CN216600555U

CN216600555U - Practical heat dissipation device for loading PCB

Info

Publication number: CN216600555U
Application number: CN202122598900.9U
Authority: CN
Inventors: 朱超; 徐金博; 高丙午
Original assignee: Dongguan City Hao Electronic Technology Co ltd
Current assignee: Dongguan City Hao Electronic Technology Co ltd
Priority date: 2021-10-27
Filing date: 2021-10-27
Publication date: 2022-05-24
Anticipated expiration: 2031-10-27

Abstract

The utility model belongs to the technical field of heat dissipation equipment, and particularly relates to a practical heat dissipation device for loading a PCB (printed circuit board), which comprises a mounting seat and a heat transfer mechanism, wherein the mounting seat is provided with a mounting limiting groove; the heat transfer mechanism comprises a heat exchange assembly and a cover plate, the heat exchange assembly is arranged on the mounting seat, and the cover plate covers the heat exchange assembly; the heat exchange assembly comprises a connecting carrier, a heat exchange tube, a heat exchange seat and a fin component, the connecting carrier is fixedly arranged on a mounting seat, a limit groove for installing the heat exchange seat is formed in the connecting carrier, the heat exchange seat is installed in the limit groove and can abut against a heating chip on a PCB, the fin component is fixedly arranged on the connecting carrier, the heat exchange tube is arranged between the fin component and the heat exchange seat, a heat transmission unit is adopted to directly abut against the PCB to heat the heating end, a fan structure is omitted, the output end of the air channel and an external air blowing unit is communicated, the overall space occupation volume of the PCB is effectively reduced, the PCB installation difficulty is reduced, the practicability of the heat dissipation device for the PCB is improved, and enterprise development is facilitated.

Description

Practical heat dissipation device for loading PCB

Technical Field

The utility model belongs to the technical field of heat dissipation equipment, and particularly relates to a practical heat dissipation device for loading a PCB.

Background

Along with the improvement of the integration level of power electronic products, the volume of the electronic products becomes smaller and smaller, more and more devices are arranged on the PCB with the same size, and the heat emitted by the devices arranged on the PCB needs to be discharged in time so as to ensure that each electrical appliance element can work stably and reliably. At present, electronic products are often provided with fans for dissipating heat of devices on a PCB, and a special mounting seat is usually provided for the fans in a housing of the electronic products, and the fans are fixed on the mounting seat and then connected to a circuit access point and a control line access point on the PCB through wires.

The PCB heat dissipation device adopting the fan structure is large in overall size, so that the installation environment of the PCB is limited, the installation effect of the PCB is seriously influenced, the normal use of the PCB is not facilitated, the market public praise of the PCB provided with the heat dissipation fan is reduced, and the enterprise development is not facilitated.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a practical heat dissipation device for loading a PCB (printed circuit board), and aims to solve the technical problems that in the prior art, the PCB heat dissipation device adopting a fan structure is large in overall size, so that the installation environment of the PCB is limited, the installation effect of the PCB is seriously influenced, the normal use of the PCB is not facilitated, the market public praise of the PCB provided with a heat dissipation fan is reduced, and the enterprise development is not facilitated.

In order to achieve the above object, an embodiment of the present invention provides a practical heat dissipation device for loading a PCB, including a mounting base and a heat transfer mechanism, wherein the mounting base is provided with a mounting limit groove for mounting the PCB; the heat transfer mechanism comprises a heat exchange assembly and a cover plate, the heat exchange assembly is arranged on the mounting seat and limits the PCB, a heat exchange contact end of the heat exchange assembly can extend to a heating end of the PCB, and the cover plate covers the heat exchange assembly; the heat exchange component comprises a connecting carrier, a heat exchange tube, a heat exchange seat and a fin part, wherein the connecting carrier is fixedly arranged on the mounting seat, a limiting groove used for installation is formed in the connecting carrier, the heat exchange seat is installed in the limiting groove and can abut against a heating chip on a PCB, the fin part is fixedly arranged on the connecting carrier, the end face of the fin part is abutted against the heat exchange seat, the heat exchange tube is arranged between the fin part and the heat exchange seat, and the heat exchange tube and the heat exchange seat are formed by casting copper alloy.

