CN216582860U - Loading and unloading device of semiconductor chip plasma cleaning machine - Google Patents

Abstract

The utility model discloses a loading and unloading device of a semiconductor chip plasma cleaning machine, which comprises a machine base, a material storage device, a material conveying device and a first material pushing device, charging tray subassembly and second blevile of push, storage device is including installing the first elevating system on the frame, install the centre gripping subassembly at first elevating system and install the magazine on the centre gripping subassembly, pass the material device including installing the translation group one on the frame and installing left side board and the right side board at translation group one, defeated material subassembly is installed to left side board and right side board, first blevile of push is including installing the third translation mechanism on the frame and installing the first pusher dog at third translation mechanism, the charging tray unit mount is on the frame, the second blevile of push is including installing the fourth translation mechanism on the frame, install the second elevating system at fourth translation mechanism and install the second pusher dog at second elevating system. By adopting the utility model, the function of reducing the number of adjusting parts is realized, the adjusting steps are simplified, and the time consumption is reduced.

Description

Loading and unloading device of semiconductor chip plasma cleaning machine

Technical Field

The utility model relates to the technical field of plasma cleaning machine equipment, in particular to a feeding and discharging device of a semiconductor chip plasma cleaning machine.

Background

A plasma cleaning machine is a device for cleaning semiconductor chips such as a chip frame or a PCB board by plasma discharge. The existing plasma cleaning machine is provided with a feeding and discharging mechanism which can be used corresponding to semiconductor chips with different widths, but most parts on the feeding and discharging mechanism are adjusted on one side, such as a material storage device and a material conveying device, the positions of one side of the material storage device and the other side of the material conveying device are fixed, and therefore the semiconductor chips with different widths can be placed and conveyed.

However, such an adjustment method requires corresponding adjustment of other components, such as the first pusher jaw for pushing the unwashed semiconductor chip in the storage device out to the transfer device; the first push claw and the second push claw correspond to the central line position of the semiconductor chip, therefore, when the type of the semiconductor chip is converted, a plurality of components need to be matched and adjusted, and the adjusting steps are complex and time-consuming.

Disclosure of Invention

The technical problem to be solved by the present invention is to provide a loading and unloading device for a semiconductor chip plasma cleaning machine, which realizes the function of reducing the number of adjusting components, simplifies the adjusting steps, and reduces the time consumption.

In order to solve the technical problem, the utility model provides a loading and unloading device of a semiconductor chip plasma cleaning machine, which comprises a machine base;

the material storage device comprises a first lifting mechanism arranged on the machine base, a clamping assembly arranged at the output end of the first lifting mechanism and a plurality of material boxes arranged on the clamping assembly;

the material conveying device comprises a first translation group, a left side plate, a right side plate and a material conveying assembly, wherein the first translation group is arranged on the base and is positioned at the discharge end of the material box;

the first material pushing device comprises a third translation mechanism arranged on the base and a plurality of first push claws arranged at the conveying end of the third translation mechanism, the third translation mechanism is positioned on one side of the material box far away from the material conveying device, and the first push claws push the semiconductor chips in the material box out to the material conveying device;

the material tray assembly is arranged on the base and used for alternately receiving the semiconductor chips on the material conveying device;

and the second pushing device comprises a fourth translation mechanism arranged on the base, a second lifting mechanism arranged at the output end of the fourth translation mechanism and a plurality of second pushing claws arranged at the output end of the second lifting mechanism, and the second pushing claws are used for pushing the semiconductor chip into the material conveying device from the material tray assembly or pushing the material tray assembly out from the material conveying device.

Wherein, the centre gripping subassembly includes mounting panel, left holding strip, right holding strip, positioning mechanism and hold-down mechanism, the mounting panel sets up first elevating system's output, positioning mechanism and hold-down mechanism all install on the mounting panel, and a plurality of right holding strips are installed on positioning mechanism, and a plurality of left holding strips are installed on hold-down mechanism to press from both sides tight magazine with right holding strip cooperation under hold-down mechanism's effect.

The positioning mechanism comprises a first screw rod and a plurality of first right clamping strips, wherein the first screw rod is connected with a second connecting plate in a sliding mode and a mounting plate in a threaded mode, the first right clamping strips are fixed on the second connecting plate at equal intervals, the first screw rod is connected with the second connecting plate in a rotating mode, and a hand wheel convenient to rotate the first screw rod is fixed at the tail end of the first screw rod.

