CN218156597U

CN218156597U - Pressure sensing device and electronic equipment

Info

Publication number: CN218156597U
Application number: CN202221636386.1U
Authority: CN
Inventors: 李灏; 刘伟治; 郭亚博
Original assignee: Shenzhen New Degree Technology Co Ltd
Current assignee: Shenzhen New Degree Technology Co Ltd
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-12-27
Anticipated expiration: 2032-06-28

Abstract

The utility model relates to a forced induction technical field provides a forced induction device and electronic equipment. The pressure sensing device comprises a shell, a bracket, a control panel and a pressure sensor, wherein the bracket is arranged in the shell, and the pressure sensor is contacted with the inner side wall of the shell so as to sense the mechanical deformation of the shell generated under the action of external pressure, convert the mechanical deformation into an electrical signal and send the electrical signal to the control panel through a conductive piece, so that pressure sensing is realized; wherein, pressure sensor installs between the inside wall of support and casing.

Description

Pressure sensing device and electronic equipment

Technical Field

The utility model belongs to the technical field of the forced induction technique and specifically relates to a forced induction device and electronic equipment are related to.

Background

As an important sensor, a pressure sensor has been widely used in various fields for a long time. In the field of consumer electronics, the mechanical design of pressure sensing schemes is also varied, subject to the limitations of mechanical structures. The technical principle of pressure induction is that an external force is applied to a structural member in an induction area to cause the structural member to generate micro mechanical deformation, and then a pressure sensor placed on the surface of the structural member detects the micro mechanical deformation. Finally, the pressure sensor converts the detected mechanical deformation into an electrical signal to realize pressure sensing.

In the related art, the pressure sensing device includes a pressure sensor, a PCB main board, and a bracket. The pressure sensor is used for converting the detected mechanical deformation into an electrical signal and is electrically connected with the PCB mainboard. The pressure sensor is installed between the PCB main board and the support and generates assembly stress on the PCB main board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pressure-sensitive device and electronic equipment aims at solving among the correlation technique pressure-sensitive device's control panel and has the technical problem of assembly stress.

In a first aspect, the present application provides a pressure sensing apparatus comprising:

a housing;

a bracket mounted inside the housing;

a control panel mounted to the bracket;

the pressure sensor is installed between the support and the inner side wall of the shell, the pressure sensor is in contact with the support, and the pressure sensor is electrically connected with the control panel through the conductive piece.

In one embodiment, the bracket has a supporting surface and a supporting block, one end of the supporting block is connected to the supporting surface and extends in a direction away from the supporting surface, the other end of the supporting block is provided with a clamping block, one side surface of the control plate is supported on the supporting surface, and the other side surface of the control plate is supported on the clamping block.

In one embodiment, the bracket further comprises a positioning column connected to the supporting surface, and the control plate is provided with a positioning hole used for positioning and matching with the positioning column.

In one embodiment, the number of the supporting blocks is more than two, and at least two supporting blocks are oppositely arranged on the supporting surface.

In one embodiment, one end of the support block is connected to the edge of the support surface; the edge of the control panel is provided with a first notch, and the first notch is used for the supporting block to pass through.

In one embodiment, the control board is mounted on one side of the bracket and the pressure sensor is mounted on the other side of the bracket.

In one embodiment, the surface of the bracket is provided with a mounting groove, the bottom of the pressure sensor is mounted in the mounting groove, and the top of the pressure sensor is in contact with the inner side wall of the shell.

In one embodiment, a second notch is formed in a side wall of the mounting groove, one end of the conductive member is electrically connected to the pressure sensor, and the other end of the conductive member penetrates through the second notch and is electrically connected to the control board.

In one embodiment, the pressure sensor is a resistive pressure sensor, a capacitive pressure sensor, or a piezoelectric sensor.

In one embodiment, the conductive member is a flexible printed circuit board or a conductive wire.

In a second aspect, the present application provides an electronic device comprising the pressure sensing apparatus of any one of the above.

The utility model provides a forced induction device and electronic equipment's beneficial effect is: the pressure sensor is in contact with the inner side wall of the shell to sense mechanical deformation of the shell under the action of external pressure, convert the mechanical deformation into an electrical signal and send the electrical signal to the control panel through the conductive piece to realize pressure sensing; wherein, pressure sensor installs between the inside wall of support and casing, and the stress to the control panel production when eliminating pressure sensor assembly has solved pressure sensing device's among the correlation technique control panel and has had the technical problem of assembly stress to the atress condition of control panel has been improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 2 is a further perspective view of the electronic device of FIG. 1;

FIG. 3 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 2;

FIG. 4 is a schematic structural diagram of the electronic device of FIG. 2 with the housing removed;

FIG. 5 is an exploded view of FIG. 4;

FIG. 6 is a further perspective view of the electronic device of FIG. 2 with the housing removed;

FIG. 7 is a schematic structural view of the stent of FIG. 6;

fig. 8 is a further perspective view of the stent of fig. 7.

