CN216623165U

CN216623165U - Server heat abstractor of low-power consumption

Info

Publication number: CN216623165U
Application number: CN202220125065.9U
Authority: CN
Inventors: 曾犁
Original assignee: Hangzhou Shugang Technology Co ltd
Current assignee: Hangzhou Shugang Technology Co ltd
Priority date: 2022-01-18
Filing date: 2022-01-18
Publication date: 2022-05-27
Anticipated expiration: 2032-01-18

Abstract

The utility model provides a low-power consumption server heat dissipation device, comprising: the cooling device comprises a base plate and an absorption assembly, wherein the base plate is provided with a cooling assembly. The cooling assembly comprises a box body, a partition frame, heat conduction copper sheets, a top plate and a semiconductor refrigeration sheet, the box body is fixedly installed on the bottom plate, the partition frame is installed on the inner bottom wall of the box body, a plurality of heat conduction copper sheets are fixedly installed on the inner wall of the partition frame, and the same top plate is fixedly installed on the top sides of the partition frame and the box body. The absorption assembly is mounted on the housing. According to the low-power-consumption server heat dissipation device, when air in the server flows into the box body through the air inlet pipe, the heat in the air can be conducted into a cooled water source through the heat conduction copper sheet, the air can be cooled at the moment, and the heat dissipation and cooling effects on the air are excellent.

Description

Server heat abstractor of low-power consumption

Technical Field

The utility model relates to the technical field of heat dissipation devices, in particular to a server heat dissipation device with low power consumption.

Background

With the increasing data processing capability of computers, servers with high-density hardware and software have been rapidly developed as important components. In recent years, the server has become smaller and more powerful, and the heat of the server has increased dramatically, so that how to dissipate the heat of the electronic devices in the server is a key issue in view of the high heat flux density of the electronic devices in the server.

However, the existing server heat dissipation device generally increases the air flow rate inside the whole server to achieve the heat dissipation effect through blowing of the heat dissipation fan, and a single fan blows not only the heat dissipation effect is not excellent, but also the fan rotates all the time and increases the power consumption of the whole device, so that a server heat dissipation set device with low power consumption is needed.

The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a low-power-consumption server heat dissipation device, wherein a cooling assembly can reduce the working time of the whole device, so that the power consumption of the whole device can be reduced to a certain extent, and the energy-saving effect of the whole device is more ideal.

In order to achieve the above object, the present invention provides a server heat dissipation device with low power consumption, including: the absorption assembly comprises a bottom plate and an absorption assembly, wherein a cooling assembly is installed on the bottom plate. The cooling assembly comprises a box body, a partition frame, a heat conduction copper sheet, a top plate and a semiconductor refrigeration sheet. The box body is fixedly installed on the bottom plate, a partition frame is installed on the inner bottom wall of the box body, a plurality of heat conduction copper sheets are fixedly installed on the inner wall of the partition frame, and the same top plate is fixedly installed on the top sides of the partition frame and the box body. The absorption assembly is mounted on the housing.

In one or more embodiments, the absorption assembly comprises an installation shell, filter cotton, a conduit and a top cover, the installation shell is fixedly installed on the outer wall of the box body, the installation shell is communicated with the box body through the conduit, the filter cotton in sliding connection is installed on the inner wall of the installation shell, and the top side of the installation shell is provided with the top cover in fixed connection through a bolt.

In one or more embodiments, an exhaust pipe is mounted on the outer wall of the mounting housing, and a dispersion assembly is mounted at an end of the exhaust pipe remote from the mounting housing.

In one or more embodiments, the dispersion assembly includes an adapter plate, an adapter tube, and an exhaust hood, a top side of the adapter plate communicating with an end of the exhaust tube remote from the mounting housing. A plurality of adapter tubes are installed on the bottom side of the adapter plate, an exhaust hood is installed at one end, far away from the adapter plate, of each adapter tube, each electromagnetic valve fixedly installed is sleeved on the outer wall of each adapter tube, and a temperature sensor B is installed on each exhaust hood.

