CN216626237U

CN216626237U - PCB (printed circuit board) chip packaging structure capable of being rapidly distributed

Info

Publication number: CN216626237U
Application number: CN202123083673.2U
Authority: CN
Inventors: 樊颖
Original assignee: LUOYANG WEIXIN ELECTRONIC TECHNOLOGY CO LTD
Current assignee: LUOYANG WEIXIN ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2021-12-09
Filing date: 2021-12-09
Publication date: 2022-05-27
Anticipated expiration: 2031-12-09

Abstract

The utility model provides a but PCB board chip package structure of quick overall arrangement, relate to PCB technical field, which comprises a plate body, the equal transverse arrangement in both ends is equipped with the pad about the plate body upper surface, the position that the upper surface of plate body is located between the pad is equipped with the silk screen printing layer, the middle part at both ends is equipped with parallel horizontal bar two and horizontal bar one respectively about the silk screen printing layer upper surface, the middle part at both ends is equipped with parallel vertical bar two and vertical bar one respectively around the silk screen printing layer upper surface, vertical bar two and vertical bar one are located the outside at both ends around horizontal bar two and the horizontal bar one respectively, be equipped with silk screen printing strip one between the center of two inboards of horizontal bar and the center of a horizontal bar inboard. According to the utility model, through the matching action of the transverse bar II, the transverse bar I, the vertical bar II, the vertical bar I, the silk-screen printing bar II and the like arranged on the silk-screen printing layer between the pads of the board body, the purposes of performing rapid layout according to the position of a chip, not influencing the continuous operation of subsequent layout and wiring of the built package and not delaying the progress of the work are achieved.

Description

PCB (printed circuit board) chip packaging structure capable of being rapidly distributed

Technical Field

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a PCB chip packaging structure capable of being rapidly distributed.

Background

At present, when a PCB (printed circuit board) is packaged in the early period, because the chip information of individual devices is incomplete or the types of the devices are wrong, a chip packaging structure cannot be embodied on the PCB in the first time, and circuits cannot be distributed according to the positions of the chips, so that the subsequent layout and wiring work of the built package cannot be continued, and the progress of the work is delayed.

Disclosure of Invention

In order to overcome the defects in the background art, the utility model aims to provide a PCB chip packaging structure capable of being quickly arranged, and the utility model achieves the purposes of quickly arranging according to the position of a chip, not influencing the continuous operation of the subsequent arrangement and wiring work of the built package and not delaying the progress of the work by the matching action of a horizontal bar II, a horizontal bar I, a vertical bar II, a vertical bar I, a silk-screen printing bar I and the like arranged on a silk-screen printing layer between pads of a plate body.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme:

the utility model provides a but PCB board chip package structure of quick overall arrangement, which comprises a plate body, the equal transverse arrangement in both ends is equipped with the pad about the plate body upper surface, the position that the upper surface of plate body is located between the pad is equipped with the silk screen printing layer, the middle part at both ends is equipped with parallel horizontal bar two and horizontal bar one respectively about silk screen printing layer upper surface, the middle part at both ends is equipped with parallel vertical bar two and vertical bar one respectively around the silk screen printing layer upper surface, vertical bar two and vertical bar one are located the outside at both ends around horizontal bar two and the horizontal bar one respectively, be equipped with silk screen printing strip one between the center of two inboards of horizontal bar and the center of a horizontal bar inboard, be equipped with silk screen printing strip two between the center of two inboards of vertical bar and the center of a vertical bar, silk screen printing strip one and silk screen printing strip two are in horizontal bar two, horizontal bar one, the center department between vertical bar two and the vertical bar one forms the crosspoint.

The rear end of the first transverse bar is provided with a first guide head, the left end of the first vertical bar is provided with a second guide head, the front end of the second transverse bar is provided with a third guide head, the right end of the second vertical bar is provided with a fourth guide head, and the first guide head, the second guide head, the third guide head and the fourth guide head are distributed along the anticlockwise direction.

And the left end and the right end of the upper surface of the silk-screen layer are positioned on the outer sides of the transverse bars II and the transverse bars I, and silk-screen pins II and silk-screen pins I corresponding to the bonding pads are respectively arranged and arranged, and the silk-screen pins II and the silk-screen pins I are rectangular.

And the front side of the screen printing pin II is provided with an auxiliary guide head II, and the rear side of the screen printing pin I is provided with an auxiliary guide head I.