Wherein, in the figures, the respective reference numerals:

10. an electronic device;

100. a housing;

200. a support; 210. a support surface; 220. a support block; 230. a clamping block; 240. accommodating a tank; 250. a positioning column; 260. mounting grooves; 261. a second notch;

310. a control panel; 311. positioning holes; 312. a first notch; 320. an electronic device;

410. a pressure sensor; 420. a conductive member;

500. and a tail cover.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The application provides an electronic device 10 comprising any one of the following pressure sensing devices. The pressure sensing device is arranged in the electronic equipment 10, so that the electronic equipment 10 can increase the capability of accurately identifying the touch pressure, the user experience is improved, and the product function application is expanded.

The electronic device 10 may be selected as an earphone, a mobile phone, smart glasses, etc.

Fig. 1 is a schematic structural diagram of an electronic device 10 according to an embodiment of the present invention. Fig. 2 is another perspective view of the electronic device 10 in fig. 1. Fig. 3 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A of fig. 2.

Referring to fig. 1 to 3, the pressure sensing apparatus provided in the present application includes a housing 100, a bracket 200, a control board 310, and a pressure sensor 410. The bracket 200 is installed inside the case 100. The control board 310 is mounted to the stand 200. The pressure sensor 410 is installed between the bracket 200 and the inner sidewall of the housing 100, the pressure sensor 410 is in contact with the bracket 200, and the pressure sensor 410 is electrically connected to the control board 310 through the conductive member 420.

The pressure sensor 410 contacts the inner sidewall of the casing 100 to sense the mechanical deformation of the casing 100 under the action of external pressure, and converts the mechanical deformation into an electrical signal, which is sent to the control board 310 through the conductive member 420 to implement pressure sensing. Because the pressure sensor 410 is installed between the inner side walls of the bracket 200 and the housing 100, stress generated to the control board 310 when the pressure sensor 410 is assembled is eliminated, stress condition of the control board 310 is improved, and service life of the control board 310 is prolonged.

Alternatively, the housing 100 is a plastic, metal, glass, ceramic, or wood housing.

Alternatively, the control Board 310 is a PCB (Printed Circuit Board) main Board.

In this embodiment, the control board 310 is mounted on the bracket 200 in many ways, such as by bonding, clipping, or screwing.

Specifically, referring to fig. 3, 5 and 7, the bracket 200 has a supporting surface 210 and a supporting block 220, one end of the supporting block 220 is connected to the supporting surface 210 and extends in a direction away from the supporting surface 210, and the other end of the supporting block 220 is provided with a latch 230. One side surface of the control plate 310 is supported on the supporting surface 210, and the other side surface of the control plate 310 is supported on the fixture 230, so that the control plate 310 is clamped and fixed between the supporting surface 210 and the fixture 230, the assembly is simple, and the assembly stress generated to the control plate 310 is reduced.

Optionally, the supporting block 220 is substantially perpendicular to the supporting surface 210, for example, the angle between the supporting block 220 and the supporting surface 210 is 80 ° to 100 °. The side surface of the latch 230 facing the supporting surface 210 is substantially parallel to the supporting surface 210, for example, the included angle between the side surface of the latch 230 facing the supporting surface 210 and the supporting surface 210 is-10 ° to 10 °.

Optionally, one side of the latch 230 facing the supporting surface 210 has a flat surface, and the control plate 310 is in flat contact with the latch 230, so that smooth contact is facilitated, and the sharp part is prevented from pressing against the control plate 310.

Optionally, the support surface 210 is planar to stably support the control board 310.

In one possible embodiment, referring to fig. 3, 5 and 7, the side of the control board 310 facing the supporting surface 210 is mounted with a plurality of electronic devices 320, such as resistors, capacitors, control modules, and the like. The support surface 210 has a receiving groove 240 in the middle. A plurality of electronic devices 320 are accommodated in the accommodating groove 240.