In one or more embodiments, a controller fixedly connected with the outer wall of the box body is installed on the outer wall of the box body, and the controller is electrically connected with the semiconductor refrigeration sheet, the temperature sensor A, the temperature sensor B and the electromagnetic valve through leads.

In one or more embodiments, the intake pipe is installed to the one side that the installation shell was kept away from to the box outer wall, the one end of intake pipe extends to in the bulkhead, just fixed mounting has temperature sensor A on the inner wall of the intake pipe other end.

In one or more embodiments, the end of the air inlet pipe, which is far away from the box body, is provided with a communicated mounting cover, the bottom side of the mounting cover is adhered with a fixedly connected rubber ring, and two groups of symmetrically distributed mounting blocks are fixedly mounted on the outer wall of the mounting cover.

In one or more embodiments, a fixed cover fixedly connected with the top plate is mounted on the upper surface of the top plate, the inner top wall of the fixed cover abuts against the top of the semiconductor refrigeration sheet, and a plurality of uniformly distributed cooling fins are fixedly mounted on the upper surface of the fixed cover.

In one or more embodiments, the box body and the partition frame form a shape of Chinese character 'hui', and a gap between the box body and the partition frame is filled with cooling water.

In one or more embodiments, the plurality of heat-conducting copper sheets are distributed in an "S" shape, and the top sides of the upper heat-conducting copper sheets are abutted to the lower surface of the top plate.

Compared with the prior art, according to the utility model discloses server heat abstractor of low-power consumption has following beneficial effect:

1. the cooling assembly in the utility model is installed through the semiconductor refrigeration piece, and the semiconductor refrigeration piece can refrigerate the water source in the box body in the later use process. When the air in the server flows into the box body through the air inlet pipe, the heat conducting copper sheet can cool the air in a water source for guiding heat in the air into the box body, the air cooling can be completed at the moment, the heat dissipation and cooling effects of the air are excellent, the device does not need to work in real time, the working time and the power consumption of the whole device can be reduced, and therefore the energy-saving effect of the whole device is ideal.

2. The internal absorption assembly can absorb dust in gas while dissipating heat and reducing temperature of air in the server. Therefore, the phenomenon that the operation of the whole device is influenced by poor contact of components in the server due to excessive dust in the later-stage use process can be greatly reduced.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment of a low-power-consumption server heat dissipation device according to the present invention;

FIG. 2 is a schematic front view of the interior of the cooling module of FIG. 1;

FIG. 3 is a schematic top view of the cooling assembly of FIG. 1;

FIG. 4 is a schematic structural view of the dispersion assembly shown in FIG. 1;

fig. 5 is a schematic view of the structure of the mounting cover shown in fig. 1.

Reference numbers in the figures: the device comprises a base plate 1, a cooling assembly 2, a box 21, a partition frame 22, a heat conducting copper sheet 23, a top plate 24, a semiconductor refrigerating sheet 25, a controller 3, an absorption assembly 4, a mounting shell 41, filter cotton 42, a guide pipe 43, a top cover 44, an air inlet pipe 5, a temperature sensor A5, a fixing cover 6, a radiating fin 6, an exhaust pipe 7, a mounting cover 8, a rubber ring 8a, a mounting block 8B, a dispersion assembly 9, a switching disc 91, a switching pipe 92, an exhaust hood 93, an electromagnetic valve 94 and a temperature sensor B95.

Detailed Description

The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.

Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.

As shown in fig. 1 to 5, a low power consumption server heat dissipation device according to an embodiment of the present invention includes: a bottom plate 1, a cooling module 2 and an absorption module 4.

In an embodiment of the present invention, referring to fig. 1, fig. 2 and fig. 3, the cooling assembly 2 includes a box 21, a frame 22, a heat conducting copper sheet 23, a top plate 24 and a semiconductor cooling sheet 25. The box body 21 is fixedly arranged on the bottom plate 1. A partition frame 22 is installed on the inner bottom wall of the box body 21, a plurality of heat conduction copper sheets 23 are fixedly installed on the inner wall of the partition frame 22, and the same top plate 24 is fixedly installed on the top sides of the partition frame 22 and the box body 21.

