CN216624215U - Die bonding swing arm device - Google Patents
Die bonding swing arm device Download PDFInfo
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- CN216624215U CN216624215U CN202122760754.5U CN202122760754U CN216624215U CN 216624215 U CN216624215 U CN 216624215U CN 202122760754 U CN202122760754 U CN 202122760754U CN 216624215 U CN216624215 U CN 216624215U
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- force arm
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Abstract
The utility model relates to the technical field of chip packaging production, in particular to a die bonding swing arm device which comprises a force arm seat, a force arm piece and a picking piece, wherein the force arm piece is arranged on the force arm seat, the picking piece is arranged at one end, far away from the force arm seat, of the force arm piece, the force arm piece is provided with two detection pieces, and the two detection pieces are used for abutting against an external wafer and detecting the connection and disconnection of a contact with the contact height difference of the wafer. According to the utility model, the two detection pieces are arranged, the through section of the contact is judged according to the height difference of the contact between the closed loop and the wafer formed by the two detection pieces, and the height of the contact to the wafer is judged according to the on-off state of the contact, so that the detection effect is achieved.
Description
Technical Field
The utility model relates to the technical field of wafer processing and production, in particular to a die bonding swing arm device.
Background
The existing die bonding swing arm device has the following defects: when the swing arm picks up the wafer overpressure, the picking head avoids around the swing arm elastic joint arc, friction is easily generated on the surface of the wafer, the surface of the wafer is damaged, and defects are generated.
Disclosure of Invention
The utility model provides a die bonding swing arm device aiming at the problems in the prior art, which can prevent a picking head from damaging the surface of a wafer in the picking process.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the utility model provides a die bonding swing arm device which comprises a force arm seat, a force arm piece and a picking piece, wherein the force arm piece is arranged on the force arm seat, the picking piece is arranged at one end, far away from the force arm seat, of the force arm piece, the force arm piece is provided with two detection pieces, and the two detection pieces are used for forming a closed loop by utilizing the elasticity of a spring.
Further, the detection piece comprises a terminal connector and a terminal, the terminal connector is connected with the force arm piece, and the terminal is installed on the terminal connector.
Furthermore, arm of force spare is provided with two riveting holes, is provided with the riveting piece in the riveting hole, and the riveting piece spiro union has set screw, and set screw is used for fixing terminal connector and riveting piece.
Further, the two fixing screws interfere with each other.
Further, the force arm piece is provided with an installation piece, and an elastic piece is arranged between the installation piece and the force arm piece; the picking member is disposed at the mounting member.
Furthermore, the mounting piece is provided with a first clamping part, the first clamping part is connected with an arc-shaped part, the arc-shaped part is connected with a second clamping part, and mounting holes for mounting the picking piece are formed among the first clamping part, the arc-shaped part and the second clamping part; the first clamping part and the second clamping part are fixed through screws.
Furthermore, the arm of force piece is provided with an elastic hole, the elastic piece is arranged in the elastic hole, and the mounting piece is abutted against the elastic hole.
The utility model has the beneficial effects that: the wafer detecting device is provided with the two detecting pieces, the on-off of the loop is judged through the contact between the two detecting pieces forming the closed loop and the wafer, and the contact between the detecting pieces and the wafer is judged through the on-off of the loop, so that the stress of the wafer is judged, and the detecting effect is achieved.
Drawings
FIG. 1 is a schematic diagram of the present invention.
Fig. 2 is an exploded view of the present invention.
Fig. 3 is an enlarged view of fig. 1 at a.
Reference numerals: 1-arm of force seat, 2-arm of force piece, 3-picking member, 4-detection piece, 5-elastic component, 21-riveting hole, 22-riveting piece, 23-set screw, 24-installed part, 25-first clamping part, 26-arc portion, 27-second clamping part, 28-bullet hole, 41-terminal connector, 42-terminal.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention is described in detail below with reference to the attached drawings.
As shown in fig. 1 to 3, the die bonding swing arm device provided by the present invention includes a force arm base 1, a force arm 2 and a picking member 3, wherein the force arm 1 is disposed on the force arm base 2, the picking member 3 is disposed on one end of the force arm 2 away from the force arm base 1, the force arm 2 is provided with two detecting members 4, and the two detecting members 4 are used for abutting against an external wafer and forming a closed loop with the wafer.
The working principle of the present invention is well known in the art, for example, refer to the chinese utility model patent with patent number "CN 201922165782.5". The innovation points of the utility model are as follows: the detection piece 4 is arranged, the detection piece 4 is respectively contacted with the wafer before and after picking up, a closed loop is formed by the two detection pieces 4 and the wafer (the detection piece 4 is conducted with an external power supply when in use), and if the closed loop can be smoothly electrified, the wafer is qualified; if the closed loop can not be electrified, the wafer is proved to be in a damaged state, so that the wafer can be placed in a corresponding position for processing, and the damaged wafer is prevented from entering subsequent processing.
Meanwhile, due to the arrangement of the detection piece 4, the uneven frame die bonding quality is realized, and the consistency of the thickness of the glue is easier to ensure.