The thicknesses of the transverse bar II, the transverse bar I, the vertical bar II and the vertical bar I are larger than those of the screen printing bar I and the screen printing bar II, and an embedding groove is formed among the transverse bar II, the transverse bar I, the vertical bar II and the vertical bar I.

And the rear side of the vertical bar II is correspondingly provided with a semi-circular arc-shaped directional inspection seal.

The thicknesses of the transverse bar II, the transverse bar I, the vertical bar II and the vertical bar I are larger than those of the silk screen printing bar I and the silk screen printing bar II, and the end points are closed to form a rectangular frame body.

Due to the adoption of the technical scheme, the utility model has the following beneficial effects:

according to the PCB chip packaging structure capable of being quickly arranged, disclosed by the utility model, through the matching action of the transverse bar II, the transverse bar I, the vertical bar II, the vertical bar I, the silk-screen bar II and the like arranged on the silk-screen layer between the pads of the board body, the quick arrangement can be carried out according to the position of the chip, the placement of the chip is more accurate and standard, the follow-up arrangement and wiring work of the built package is not influenced, and the progress of the work is not delayed.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic top view of the present invention.

Fig. 3 is a schematic structural diagram of embodiment 2 of the present invention.

Fig. 4 is a schematic top view of embodiment 2 of the present invention.

In the figure: 1. a plate body; 2. printing a first foot by screen printing; 3. a pad; 4. printing a first silk screen strip; 5. a first horizontal bar; 6. a first guide head; 7. a first auxiliary guide head; 8. screen printing layer; 9. a first vertical bar; 10. a second silk-screen strip; 11. a second guiding head; 12. a second horizontal bar; 13. printing a second pin by silk screen; 14. a third guiding head; 15. a second auxiliary guide head; 16. a vertical bar II; 17. directional checking and printing; 18. and a fourth guiding head.

Detailed Description

The present invention will be explained in detail by the following examples.

Referring to the attached figures 1-4, a PCB chip packaging structure capable of being rapidly arranged comprises a plate body 1, wherein the left end and the right end of the upper surface of the plate body 1 are transversely provided with bonding pads 3, a silk-screen layer 8 is arranged on the upper surface of the plate body 1 at a position between the bonding pads 3, the middle parts of the left end and the right end of the upper surface of the silk-screen layer 8 are respectively provided with a second parallel transverse bar 12 and a first transverse bar 5, the middle parts of the front end and the rear end of the upper surface of the silk-screen layer 8 are respectively provided with a second parallel vertical bar 16 and a first vertical bar 9, the second vertical bar 16 and the first vertical bar 9 are respectively arranged on the outer sides of the front end and the rear end of the second transverse bar 12 and the first transverse bar 5, a first silk-screen strip 4 is arranged between the center of the inner side of the second transverse bar 12 and the center of the inner side of the first transverse bar 5, a second silk-screen strip 10 is arranged between the center of the inner side of the second vertical bar 16 and the inner side of the first vertical bar 9, and the first silk-screen strip 4 and the second silk-screen strip 10 form a cross point at the center among the second transverse bar 12, the first transverse bar 5, the center of the first vertical bar 16 and the first vertical bar 9, when the chip is missing or the model is not matched and can not be installed on the PCB temporarily, by searching the position of the silk-screen layer 8 and regarding the position as the position of the chip to be packaged later, and the intersection point at the center of the bonding pad 3 can be regarded as the center position of the chip, so that the subsequent circuit layout of the package can be laid out according to the first silk-screen strip 4, the second silk-screen strip 10 and the intersection points of the first silk-screen strip 4 and the second silk-screen strip 10, the routing of the chip can also be continued before the appropriate type of package is not selected, bar two 12 and bar one 5 acting as the boundaries between the area of the pads 3 and the area of the chip bonding, before the packaging of a proper type is not selected, the transverse bar II 12, the transverse bar I5, the vertical bar II 16 and the vertical bar I9 can be respectively regarded as a side line of the chip to assist the proceeding of the circuit layout work, and the subsequent chip placement can be used as a reference line, so that the placement of the chip is more accurate and standard.