Optionally, the heat exchange tubes are loaded with a heat transfer fluid.

Optionally, the heat transfer seat includes connecting plate and butt platform, the butt platform is fixed to be set up on the connecting plate, the connecting plate with the connection carrier can be dismantled and be connected, the quantity of connecting plate is two sets of, and is two sets of the connecting plate symmetry sets up the tip both sides of butt platform, the butt bench shaping of taking shape is limited the holding tank of heat exchange tube, the holding tank is located two sets of between the connecting plate, the inner wall of holding tank can with the lateral wall butt of heat exchange tube.

Optionally, the connecting plate and the abutment table are both cast in one piece from a copper alloy through a casting machine.

Optionally, the connection carrier includes a covering frame and a mounting plate, the covering frame is disposed at an axial edge of the mounting plate, the limiting groove is formed on the mounting plate, and a plurality of connection units for connecting the mounting seat are disposed at an axial edge of the mounting plate; wherein, the height of cladding frame is greater than the mounting plate thickness, the mounting panel is located the intermediate position of cladding frame, the up end and the lower terminal surface symmetric shaping of mounting panel have first mounting groove and second mounting groove, the spacing groove runs through mounting panel and intercommunication first mounting groove with the second mounting groove, first mounting groove is used for holding PCB, the second mounting groove is used for holding the heat exchange tube.

Optionally, the fin component includes the Contraband type frame of multiunit parallel arrangement, the multiunit Contraband type frame closes the installation in proper order, the inner circle of Contraband type frame forms wind channel structure, Contraband type frame is fixed to be set up connect the carrier and keep away from the tip of mount pad, Contraband type frame is followed connect the length direction setting of carrier, the tip of Contraband type frame with the heat exchange tube with the heat transfer seat butt.

Optionally, the cover plate comprises a plane plate and two connecting side plates, the number of the connecting side plates is two, the connecting side plates are symmetrically arranged on two side edges of the plane plate, the connecting side plates extend towards the fin part, the connecting side plates can coat the fin part, and the connecting carrier is close to the end portion of the connecting side plates and is provided with a connecting block for connecting the connecting side plates in a protruding mode.

One or more technical solutions in the practical heat dissipation device for loading the PCB provided by the embodiment of the present invention have at least one of the following technical effects: installing the PCB on the installation seat through the installation limiting groove, coating heat-conducting silica gel on the end face of the heat exchange seat abutted to the PCB, abutting the heat exchange seat on the heating end of the PCB, arranging the heat exchange tube on the heat exchange seat, fixedly connecting the connecting carrier to the installation seat, further limiting the heat exchange seat and the heat exchange tube, and limiting the fin part on the connecting carrier through the cover body to finish installation; compared with the technical problems that the whole size of the PCB heat dissipation device adopting the fan structure is larger, the installation environment of the PCB is limited, the installation effect of the PCB is seriously influenced, the normal use of the PCB is not facilitated, the market public praise of the PCB provided with the heat dissipation fan is reduced, and the development of enterprises is not facilitated.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a practical heat dissipation apparatus for loading a PCB according to an embodiment of the present invention.

Fig. 2 is an exploded view of the structure of the practical heat sink for loading a PCB of fig. 1.

Fig. 3 is a schematic structural diagram of a heat transfer mechanism according to an embodiment of the present invention.

Fig. 4 is an exploded view of the structure of the heat transfer mechanism according to the embodiment of the present invention.

