CN216647255U - Electronic device - Google Patents

Abstract

The application provides an electronic device, which relates to the technical field of electronic devices; the electronic device includes a chassis; the circuit board is arranged in the accommodating space of the case, and is provided with a plurality of plug-in structures, and each plug-in structure is respectively used for plugging devices with different functions; the circuit board comprises a first surface and a second surface which are opposite, and at least one plug-in structure is arranged on the first surface and the second surface respectively; the heat dissipation module is respectively arranged on the first surface and the second surface of the circuit board, is stacked with the devices inserted into the at least one insertion structure and is used for dissipating heat of the corresponding devices; wherein the stacking direction of the heat dissipation module and the device is perpendicular to the first surface and the second surface. This application technical scheme can reach rational utilization quick-witted incasement space, reduces quick-witted case size, guarantees good radiating effect simultaneously.

Description

Electronic device

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

Based on the improvement of network and performance requirements, desktop high-performance workstations are more and more favored by customers, and how to reasonably utilize space and reduce the size of a case is a problem to be solved at present.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide electronic equipment, so that the space layout is reasonably utilized, and the size of a case is reduced.

In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:

the application provides an electronic device, this electronic device includes: a chassis;

the circuit board is arranged in the accommodating space of the case, and is provided with a plurality of plug-in structures, and each plug-in structure is respectively used for plugging devices with different functions;

the circuit board comprises a first surface and a second surface which are opposite, and at least one plug-in structure is arranged on the first surface and the second surface respectively;

the heat dissipation module is respectively arranged on the first surface and the second surface of the circuit board, is stacked with the devices inserted into the at least one insertion structure and is used for dissipating heat of the corresponding devices;

wherein the stacking direction of the heat dissipation module and the device is perpendicular to the first surface and the second surface.

In some variations of the present application, the plurality of plug structures includes at least one of a processor socket, a high-speed serial computer expansion bus standard socket, a memory socket, a hard disk socket, and a network card socket.

In some modified embodiments of the present application, the case includes a first sidewall, and a side of the case opposite to the first sidewall is an opening adapted to the circuit board;

the first side wall is provided with an air outlet, the heat dissipation module forms a heat dissipation channel between the opening and the air outlet, and the direction from the first side wall to the opening is a first direction.

In some modified embodiments of the present application, the heat dissipation module includes a heat dissipation plate stacked with the corresponding device, and the heat dissipation fan is disposed on a side of the heat dissipation plate close to the opening and has an air outlet direction facing the heat dissipation plate.

In some modified embodiments of the present application, the first surface of the circuit board is provided with a first plug structure and a second plug structure in parallel along a second direction;

wherein the second direction is perpendicular to the first direction.

In some variations of the present application, the first plug structure is the processor socket, and the second plug structure is the high-speed serial computer expansion bus standard socket.

In some modified embodiments of the present application, the first surface of the circuit board is provided with two sets of the heat dissipation modules, and the two sets of the heat dissipation modules are respectively corresponding to the first plug structure and the second plug structure, and are used for forming a heat dissipation channel between the opening and the air outlet, wherein the heat dissipation channel is respectively corresponding to the first plug structure and the second plug structure.

In some variations of the present application, the fins of two sets of the heat dissipation modules overlap to form a heat transfer channel.

In some modified embodiments of the present application, two opposite sides of the circuit board in the second direction are respectively provided with a first sliding mechanism extending along the first direction, and the first sliding mechanism is used for being slidably connected with a third side wall and a fourth side wall of the chassis opposite in the second direction, so that the circuit board can slide back and forth along the first direction.

In some modified embodiments of the present application, the third side wall and the fourth side wall of the chassis are respectively provided with a second sliding mechanism cooperating with the first sliding mechanism, and the first sliding mechanism is slidably connected with the second sliding mechanism so that the circuit board can slide back and forth along the first direction.

Compared with the prior art, the electronic equipment provided by the application has the advantages that the first surface and the second surface, opposite to the circuit board, in the case are respectively provided with the multiple slot structures, so that the devices can be respectively inserted into two sides of the circuit board, and the heat dissipation modules which are stacked with at least one device are arranged on the two sides of the circuit board, so that the heat dissipation efficiency of the devices can be improved, the space in the case can be reasonably utilized, the size of the case can be reduced, the space can be saved, the use requirement of a user can be met, and the use experience of the user can be improved; and the assembly mode of the circuit board and the case is simple and convenient, and the system is convenient to upgrade and expand.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:

fig. 1 schematically illustrates a main structure diagram of an electronic device provided in the present application;

fig. 2 schematically illustrates a structural diagram of a first surface of a circuit board of an electronic device provided by the present application;

fig. 3 schematically illustrates a structural diagram of a second surface of a circuit board of an electronic device provided by the present application;

