CN216612886U - Semiconductor element assembly system - Google Patents

Abstract

The utility model discloses a semiconductor element assembly system which comprises a machine table, wherein a vibration feeding device, a material tray automatic conveying device, a material taking manipulator and an assembly device are arranged on the machine table; the vibration feeding device comprises a plurality of vibration feeding machines, wherein a single vibration feeding machine is configured to feed one type of semiconductor elements with the same specification, and each vibration feeding machine is provided with a hopper disc for feeding and a flexible vibration disc for uniformly dispersing the semiconductor elements so as to conveniently take the semiconductor elements; the automatic material tray conveying device comprises a plurality of feeding and discharging conveying units for conveying material trays; the feeding and discharging conveying unit comprises a feeding station and a material taking station; the assembling device comprises a loading station, an assembling tray is arranged on the loading station, and assembling notches are uniformly formed in the assembling tray; the material taking manipulator takes the semiconductor elements on the flexible vibration discs and the semiconductor elements on the material discs of the material taking stations and moves the semiconductor elements into the assembling notch; the assembly notch is configured to load the assembled semiconductor element.

Description

Semiconductor element assembly system

Technical Field

The utility model relates to the field of electronic assembly automation, in particular to a semiconductor element assembling system.

Background

Currently, in the production and manufacturing process of the electronic assembly industry, a molded semiconductor finished product is often assembled and molded by a plurality of semiconductor elements with different specifications; there is then a need for assembly work of semiconductor elements; in the prior art, the conventional operation is to manually pick up a plurality of semiconductor elements one by using tweezers or other tools and place the semiconductor elements in an assembly mold in a stacking manner for assembly; the manual assembly mode undoubtedly has the problems of low efficiency, easy error, high working difficulty and the like. Under the requirement of mass supply, the quantity of semiconductor elements required to be obtained is very large, the requirement of production supply is undoubtedly greatly limited by adopting a manual assembly mode, and the intelligent and mass conveying and assembling work of the semiconductor elements cannot be finished; the demand for automated semiconductor device assembling equipment is becoming more and more urgent. In the electronic assembly industry, the semiconductor element has a modular standardized semiconductor element, and the semiconductor element is convenient to load by a material tray, so that automatic feeding can be realized by the material tray; there are also granular or small, non-standardized semiconductor components that are not easily loaded through a tray. The problem to be solved is that the semiconductor elements with different specifications can be automatically assembled.

Disclosure of Invention

The present invention is directed to overcoming the above-mentioned deficiencies of the prior art and to providing a semiconductor device mounting system; the vibration feeding machine is used for feeding granular or small non-standardized semiconductor elements; the automatic material tray conveying device is used for feeding the standardized semiconductor elements of the module through the material tray; the semiconductor elements with different specifications can be loaded at the same time, and the semiconductor element packaging machine is suitable for the assembly of semiconductor elements with various models; the material taking manipulator sequentially places the sucked semiconductor elements in an assembly notch on an assembly tray, so that the automatic assembly work of the semiconductor elements is realized; compared with the mode of manually picking up and assembling the semiconductor elements one by one in the prior art, undoubtedly, the manual labor force is greatly released; the production efficiency is improved, and the productivity is increased; the supply requirement of batch is met.

The technical scheme of the utility model is realized as follows:

a semiconductor device assembly system includes a machine, on which: the vibration feeding device consists of a plurality of vibration feeding machines which are arranged adjacently, wherein a single vibration feeding machine is configured to feed semiconductor elements with the same specification, and each vibration feeding machine is provided with a hopper disc for feeding and a flexible vibration disc for uniformly dispersing the semiconductor elements so as to conveniently take the semiconductor elements; the automatic material tray conveying device consists of a plurality of feeding and discharging conveying units which are arranged adjacently and used for conveying material trays; the material trays on the single feeding and discharging conveying unit are configured to load semiconductor elements with the same specification; each feeding, discharging and conveying unit comprises a feeding station and a material taking station; the material tray is conveyed to the material taking station from the material loading station to take materials. The material taking manipulator is configured to take the semiconductor elements on the single flexible vibration disc and the material disc at the material taking station and move the semiconductor elements to the assembling device; the assembling device is arranged between the vibration feeding device and the automatic material tray conveying device; the assembling device comprises a loading station, wherein an idle assembling tray is arranged on the loading station, and a plurality of assembling notches are uniformly distributed on the assembling tray; the assembly notch is configured to load the assembled semiconductor element.

