dissipation grooves 18 are used for circulating internal air, partial heat generated by the chip body 2 is taken away, and the heat dissipation effect is improved.

The use principle and the advantages are as follows: when the cooling device is used, the two oppositely arranged poking plates 13 are poked to enable the two poking plates 13 to be close to each other, the poking plates 13 pull the rotating shaft 8 to retract into the first sliding groove 1001 through the connecting rod 12, the rectangular frame 10 is placed on the upper mounting plate 4, the pair of poking plates 13 are loosened, the rotating shaft 8 is pushed to be inserted into the rotating shaft seat 6 in the elastic potential energy reset state of the spring 11 to fix the rectangular frame 10, the water pump 16 conveys cooling liquid in the water tank 1 into the cooling pipe 15, the cooling pipe 15 increases the cooling liquid circulation path due to the snake shape, so that the cooling liquid in the cooling pipe 15 carries partial heat on the heat dissipation fins 3 and finally flows back into the water tank 1 to complete waterway circulation, the fan 9 works to drive air to blow through the heat dissipation fins 3 to carry away heat on the chip body 2, and partial heat dissipation effect of the chip body 2 is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a microcontroller heat radiation structure based on FLASH, includes water tank (1), chip body (2), first radiator unit and second radiator unit, water tank (1), chip body (2), first radiator unit and second radiator unit pass through the bolt and install its characterized in that in proper order together: first radiator unit includes a plurality of radiator fin (3), all installs mounting panel (4) and lower mounting panel (5) on radiator fin (3) that are located first radiator unit both ends, it is parallel to each other with lower mounting panel (5) to go up mounting panel (4), both ends it all installs pivot seat (6) to go up mounting panel (4) upper surface, pivot seat (6) fixed mounting is at arbitrary mounting panel (4) both ends along length direction, both ends go up and are provided with rectangular frame (10) between mounting panel (4), one side slidable mounting that rectangular frame (10) are close to pivot seat (6) has pivot (8), fixed mounting has fan (9) on rectangular frame (10).

2. The microcontroller heat dissipation structure based on FLASH of claim 1, wherein: first spout (1001) have been seted up to rectangular frame (10) inside, second spout (1002) have been seted up on rectangular frame (10) surface, pivot (8) sliding connection is in first spout (1001) on rectangular frame (10), and pivot (8) are close to the one end of pivot seat (6) and run through rectangular frame (10) and rotate the connection in pivot seat (6), connecting rod (12) are installed perpendicularly to integrated into one piece formula on pivot (8), the one end that pivot (8) were kept away from in connecting rod (12) runs through second spout (1002) and installs toggle plate (13).

3. The FLASH-based microcontroller heat dissipation structure of claim 2, wherein: and a spring (11) is connected between the other end of the rotating shaft (8) and the inner wall of the first sliding groove (1001) on the rectangular frame (10).

4. The microcontroller heat dissipation structure based on FLASH of claim 1, wherein: install first filter screen (7) in rectangular frame (10), second filter screen (14) are installed to the one side that first filter screen (7) were kept away from in fan (9).

5. The microcontroller heat dissipation structure based on FLASH of claim 1, wherein: the second heat dissipation assembly comprises a plurality of cooling pipes (15) arranged between the heat dissipation fins (3) in a snake-shaped mode, openings at two ends of each cooling pipe (15) are communicated with the inside of the water tank (1), a water pump (16) is arranged in the water tank (1), and the output end of the water pump (16) is connected with the opening at one end of each cooling pipe (15).

6. The microcontroller heat dissipation structure based on FLASH of claim 1, wherein: a plurality of shock pads (17) are installed to one side that water tank (1) is close to chip body (2), and is a plurality of radiating groove (18) have been seted up on shock pad (17).