In order to facilitate the layout of circuits according to the pin sequencing of the chips, the rear end of the first transverse bar 5 is provided with a first guide head 6, the left end of the first vertical bar 9 is provided with a second guide head 11, the front end of the second transverse bar 12 is provided with a third guide head 14, the right end of the second vertical bar 16 is provided with a fourth guide head 18, and the first guide head 6, the second guide head 11, the third guide head 14 and the fourth guide head 18 are distributed along the anticlockwise direction, in particular, because the pins on the chips are sequenced from the pins below the notch in the anticlockwise direction, in order to more intuitively display the pin sequencing direction of the subsequent chips after packaging, the pin sequencing direction plays a role in pointing to the pin sequencing by arranging the first guide head 6, the second guide head 11, the third guide head 14 and the fourth guide head 18 at corresponding end points along the anticlockwise direction on the second transverse bar 12, the first transverse bar 5, the second vertical bar 16 and the first vertical bar 9, the corresponding end points, and further facilitates the judgment of the sequencing of the pins of the subsequent chips, thereby laying out the wires according to the pin order.

In order to prompt a worker to package the pins of a subsequent chip, the left end and the right end of the upper surface of a silk-screen layer 8 are respectively provided with a second silk-screen foot 13 and a first silk-screen foot 2 which correspond to a bonding pad 3 and are respectively arranged at the positions outside a second transverse bar 12 and a first transverse bar 5, the pins of the chip are replaced by the second silk-screen foot 13 and the first silk-screen foot 2, circuits can be laid out according to the positions of the second silk-screen foot 13 and the first silk-screen foot 2, in order to enable the packaging position of the subsequent chip to be more accurate, the second silk-screen foot 13 and the first silk-screen foot 2 are both rectangular, as most of the pins of the chip are rectangular, when each pin of the chip is aligned with the corresponding second silk-screen foot 13 or the first silk-screen foot 2, or each pin completely covers the second silk-screen foot 13 or the first silk-screen foot 2, or each pin is positioned in the center of the second silk-screen foot 13 or the first silk-screen foot 2, and whether the positions of the second silk-screen foot 13 or the first silk-screen foot 2 are aligned or not, can be used as a reference for the chip to be corrected.

In order to enable the sequencing of the pins to be more visual, an auxiliary guide head II 15 is arranged on the front side of a screen printing pin II 13, an auxiliary guide head I7 is arranged on the rear side of a screen printing pin I2, and when the chip is welded, the direction of the sequencing of the pins can be more visually observed and judged through the auxiliary guide head II 15 and the auxiliary guide head I7.

For the position of better firm chip, the thickness of horizontal bar two 12, horizontal bar one 5, vertical bar two 16 and vertical bar one 9 is greater than the thickness of screen printing strip one 4 and screen printing strip two 10, horizontal bar two 12, horizontal bar one 5, form between vertical bar two 16 and the vertical bar one 9 and inlay the groove, make the chip can place in inlaying the groove, screen printing strip one 4 and screen printing strip two 10 are equivalent to the bottom of inlaying the groove, horizontal bar two 12 all around, horizontal bar one 5, vertical bar two 16 and vertical bar one 9 are equivalent to the cell wall, make the difficult skew that produces of chip.

In order to recognize the orientation of the chip of the subsequent package more quickly, so as to facilitate the circuit arrangement of the chip, and in order to avoid safety accidents caused by reverse connection of the circuit due to the error of the swinging direction of the chip, the rear side of the vertical bar II 16 is correspondingly provided with a semi-circular arc-shaped directional check stamp 17, the edge of the chip is generally provided with a notch or a mark for prompting the pin direction of the chip, so as to prompt the position of the first pin, and the subsequent pins are sequenced in a reverse clock mode, so that a worker can be prompted to swing the direction of the chip of the subsequent package by arranging the directional check stamp 17 corresponding to the notch or the mark on the chip on the outer side of the vertical bar II 16, the efficiency of the circuit arrangement work is improved, the circuit arrangement is more accurate, and after the chip is arranged on the board, if the chip swings correctly, the notch or the mark of the chip is positioned on the same side as the directional check stamp 17 and is respectively positioned on both sides of the vertical bar II 16, if the chip swings towards the direction, the breach or the seal of a mark of chip is kept away from directional check seal 17 then, and is located vertical bar 9 one side to after the chip is put, can judge through the chip breach or the position relation of seal of a mark and directional check seal 17 whether the chip pendulum to correct, thereby avoid pendulum to making mistakes and causing the incident.

In order to enable the chip to be placed more stably, the thicknesses of the second transverse bar 12, the first transverse bar 5, the second vertical bar 16 and the first vertical bar 9 are larger than the thicknesses of the first silk-screen printing bar 4 and the second silk-screen printing bar 10, and end points are closed to form a rectangular frame body.

