CN216596958U

CN216596958U - Mobile solid state disk with efficient three-dimensional heat dissipation system

Info

Publication number: CN216596958U
Application number: CN202220633799.8U
Authority: CN
Inventors: 古德宗; 廖浚男; 范光宇
Original assignee: Zhejiang Ruizhaoxin Semiconductor Technology Co ltd
Current assignee: Zhejiang Ruizhaoxin Semiconductor Technology Co ltd
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2022-05-24
Anticipated expiration: 2032-03-23

Abstract

The utility model discloses a remove solid state hard drives with high-efficient three-dimensional cooling system, include: a receiving case provided with a vertical direction and a horizontal direction; a hard disk main board configured in the housing case; a silica gel heat conductor coated in the housing and used for connecting the hard disk mainboard; wherein, hold the shell and be provided with the radiating part on two opposite flank on the horizontal direction, the radiating part includes a plurality of and the corresponding heat dissipation cell body in position and the heat transfer body that distribute along the horizontal direction, the heat transfer body protrusion is to the inside of holding the shell, two relative tip of heat transfer body on the vertical direction have the heat transfer hole, the heat transfer hole is linked together with the heat dissipation cell body and is interacted through heat dissipation cell body and outside air. The utility model discloses a structure of radiating part and silica gel heat conduction realizes the convection heat dissipation, has established more efficient heat-conduction three-dimensional cooling system, and has water-proof effects concurrently simultaneously, effectively protects product safety.

Description

Mobile solid state disk with efficient three-dimensional heat dissipation system

Technical Field

The utility model belongs to the technical field of semiconductor memory device technique and specifically relates to a remove solid state hard drives with high-efficient three-dimensional cooling system is related to.

Background

The mobile solid state disk is a movable solid state disk, also called PSSD, namely a Portable SSD, and the solid state disk originally installed in a computer is made into a traditional mobile hard disk form, is similar to a U disk, and has the characteristics of small volume, quick reading, large capacity and small influence by external force.

Compared with the traditional mechanical mobile hard disk, the mobile solid state hard disk does not adopt a mechanical operation part, and mainly depends on a main control chip and a flash memory chip to store data. Because no mechanical part runs, the mobile solid state disk is smaller and more convenient, along with the continuous development of the technology, the current mobile solid state disk has obvious advantages in reading and writing speed, and the transmission speed of the fastest mobile solid state disk can break through 3000MB/s, so that the efficient work of a flash memory chip and a main control chip is benefited. With the increasing transmission speed and the increasing heat productivity, it is conceivable that heat is accumulated in the small space of the mobile solid state disk, which undoubtedly brings about great hidden troubles to the service lives of the flash memory chip and the main control chip. The mobile solid state disk sold in the market generally adopts passive heat dissipation on the outer surface, the heat dissipation efficiency is low, and heat accumulation cannot be released inside. In the past, the service life of the mobile solid state disk is greatly reduced.

Therefore, how to improve the heat dissipation effect is a key point for prolonging the service life of the heat dissipation structure, at present, corresponding heat dissipation structures are available, for example:

the heat dissipation TYPE mobile hard disk disclosed in patent document 1 comprises a shell, a PCB mainboard, a solid state disk, a fan and a TYPE-C interface, wherein the PCB mainboard, the solid state disk and the fan are all installed in the shell, and a plurality of heat dissipation holes are formed in the shell; the solid state hard drives and the fan are connected with the PCB mainboard, the TYPE-C interface is installed on the side wall of the shell and connected with the PCB mainboard for connecting external equipment.

Patent document 2 discloses a heat dissipation device for an SSD solid state disk, and relates to the technical field of hard disks. This SSD solid state hard drives heat abstractor, including organism, solid state hard drives, base, heat dissipation window, solid state hard drives swing joint is on the inner wall bottom right side of organism, it has the metal conducting strip to peg graft in the inside of base, heat dissipation window fixed mounting is in the inside right side top of organism, the inner wall bottom left side fixedly connected with dog of organism, the inside left side of organism is from last to being equipped with spacing subassembly and transmission assembly down in proper order, the inside left side upper end of organism is rotated and is connected with the gear, the big knob of fixedly connected with of pivot department fixedly connected with of gear.

However, the above-mentioned patent document 1 needs to be installed with a fan, and the second patent document needs a larger heat dissipation assembly space, because the use of the mobile solid state disk needs convenience, the external dimension is smaller, and the possibility of using a large-area heat dissipation structure cannot be used.

Patent document 1 CN 210182069U.

Patent document 2 CN 214670386U.