Wherein, in the figures, the various reference numbers:

10-mounting base 20-heat transfer mechanism 30-elastic connecting piece

21-heat exchange assembly 22-cover plate 211-connecting carrier

212-heat exchange tube 213-heat exchange base 214-fin part

215-limiting groove 213 a-connecting plate 213 b-abutting table

212 a-connecting pipe 212 b-extending pipe 211 a-coating frame

211 b-mounting plate 214 a-Contraband type frame 221-plane plate

222-connecting the side plates.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to fig. 1-4 are exemplary and intended to be used to illustrate embodiments of the utility model, and should not be construed as limiting the utility model.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

In one embodiment of the present invention, as shown in fig. 1 to 4, a practical heat dissipation device for loading a PCB is provided, which includes a mounting base 10 and a heat transfer mechanism 20, wherein the mounting base 10 is provided with a mounting limiting groove for mounting the PCB; the heat transfer mechanism 20 comprises a heat exchange assembly 21 and a cover plate 22, the heat exchange assembly 21 is arranged on the mounting base 10 and limits the PCB, a heat exchange contact end of the heat exchange assembly 21 can extend to a heating end of the PCB, and the cover plate 22 covers the heat exchange assembly 21; wherein, heat exchange assembly 21 is including connecting carrier 211, heat exchange tube 212, heat exchange seat 213 and fin part 214, connecting carrier 211 is fixed to be set up on the mount pad 10, be provided with on the connecting carrier 211 and be used for the installation the spacing groove 215 of heat exchange seat 213, heat exchange seat 213 installs spacing inslot and can butt the chip that generates heat on the PCB, fin part 214 is fixed to be set up on connecting carrier 211, fin part 214 the terminal surface with heat exchange seat 213 butt, heat exchange tube 212 sets up fin part 214 with between the heat exchange seat 213, heat exchange tube 212 with heat exchange seat 213 is by copper alloy cast molding.

Specifically, the PCB is mounted on the mounting base 10 through the mounting limiting groove, the end surface of the heat exchange base 213 abutted to the PCB is coated with heat conductive silica gel, the heat exchange tube 212 is arranged on the heat exchange base 213 after the heat exchange base 213 is abutted to the heating end of the PCB, the connection carrier 211 is fixedly connected to the mounting base 10, the heat exchange base 213 and the heat exchange tube 212 are limited, and the fin part 214 is limited on the connection carrier 211 through the cover body to complete the mounting; compared with the technical problems that the PCB heat dissipation device adopting the fan structure in the prior art is large in overall size, the installation environment of the PCB is limited, the installation effect of the PCB is seriously influenced, the normal use of the PCB is not facilitated, the market public praise of the PCB provided with the heat dissipation fan is reduced, and the enterprise development is not facilitated.

In another embodiment of the present invention, the heat exchange pipe 212 is loaded with a heat transfer fluid.

As shown in fig. 1 to 4, in another embodiment of the present invention, the heat exchanging seat 213 includes two sets of connecting plates 213a and two abutting tables 213b, the abutting table 213b is fixedly disposed on the connecting plate 213a, the connecting plate 213a is detachably connected to the connecting carrier 211, the two sets of connecting plates 213a are symmetrically disposed on both sides of an end of the abutting table 213b, a receiving groove for receiving the heat exchanging tube 212 is formed on the abutting table 213b, the receiving groove is located between the two sets of connecting plates 213a, an inner wall of the receiving groove can abut against an outer wall of the heat exchanging tube 212, in this embodiment, the thickness of the abutting table 213b is larger than that of the connecting plate 213a, a step structure is disposed at a connecting position of the abutting table 213b and the connecting plate 213a, and the step structure corresponds to an edge position of the limiting groove 215 of the connecting carrier 211, the heat exchanging seats 213 are effectively prevented from being detached from the connection carrier 211.

As shown in fig. 1 to 4, in another embodiment of the present invention, the heat exchange tube 212 includes a connection tube 212a and an extension tube 212b, the connection tube 212a is shaped to fit the receiving groove, in this embodiment, the receiving groove is recessed from an end surface of the abutting table 213b close to the heat exchange tube 212 to form a square groove structure, one end of the extension tube 212b is connected to the connection tube 212a, the other end of the extension tube 212b is bent to extend to one side of the heat exchange seat 213, the extension tube 212b and the connection tube 212a are both abutted to the fin member 214, the heat exchange tube 212 and the connection tube 212a are communicated, and a heat conducting liquid is disposed in the heat exchange tube 212 and the connection tube 212 a.