In this embodiment, the detecting member 4 includes a connector 41 of a terminal 42 and the terminal 42, the connector 41 of the terminal 42 is connected to the force arm 2, and the terminal 42 is mounted on the connector 41 of the terminal 42. That is, the terminals 42 are in contact with the wafer to achieve conduction, the connectors 41 of the terminals 42 allow the terminals 42 to be reliably fixed on the force arm 2, so as to prevent the terminals 42 from falling off during movement.
In the present embodiment, the force arm 2 is provided with two riveting holes 21, a riveting member 22 is provided in each riveting hole 21, and a fixing screw 23 is screwed to the riveting member 22, and the fixing screw 23 is used for fixing the connector 41 of the terminal 42 and the riveting member 22.
In practical use, in order to make the structure of the present invention more compact, the two fixing screws 23 are abutted against each other, so that the two detecting members 4 are fixed by the fixing screws 23, and thus, power supply can be realized only by contacting with an external power supply.
In this embodiment, the force arm 2 is provided with a mounting member 24, and an elastic member 5 is provided between the mounting member 24 and the force arm 2; the picking member 3 is provided to the mounting member 24. The installation part 24 realizes the effect that the picking part 3 has the lifting effect vertical to the force arm part 2, and compared with the prior art, the utility model has the advantage of reducing the friction damage of the surface of the chip.
And the setting of elastic component 5 lets pick up 3 promptly and has certain buffering, can reduce the impact force to the solid crystal when letting pick up the solid crystal by pick up 3 to reduce the damage to the chip positive and negative when picking up.
Specifically, picking member 3 is preferably a suction nozzle, that is, after picking member 3 contacts the die, the die is sucked by negative pressure to move, so that picking stability is ensured.
Specifically, the arm member 2 is provided with an elastic hole 28, the elastic member 5 is installed in the elastic hole 28, and the installation member 24 abuts against the elastic hole 28. Through the setting of elastic component 5 for adjust the elasticity of picking member 3, make picking member 3 have certain buffering effect and make it cause the damage when avoiding lieing in the wafer contact. In the present invention, the elastic member 5 is preferably a spring.
Specifically, the mounting member 24 is provided with a first clamping portion 25, the first clamping portion 25 is connected with an arc-shaped portion 26, the arc-shaped portion 26 is connected with a second clamping portion 27, and a mounting hole for mounting the picking member 3 is formed among the first clamping portion 25, the arc-shaped portion 26 and the second clamping portion 27; the first clamping portion 25 and the second clamping portion 27 are fixed by screws. First clamping part 25, arc portion 26 and second clamping part 27 constitute hoop-shaped structure promptly for let pick up 3 install to the mounting hole after, through carrying out the lock screw between first clamping part 25 and the second clamping part 27, thereby realize the pinning effect to pick up 3, also be convenient for the staff and change pick up 3.
In addition, the force arm part 2 is of a hollow structure, and the reinforcing ribs are arranged in the force arm part 2, so that the effect of reducing the weight of the force arm part 2 is achieved, and high-precision movement is facilitated.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (7)
1. The utility model provides a gu brilliant swing arm device, includes power arm seat, arm of force spare and picks up the piece, arm of force spare set up in power arm seat, it sets up in the arm of force spare is kept away from the one end of power arm seat, its characterized in that: the force arm piece is provided with two detection pieces, and the two detection pieces are used for abutting against an external wafer and forming a closed loop with the wafer.
2. The die bonding swing arm device according to claim 1, wherein: the detection piece comprises a terminal connector and a terminal, the terminal connector is connected with the force arm piece, and the terminal is installed on the terminal connector.
3. The die bonding swing arm device according to claim 1, wherein: the force arm piece is provided with two riveting holes, a riveting piece is arranged in each riveting hole, the riveting piece is screwed with a fixing screw, and the fixing screw is used for fixing the terminal connector and the riveting piece.
4. The die bonding swing arm device according to claim 3, wherein: the two set screws interfere with each other.
5. The die bonding swing arm device according to claim 1, wherein: the force arm piece is provided with an installation piece, and an elastic piece is arranged between the installation piece and the force arm piece; the picking member is disposed at the mounting member.
6. The die bonding swing arm device according to claim 5, wherein: the mounting piece is provided with a first clamping part, the first clamping part is connected with an arc-shaped part, the arc-shaped part is connected with a second clamping part, and mounting holes for mounting the picking piece are formed among the first clamping part, the arc-shaped part and the second clamping part; the first clamping part and the second clamping part are fixed through screws.
7. The die bonding swing arm device according to claim 5, wherein: the arm of force spare is provided with the bullet hole, the elastic component install in the bullet hole, the installed part with bullet hole is contradicted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122760754.5U CN216624215U (en) | 2021-11-11 | 2021-11-11 | Die bonding swing arm device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122760754.5U CN216624215U (en) | 2021-11-11 | 2021-11-11 | Die bonding swing arm device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216624215U true CN216624215U (en) | 2022-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122760754.5U Active CN216624215U (en) | 2021-11-11 | 2021-11-11 | Die bonding swing arm device |
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| Country | Link |
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| CN (1) | CN216624215U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116072595A (en) * | 2023-03-30 | 2023-05-05 | 东莞联鹏智能装备有限公司 | Cross beam and die bonding device |
-
2021
- 2021-11-11 CN CN202122760754.5U patent/CN216624215U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116072595A (en) * | 2023-03-30 | 2023-05-05 | 东莞联鹏智能装备有限公司 | Cross beam and die bonding device |
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