SUMMERY OF THE UTILITY MODEL

The utility model relates to an in order to avoid the weak point that prior art exists, provide a solid state hard drives who realizes high-efficient heat dissipation function under the limited condition of space cost.

The utility model provides a technical problem adopt following technical scheme:

the utility model provides a remove solid state hard drives with high-efficient three-dimensional cooling system, include:

a receiving case provided with a vertical direction and a horizontal direction;

a hard disk main board configured in the housing case;

a silica gel heat conductor coated in the containing shell and used for connecting the hard disk mainboard;

wherein, hold the shell and be provided with the radiating part on two opposite flank on the horizontal direction, the radiating part includes a plurality of and the corresponding heat dissipation cell body in position and the heat transfer body that distribute along the horizontal direction, the heat transfer body protrusion is to the inside of holding the shell, two relative tip of heat transfer body on the vertical direction have the heat transfer hole, the heat transfer hole is linked together with the heat dissipation cell body and is interacted through heat dissipation cell body and outside air.

In several embodiments, the heat sink body is recessed inwardly from the containment housing into the interior of the heat exchanger body.

In several embodiments, it includes separable main casing body and end cover body to hold the shell, be provided with two insulators in the main casing body, the insulator distributes along the horizontal direction, the insulator press close to the radiating part and with there being the interval between the radiating part, the silica gel heat conductor sets up between two insulators.

In several embodiments, an end face of the end cover body facing the main housing is surrounded by a separation ring, and the separation ring protrudes to the outside of the end cover body.

In several embodiments, the heat sink grooves are disposed obliquely, and the two heat exchanging holes are disposed on two different end surfaces of the same heat exchanging body and are respectively communicated with two opposite end portions of the corresponding heat sink grooves.

The utility model realizes convection heat dissipation through the structure of heat dissipation part and silica gel heat conduction, establishes a more efficient heat conduction three-dimensional heat dissipation system, and does not need to increase the space; through the setting of spacer element, possess certain splashproof function for when the product has high-efficient heat dissipation function, can the maximize alleviate because of the harm that the liquid that the accident leads to spilled into and bring, finally make the life of product prolong greatly, data safety can protect.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not to be considered limiting of the scope of the present disclosure.

FIG. 1 schematically shows the overall structure of a mobile solid state disk with an efficient three-dimensional heat dissipation system;

figure 2 schematically illustrates the explosive structure of figure 1;

fig. 3 schematically shows a side structure of the main casing in fig. 1;

fig. 4 schematically shows a perspective structure of the main housing of fig. 1;

fig. 5 schematically illustrates the structure of the end cap body of fig. 1.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, embodiments of the present invention are described in detail below, and the embodiments of the present invention are described in detail below clearly and completely.

Therefore, the detailed description of the embodiments of the present invention provided below is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention, and all other embodiments obtained by those skilled in the art without any inventive work based on the embodiments of the present invention belong to the scope of the present invention.

The terminology used herein is for the purpose of explaining the embodiments and is not intended to limit and/or define the invention.

For example, expressions such as "in a certain direction", "along a certain direction", "parallel", "orthogonal", "center", "relative", "front-back-left-right" and the like indicate relative or absolute arrangements, and indicate not only such arrangements in a strict sense but also a state of being relatively displaced with a tolerance or an angle or a distance to the extent that the same function can be obtained.

As shown in fig. 1-2, the main body of the mobile solid-state hard disk with a high-efficiency three-dimensional heat dissipation system is composed of a housing 10, a hard disk main board 20 and a silica gel heat conductor 30, the hard disk main board 20 is a conventional integrated mobile solid-state hard disk main board, both the hard disk main board 20 and the silica gel heat conductor 30 are disposed in the housing 10, the hard disk main board 20 and the housing 10 are connected by the silica gel heat conductor 30, and the silica gel heat conductor 30 may be a silica gel heat conducting fin.

As shown in fig. 1-3, firstly, a vertical direction 101 and a horizontal direction 102 are set based on an accommodating housing 10, where the accommodating housing 10 is composed of a main housing 11 and an end cover 12 which are separable, the main housing 11 constitutes an accommodating space, the end cover 12 is used to close the accommodating space, specifically, heat dissipation parts are disposed on two opposite sides of the main housing 11 in the horizontal direction 102, the heat dissipation parts include a plurality of heat dissipation groove bodies 40 and heat exchange bodies 50 which are distributed along the horizontal direction 102 and correspond to each other in position, the heat exchange bodies 50 protrude into the main housing 11, heat exchange holes 51 are disposed at two opposite ends of the heat exchange bodies 50 in the vertical direction 101, and the heat exchange holes 51 are communicated with the heat dissipation groove bodies 40 and interact with outside air through the heat dissipation groove bodies 40.