Preferably, the single feeding and discharging conveying unit further comprises a recovery station; in the feeding process, the material trays are stacked at a feeding station, and the single material trays can be sequentially conveyed to a material taking station for taking materials; after the material taking is finished, the material tray at the material taking station is conveyed to the recovery station and can be automatically stacked. Can realize automatic material loading of batch, unloading and the recovery of charging tray, then operating personnel only need be responsible for the charging tray pile up place at the material loading station and collect from retrieving the station pile up good charging tray can, convenient operation.

Preferably, the single vibration feeding machine comprises a first vibration component and a second vibration component which are adjacent; the hopper disc is arranged on the first vibrating assembly, and the semiconductor element is placed in the hopper disc for pre-feeding; the flexible disk is disposed on the second vibratory assembly and the hopper disk is configured to vibrate to feed the semiconductor components into the flexible disk. The semiconductor elements are pre-loaded and stacked in a funnel disc, and the funnel disc vibrates to discharge materials in a flexible vibration disc; the material is evenly scattered and is conveniently taken by further vibration of the soft vibration disc, and the material is taken layer by layer in a progressive manner, so that the material is conveniently taken.

Preferably, the funnel disc and the flexible vibration disc are adjacent to each other in front and back; the funnel dish is located the top of gentle vibration dish, and the front end of funnel dish is equipped with the opening, and the opening part of funnel dish is just to the gentle vibration dish.

Preferably, the first vibration assembly comprises a first vibrator which is also positioned below the hopper disc, and the first vibrator is a vibration motor; the second vibration subassembly includes the second vibrator that is located gentle vibration dish below, the second vibrator includes four linear vibration motors that distribute around gentle vibration dish.

Preferably, the free end of the material taking manipulator is provided with a material taking assembly; the material taking units with the same number as the vibration feeding machines are arranged on one side of the material taking assembly close to the vibration feeding device side by side; the material taking units with the same number as the feeding and discharging conveying units are arranged on one side of the material taking assembly close to the automatic material tray conveying device side by side; each material taking unit is configured to absorb the semiconductor elements on the flexible vibration disc or the material disc at the material taking station.

Preferably, the material taking unit is configured as a suction nozzle or a clamping jaw.

Preferably, still include positioner, positioner is including the first locating component of shooing that is located the liftable removal of gentle vibration dish top and is adjusted and the second that is located the liftable removal of material-taking station top and adjusts the locating component of shooing.

Preferably, the assembling device further comprises a stacking station and a third vibrator positioned below the loading station; the assembly trays are stacked on a stacking station and are sequentially conveyed to the assembly station for assembling the semiconductor elements.

The design starting point, the idea and the beneficial effects of the utility model adopting the technical scheme are as follows:

firstly, the semiconductor element assembling system can realize the automatic batch assembly of the semiconductor elements; the vibration feeding machine is used for feeding granular or small non-standardized semiconductor elements; the automatic material tray conveying device is used for feeding the standardized semiconductor elements of the module through the material tray; therefore, semiconductor elements with different specifications can be loaded at the same time, and the semiconductor element packaging machine is suitable for semiconductor elements with various models; the material taking assembly can sequentially absorb the semiconductor elements on the flexible vibration plate or the material taking station material plate, so that the material taking is in order; the material taking manipulator sequentially places the sucked semiconductor elements in an assembly notch on an assembly tray, so that the automatic assembly work of the semiconductor elements is realized; compared with the mode of manually picking up and assembling the semiconductor elements one by one in the prior art, undoubtedly, the manual labor force is greatly released; the production efficiency is improved, and the productivity is increased; the supply requirement of batch is met.

Secondly, vibration loading attachment can carry out automatic material loading through the effect of first vibrator and second vibrator to semiconductor element homodisperse is conveniently got on gentle vibration dish, and during the operation, only need with semiconductor element pile up place in the funnel dish can. In addition, the feeding and discharging conveying unit can automatically convey a single material tray from the feeding station to the material taking station, and convey the material tray with the material taken to the recovery station for automatic stacking; therefore, an operator only needs to be responsible for batch feeding and batch material tray recovery, and other processes are automatic operation; the labor force is further released, intelligent management is realized, and the working efficiency is improved.

In addition, through the vibration material loading machine that sets up side by side to and the unloading conveying unit that goes up that sets up side by side realize carrying out the material loading simultaneously to the semiconductor component of different specifications, the rational utilization space.