fig. 4 schematically illustrates a structural diagram of a slot structure of a first surface of a circuit board of an electronic device provided in the present application;

fig. 5 schematically illustrates a structural diagram of a slot structure on a second surface of a circuit board of an electronic device provided in the present application;

the reference numbers indicate:

the computer case comprises a case 1, a circuit board 2, a processor slot 201, a memory slot 202, a high-speed serial computer expansion bus standard slot 203, a hard disk slot 204, a network card slot 205, a first sliding mechanism 21, a heat dissipation module 3, a heat dissipation sheet 301, a lap joint portion 3011, a heat dissipation fan 302, a processor 4, a memory 5, a high-speed serial computer expansion bus standard card 6, a hard disk 7 and a network card 8.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.

With reference to fig. 1-5, an embodiment of the present application provides an electronic device, including: a chassis 1; the circuit board 2 is arranged in the accommodating space of the case 1, and a plurality of plug-in structures are arranged on the circuit board 2, and each plug-in structure is respectively used for plugging devices with different functions; the circuit board 2 comprises a first surface and a second surface which are opposite, and the first surface and the second surface are respectively provided with at least one plug-in structure; the heat dissipation module 3 is respectively arranged on the first surface and the second surface of the circuit board 2, and the devices inserted into the at least one insertion structure are stacked and arranged for dissipating heat of the corresponding devices; wherein, the stacking direction of the heat dissipation module 3 and the device is perpendicular to the first surface and the second surface.

Specifically, the electronic device provided by the embodiment of the application can be a desktop workstation, a desktop computer or the like; in the technical scheme that this application adopted, electronic equipment's structure includes: case 1 and set up in the inside circuit board 2 of the accommodation space of case 1, be provided with multiple grafting structure on circuit board 2, every kind of grafting structure can be used for pegging graft the device of different functions, for example: but not limited to, the system comprises a hard disk slot for plugging a hard disk, a processor slot 201 for plugging a processor 4, a high-speed serial computer expansion bus standard slot 203 for plugging a high-speed serial computer expansion bus standard card 6 and the like; at present, how rational utilization machine case 1 inner space, the problem that needs to solve at present with the size that reduces electronic equipment's machine case 1, for solving this problem, in the technical scheme that this application was taken, circuit board 2 includes relative first surface and second surface, and be provided with at least one kind foretell grafting structure on first surface and the second surface respectively, can make circuit board 2's both sides homoenergetic peg graft the device, compare in the scheme of only through circuit board 2 unilateral peg graft device of present adoption, can be reasonable and abundant utilize the inside accommodation space of machine case 1, thereby can reduce machine case 1's size, thereby can save space, improve user's use experience.

Furthermore, in use, the continuous operation of the devices plugged on the circuit board 2 can generate a large amount of heat, and based on the scheme that the plugging structures are arranged on the two sides of the circuit board 2, the heat dissipation modules 3 of the electronic equipment are also respectively arranged on the first surface and the second surface of the circuit board 2, so that the heat dissipation of the devices plugged by the plugging structures on the two sides of the circuit board 2 is realized; when the heat dissipation module is arranged, the heat dissipation device and the device inserted into at least one insertion structure on the circuit board 2 can be stacked, and the stacking direction is perpendicular to the first surface and the second surface of the circuit board 2, so that the space occupied by the heat dissipation module 3 can be reduced while the device is effectively dissipated, and the internal layout of the case 1 is reasonable; the heat dissipation module 3 can realize heat dissipation and temperature reduction of the device in an air cooling heat dissipation mode.

According to the above list, the embodiment of the application provides an electronic device, the first surface and the second surface that are opposite through circuit board 2 in machine case 1 set up multiple slot structure respectively, can realize the device of pegging graft respectively in circuit board 2's both sides, and set up the heat dissipation module 3 of piling up the arrangement with at least one device in circuit board 2's both sides, can promote the radiating efficiency to the device, simultaneously can the inside space of rational utilization machine case 1, be favorable to reducing machine case 1's size, in order to satisfy user's user demand, improve user's use and experience.

Through the double-sided design, the slots can be respectively arranged on the two sides of the mainboard, the double-sided design can be used for arranging components such as a processor 4, a display card, a memory and the like, the space can be reasonably utilized, and therefore the size of the case 1 is reduced, and a drawer-type assembly mode is adopted, so that system upgrading or maintenance and the like are facilitated; through set up thermal module 3 respectively in the both sides of mainboard, can promote the radiating efficiency.

