CN216621565U

CN216621565U - Pressure detection device and electronic equipment

Info

Publication number: CN216621565U
Application number: CN202122749222.1U
Authority: CN
Inventors: 张平
Original assignee: Shenzhen New Degree Technology Co Ltd
Current assignee: Shenzhen New Degree Technology Co Ltd
Priority date: 2021-11-10
Filing date: 2021-11-10
Publication date: 2022-05-27
Anticipated expiration: 2031-11-10

Abstract

The application provides a pressure detection device and electronic equipment, pressure detection device includes: the first end of the beam body is a fixed end; the pressure detection module, the pressure detection module includes stress amplification spare and pressure sensor, and the stress amplification spare is installed on the roof beam body, and pressure sensor installs and keeps away from one side of the roof beam body at the stress amplification spare. The electronic equipment comprises an equipment body and the pressure detection device. When the beam body is deformed a little under the action of external force, stress can be concentrated on the stress amplifying piece of the pressure detection module, and the deformation of the stress amplifying piece at the stress concentrated position is larger. The pressure sensor arranged on the stress amplifying piece can detect the deformation of the stress amplifying piece more easily, and the sensitivity of the pressure detection device is improved.

Description

Pressure detection device and electronic equipment

Technical Field

The application belongs to the pressure detection field, and more specifically relates to a pressure detection device and an electronic device.

Background

With the technological progress and social development, pressure detection has become a necessary function for some electronic devices, for example, pressure sensors are used to implement pressure switches or pressure function keys.

Currently, a pressure detecting device in an electronic apparatus includes a beam body for receiving an external force and a pressure sensor mounted on the beam body. When an external force acts on the beam body, the beam body is deformed, and the pressure sensor mounted on the beam body detects the external force applied to the beam body by detecting the deformation of the beam body.

However, the sensitivity of the pressure detecting device is low, and the pressure sensor may not detect the deformation of the beam body when the external force applied to the beam body is small.

SUMMERY OF THE UTILITY MODEL

An object of the embodiments of the present application is to provide a pressure detection apparatus and an electronic device, so as to solve the problem that the sensitivity of the pressure detection apparatus in the related art is low, and when an external force applied to a beam is small, a pressure sensor may not be able to detect the deformation of the beam.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in one aspect, a pressure detection apparatus is provided, including:

the first end of the beam body is a fixed end;

the pressure detection module comprises a stress amplification piece and a pressure sensor, the stress amplification piece is installed on the beam body, and the pressure sensor is installed on one side, far away from the beam body, of the stress amplification piece.

In one embodiment, the stress amplifying piece is provided with a first groove.

This structure makes stress amplification piece take place stress concentration in first recess department through setting up first recess, and stress amplification piece is bigger at first recess position department deflection to pressure sensor detects the deformation of stress amplification piece and can improve pressure detection device's sensitivity.

In one embodiment, the number of the first grooves is multiple, and the multiple first grooves are arranged side by side along the axial direction of the beam body.

This structure, when pressure sensor's detection area is great, set up the quantity of first recess into a plurality ofly, guarantee that pressure sensor can reliably detect out the external force of exerting on the roof beam body.

In one embodiment, the outer peripheral surface of the beam body is provided with a first cambered surface;

and a second cambered surface matched with the first cambered surface is arranged on the side surface of the stress amplification piece facing the beam body.

This structure can guarantee that the stress amplification piece can be stably contacted with the roof beam body to the strain of the roof beam body can be transmitted to the stress amplification piece.

In one embodiment, the beam body is provided with an installation groove for accommodating the pressure detection module.

This structure can guarantee equally that stress amplification piece can be stable with the roof beam body contact, and then the meeting an emergency of the roof beam body can transmit stress amplification piece on.

In one embodiment, the beam body is provided with a second groove, and the pressure detection module is covered on the second groove.

This structure is through setting up the second recess for the roof beam body itself can take place stress concentration in the position department of installation pressure detection module equally, further improves pressure detection device's sensitivity.

In one embodiment, the number of the second grooves is multiple, and the second grooves are arranged at intervals along the length direction of the beam body; the distance between the first groove and the second groove and the distance between the first groove and the second groove are smaller than the length of the pressure detection module.

This structure, when the size of pressure detection module is great, set up the quantity of second recess into a plurality ofly, can make the pressure detection module can be reliable detect out the strain of roof beam body at self stress concentration position department.

In one embodiment, the stress amplifier is mounted to the beam near the fixed end.