It should be noted that: when the device is used for heat dissipation and cooling, the controller 3 can directly control the semiconductor refrigeration piece 25 to work, and at the moment, the semiconductor refrigeration piece 25 can refrigerate the water source in the box body 21. When gas flows into the inside of the partition frame 22 in the box body 21 through the gas inlet pipe 5, the heat conducting copper sheets 23 in the partition frame 22 can guide heat in the gas into a cold water source, so that heat dissipation of the air can be completed, and the temperature of hot air in the server can be reduced by absorbing the heat in the circulating air, so that heat dissipation and cooling of the server can be completed. Through the refrigeration work of semiconductor refrigeration piece 25, can carry out the replacement of relatively longer air heat, need not to make this device work all the time, consequently can make the energy-conserving effect of this device more outstanding.

In an embodiment of the present invention, referring to fig. 1, fig. 2 and fig. 3, the absorption assembly 4 comprises a mounting shell 41, a filter cotton 42, a conduit 43 and a top cover 44, wherein the mounting shell 41 is fixedly mounted on the outer wall of the box body 21. The installation shell 41 is communicated with the box body 21 through a guide pipe 43, the filter cotton 42 in sliding connection is installed on the inner wall of the installation shell 41, and the top side of the installation shell 41 is provided with a fixedly connected top cover 44 through bolts.

It should be noted that: when the air after heat exchange in the box 21 flows into the interior of the installation shell 41 through the conduit 43 in the absorption assembly 4, the filter cotton 42 in the interior of the installation shell 41 can absorb dust particles in the air, so that the air can flow into the server in a relatively clean state. This can avoid the unit ware in the server to go up the dust too much, causes the components and parts contact failure, influences the demonstration of whole device operation, and staff's later stage can directly open top cap 44 through the bolt simultaneously, can change filter pulp 42.

In an embodiment of the present invention, referring to fig. 1 and fig. 4, an exhaust pipe 7 is installed on an outer wall of the installation shell 41, and a dispersion assembly 9 is installed at one end of the exhaust pipe 7 away from the installation shell 41, where the dispersion assembly 9 includes an adapter 91, an adapter 92, and an exhaust hood 93. The top side of the adapter plate 91 is communicated with one end, far away from the mounting shell 41, of the exhaust pipe 7, a plurality of adapter tubes 92 are mounted on the bottom side of the adapter plate 91, and an exhaust hood 93 is mounted at one end, far away from the adapter plate 91, of each adapter tube 92. The outer wall of each adapter tube 92 is sleeved with a fixedly mounted solenoid valve 94, and each exhaust hood 93 is provided with a temperature sensor B95.

It should be noted that: through installing a plurality of adapter tubes 92 on adapter disc 91, carrying out the installation of whole device, can install each adapter tube 92 near the components and parts that the server generates heat respectively, the air of later stage through cooling module 2 circulation cooling then can be smooth through the position of the interior heating parts of adapter tube 92 flow direction server, can realize the heat dissipation cooling to the server. When the temperature sensor B95 on the exhaust hood 93 detects that the temperature nearby is in the normal numerical range, the temperature sensor B95 can automatically send a signal to the controller 3, the controller 3 can close the corresponding electromagnetic valve 94, more cold air can be introduced into the components with higher temperature, and the fixed-point corresponding cooling can be realized, so that the whole device can be prevented from being in a working state for a long time and consuming a large amount of electric energy.

In the embodiment of the present invention, referring to fig. 1 and 5, a controller 3 is fixedly connected to an outer wall of the box 21. And the controller 3 is electrically connected with the semiconductor refrigeration piece 25, the temperature sensor A5a, the temperature sensor B95 and the electromagnetic valve 94 through leads. And an air inlet pipe 5 is arranged on one side of the outer wall of the box body 21, which is far away from the mounting shell 41. One end of the air inlet pipe 5 extends into the partition frame 22, and a temperature sensor A5a is fixedly mounted on the inner wall of the other end of the air inlet pipe 5. Through the installation of temperature sensor A5a, temperature sensor A5a accessible detects the temperature of the air in intake pipe 5 to controller 3 is controlled in the temperature transmission that will detect, controller 3 then can be through to the temperature that detects in real time with the operating condition of whole device is judged to the contrast between the numerical value of storing.