Further, referring to fig. 4 and 5, in an implementation, the above-mentioned various slots may include, but are not limited to: one or more of a processor slot 201, a high-speed serial computer expansion bus standard slot 203, a memory slot 202, a hard disk slot 204 and a network card slot 205; the processor slot 201 may be used to plug a Central Processing Unit (Central Processing Unit, CPU for short) 4 as an operation and control core of the system; a high-speed serial computer expansion bus (PCI-E) slot 203 for inserting and supporting a high-speed serial computer expansion bus standard card 6, hereinafter referred to as PCI-E standard card; the memory slot 202 is used for plugging the memory 5; the hard disk slot 204 can be used for plugging the solid state disk 7; the network card slot 205 is used for plugging the network card 8; of course, the types of the slots that can be arranged on the circuit board 2 are not limited to the above slots, and are not described in detail here.

Specifically, referring to fig. 4 and 5, in the technical solutions adopted in the present application, for example: a processor slot 201, two memory slots 202 and a high-speed serial computer expansion bus standard slot 203 may be arranged on a first surface of the circuit board 2, and two memory slots 202, a high-speed serial computer expansion bus standard slot 203, a network card slot 205 and two hard disk slots 204 may be arranged on a second surface of the circuit board 2, where the PCI-E slot high-speed serial computer expansion bus standard slot 203 on the first surface may be used to plug a PCI-E × 16 standard card, the high-speed serial computer expansion bus standard slot 203 on the second surface may be used to plug a PCI-E × 8 standard card, and the hard disk slots 204 may be used to plug the m.2 solid state disk 7.

Further, refer to fig. 1, for realizing the high-efficient heat dissipation to the device of pegging graft on the circuit board 2, in concrete implementation, one side of machine case 1 is opening form and this opening and circuit board 2 adaptation, the first side wall of box is relative with the opening, and set up air outlet (not shown in the figure) on the first side wall, when thermal module 3 during operation, can form heat dissipation channel between the opening of air outlet and machine case 1, thereby can realize conducting the temperature that the device of machine case 1 inside produced to the machine case 1 outside, in order to reach the inside cooling of machine case 1, to the high-efficient radiating effect of device.

Further, referring to fig. 1 to fig. 3, in an implementation, the heat dissipation module 3 may adopt an air-cooling heat dissipation manner, which specifically includes: the radiating fin 301 is stacked with at least one device, and the radiating fan 302 is arranged on one side of the radiating fin 301 close to the opening of the case 1, the air outlet direction of the radiating fan 302 faces the direction of the radiating fin 301, in the running process of the device, the radiating fin 301 can absorb the heat generated by the device, the radiating fan 302 can conduct the air on the opening side of the case 1 in the direction of the radiating fin 301, and the heat of the radiating fin 301 is conducted out from the air outlet of the case 1, so that the heat generated by the device in the case 1 can be continuously conducted out, the temperature of the device is favorably reduced, the adverse effect of high temperature on the device is avoided, and the service life of the device is favorably prolonged and the running stability of electronic equipment is favorably improved.

Further, referring to fig. 2 and fig. 4, in a specific implementation, a first plug structure and a second plug structure are arranged in parallel on the first surface of the circuit board 2 along a second direction, where the second direction is perpendicular to the first direction from the opening side of the chassis 1 to the air outlet, where the first plug structure may be a processor slot 201 for plugging the central processing unit, and the second plug structure may be a PCI-E slot for plugging the PCI-E standard card, and of course, the first plug structure and the second plug structure are not limited to the above two types of slots; in the operation process of the electronic equipment, the central processing unit and the PCI-E standard card have higher heat dissipation requirements, so that two heat dissipation modules 3 can be arranged on the first surface of the circuit board 2 and are respectively arranged corresponding to the first plug-in structure and the second plug-in structure, and through the matching of each group of heat dissipation fins 301 and the heat dissipation fan 302, heat dissipation channels can be respectively formed at the positions corresponding to the first plug-in structure and the second plug-in structure, so that the devices plugged by the first plug-in structure and the second slot can be simultaneously cooled, and the heat dissipation effect and the efficiency are improved; two sets of thermal module 3 can start simultaneously, stop, perhaps two sets of thermal module 3 can also the separate control, make two sets of thermal module 3 start according to the temperature of its device that corresponds, stop, for example: the controller of the case 1 can monitor the temperature of the devices corresponding to the two sets of heat dissipation modules 3 when the temperature of a certain device is higher than a set temperature value.

Further, referring to fig. 2, in a specific implementation, in order to further improve the heat dissipation efficiency of the device plugged in the first plugging structure and the second plugging structure, two heat dissipation fins 301 of two sets of heat dissipation modules 3 on the first surface of the circuit board 2 are provided with a lap joint portion 3011, so that the two heat dissipation fins 301 are overlapped with each other to form a heat transfer channel, when the temperature of the device corresponding to one of the two heat dissipation modules 3 is higher, the heat dissipation fin 301 of the other heat dissipation module 3 can absorb part of heat, and the heat is conducted to the outside of the chassis 1 through the heat dissipation of the side where the heat dissipation fin is located, so as to realize the cooperative heat dissipation of the two sets of heat dissipation modules 3, which can effectively improve the heat dissipation efficiency and efficiently cool down the device.