This structure, when the roof beam body received the exogenic action, the stiff end of the roof beam body is more concentrated, the deflection is bigger than other positions stress in the roof beam body, installs stress amplification piece and can improve pressure detection device's sensitivity in the position that the roof beam body is close to the stiff end.

In one embodiment, the stress amplifier is bonded to the beam body; or the stress amplification piece and the beam body are welded and fixed.

This structure guarantees the reliable connection between stress amplification piece and the roof beam body on the basis that the meeting an emergency of guaranteeing the roof beam body can reliably transmit stress amplification piece.

In one embodiment, the pressure sensing device further comprises a processor electrically connected to the pressure sensor.

This structure, through setting up the treater, when the external force of equidirectional applys the roof beam body on, pressure sensor can generate different electric signals, and the treater can judge the external force direction of applying on the roof beam body according to the electric signal of difference.

In another aspect, an electronic device is provided, which includes a device body and the pressure detection device as described above; the first end of the beam body of the pressure detection equipment is connected with the equipment body.

The application provides a pressure measurement and electronic equipment's beneficial effect lies in: the application discloses pressure detection device installs stress amplification piece on being used for receiving the roof beam body of external force, installs pressure sensor in the one side that stress amplification piece kept away from the roof beam body. When the beam body is deformed a small amount under the action of external force, stress can be concentrated on the stress amplification piece of the pressure detection module, and the deformation of the stress amplification piece at the stress concentrated position is larger. The pressure sensor arranged on the stress amplification piece can detect the deformation of the stress amplification piece more easily, and the sensitivity of the pressure detection device is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a pressure detection apparatus according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of the pressure detecting module shown in FIG. 1;

fig. 3 is a side view of a pressure detection device provided in the second embodiment of the present application;

fig. 4 is a schematic structural diagram of a pressure detection apparatus according to a third embodiment of the present application;

FIG. 5 is an enlarged view of a portion of FIG. 4 at A;

fig. 6 is a schematic structural diagram of a pressure detection apparatus according to a fourth embodiment of the present application;

fig. 7 is a schematic structural diagram of a pressure detection apparatus according to a fifth embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

100. a beam body;

110. a fixed end;

120. mounting grooves;

130. a second groove;

200. a pressure detection module;

210. a stress amplifying member;

211. a first groove;

220. a pressure sensor;

300. a processor.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "the like," can explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1 and fig. 2, a pressure detecting device according to an embodiment of the present application will be described. The pressure detecting apparatus includes a beam 100 and a pressure detecting module 200. The first end of the beam 100, i.e., the left end of the beam 100, is a fixed end 110. Illustratively, the first end of the beam 100 may be fixedly connected with the device body of the electronic device. The beam 100 may be fixed to the device body by bonding, bolting, or snap-fitting. The second end of the beam 100 may be a fixed end or a free end, that is, the beam 100 may be a cantilever beam or a simply supported beam, and the embodiment is not limited herein. The beam 100 is used to receive an external force, and it is easily understood that the beam 100 is deformed when the external force acts on the beam 100.

It should be noted that the cross-sectional shape of the beam 100 is not limited, that is, the cross-section of the beam 100 may be any suitable shape, such as a square or a circle, and those skilled in the art can set the shape according to actual needs.

The pressure detecting module 200 is installed above the outer peripheral surface of the beam 100, but this is not a limitation to the specific protection scope of the present application, for example, in some possible implementations, the pressure detecting module 200 may also be installed at the bottom of the outer peripheral surface of the beam 100 or at the side of the outer peripheral surface of the beam 100.

Referring to fig. 1 and 2, the pressure detecting module 200 is used for detecting an external force applied to the beam 100, wherein the pressure detecting module 200 may be installed at a first end of the beam 100, a middle portion of the beam 100, or a second end of the beam 100. The pressure detecting module 200 includes a stress amplifying member 210 and a pressure sensor 220, and the stress amplifying member 210 is mounted on the beam body 100. The stress amplifier 210 and the beam 100 are rigidly connected, for example, by welding or riveting, so that the strain amplifier 210 can be transmitted when the beam 100 is deformed by an external force. In one possible implementation, the stress amplification member 210 is formed as a sheet structure, and a surface of the stress amplification member 210 facing the beam body 100 is attached to the beam body 100. The stress amplifying member 210 is provided with a stress concentration region where the stress amplifying member 210 is more deformed when the beam body 100 transfers strain to the stress amplifying member 210. The pressure sensor 220 is mounted on the side of the stress amplifier 210 away from the beam 100, wherein the pressure sensor 220 may be mounted on the stress amplifier 210 by means of bonding. The sensing area of the pressure sensor 220 is located opposite to the stress concentration area of the stress amplifying member 210 so that it can be sensed by the pressure sensor 220 when the stress amplifying member 210 is more largely deformed. The specific structure of the pressure sensor 220 is not limited in the present embodiment, and those skilled in the art can select any suitable pressure sensor 220 according to the actual requirement. Of course, various types of mechanical sensors such as strain gauges, flexible sensors, etc. may be selected from commercially available sensors.