In another embodiment of the present invention, as shown in fig. 1 to 4, the connecting plate 213a and the abutment stage 213b are integrally formed by casting copper alloy through a casting machine, a screw hole is connected to a corner of the connecting plate 213a, and the connecting plate 213a is fixedly mounted on the connecting carrier 211 by screws.

As shown in fig. 1 to 4, in another embodiment of the present invention, the connection carrier 211 includes a covering frame 211a and a mounting plate 211b, the covering frame 211a is disposed on an axial edge of the mounting plate 211b, the limiting groove 215 is formed on the mounting plate 211b, and a plurality of connection units for connecting the mounting seat 10 are disposed on an axial edge of the mounting plate 211 b; wherein, cladding frame 211a highly is greater than mounting panel 211 b's thickness, mounting panel 211b is located cladding frame 211 a's intermediate position, mounting panel 211 b's up end and lower terminal surface symmetric molding have first mounting groove and second mounting groove, spacing groove 215 runs through mounting panel 211b and intercommunication first mounting groove with the second mounting groove, first mounting groove is used for holding PCB, the second mounting groove is used for holding heat exchange tube 212, in this embodiment, the coupling unit is for the cylindrical structure who has the screw.

As shown in fig. 1 to 4, in another embodiment of the present invention, the fin member 214 includes a plurality of sets of Contraband-shaped frames 214a arranged in parallel, the plurality of sets of Contraband-shaped frames 214a are sequentially covered and mounted, an inner ring of the Contraband-shaped frame 214a forms an air duct structure, the Contraband-shaped frame 214a is fixedly disposed at an end of the connection carrier 211 far away from the mounting seat 10, the Contraband-shaped frame 214a is disposed along a length direction of the connection carrier 211, and an end of the Contraband-shaped frame 214a abuts against the heat exchange tube 212 and the heat exchange seat 213.

Specifically, the Contraband-shaped frame 214a includes a top plate, a vertical plate, and a bottom plate, the same side edges of the top plate and the bottom plate are fixedly connected to two ends of the vertical plate, in other embodiments, the top plate and the bottom plate are bent from two ends of the vertical plate to the same side for molding, the top plate is adhered to the bottom wall of the second mounting groove by a hinge glue, the vertical plate is perpendicular to the bottom wall of the second mounting groove, the top plate, the bottom plate, and the vertical plate are all disposed in a bar-shaped structure and extend along the length direction of the mounting plate 211b, all the Contraband-shaped frames 214a are disposed in parallel along the width direction of the mounting plate 211b, two adjacent groups of the Contraband-shaped frames 214a form an air duct structure through the corresponding top plate and the bottom plate, multiple groups of the air duct structures are disposed in parallel, and all the top plates are abutted to the heat exchange tubes 212, the top plate, the bottom plate and the vertical plate are all formed by casting aluminum alloy, the air channel structure is connected with an external air blowing structure pipeline through a cover body or a pipeline unit, and the air blowing structure can be a cooling fan.

As shown in fig. 1 to 4, in another embodiment of the present invention, the cover plate 22 includes two sets of connection side plates 222 and a plane plate 221, the two sets of connection side plates 222 are symmetrically disposed on two side edges of the plane plate 221, the connection side plates 222 extend toward the fin member 214, the connection side plates 222 can cover the fin member 214, a connection block for connecting the connection side plates 222 is protrudingly disposed at an end of the connection carrier 211 close to the connection side plates 222, in this embodiment, the connection block is provided with a screw hole, the connection side plates 222 are provided with an optical hole, and the connection side plates 222 are detachably connected to the connection block through screws.