Drawings

FIG. 1 is a schematic perspective view of a semiconductor device mounting system according to an embodiment of the present invention; FIG. 2 is a schematic perspective view of another embodiment of the semiconductor device assembly system of the present invention;

FIG. 3 is a schematic perspective view of a vibratory feeding device according to an embodiment of the present invention;

FIG. 4 is a schematic perspective view of an automatic tray conveying device according to an embodiment of the present invention;

FIG. 5 is a schematic perspective view of an assembly device according to an embodiment of the present invention;

FIG. 6 is a schematic perspective view of a feeding and discharging conveying unit according to an embodiment of the present invention;

FIG. 7 is a schematic perspective view of the embodiment of the present invention in which the work table is lowered to the same height as the recycling station;

FIG. 8 is a schematic perspective view of a feeding recovery assembly according to an embodiment of the present invention;

FIG. 9 is an enlarged view of portion A of FIG. 8;

FIG. 10 is a schematic perspective view of a tray stack according to an embodiment of the present invention;

FIG. 11 is a schematic perspective view of an embodiment of the present invention showing a tray supported by the front and rear clamping members;

FIG. 12 is a schematic perspective view of an embodiment of the elevating transfer assembly of the present invention;

FIG. 13 is a schematic perspective view of another embodiment of the present invention;

fig. 14 is a schematic perspective view of a vibration feeder according to an embodiment of the present invention;

FIG. 15 is a schematic perspective view of a first vibration assembly in an embodiment of the present invention;

FIG. 16 is a schematic perspective view of the connection of the funnel tray and the first vibrator according to an embodiment of the present invention;

fig. 17 is a schematic perspective view illustrating a connection between the flexible vibration plate and the second vibration adapter plate according to an embodiment of the present invention;

FIG. 18 is a perspective view of a second vibratory assembly in accordance with an embodiment of the utility model;

fig. 19 is an enlarged view of a portion B in fig. 18.

The figures are numbered: a machine table a; vibrating the feeding device A; a material tray automatic conveying device B; a material taking manipulator C; assembling a device D; a material tray 1; a stacking unit 2; a feeding station 3; a feeding track 4; a recycling station 5; a blanking track 6; a work table 7; a material taking station 8; a transfer track 9; a jacking plate 10; a lifting pallet 11; a front cleat 12 a; a rear cleat 12 b; a cylinder 13; a support plate 14; a support slot 15; a limiting vertical plate 16; a lifting electric cylinder 17; a telescopic push rod 17 a; a guide plate 18; a guide rod 19; vibrating the feeder 20; a feeding and discharging conveying unit 21; a feeding recovery assembly E; a lifting transfer assembly F; a take-off assembly 22; a loading station 23; the assembly tray 24; an assembly notch 25; a first vibration assembly 26; a second vibration assembly 27; a hopper tray 28; a first vibrator 29; a flexible vibration plate 30; a second vibrator 31; the linear vibration motor 31 a; an opening 32; a first vibration adapter plate 33; a connecting plate 34; a fixed seat 35; a control switch 36; a substrate 37; a support rod 38; a bottom light source assembly 39; the dust-proof plate 39 a; a light emitting panel 39 b; a heat-dissipating aluminum plate 39 c; an outer cover 40; an adjustment switch 40 a; a second vibration adapter plate 41; a take-out unit 42; a first photographing positioning assembly 43; a second camera positioning assembly 44; a stacking station 45; and a third vibrator 46.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the utility model, taken in conjunction with the accompanying drawings and detailed description, is set forth below. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

In the description of the present embodiments, the term "at least one" means one or more than one unless explicitly defined otherwise. The terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of this embodiment, the position of the lifting transfer component is the front end, and the position of the feeding recovery component is the rear end.

The specific embodiment of the utility model is as follows:

as shown in fig. 1-19, the present invention provides a semiconductor component assembly system, which includes a machine a, on which a vibration feeding device a, a tray automatic conveying device B, a material taking manipulator C and an assembling device D are disposed; as shown in fig. 1 and 2, the material taking manipulator C and the assembling device D are disposed between the vibration feeding device a and the automatic tray conveying device B. The vibration feeding device a is configured to feed granular or small non-standardized semiconductor elements, the vibration feeding device a is composed of a plurality of adjacent vibration feeders 20, and a single vibration feeder 20 is configured to feed semiconductor elements of the same specification. The automatic tray conveying device B is configured to feed modular standardized semiconductor elements, the automatic tray conveying device B comprises a plurality of groups of feeding and discharging conveying units 21 which are arranged side by side and used for conveying trays 1, and the trays 1 on the single feeding and discharging conveying unit 21 are configured to load the semiconductor elements of the same specification. The material taking manipulator C can rotate and lift freely, and a material taking assembly 22 for sucking the semiconductor element is arranged at the free end of the material taking manipulator C. The assembling device D comprises a loading station 23, an unloaded assembling tray 24 is arranged on the loading station 23, and a plurality of assembling notches 25 are uniformly distributed on the assembling tray 24. During operation, the plurality of vibration feeding machines 20 and the plurality of feeding and discharging conveying units 21 simultaneously feed semiconductor elements with different specifications, the material taking manipulator C sequentially sucks the semiconductor elements, and then the semiconductor elements are sequentially stacked in the assembly notch 25 on the assembly tray 24; therefore, automatic batch assembly work of the semiconductor elements is realized, and manual picking and assembly of each semiconductor element are not needed; the labor force is greatly released, the production efficiency is improved, and the productivity is increased.