The contact area between the supporting surface 210 and the control board 310 is reduced by the accommodating groove 240, which is beneficial to reducing the clamping force applied to the control board 310, thereby facilitating the detachment of the control board 310 and enabling the control board 310 to have a larger area, so as to mount more electronic devices 320 and increase the functions of the electronic apparatus 10. As shown in fig. 7, in a side of the stand 200 close to the control board 310, a middle portion of the side of the stand 200 is a receiving groove 240, and left and right edges are left as the supporting surfaces 210. The support surface 210 is strip-shaped and extends along the length of the bracket 200.

It will be appreciated that the side of the control board 310 remote from the support surface 210 is also fitted with a number of electronic devices 320, the electronic devices 320 of this side facing away from the support 200 without interfering with the support 200.

Specifically, referring to fig. 6 and 7, the bracket 200 further has a positioning post 250 connected to the supporting surface 210, and the control board 310 has a positioning hole 311 for positioning and matching with the positioning post 250. The positioning posts 250 are inserted into the positioning holes 311, so that the control board 310 is precisely positioned on the bracket 200 and clamped and fixed on the bracket 200 by the fixture blocks 230 and the supporting surface 210.

Specifically, referring to fig. 7, the number of the support blocks 220 is two or more, so that the connection point between the bracket 200 and the control panel 310 is increased, and the installation stability of the control panel 310 is improved.

As shown in fig. 7, there are at least two support blocks 220 oppositely disposed on the support surface 210. For example, the number of the supporting blocks 220 is two, wherein one supporting block 220 is located at the left side of the supporting surface 210, and the other supporting block 220 is located at the right side of the supporting surface 210, i.e., opposite to each other.

It should be noted that the two supporting blocks 220 disposed oppositely are not necessarily in a facing relationship. For example, referring to fig. 7, the number of the supporting blocks 220 is two, wherein one supporting block 220 is located at the left side of the supporting surface 210 and above the supporting surface 210, and the other supporting block 220 is located at the right side of the supporting surface 210 and below the supporting surface 210. In other words, the two supporting blocks 220 disposed oppositely may be spaced along the length direction of the bracket 200, even along the diagonal direction of the supporting surface 210.

With reference to fig. 7, the number of the positioning pillars 250 is two or more. Optionally, two or more positioning posts 250 are spaced apart along a circumferential edge of the support surface 210. There are at least two positioning posts 250 disposed opposite each other. Similarly, the two positioning posts 250 disposed oppositely are not necessarily in a facing relationship.

In particular, referring to fig. 7, the number of support blocks 220 and positioning posts 250 is the same. For example, there are two support blocks 220 and two positioning posts 250. Two supporting blocks 220 are located on one diagonal line of the supporting surface 210, and two positioning columns 250 are located on the other diagonal line of the supporting surface 210, so that on the basis of ensuring that the control board 310 can be stably installed, the connection points between the bracket 200 and the control board 310 are reduced, the assembling stress of the control board 310 is reduced, and the area of the control board 310 for installing the electronic device 320 is increased.

In one embodiment, referring to fig. 7, one end of the supporting block 220 is connected to the edge of the supporting surface 210, compared to the supporting block 220 located at the middle of the supporting surface 210, so that the side of the bracket 200 close to the control board 310 is substantially used for mounting the control board 310 and accommodating the electronic device 320 on the control board 310, and the volume of the bracket 200 is reduced as much as possible while supporting the control board 310 of the same area, which is beneficial to the volume reduction of the pressure sensing apparatus.

Referring to fig. 6, the edge of the control plate 310 is provided with a first notch 312, and the first notch 312 is used for the supporting block 220 to pass through so as to avoid the supporting block 220. The control panel 310 can be supported on the supporting surface 210 at other positions along the edge, and the bracket 200 can reduce the volume as much as possible while supporting the control panel 310 with the same area, which is beneficial to the miniaturization of the pressure sensing device.

In this embodiment, there is a gap between the pressure sensor 410 and the control board 310 to prevent the pressure sensor 410 from touching the control board 310.

In one possible example, referring to fig. 4 and 5, the control board 310 is mounted on one side of the bracket 200, the pressure sensor 410 is mounted on the other side of the bracket 200 to fully utilize the mounting space of the bracket 200, and the bracket 200 can separate the control board 310 from the pressure sensor 410, so that a space is ensured between the control board 310 and the pressure sensor 410, and the assembly stress on the control board 310 when the pressure sensor 410 is assembled is avoided.

Generally, the pressure sensor 410 is interference fit mounted between the bracket 200 and the inner side wall of the housing 100.