Further, referring to fig. 3, a set of heat dissipation modules 3 may be disposed on the second surface of the circuit board 2, and include heat dissipation fins 301 and heat dissipation fans 302, which may be used for dissipating heat of the m.2 solid state disk 7 inserted into the hard disk slot 204, where the heat dissipation fins 301 and the hard disk slot 204 are stacked to absorb heat generated by the solid state disk 7 and take the heat out of the chassis through the heat dissipation fans 302 to form a heat dissipation channel on the second surface of the circuit board 2.

Further, referring to fig. 1 to 3, in order to facilitate the assembly of the circuit board 2 with the chassis 1 and the system upgrade in use, in a specific implementation, first sliding mechanisms 21 extending along the first direction are arranged on two opposite sides of the circuit board 2 in the second direction, the first sliding mechanism 21 can be slidably connected to a third side wall and a fourth side wall opposite to each other in the second direction inside the chassis 1, and further, second sliding mechanisms (not shown in the figure) which are respectively arranged on the third side wall and the fourth side wall and correspond to and cooperate with the first sliding mechanism 21, when the circuit board 2 is installed in the case 1, the first sliding mechanisms 21 on both sides of the circuit board 2 are connected with the second sliding mechanisms on both sides of the case 1, the first sliding mechanism 21 slides relative to the second sliding mechanism, so that the circuit board 2 can be installed in the accommodating space of the case 1 in a sliding manner; the assembly mode of the case 1 and the circuit board 2 is similar to a drawer type design, so that convenient assembly and system upgrading and expansion can be realized.

It should be noted that in the description of the present specification, the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. An electronic device, comprising:

a chassis;

the circuit board is arranged in the accommodating space of the case, and is provided with a plurality of plug-in structures, and each plug-in structure is respectively used for plugging devices with different functions;

the circuit board comprises a first surface and a second surface which are opposite, and at least one plug-in structure is arranged on the first surface and the second surface respectively;

the heat dissipation module is respectively arranged on the first surface and the second surface of the circuit board, is stacked with the devices inserted into the at least one insertion structure and is used for dissipating heat of the corresponding devices;

wherein the stacking direction of the heat dissipation module and the device is perpendicular to the first surface and the second surface.

2. The electronic device of claim 1,

the plurality of plug-in structures at least comprise one of a processor slot, a high-speed serial computer expansion bus standard slot, a memory slot, a hard disk slot and a network card slot.

3. The electronic device of claim 2, further comprising:

the case comprises a first side wall, and one side of the case, which is opposite to the first side wall, is an opening matched with the circuit board;

the first side wall is provided with an air outlet, the heat dissipation module forms a heat dissipation channel between the opening and the air outlet, and the direction from the first side wall to the opening is a first direction.

4. The electronic device of claim 3,

the heat dissipation module comprises heat dissipation fins arranged in a stacked mode with the corresponding devices and a heat dissipation fan arranged on one side, close to the opening, of each heat dissipation fin, and the air outlet direction of each heat dissipation fin faces towards the corresponding heat dissipation fin.

5. The electronic device of claim 4,

the first surface of the circuit board is provided with a first plug-in structure and a second plug-in structure in parallel along a second direction;

wherein the second direction is perpendicular to the first direction.

6. The electronic device of claim 5,

the first plug structure is the processor slot, and the second plug structure is the high-speed serial computer expansion bus standard slot.

7. The electronic device of claim 5,

the first surface of the circuit board is provided with two groups of heat dissipation modules, the two groups of heat dissipation modules are respectively arranged corresponding to the first plug-in structure and the second plug-in structure, and heat dissipation channels respectively corresponding to the first plug-in structure and the second plug-in structure are formed between the opening and the air outlet.

8. The electronic device of claim 7,

the radiating fins of the two groups of radiating modules are mutually overlapped to form a heat transfer channel.

9. The electronic device of claim 1,

the two opposite sides of the circuit board in the second direction are respectively provided with a first sliding mechanism extending along the first direction, and the first sliding mechanisms are used for being in sliding connection with a third side wall and a fourth side wall of the case opposite to each other in the second direction, so that the circuit board can slide back and forth along the first direction.

10. The electronic device of claim 9,

and the third side wall and the fourth side wall of the case are respectively provided with a second sliding mechanism matched with the first sliding mechanism, and the first sliding mechanism is in sliding connection with the second sliding mechanism so that the circuit board can slide back and forth along the first direction.

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