The pressure detection device provided by the present embodiment has the beneficial effects that the pressure detection device of the present application mounts the stress amplification member 210 on the beam 100 for receiving the external force, and mounts the pressure sensor 220 on the side of the stress amplification member 210 away from the beam 100. When the beam 100 deforms a little under the action of external force, stress concentrates on the stress amplifier 210 of the pressure detection module 200, and the stress amplifier 210 deforms a larger amount at the stress concentration position. The pressure sensor 220 mounted on the stress amplification member 210 more easily detects the deformation of the stress amplification member 210, improving the sensitivity of the pressure detection apparatus. In the related art, in order to improve the sensitivity of the pressure detection device, a complicated structure is provided on the beam body 100, which increases the cost of the pressure detection device and reduces the structural strength of the beam body 100. The pressure detection device provided by the embodiment can improve the sensitivity of the pressure detection device without arranging a complex structure on the beam body 100, reduce the cost of the pressure detection device and ensure the structural strength of the beam body 100.

In an embodiment, referring to fig. 1 and fig. 2, as a specific implementation of the pressure detecting apparatus provided in the embodiment of the present application, the stress amplifying element 210 is provided with a first groove 211. The first groove 211 may be formed on a side surface of the stress amplifying member 210, for example, the first groove 211 may be formed on a side of the stress amplifying member 210 facing the pressure sensor 220, or may be formed on a side of the stress amplifying member 210 facing the beam 100. In another possible implementation, the first groove 211 may also be opened at an intermediate position of the stress amplifier 210. The shape of the first groove 211 may be set according to actual needs, for example, the shape of the first groove 211 may be set to any suitable shape such as a circle, a square, or a polygon.

By forming the first groove 211 in the stress amplification member 210, the cross-sectional area of the stress amplification member 210 at the position of the first groove 211 is smaller than the cross-sectional area of the stress amplification member 210 at other positions. When the beam body 100 transfers strain to the stress amplification member 210, stress concentration occurs in the stress amplification member 210 at the position of the first groove 211, and the amount of deformation of the stress amplification member 210 at the position of the first groove 211 is greater, so that the pressure sensor 220 detects the deformation of the stress amplification member 210, which can improve the sensitivity of the pressure detection apparatus.

In an embodiment, referring to fig. 2, as a specific implementation manner of the pressure detection apparatus provided in the embodiment of the present application, the number of the first grooves 211 is multiple, and the multiple first grooves 211 are arranged side by side along the axial direction of the beam 100. For example, as shown in fig. 2, three first grooves 211 are provided at the bottom of the stress amplifying member 210, and the three first grooves 211 are uniformly provided along the axis of the beam body 100. Of course, the embodiment is only exemplary here, and a person skilled in the art may also open two, four, or five first grooves 211 on the stress amplifying member 210 as needed, that is, the number of the first grooves 211 may be adjusted according to actual needs, and is not limited herein.

By setting the number of the first grooves 211 to be plural, when the detection area of the pressure sensor 220 is large, the plural first grooves 211 are all opposite to the detection area of the pressure sensor 220, so that it can be ensured that the pressure sensor 220 can reliably detect the external force applied to the beam body 100 when the detection area is large.

In an embodiment, referring to fig. 3, as a specific implementation of the pressure detecting device provided in the second embodiment of the present application, the beam 100 has a first arc surface on an outer peripheral surface thereof. Illustratively, the cross-sectional shape of the beam 100 may be circular or elliptical, among other suitable shapes. The side of the stress amplifier 210 facing the beam 100 is correspondingly provided with a second arc surface matching with the first arc surface, that is, the bottom surface of the stress amplifier 210 is also provided with an arc surface and the arc surface matches with the outer peripheral surface of the beam 100. When the stress amplification member 210 is assembled with the beam body 100, the arc surface of the stress amplification member 210 is attached to the arc surface of the beam body 100.