In one possible example, referring to fig. 5 and 8, the surface of the bracket 200 is provided with a mounting groove 260, the bottom of the pressure sensor 410 is mounted in the mounting groove 260, and the top of the pressure sensor 410 is in contact with the inner sidewall of the housing 100. The pressure sensor 410 is located on the surface of the bracket 200, so that the assembly is convenient, and the installation groove 260 is arranged so as to facilitate the positioning of the pressure sensor 410, so that the pressure sensor 410 corresponds to the sensing area of the casing 100, so as to facilitate the sensing of the small mechanical deformation of the sensing area of the casing 100.

Optionally, the pressure sensor 410 is glued into the mounting groove 260.

Optionally, the pressure sensor 410 includes a fiber insulation layer, an epoxy layer, a flexible circuit layer, and an adhesive layer, which are sequentially stacked from top to bottom, where the adhesive layer is used for adhering and fixing the pressure sensor 410 on the bracket 200.

Specifically, the side wall of the mounting groove 260 is provided with a second gap 261, one end of the conductive element 420 is electrically connected to the pressure sensor 410, and the other end of the conductive element 420 passes through the second gap 261 and is electrically connected to the control board 310, so that the conductive element 420 can be conveniently wired.

On the basis of the foregoing embodiments, the conductive member 420 is a Flexible Printed Circuit (FPC) or a conductive wire.

On the basis of the foregoing embodiments, the pressure sensor 410 is a resistive pressure sensor, a capacitive pressure sensor, a piezoelectric sensor, or the like.

The strain gauge is an element for measuring strain, which is constituted by a sensitive grid or the like. The working principle of the resistance strain gauge is based on the strain effect, that is, when a conductor or a semiconductor material is mechanically deformed under the action of external force, the resistance value of the conductor or the semiconductor material is correspondingly changed, and the phenomenon is called the strain effect.

The piezoresistive sensor is formed by utilizing the piezoresistive effect of monocrystalline silicon. A monocrystalline silicon wafer is used as an elastic element, a group of equivalent resistors are diffused in a specific direction of monocrystalline silicon on the monocrystalline silicon wafer by utilizing the process of an integrated circuit, the resistors are connected into a bridge circuit, and the monocrystalline silicon wafer is arranged in a sensor cavity. When the pressure changes, the monocrystalline silicon generates strain, so that the strain resistor directly diffused on the monocrystalline silicon generates change in direct proportion to the measured pressure, and then a bridge circuit acquires a corresponding voltage output signal.

In one embodiment, referring to fig. 2 and 3, the pressure sensing apparatus further includes a tail cap 500. One end of the case 100 is open. The control board 310 and the pressure sensor 410 are mounted on the bracket 200 at intervals, and then are integrally installed in the housing 100 through an opening, to which the tail cap 500 is mounted to close the opening.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A pressure sensing device, comprising:

a housing;

a bracket mounted inside the housing;

a control panel mounted to the bracket;

2. The pressure sensing device of claim 1, wherein: the support is provided with a supporting surface and a supporting block, one end of the supporting block is connected to the supporting surface and extends in the direction far away from the supporting surface, a clamping block is arranged at the other end of the supporting block, one side face of the control panel is supported on the supporting surface, and the other side face of the control panel is supported on the clamping block.

3. The pressure sensing device of claim 2, wherein: the support is also provided with a positioning column connected to the supporting surface, and the control panel is provided with a positioning hole used for being matched with the positioning column in a positioning mode.

4. The pressure sensing device of claim 2, wherein: the number of the supporting blocks is more than two, and at least two supporting blocks are oppositely arranged on the supporting surface.

5. The pressure sensing device of claim 2, wherein: one end of the supporting block is connected to the edge of the supporting surface; the edge of the control panel is provided with a first notch, and the first notch is used for the supporting block to pass through.

6. The pressure sensing device of claim 1, wherein: the control panel is installed in one side of support, pressure sensor installs in the opposite side of support.

7. The pressure sensing device of claim 1, wherein: the surface of support is equipped with the mounting groove, pressure sensor's bottom install in the mounting groove, pressure sensor's top with the inside wall of casing contacts.

8. The pressure sensing device of claim 7, wherein: the lateral wall of mounting groove is equipped with the second breach, the one end of electrically conductive piece with pressure sensor electric connection, the other end of electrically conductive piece pass the second breach and with control panel electric connection.

9. The pressure sensing device of any one of claims 1 to 8, wherein: the pressure sensor is a resistance type pressure sensor, a capacitance type pressure sensor or a piezoelectric type sensor;

and/or the conductive piece is a flexible printed circuit board or a lead.

10. An electronic device, characterized in that: comprising a pressure sensing device according to any one of claims 1 to 9.