Specifically, the method comprises the following steps: as shown in fig. 4 to 19, the single loading and unloading conveying unit 21 includes adjacent loading recovery assemblies E and lifting transfer assemblies F; the feeding recovery assembly E is of an upper-layer structure and a lower-layer structure, and stacking units 2 and conveying rails which are respectively positioned on the upper layer and the lower layer and used for conveying the material tray 1 are respectively arranged on the upper layer and the lower layer of the feeding recovery assembly E; the stacking unit 2 can sequentially discharge the stacked material trays 1 and can also sequentially stack a plurality of material trays 1. The stacking unit 2 on the upper layer is configured as a feeding station 3, the material trays 1 are stacked and placed at the feeding station 3 for feeding, and the conveying track on the upper layer is configured as a feeding track 4; correspondingly, the stacking unit 2 at the lower layer is configured as a recycling station 5, and the recycling station 5 is responsible for stacking the material trays 1 for recycling; the lower conveying track is configured as a blanking track 6. The lifting transmission component F is arranged at the front end of the feeding recovery component E and comprises a workbench 7 and a driving component which is positioned below the machine platform a and drives the workbench 7 to lift; the material taking station 8 is arranged on the workbench 7, and the workbench 7 is also provided with a transfer track 9 capable of receiving or conveying the material plate 1; a lifting plate 10 for lifting the material tray 1 upwards away from the transfer rail 9 is arranged at the material taking station 8; and the conveying direction of the transfer track 9 is switchably adjustable.

When the loading and unloading conveying unit 21 specifically conveys the material trays 1, an operator stacks the material trays 1 fully loaded with semiconductor elements at the loading station 3, and the stacking unit 2 at the loading station 3 can sequentially unload the single material trays 1 onto the feeding track 6; the workbench 7 is preset to be lifted to enable the transfer track 9 and the feeding track 6 to be at the same height, the feeding track 6 sends the material tray 1 to the transfer track 9, when the material tray 1 is moved to the material taking station 8, the lifting plate 10 lifts the material tray 1 upwards to be away from the transfer track 9, the material tray 1 is stopped at the material taking station 8, and at the moment, the material taking assembly 22 can conveniently take materials from the material tray 1; after the material disc 1 is taken, the workbench 7 descends to enable the height of the transfer track 9 to be consistent with that of the blanking track 6, meanwhile, the conveying direction of the transfer track 9 is reversed, the jacking plate 10 descends to enable the material disc 1 to be conveyed to the blanking track 6 from the transfer track 9, then the blanking track 6 conveys the material disc 1 to the recovery station 5, and the material disc 1 can be automatically stacked at the recovery station 5; the operation is repeated, so that the automatic feeding of the material trays 1 stacked at the feeding station 3 can be realized, and the automatic stacking of the material trays 1 which are taken is performed at the recycling station 5; the operation personnel only need carry out batch material loading and recovery work can, the operation is very light simple, and efficiency improves greatly.

As shown in fig. 6 and 7, the feeding station 3 and the recovery station 5 are staggered up and down and back and forth, and the feeding station 3 is located between the material taking station 8 and the recovery station 5; so that the feeding station 3 and the recovery station 5 do not interfere with each other, and the feeding and recovery of the material tray 1 are not affected. And the feeding track 4 conveys the material tray 1 forwards from the feeding station 3 to the lifting transfer component F, the blanking track 6 conveys the material tray 1 backwards from the lifting transfer component F to the recovery station 5, and then the conveying directions of the feeding track 4 and the blanking track 6 are opposite.