Those skilled in the art can understand that, when the pressure detection device is applied to an electric toothbrush or an intelligent door lock, the side surface of the stress amplification member 210 facing the beam 100 is set to be an arc surface matched with the outer peripheral surface of the beam 100, so that the stress amplification member 210 can be ensured to be stably contacted with the beam 100, and when the beam 100 deforms under the action of an external force, the strain can be transmitted to the stress amplification member 210.

In an embodiment, referring to fig. 4 and fig. 5, as a specific implementation of the pressure detecting apparatus provided in the third embodiment of the present application, a mounting groove 120 for accommodating the pressure detecting module 200 is formed on the beam 100, wherein a bottom of the mounting groove 120 is formed as a plane. One end of the stress amplification member 210, i.e., the bottom surface of the stress amplification member 210, is also formed as a plane, and one end of the stress amplification member 210 is mounted to the groove bottom of the mounting groove 120. In one possible implementation, the groove bottom of the mounting groove 120 is larger in size than the bottom surface of the stress amplifying member 210 to ensure that the edge of the stress amplifying member 210 does not protrude from the mounting groove 120. Through the above arrangement, the beam body 100 is provided with the mounting groove 120, and the stress amplification piece 210 is mounted at the bottom of the mounting groove 120, so that the stress amplification piece 210 can be reliably contacted with the beam body 100 on the side facing the beam body 100, and the beam body 100 can transfer strain to the stress amplification piece 210 when being deformed. On the other hand, by installing one end of the stress amplifier 210 at the bottom of the mounting groove 120, the pressure detection module 200 can be located inside the beam 100, and the pressure detection module 200 is prevented from protruding from the beam 100. When the pressure detection device is installed inside the electronic device, the pressure detection module 200 can be prevented from interfering with other components of the electronic device.

In an embodiment, referring to fig. 6, as a specific implementation manner of the pressure detecting device provided in the fourth embodiment of the present application, the beam 100 is provided with a second groove 130, where the shape of the second groove 130 may be a suitable shape such as a circle, a square, or a polygon. The pressure detecting module 200 is disposed on the second groove 130, and specifically, the second groove 130 is opposite to the detecting area of the pressure sensor 220. It should be noted that the number of the second grooves 130 is not limited, and those skilled in the art can set the number according to actual needs.

Through set up second recess 130 on roof beam body 100, when roof beam body 100 takes place to warp under the exogenic action, roof beam body 100 takes place stress concentration in second recess 130 position to the deflection of roof beam body 100 in second recess 130 position department is bigger, has further improved pressure detection device's sensitivity.

In an embodiment, referring to fig. 6, as a specific implementation manner of the pressure detection apparatus provided in the fourth embodiment of the present application, the number of the second grooves 130 is multiple, and the multiple second grooves 130 are arranged at intervals along the length direction of the beam 100. Illustratively, the number of the second grooves 130 may be three, and three second grooves 130 are disposed at equal intervals along the length direction of the beam body 100. It should be noted that the distance between the first and the last second grooves 130 is smaller than the length of the pressure detecting module 200, that is, the distance between the leftmost second groove 130 and the rightmost second groove 130 is smaller than the length of the pressure detecting module 200. When the size of the pressure detection module 200 is large, the number of the second grooves 130 is set to be plural, so that the pressure detection module 200 can reliably detect the strain of the beam 100 at the stress concentration position of the beam.

In an embodiment, please refer to fig. 7, as a specific implementation manner of the pressure detection apparatus provided in the fifth embodiment of the present application, the pressure detection apparatus further includes a processor 300, the processor 300 is installed at an outer side of the beam 100, schematically, when the pressure detection apparatus is applied to an electronic device, the beam 100 may be fixedly connected to the device body, and the processor 300 may be installed inside the device body. Processor 300 is electrically connected to pressure sensor 220, wherein pressure sensor 220 and processor 300 may be connected using wires, such that electrical signals generated by pressure sensor 220 may be transmitted to processor 300 via the wires. The present embodiment is not limited to the specific structure of the processor 300, and for example, a single chip may be used as the processor 300.

The pressure sensor 220 may generate different electrical signals when external forces in different directions, such as an external force parallel to the axial direction of the beam body 100, an external force perpendicular to the axial direction of the beam body 100, an external force inclined to the axial direction of the beam body 100, or a rotational torsion force rotating the beam body 100 about its axis, are applied to the beam body 100. By providing a program in the processor 300, the processor 300 can determine the direction of the external force applied to the girder 100 by operating the program when the pressure sensor 220 inputs different electric signals to the processor 300. On the other hand, the processor 300 may further obtain a specific magnitude of the external force applied to the beam 100 according to the electrical signal input by the pressure sensor 220.