As shown in fig. 1 to 4, in another embodiment of the present invention, the connection carrier 211 is in buffer connection with the mounting base 10 through an elastic connection member 30, specifically, the elastic connection member 30 includes a connection screw and a compression spring, the cladding frame is provided with an unthreaded hole structure, the mounting base 10 is provided with a screw hole aligned with the unthreaded hole structure, a rod body slidably connected in the unthreaded hole structure is arranged at a middle position of the connection screw, a nut and a threaded connector are respectively arranged at two ends of the rod body, the threaded connector can be in threaded connection with the screw hole, the compression spring is sleeved on the rod body, and two ends of the compression spring are respectively abutted against the nut and the cladding frame.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A utilitarian heat sink for carrying a PCB, comprising:

the mounting seat is provided with a mounting limiting groove for mounting the PCB;

the heat transfer mechanism comprises a heat exchange assembly and a cover plate, the heat exchange assembly is arranged on the mounting seat and used for limiting the PCB, a heat exchange contact end of the heat exchange assembly can extend to a heating end of the PCB, and the cover plate covers the heat exchange assembly;

the heat exchange component comprises a connecting carrier, a heat exchange tube, a heat exchange seat and a fin part, wherein the connecting carrier is fixedly arranged on the mounting seat, a limiting groove used for installation is formed in the connecting carrier, the heat exchange seat is installed in the limiting groove and can abut against a heating chip on a PCB, the fin part is fixedly arranged on the connecting carrier, the end face of the fin part is abutted against the heat exchange seat, the heat exchange tube is arranged between the fin part and the heat exchange seat, and the heat exchange tube and the heat exchange seat are formed by casting copper alloy.

2. A practical heat sink for loading a PCB according to claim 1, wherein: the heat exchange tubes are filled with heat conducting liquid.

3. A practical heat sink for loading a PCB according to claim 1, wherein: the heat exchange base comprises a connecting plate and a butt joint table, the butt joint table is fixedly arranged on the connecting plate, the connecting plate is detachably connected with the connecting carrier, the number of the connecting plate is two sets, the connecting plate is symmetrically arranged on two sides of the end portion of the butt joint table, the butt joint table is limited in forming position, the accommodating groove of the heat exchange tube is located between the connecting plates, and the inner wall of the accommodating groove can be abutted to the outer side wall of the heat exchange tube.

4. A practical heat sink for loading a PCB according to claim 3, wherein: the connecting plate and the abutting table are integrally formed by casting copper alloy through a casting machine.

5. A practical heat sink for loading a PCB according to claim 1, wherein: the connecting carrier comprises a coating frame and a mounting plate, the coating frame is arranged on the axial edge of the mounting plate, the limiting groove is formed on the mounting plate, and a plurality of connecting units used for connecting the mounting seat are arranged on the axial edge of the mounting plate; wherein, the height of cladding frame is greater than the mounting plate thickness, the mounting panel is located the intermediate position of cladding frame, the up end and the lower terminal surface symmetric shaping of mounting panel have first mounting groove and second mounting groove, the spacing groove runs through mounting panel and intercommunication first mounting groove with the second mounting groove, first mounting groove is used for holding PCB, the second mounting groove is used for holding the heat exchange tube.

6. A practical heat sink for loading a PCB according to claim 1, wherein: the fin part includes the Contraband type frame that the multiunit set up side by side, the multiunit Contraband type frame covers in proper order and closes the installation, the inner circle of Contraband type frame forms wind channel structure, Contraband type frame is fixed to be set up connect the carrier and keep away from the tip of mount pad, Contraband type frame is followed the length direction who connects the carrier sets up, the tip of Contraband type frame with the heat exchange tube with the heat transfer seat butt.

7. A practical heat sink for loading a PCB according to claim 6, wherein: the apron includes the plane board and connects the curb plate, the quantity of connecting the curb plate is two sets of, and is two sets of it sets up to connect the curb plate symmetry on the both sides border of plane board, it is past to connect the curb plate the direction extension of finned part, it can the cladding to connect the curb plate finned part, it is close to connect the carrier connect the tip of curb plate outstanding be provided with and be used for connecting the connecting block of curb plate.