The pressing mechanism comprises a first connecting plate and a first driving cylinder, the first connecting plate is connected with the mounting plate in a sliding mode, the first driving cylinder is mounted on the mounting plate, the first connecting plate is connected with the tail end of an extension rod of the first driving cylinder, a plurality of push plates are arranged on the first connecting plate, and a spring is arranged between the left holding strip and the push plates.

The first driving cylinder is a stroke-adjustable cylinder or a cylinder with a magnetic switch.

The base plate is installed on the base, the first translation mechanism is installed on the base plate, the second translation mechanism is installed on the base plate, the baffle is installed on the base plate, a guide rail is fixed on the base plate, the left side plate and the right side plate are connected with the guide rail in a sliding mode, the output end of the first translation mechanism is installed on the left side plates, the output end of the second translation mechanism is installed on the right side plates, the left side plates and the right side plates move in opposite directions or away from one another in a one-to-one mode, the baffle is located in the middle of the guide rail, and the left side plate and the right side plate which are close to the baffle are both provided with the ranging sensors.

The material conveying assembly comprises an upper pressing wheel mechanism, a lower conveying mechanism and a first material bearing strip, the first material bearing strip is installed on the left side plate or the right side plate, a first horizontal through groove is formed in the first material bearing strip, the upper pressing wheel mechanism and the lower conveying mechanism are both installed on the left side plate or the right side plate, the upper pressing wheel mechanism is arranged above the first horizontal through groove, and the lower conveying mechanism is located below the first horizontal through groove.

Wherein, conveying mechanism includes power supply, transfer line, action wheel, follows driving wheel and conveyer belt down, the power supply is installed on the bottom plate, the transfer line rotates with the bottom plate to be connected, the action wheel rotates with left side board or right side board to be connected, action wheel and transfer line sliding connection to the transfer line can drive the action wheel and rotate, and two are rotated with left side board or right side board respectively from the driving wheel and are connected, and the conveyer belt cup joints on the action wheel and takes turns to from the wheel face of driving wheel, and the transport face of conveyer belt with the downside that the groove was led to first level is on same horizontal plane, rotate on left side board or the right side board and be connected with the ferryboat of crossing that is used for compressing tightly the conveyer belt.

The material tray assembly comprises a second translation group, material trays and a third lifting mechanism, the second translation group is installed on the base, the two material trays are installed on the second translation group respectively and are driven by the second translation group to be close to the material conveying device in turn, and the third lifting mechanism is installed between the second translation group and one material tray.

The material tray is provided with a plurality of groups of second material bearing strips which are respectively connected with the material tray in a sliding manner, and the second material bearing strips are provided with second horizontal through grooves for supporting semiconductor chips.

The beneficial effects of the implementation of the utility model are as follows: the mounting positions of the material boxes are determined by adjusting the clamping assembly, and the positions of the central surfaces of the material boxes in each group are ensured to be unchanged; the positions of the left side plate and the right side plate are synchronously adjusted through the first translation group, so that the semiconductor chips are conveyed forwards in a matching mode through the material conveying assemblies on the left side plate and the material conveying assemblies on the right side plate, and the positions of the first push claw and the second push claw do not need to be correspondingly adjusted due to the fact that the positions of the central planes of the semiconductor chips conveyed by all groups are unchanged, so that the function of reducing the number of adjusting parts is achieved, the adjusting steps are simplified, and time consumption is reduced.

Drawings

FIG. 1 is a front cross-sectional view of a loading and unloading apparatus of a semiconductor chip plasma cleaning machine according to the present invention;

fig. 2 is a side view of a material storing device in a loading and unloading device of a semiconductor chip plasma cleaning machine according to the present invention;

FIG. 3 is a view A-A of FIG. 2;

FIG. 4 is a side view of a material transfer device in a loading/unloading device of a semiconductor chip plasma cleaning machine according to the present invention;

FIG. 5 is a front cross-sectional view of a material conveying device in a loading/unloading device of a semiconductor chip plasma cleaning machine according to the present invention;

FIG. 6 is a side view of a first pusher in a loading/unloading apparatus of a semiconductor chip plasma cleaning machine according to the present invention;

fig. 7 is a side view of a tray assembly in a loading and unloading apparatus of a semiconductor chip plasma cleaning machine according to the present invention.