As shown in fig. 6-11, the feeding track 4 and the discharging track 6 each include two conveying belts arranged at intervals; the stacking unit 2 comprises a lifting supporting plate 11 positioned between two conveying belts and a front and rear clamping and supporting assembly, wherein the front and rear clamping and supporting assembly comprises a front clamping plate 12a arranged in front of and above the lifting supporting plate 11 and a rear clamping plate 12b arranged in rear of and above the lifting supporting plate 11; the lower ends of the front clamping plate 12a and the rear clamping plate 12b are respectively provided with a supporting plate 14 which horizontally extends towards the central position of the lifting supporting plate 11, and the heights of the front clamping plate 12a and the rear clamping plate 12b are consistent and are always kept unchanged; the front plate 12a and the rear plate 12b are connected to the air cylinder 13, respectively, and can be adjusted in a forward and backward movement under the control of the air cylinder 13. The stacking unit 2 is matched with the front and rear clamping and supporting components through the lifting supporting plate 11 to realize the blanking action of the stacked material discs 1 and the stacking action of the material discs 1. Specifically, the method comprises the following steps: during feeding, the material trays 1 are stacked and placed at the feeding station 3, the stacked material trays 1 are clamped and supported by the front clamping plate 12a and the rear clamping plate 12b, and the supporting plates 14 at the bottoms of the front clamping plate 12a and the rear clamping plate 12b are respectively supported at the bottom of the material tray 1 at the lowest end; the material tray 1 is suspended above the lifting support plate 11; when a single material tray 1 needs to be discharged, the lifting support plate 11 rises and contacts the bottom end of the material tray 1 at the lowest end, so that the lifting support plate 11 supports the stacked material trays 1; then the front clamping plate 12a and the rear clamping plate 12b move away from the material tray 1; the lifting supporting plate 11 will then descend by the height of a tray 1; as shown in fig. 5, a supporting groove 15 into which the avoidance supporting plate 14 extends is arranged between any two stacked trays 1; when the lifting supporting plate 11 descends by the height of one tray 1, the front clamping plate 12a and the rear clamping plate 12b extend out towards the direction of the tray 1 again to enable the supporting plate 14 to extend into the supporting groove 15; so that the bottom of the second tray 1 from bottom to top can be just supported; at the moment, the tray 1 at the lowest end is separated from the stacked trays 1; then the lifting support plate 11 can drive the material tray 11 to descend, and when the lifting support plate 11 descends to the lower part of the conveying belt, the material tray 1 falls on the feeding track 4 and is conveyed to the material taking station 8; repeating the above action, can be constantly will piling up the charging tray 1 of material loading station 3 department and send to material taking station 8 in proper order, realize the automatic feeding function. Further: when the unloaded material tray 1 is stacked, the action is opposite to the action, when the material tray 1 after material taking is finished is conveyed to the recovery station 5, the lifting support plate 11 rises to act on the material tray 1 to lift the material tray upwards, and meanwhile, the front clamping plate 12a and the rear clamping plate 12b move away from the material tray; the tray 1 is lifted up to enable the bottom height of the tray to be just supported by the supporting plates 14 at the bottoms of the front clamping plate 12a and the rear clamping plate 12b, and the front clamping plate 12a and the rear clamping plate 12b respectively move towards the center direction of the tray 1 to clamp and support the tray 1; then the lifting support plate 11 descends and resets, when the next material tray 1 finishes material taking and is conveyed to the upper part of the lifting support plate 11 again, the lifting support plate 11 jacks the material tray 1 again and contacts with the material tray 1 above, so that the material tray 1 is stacked on the lifting support plate 11; then the front clamping plate 12a and the rear clamping plate 12b move away from the material tray 1 again, and then the lifting support plate 11 continues to rise to lift the stacked material trays 1 upwards by the height of one material tray 1; preceding splint 12a and back splint 12b press from both sides the charging tray 1 of lower extreme once more and get and the bearing, and lifting support plate 11 descends again afterwards and resets, repeats above-mentioned action to make and get the charging tray 1 that the material was accomplished and will all pile up in proper order on this recovery station 5, make things convenient for disposable recovery charging tray 1. In addition, material loading station 3 and 5 departments of retrieving still be equipped with the spacing riser 16 that is located charging tray 1 all around and vertical setting respectively, spacing riser 16 be "L" type structure, the edge of charging tray 1 just can restrict in this spacing riser 16, can be further carry on spacingly to charging tray 1 for charging tray 1 piles up neatly, avoids the charging tray 1 skew that piles up untidy. In this embodiment, the stacking unit 2 on the upper layer of the feeding and recycling assembly E is configured as a feeding station 3, and the stacking unit 2 on the lower layer is configured as a recycling station 5, which is just one design solution. The stacking unit 2 at the upper layer can be designed as a recovery station, and the stacking unit 2 at the lower layer can be designed as a feeding station; the corresponding configuration can be carried out according to the actual demand, and the use is more flexible.