The air inlet pipe 5 is far away from one end of the box body 21 and is provided with an installation cover 8 which is communicated, the bottom side of the installation cover 8 is adhered with a rubber ring 8a which is fixedly connected, and the outer wall of the installation cover 8 is fixedly provided with two groups of installation blocks 8b which are symmetrically distributed. When the device is installed, the installation cover 8 can be installed at the vent of the server through the installation block 8b, and meanwhile, the rubber ring 8a can increase the sealing of the connection part between the installation cover 8 and the server, so that the gas in the server can smoothly flow into the air inlet pipe 5 through the installation cover 8.

Wherein, the last surface mounting of roof 24 has fixed cover 6 of fixed connection, the interior roof of fixed cover 6 supports with the top of semiconductor refrigeration piece 25, just the last fixed surface of fixed cover 6 installs a plurality of evenly distributed's fin 6a, through the last surface mounting at fixed cover 6 having fin 6a, when using semiconductor refrigeration piece 25 to carry out refrigeration work, fin 6a can be to the produced heat dissipation to the air of semiconductor refrigeration piece 25 during operation, realizes the heat dissipation to semiconductor refrigeration piece 25 itself.

The box body 21 and the partition frame 22 form a square shape, and cooling water is filled in a gap between the box body 21 and the partition frame 22. The plurality of heat conduction copper sheets 23 are distributed in an S shape, and the top sides of the heat conduction copper sheets 23 are abutted to the lower surface of the top plate 24. Through the space filling cooling water between box 21 and bulkhead 22, when semiconductor refrigeration piece 25 carried out the during operation, can be smooth refrigerate with cooling, the later stage can absorb the heat in the circulation air through the cooling water, because heat conduction copper sheet 23 is "S" type distribution, the circulation route of multiplicable air in bulkhead 22 simultaneously, and then makes the cooling water more comprehensive to the absorption of heat in the air.

Working principle;

s1, when the device is used, firstly, a worker can install the whole device at a required position through the bottom plate 1, the installation cover 8 is installed at a vent of the server through the installation block 8b, and the adapter tube 92 in the dispersion assembly 9 can be installed inside the server after the installation of the installation cover 8 is completed, so that the installation of the whole device can be completed;

s2, the heat dissipation fan in the server works to drive the air to circulate, and the circulated air flows into the installation cover 8 through the installation cover 8. When the gas flows into the installation cover 8, the temperature sensor A5a in the installation cover 8 can detect the temperature of the gas in real time, when the temperature of the gas is higher than a set value, the temperature sensor A5a can send a signal to the controller 3, and at the moment, the controller 3 supplies power to the semiconductor chilling plates 25 to enable the semiconductor chilling plates 25 to carry out chilling work;

s3, at this time, the semiconductor cooling plate 25 cools the water source in the box 21, and when the gas flows into the inside of the partition frame 22 in the box 21 through the air inlet pipe 5, the heat conducting copper plate 23 in the partition frame 22 guides the heat in the gas into the cold water source, so as to complete the heat dissipation of the air. The temperature of the hot air in the server can be reduced by absorbing the heat in the circulating air, so that the heat dissipation and the temperature reduction of the server can be completed. Through one-time operation of the semiconductor refrigerating sheet 25, relatively long air heat replacement can be carried out, and the device does not need to operate all the time, so that the energy-saving effect of the device is more excellent;

s4, the gas heat-exchanged in the tank 21 flows into the housing case 41 through the duct 43 in the absorption unit 4. After the air enters the installation shell 41, the filter cotton 42 in the installation shell 41 can absorb dust particles in the air, so that the air can flow into the server in a relatively clean state, and further, the phenomenon that the operation of the whole device is influenced due to poor contact of components and parts caused by excessive dust on elements in the server can be avoided.

The circuits and controls involved in the present invention are prior art and will not be described in detail herein.