In one embodiment, referring to fig. 1 and 4, as a specific implementation of the pressure detecting apparatus provided in any one of the first to fifth embodiments of the present application, the stress amplifier 210 is installed at a position close to the fixed end 110 of the beam 100. The distance between the stress amplifier 210 and the fixed end 110 of the beam 100 can be set according to actual requirements. When the beam 100 receives an external force, stress is more concentrated at the fixed end 110 of the beam 100 than at other positions of the beam 100, so that the beam 100 is deformed more at the fixed end 110, and the sensitivity of the pressure detecting apparatus can be improved by installing the stress amplifying member 210 at a position of the beam 100 close to the fixed end 110.

In one embodiment, the stress amplification member 210 is bonded to the beam 100, and specifically, the stress amplification member 210 is connected to the beam 100 by a hard adhesive, i.e., the adhesive between the stress amplification member 210 and the beam 100 is not elastic after curing. For example, the stress amplifier 210 and the beam 100 may be connected by structural adhesive, thermal gutta-percha, optical adhesive, or UV adhesive. In another possible implementation manner, the stress amplification member 210 is fixed to the beam body 100 by welding, and for example, the stress amplification member 210 and the beam body 100 may be fixed by laser welding. Above-mentioned setting, on the basis that the meeting an emergency that guarantees roof beam body 100 can reliably be transmitted stress amplification piece 210, guarantee stress amplification piece 210 and the reliable connection between the roof beam body 100, pressure measurement device is in the in-process that uses promptly, and pressure measurement module 200 can not follow roof beam body 100 and drop.

On the basis of the pressure detection device provided in any one of the first to fifth embodiments, the application further provides an electronic device, and in a specific application, the electronic device may be a wind power mast, an intelligent home, an intelligent door lock, a TWS (true wireless stereo) earphone, an electric toothbrush, a tooth cleaner, a mobile phone, and the like. When the electronic device is an electric toothbrush, a tooth washing device or the like, the beam body 100 of the pressure detection device can be a cantilever beam, that is, one end of the beam body 100 is a fixed end 110, and the other end is a free end; when the electronic device is a mobile phone, the two ends of the beam 100 are fixed ends 110, and the middle of the beam 100 supports the pressing position of the mobile phone screen. The electronic equipment comprises an equipment body and the pressure detection device provided by any one of the embodiments. The first end of the beam 100 of the pressure detecting device is fixedly connected to the device body, for example, a fastener may be used to fix the first end of the beam 100 to the device body.

The electronic equipment provided by the embodiment of the application has the beneficial effects that: when the electronic device detects an external force through the pressure detection apparatus, the pressure detection apparatus provides the stress amplifier 210 between the beam body 100 and the pressure sensor 220. When the external force applied to the beam body 100 is small and the beam body 100 is slightly deformed, stress concentration occurs on the stress amplifier 210 of the pressure detection module 200, and the stress amplifier 210 is deformed more at the position where the stress concentration occurs. The pressure sensor 220 mounted on the stress amplification member 210 more easily detects the deformation of the stress amplification member 210, improves the sensitivity of the pressure detection apparatus, and thus the electronic device more easily detects the external force.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims

1. Pressure detection device, its characterized in that includes:

the first end of the beam body is a fixed end;

2. The pressure sensing device of claim 1, wherein the stress amplifying member defines a first recess therein.

3. The pressure detecting device according to claim 2, wherein the number of the first grooves is plural, and the plural first grooves are arranged side by side in an axial direction of the beam body.

4. The pressure detecting device of claim 1, wherein the beam body has a first curved surface on an outer circumferential surface thereof;

5. The pressure detecting device of claim 1, wherein the beam body defines an installation slot for receiving the pressure detecting module.

6. The pressure detection device of claim 1, wherein the beam body defines a second recess, and the pressure detection module is disposed in the second recess.

7. The pressure detection device of claim 6, wherein the number of the second grooves is plural, and the plural second grooves are arranged at intervals along the length direction of the beam body; the distance between the first groove and the second groove and the distance between the first groove and the second groove are smaller than the length of the pressure detection module.

8. The pressure sensing device of any of claims 1-7, wherein the stress amplifier is mounted to the beam proximate the fixed end.

9. The pressure detection device of any one of claims 1-7, further comprising a processor electrically connected to the pressure sensor.

10. An electronic device, characterized in that; comprising a device body and a pressure detection device according to any of claims 1-9; the first end of the beam body of the pressure detection equipment is connected with the equipment body.