As shown in fig. 12-13, the driving assembly below the working platform 7 is disposed below the machine platform a, the driving assembly includes a vertically disposed electric lifting cylinder 17, a telescopic push rod 17a is disposed at an upper end of the electric lifting cylinder 17, and an upper end of the telescopic push rod 17a is connected to a bottom end of the working platform 7; a guide assembly for stably lifting the workbench 7 is also arranged between the lifting electric cylinder 17 and the workbench 7, the guide assembly comprises a horizontal guide plate 18 fixed at the upper end of the lifting electric cylinder 17, and a telescopic push rod 17a upwards penetrates out of the guide plate 18; the bottom end of the workbench 7 is also provided with three guide rods 19 which are uniformly distributed around the telescopic push rod 17a and are distributed in a triangular shape; the lower end of the guide rod 19 is slidably arranged on the guide plate 18 in a penetrating way; then, with this lifting structure, when the table 7 is lifted and adjusted, the telescopic rod 17a drives the table 7 to lift, and the guide rod 19 slides up and down relative to the guide plate 18, so that the lift cylinder 17 can stably drive the table 7 to lift and adjust. Furthermore, the transfer track 9 likewise has two conveyor belts, between which the lifting plate 10 is arranged.

As shown in fig. 4, further: the automatic tray conveying device B is provided with 4 groups of feeding and discharging conveying units 21 which are arranged side by side, and each group of feeding and discharging conveying units 21 is responsible for feeding and conveying semiconductor elements of one specification.

As shown in fig. 14-19, the vibrating feeder 20 includes a first vibrating assembly 26 and a second vibrating assembly 27 adjacent to each other; the first vibrating assembly 26 comprises a hopper disc 28 and a first vibrator 29 capable of controlling the hopper disc 28 to vibrate; the second vibration unit 27 includes a flexible vibration plate 30 and a second vibrator 31 for controlling the flexible vibration plate 30 to vibrate; an opening 32 is arranged at the front end of the hopper disc 28; and the opening 32 is located above the flexplate 30. In operation, granular or fragmented semiconductor element materials are stacked on the hopper disc 28, and then the first vibrator 29 is controlled to drive the hopper disc 28 to vibrate so as to drop part of the materials from the opening 32 onto the flexible vibration disc 30; after falling, partial materials are too concentrated and are distributed unevenly; the second vibrator 31 drives the soft vibration disc 30 to vibrate gently again, so that the materials on the soft vibration disc 30 are scattered, and the materials are uniformly distributed on the soft vibration disc 30; then conveniently get material manipulator C and get the material to the semiconductor component on the gentle vibration dish 30.

As shown in fig. 15 to 16, the first vibrator 29 is a vibration motor, and the hopper plate 28 is connected to an upper end of the vibration motor, specifically: a first vibration adapter plate 33 is arranged at the upper end of the vibration motor, a connecting plate 34 extending downwards is correspondingly arranged at the bottom of the funnel disk 28, and the connecting plate 34 is fixedly connected with the first vibration adapter plate 33 through screws; the vibration motor is directly connected under the hopper disc 28, so that the vibration effect is better, and the material is more easily vibrated out. And funnel dish 28 is connected with the vibrating motor through first vibration keysets 33, makes the vibration conduction more even on funnel dish 28, easily dismantles the installation between funnel dish 28 and the vibrating motor, conveniently changes the charging tray. In addition, the first vibration assembly 26 further comprises a fixed seat 35 located at the bottom, the vibration motor is arranged on the fixed seat 35, and a control switch 36 for controlling the vibration motor to be turned on and turned off is arranged on the fixed seat 35, so that the operation is more convenient and simpler.

As shown in fig. 17 to 19, the second vibration unit 27 includes a base plate 37 at the bottom, and the second vibrator 31 includes four linear vibration motors 31a respectively disposed on the peripheries of the base plate 37, wherein the upper end of the single linear vibration motor 31a is connected to a support rod 38; and the bottom of the flexible vibration disk 30 is also detachably connected with a second vibration adapter plate 41, and the top end of the supporting rod 38 is connected to the second vibration adapter plate 41. The four linear vibration motors 31a are distributed around the bottom of the flexible vibration plate 30, so that the vibration amplitude is stable, the flexible vibration plate 30 vibrates in the vertical direction, and the vibration is softer; therefore, the materials in the flexible vibration disc 30 can be controlled to move up and down, left and right by adjusting the amplitude of the linear vibration motor 31 a; can be according to getting material demand control gentle shake the interior material of dish 30 and be in the middle of or scatter, guarantee that the material homodisperse is in gentle dish 30 that shakes all the time. In addition, a bottom light source assembly 39 is further arranged at the bottom of the flexible vibration disc 30, and the bottom light source assembly 39 can provide illumination, so that when the material is grabbed, the shooting position identification of the material on the flexible vibration disc 30 is facilitated; specifically, the method comprises the following steps: the bottom light source assembly 39 is positioned right below the flexible vibration disc 30, the linear vibration motors 31a are distributed around the bottom light source assembly 39, and the second vibration adapter plate 41 is of a structure shaped like a Chinese character 'kou', so that illumination of the bottom light source assembly 39 can be avoided; in which as shown in figure 19: from top to bottom, the bottom light source assembly 39 comprises a dust-proof plate 39a, a light-emitting plate 39b and a heat-radiating aluminum plate 39c, so that the product is more durable. As shown in fig. 14, a cover 40 is further disposed between the substrate 37 and the flexible disk 30, and the cover 40 can further prevent dust and shield light; and the front end of the outer cover 40 is also provided with an adjusting switch 40a, the adjusting switch 40a can control the start and stop of the linear vibration motor 31a, and the adjustment is convenient and quick. Correspondingly, the flexible vibration disc 30 is made of a plastic material with light transmittance, so that light can penetrate through the flexible vibration disc 30, and the materials on the flexible vibration disc 30 can be shot and positioned more clearly; specifically, in the present embodiment, the flexible vibration plate 30 is made of pom material, and has the characteristics of light transmission and light weight.