The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the utility model to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the utility model and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the utility model and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the utility model be defined by the claims and their equivalents.

Claims

1. A low-power server heat sink, comprising:

a base plate (1);

the cooling assembly (2) is mounted on the bottom plate, the cooling assembly (2) comprises a box body (21), a partition frame (22), heat-conducting copper sheets (23), a top plate (24) and semiconductor refrigerating sheets (25), the box body (21) is fixedly mounted on the bottom plate (1), the partition frame (22) is mounted on the inner bottom wall of the box body (21), a plurality of heat-conducting copper sheets (23) are fixedly mounted on the inner wall of the partition frame (22), and the same top plate (24) is fixedly mounted on the top sides of the partition frame (22) and the box body (21); and

an absorbent assembly (4), the absorbent assembly (4) being mounted on the cabinet (21).

2. The low-power-consumption server heat dissipation device as recited in claim 1, wherein the absorption assembly (4) comprises a mounting shell (41), filter cotton (42), a conduit (43) and a top cover (44), the mounting shell (41) is fixedly mounted on the outer wall of the box body (21), the mounting shell (41) and the box body (21) are communicated through the conduit (43), the filter cotton (42) is mounted on the inner wall of the mounting shell (41) in a sliding connection, and the top side of the mounting shell (41) is provided with the top cover (44) in a fixed connection through bolts.

3. The low-power-consumption server heat sink device as recited in claim 2, wherein an exhaust pipe (7) is mounted on an outer wall of the mounting case (41), and a dispersion member (9) is mounted on an end of the exhaust pipe (7) away from the mounting case (41).

4. The server heat dissipation device with low power consumption as recited in claim 3, wherein the dispersion assembly (9) comprises an adapter plate (91), adapter tubes (92) and an exhaust hood (93), the top side of the adapter plate (91) is communicated with one end, away from the mounting shell (41), of the exhaust pipe (7), a plurality of adapter tubes (92) are installed on the bottom side of the adapter plate (91), the exhaust hood (93) is installed at one end, away from the adapter plate (91), of each adapter tube (92), a fixedly installed solenoid valve (94) is sleeved on the outer wall of each adapter tube (92), and a temperature sensor B (95) is installed on each exhaust hood (93).

5. The server heat dissipation device with low power consumption as recited in claim 1, wherein the controller (3) is fixedly connected to the outer wall of the box body (21), and the controller (3) is electrically connected to the semiconductor chilling plate (25), the temperature sensor a (5a), the temperature sensor B (95) and the electromagnetic valve (94) through wires.

6. The server heat dissipation device with low power consumption as recited in claim 1, wherein an air inlet pipe (5) is installed on one side of the outer wall of the box body (21) far away from the installation shell (41), one end of the air inlet pipe (5) extends into the partition frame (22), and a temperature sensor A (5a) is fixedly installed on the inner wall of the other end of the air inlet pipe (5).

7. The server heat dissipation device with low power consumption of claim 6, wherein one end of the air inlet pipe (5) far away from the box body (21) is provided with a communicated mounting cover (8), a fixedly connected rubber ring (8a) is adhered to the bottom side of the mounting cover (8), and two groups of symmetrically distributed mounting blocks (8b) are fixedly mounted on the outer wall of the mounting cover (8).

8. The low-power-consumption server heat dissipation device as recited in claim 1, wherein a fixed cover (6) is fixedly connected to the upper surface of the top plate (24), an inner top wall of the fixed cover (6) abuts against the top of the semiconductor refrigeration sheet (25), and a plurality of uniformly distributed cooling fins (6a) are fixedly mounted on the upper surface of the fixed cover (6).

9. The server heat sink with low power consumption according to claim 1, wherein the box body (21) and the partition frame (22) form a Chinese character 'hui' shape, and a gap between the box body (21) and the partition frame (22) is filled with cooling water.

10. The server heat sink with low power consumption as claimed in claim 1, wherein the plurality of heat-conducting copper sheets (23) are distributed in an "S" shape, and the top side of the upper heat-conducting copper sheet (23) is against the lower surface of the top plate (24).