Embodiment 1, a PCB chip package structure capable of fast layout, when a chip is missing or the type is not matched and cannot be mounted on a PCB temporarily, by finding the position of a silk-screen layer 8 and regarding it as the position of the chip to be packaged later, and regarding the intersection point at the center of a pad 3 as the center position of the chip, so that the subsequent circuit layout of the package can be laid out according to these first silk-screen strips 4 and second silk-screen strips 10 and their intersection points, before the package of the proper type is not selected, the circuit layout of the chip can be continued, the second cross strips 12 and the first cross strips 5 can be used as the boundary lines between the area where the pad 3 is located and the chip soldering area, before the package of the proper type is not selected, the second cross strips 12, the first cross strips 5, the second vertical strips 16 and the first vertical strips 9 can be respectively considered as a side line of the chip, the subsequent chip placement can be used as a reference line to assist the circuit layout work, so that the placement of the chip is more accurate and standard.

Embodiment 2 is a PCB chip packaging structure capable of layout quickly, and compared with embodiment 1, the thickness of the second transverse bar 12, the first transverse bar 5, the second vertical bar 16 and the first vertical bar 9 is larger than that of the first screen printing bar 4 and that of the second screen printing bar 10, and the end points are closed to form a rectangular frame body, so that a chip can be placed on the screen printing layer 8 more stably.

Claims

1. The utility model provides a but PCB board chip package structure of quick overall arrangement, includes plate body (1), characterized by: the plate is characterized in that pads (3) are transversely arranged at the left end and the right end of the upper surface of the plate body (1), a screen printing layer (8) is arranged at a position between the pads (3) on the upper surface of the plate body (1), parallel transverse bars II (12) and transverse bars I (5) are arranged at the middle parts of the left end and the right end of the upper surface of the screen printing layer (8), parallel vertical bars II (16) and vertical bars I (9) are arranged at the middle parts of the front end and the rear end of the upper surface of the screen printing layer (8) respectively, vertical bars II (16) and vertical bars I (9) are arranged at the outer sides of the front end and the rear end of the transverse bars II (12) and the transverse bars I (5) respectively, screen printing bars I (4) are arranged between the centers of the inner sides of the transverse bars II (12) and the inner sides of the transverse bars I (5), screen printing bars II (10) are arranged between the centers of the inner sides of the vertical bars II (16) and the inner sides of the vertical bars I (9), and screen printing bars II (4) and screen printing bars II (10) are arranged between the transverse bars II (12) and the inner sides of the transverse bars II (12), The centers of the transverse bar I (5), the vertical bar II (16) and the vertical bar I (9) form a cross point.

2. The PCB chip packaging structure capable of being rapidly arranged according to claim 1, wherein: the rear end of the transverse bar I (5) is provided with a guide head I (6), the left end of the vertical bar I (9) is provided with a guide head II (11), the front end of the transverse bar II (12) is provided with a guide head III (14), the right end of the vertical bar II (16) is provided with a guide head IV (18), and the guide head I (6), the guide head II (11), the guide head III (14) and the guide head IV (18) are distributed along the anticlockwise direction.

3. The PCB chip packaging structure capable of being rapidly arranged according to claim 1, wherein: the positions of the left end and the right end of the upper surface of the silk-screen layer (8) on the outer sides of the transverse bars (12) and the transverse bars (5) are respectively provided with silk-screen pins (13) and silk-screen pins (2) corresponding to the bonding pads (3), and the silk-screen pins (13) and the silk-screen pins (2) are rectangular.

4. The PCB chip packaging structure capable of being rapidly arranged according to claim 3, wherein: and the front side of the second screen printing pin (13) is provided with a second auxiliary guide head (15), and the rear side of the first screen printing pin (2) is provided with a first auxiliary guide head (7).

5. The PCB chip packaging structure capable of being rapidly arranged according to claim 1, wherein: the thickness of the transverse bar II (12), the transverse bar I (5), the vertical bar II (16) and the vertical bar I (9) is larger than that of the screen printing bar I (4) and the screen printing bar II (10), and an embedding groove is formed between the transverse bar II (12), the transverse bar I (5), the vertical bar II (16) and the vertical bar I (9).

6. The PCB chip packaging structure capable of being rapidly arranged according to claim 1, wherein: and a semi-circular arc-shaped directional inspection seal (17) is correspondingly arranged on the rear side of the second vertical bar (16).

7. The PCB chip package capable of being quickly laid out of claim 5, wherein: the thicknesses of the transverse bar II (12), the transverse bar I (5), the vertical bar II (16) and the vertical bar I (9) are larger than the end points of the screen printing bar I (4) and the screen printing bar II (10) to be closed, and a rectangular frame body is formed.