As shown in fig. 14, the funnel disk 28 is adjacent to the flexible disk 30 in the front-back direction, the funnel disk 28 is located above the flexible disk 30, and the opening 32 is located opposite to the flexible disk 30; then the materials on the hopper disc 28 are easy to fall on the flexible vibration disc 30 along with the vibration of the hopper disc 28 in the front-back direction; the feeding is convenient and fast, and manual operation is not needed.

As shown in fig. 1 to 3, the vibration feeder a is configured with 6 sets of vibration feeders 20 arranged side by side, and each set of vibration feeders 20 is configured to perform vibration feeding on semiconductor elements of different specifications.

Further, the method comprises the following steps: the material taking assembly 22 is correspondingly provided with 6 material taking units 42 side by side on one side close to the vibration feeding device A, and the material taking units 42 are configured as suction nozzles; the single material taking unit 42 is responsible for sucking the semiconductor elements on one flexible vibration disc 30; on the side of the picking assembly 22 close to the tray automatic conveyor B, there are correspondingly 4 picking units 42 side by side, and a single picking unit 42 is responsible for picking up semiconductor components at one picking station 8. Each pick-up unit 42 is then responsible for picking up semiconductor elements of one specification; then, the semiconductor elements with different specifications can be conveyed and loaded at the same time through the vibration feeding device A and the automatic tray conveying device B; the semiconductor elements can be sequentially sucked by a plurality of material taking units 42. In addition, a positioning device is further arranged on the machine table a, and the photographing positioning device comprises a movably adjustable first photographing positioning component 43 positioned above the flexible vibration disc 30 and a movably adjustable second photographing positioning component 44 positioned above the material taking station 8; the first photographing positioning assembly 43 can slide and lift on the machine table a to photograph each flexible vibration plate 30, so as to identify the distribution position of the semiconductor elements on the flexible vibration plate 30; and the bottom light source assembly 39 can provide light to make the first photographing positioning assembly 43 have better photographing effect and more clear positioning. The second photographing positioning assembly 44 can also slide and lift on the machine platform a to photograph each material taking station 8, identify the distribution position of the semiconductor elements on the material tray 1 at the material taking station 8, and facilitate the material taking unit 42 to directly absorb the semiconductor elements on the material tray 1.

As shown in fig. 1-3 and 5, the assembly device D comprises a stacking station 45, the stacking station 45 is also provided with a stacking unit 2, and the empty assembly tray 24 is stacked on the stacking station 45; the single assembly tray 24 will be transported and stay at the loading station 23 for assembly of the semiconductor components; wherein, a plurality of assembling notches 25 are uniformly arranged on the assembling tray 24; the material taking manipulator C sequentially sucks the semiconductor components on the flexible vibration disc 30 and the material taking station 8, then moves the semiconductor components to the position above the material loading station 23, sequentially stacks the semiconductor components in the assembling notch 25, and then completes the assembly of the single semiconductor component; a third vibrator 46 is arranged below the charging station 23; during assembly, there is a phenomenon that the positions of the semiconductor devices are shifted after being placed or there is a gap between the semiconductor devices, so the third vibrator 46 can drive the assembly tray 24 to vibrate gently, thereby aligning the positions of the stacked semiconductor devices and eliminating the gap, so that the assembly is more accurate. When the assembly notches 25 on the individual assembly trays 24 are full, the assembly trays 24 are taken away, and the assembly trays 24 on the stacking station 45 can be automatically conveyed to the loading station 23 again; thus, a plurality of assembled semiconductor elements can be obtained, and the operation is convenient and simple.