As shown in fig. 3-4, the heat sink body 40 is obliquely disposed, and the heat sink body 40 is recessed inward into the heat exchanger 50 from the main housing 11, so that the heat exchanger 50 is in a shell-shaped structure, the usage amount is reduced, and the weight is reduced, two of the heat exchanging holes 51 are respectively disposed on two different end surfaces of the same heat exchanger 50, that is, the two heat exchanging holes 51 are substantially located at diagonal positions, and there are intervals in the horizontal direction and the vertical direction, and the two heat exchanging holes 51 are respectively communicated with two opposite end portions of the corresponding single heat sink body 40, that is, from the inward view angle outside the main housing 11, the bottom end and the top end of the heat sink body 40 are provided with the heat exchanging holes 51, thereby achieving heat exchange.

Through the combination of the heat exchange body 50, the heat exchange hole 51 and the heat dissipation groove body 40, efficient convection heat dissipation is achieved, and through the silica gel heat conductor 30, when the convection heat dissipation is achieved, heat inside the heat exchange body can be dissipated through a heat conduction heat dissipation mode, and the heat dissipation efficiency of the three-dimensional heat dissipation system formed by the convection heat dissipation and the heat conduction heat dissipation is efficient and silent.

As shown in fig. 4, two isolators 60 are further disposed in the main housing 11, the isolators 60 are strip-shaped and distributed along the horizontal direction 102, there is a gap between the heat dissipation portion and the heat dissipation portion that is attached to the isolators 60, the silica gel heat conductor 30 is disposed between the two isolators 60, and an isolation region is formed between the isolators 60 and the heat exchanger 50 that is attached to each other through the gap between the isolators 60 and the heat exchanger 50 that is attached to each other, and an instant external liquid enters the main housing 11 through the heat exchanging holes 51, and is also blocked in the isolation region, so that the hard disk main body 20 is prevented from being damaged by water, and an anti-splattering effect is achieved.

As shown in fig. 5, in consideration of the small size of the mobile solid state disk, the interface can be inserted in the front and back directions, and the front and back surfaces of the product are not strictly limited in use, so that a separation ring 70 is disposed around the end surface of the end cover 12 facing the main housing 11, and the separation ring 70 protrudes to the outside of the end cover 12 and is in a closed loop shape, so that even if the end cover 12 is used as a bottom surface on a platform and is immersed in a liquid, the liquid can be blocked outside the hard disk main board 20 by the separation ring 70, thereby achieving protection.

It should be noted that the end cover 12 and the main housing 11 are connected by a fastener, such as a screw 100, for easy assembly and disassembly.

The present invention has described preferred embodiments, including the best mode known to those of the present invention for carrying out the present invention. Of course, variations of these preferred embodiments will be apparent to those skilled in the art. The present invention contemplates that skilled artisans can use this variation as appropriate, and the present invention teaches that the present invention can be practiced otherwise than as specifically described herein. Accordingly, this invention includes all modifications encompassed within the spirit and scope of the invention as defined by the claims. Moreover, unless stated otherwise or clearly contradicted by context, the present disclosure includes any and all possible variations of the above-described elements.

Claims

1. A mobile solid state disk with an efficient three-dimensional heat dissipation system is characterized by comprising:

a receiving case provided with a vertical direction and a horizontal direction;

a hard disk main board configured in the housing case;

2. The mobile solid state disk with the efficient three-dimensional heat dissipation system as recited in claim 1, wherein the heat dissipation groove body is recessed inwards from the accommodating shell to the inside of the heat exchange body.

3. The mobile solid state disk with the efficient three-dimensional heat dissipation system according to claim 2, wherein the accommodating case comprises a main case body and an end cover body which can be separated, two isolating bodies are arranged in the main case body, the isolating bodies are distributed along a horizontal direction, the isolating bodies are close to the heat dissipation portion and have a distance with the heat dissipation portion, and the silica gel heat conductor is arranged between the two isolating bodies.

4. A mobile solid state disk with an efficient three-dimensional heat dissipation system as recited in claim 3, wherein an isolation ring is disposed around an end face of the end cover body facing the main casing, and the isolation ring protrudes outward of the end cover body.

5. The mobile solid state disk with the efficient three-dimensional heat dissipation system as claimed in claim 3, wherein the heat dissipation slot is obliquely arranged, and the two heat exchange holes are respectively arranged on two different end faces of the same heat exchange body and are respectively communicated with two opposite end portions of the corresponding heat dissipation slot.