In summary, the semiconductor element assembling system of the utility model can simultaneously feed semiconductor elements of different specifications, and is provided with the vibration feeding machine A to conveniently feed fragmented or granular semiconductor elements; a material tray automatic conveying device B is arranged to conveniently feed the modularized semiconductor elements through the material tray 1; the semiconductor element assembly is more suitable for the assembly of various types of semiconductor elements; the material taking assembly 22 is provided with a plurality of material taking units 42 which are respectively responsible for absorbing semiconductor elements of one specification, so that the material taking is in order; then the material taking manipulator C sequentially places the sucked semiconductor elements in the assembly notches 25 on the assembly tray 24, thereby completing the automatic assembly work of the semiconductor elements; compared with the mode of manually picking up and assembling the semiconductor elements one by one in the prior art, undoubtedly, the manual labor force is greatly released; the production efficiency is improved, and the productivity is increased; the supply requirement of batch is met.

Claims (9)

1. A semiconductor component mounting system, characterized by: comprises a machine platform, on which is arranged:

the vibration feeding device consists of a plurality of vibration feeding machines which are arranged adjacently, a single vibration feeding machine is configured to feed one type of semiconductor elements with the same specification, and each vibration feeding machine is provided with a hopper disc for feeding and a flexible vibration disc for dispersing the semiconductor elements so as to conveniently take the semiconductor elements;

the automatic material tray conveying device consists of a plurality of feeding and discharging conveying units which are arranged adjacently and used for conveying material trays; the material trays on the single feeding and discharging conveying unit are configured to load another type of semiconductor elements with the same specification; each feeding, discharging and conveying unit comprises a feeding station and a material taking station; the material tray is conveyed to a material taking station from a material loading station to take materials;

the material taking manipulator is configured to take the semiconductor elements on the single flexible vibration disc and the material disc at the material taking station and move the semiconductor elements into the assembling device;

the assembling device is arranged between the vibration feeding device and the automatic material tray conveying device; the assembling device comprises a loading station, wherein an idle assembling tray is arranged on the loading station, and a plurality of assembling notches are uniformly distributed on the assembling tray; the assembly notch is configured to load the assembled semiconductor element.

2. The semiconductor component mounting system according to claim 1, wherein: the single feeding and discharging conveying unit also comprises a recovery station; in the feeding process, the material trays are stacked at a feeding station, and the single material trays can be sequentially conveyed to a material taking station for taking materials; after material taking is finished, the material tray at the material taking station is conveyed to the recovery station and can be automatically stacked.

3. The semiconductor component mounting system according to claim 1, wherein: the single vibration feeding machine comprises a first vibration component and a second vibration component which are adjacent; the hopper disc is arranged on the first vibrating assembly, and the semiconductor element is placed in the hopper disc for pre-feeding; the flexible disk is disposed on the second vibratory assembly and the hopper disk is configured to vibrate to feed the semiconductor components into the flexible disk.

4. The semiconductor component mounting system according to claim 3, wherein: the funnel disc is adjacent to the flexible vibration disc in front and back; the funnel dish is located the top of gentle vibration dish, and the front end of funnel dish is equipped with the opening, and the opening part of funnel dish is just to the gentle vibration dish.

5. The semiconductor component mounting system according to claim 3, wherein: the first vibration assembly comprises a first vibrator which is also positioned below the hopper disc, and the first vibrator is a vibration motor; the second vibration subassembly includes the second vibrator that is located gentle vibration dish below, the second vibrator includes four linear vibration motors that distribute around gentle vibration dish.

6. The semiconductor component mounting system according to claim 1, wherein: the free end of the material taking manipulator is provided with a material taking component; the material taking units with the same number as the vibration feeding machines are arranged on one side of the material taking assembly close to the vibration feeding device side by side; the material taking units with the same number as the feeding and discharging conveying units are arranged on one side of the material taking assembly close to the automatic material tray conveying device side by side; each material taking unit is configured to absorb the semiconductor elements on the flexible vibration disc or the material disc at the material taking station.

7. The semiconductor component mounting system according to claim 6, wherein: the material taking unit is configured to be a suction nozzle or a clamping jaw.

8. The semiconductor component mounting system according to claim 1, wherein: still include positioner, positioner is including the first locating component of shooing that is located the liftable removal of gentle vibration dish top and is adjusted and the second that is located the liftable removal of material-taking station top and adjusts the locating component of shooing.

9. The semiconductor component mounting system according to claim 1, wherein: the assembling device also comprises a stacking station and a third vibrator positioned below the charging station; the assembly trays are stacked on a stacking station and are sequentially conveyed to the assembly station for assembling the semiconductor elements.

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