In the figure: 1. a machine base; 2. a material storage device; 21. a first lifting mechanism; 22. a clamping assembly; 221. mounting a plate; 222. a left holding strip; 223. a right holding strip; 224. a position adjusting mechanism; 2241. a second connecting plate; 2242. a first screw rod; 2243. a hand wheel; 225. a hold-down mechanism; 2251. a first connecting plate; 2252. a first driving cylinder; 2253. pushing the plate; 2254. a spring; 23. a magazine; 3. a material conveying device; 31. a left side plate; 32. a right side plate; 33. a material conveying component; 331. an upper pinch roller mechanism; 3311. a mounting seat; 3312. a wheel seat; 3313. a second screw; 3314. a tension spring; 332. a lower conveying mechanism; 3321. a power source; 3322. a transmission rod; 3323. a driving wheel; 3324. a driven wheel; 3325. a conveyor belt; 3326. a transition wheel; 333. a first material carrying strip; 3331. a first horizontal through groove; 34. a base plate; 35. a first translation mechanism; 36. a second translation mechanism; 37. a baffle plate; 38. a ranging sensor; 39. a guide rail; 4. a first material pushing device; 41. a third translation mechanism; 42. a first push pawl; 5. a tray assembly; 51. a material tray; 511. A second material carrying strip; 5111. a second horizontal through slot; 52. a third lifting mechanism; 53. a fifth translation mechanism; 54. a sixth translation mechanism; 6. a second material pushing device; 61. a fourth translation mechanism; 62. a second lifting mechanism; 63. and a second push pawl.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-7, the loading and unloading device of a semiconductor chip plasma cleaning machine comprises a machine base 1, a material storage device 2, a material conveying device 3, a first material pushing device 4, a material tray assembly 5 and a second material pushing device 6, wherein the machine base 1 is the machine base 1 of the plasma cleaning machine, and a controller of the plasma cleaning machine is electrically connected with the material storage device 2, the material conveying device 3, the first material pushing device 4, the material tray assembly 5 and the second material pushing device 6. The storing device 2 comprises a first lifting mechanism 21 arranged on the machine base 1, a clamping assembly 22 arranged at the output end of the first lifting mechanism 21 and a plurality of material boxes 23 arranged on the clamping assembly 22, in the implementation, the number of the material boxes 23 is five, the material boxes 23 are used for storing a plurality of semiconductor chips at equal intervals, the clamping assembly 22 can clamp the material boxes 23 with different widths in each group, and under the action of the clamping assembly 22, the central surface positions of the corresponding material boxes 23 in each group are consistent. Pass material device 3 and include translation group one, left side board 31, right side board 32 and defeated material subassembly 33, translation group one is installed on frame 1, and be located the discharge end of magazine 23, the output of translation group one is installed respectively to a plurality of left side boards 31 and a plurality of right side board 32, and the one-to-one does in opposite directions or keeps away from the motion under the drive of translation group one, in this implementation, the quantity of left side board 31 and right side board 32 is five, defeated material subassembly 33 is installed on left side board 31 and right side board 32, specifically, carry the right side at left side board 31 of subassembly 33 installation, carry the left side at right side board 32 of subassembly 33 installation, defeated material subassembly 33 on the left side board 31 and the defeated material subassembly 33 cooperation on the right side board 32 and carry semiconductor chip forward. The first material pushing device 4 comprises a third translation mechanism 41 arranged on the base 1 and a plurality of first push claws 42 arranged at the conveying end of the third translation mechanism 41, the third translation mechanism 41 is positioned at one side of the material box 23 far away from the material conveying device 3, wherein the third translation mechanism 41 can be a synchronous belt transmission mechanism to drive the first push claws 42 to move horizontally. The number of the first push claws 42 is five, the five first push claws 42 move towards the direction of the material box 23 under the driving of the third translation mechanism 41, the first push claws 42 push the semiconductor chip in the material box 23 out to the material conveying device 3, the material tray assembly 5 is installed on the machine base 1 and is used for alternately receiving the semiconductor chip on the material conveying device 3, the second material pushing device 6 comprises a fourth translation mechanism 61 installed on the machine base 1, a second lifting mechanism 62 installed at the output end of the fourth translation mechanism 61 and a plurality of second push claws 63 installed at the output end of the second lifting mechanism 62, wherein the fourth translation mechanism 61 is a synchronous belt transmission mechanism, the second lifting mechanism 62 is driven to do translation motion, and the second lifting mechanism 62 is a cylinder driving lifting mechanism. The second pushing claw 63 is matched with the first translating mechanism 61 and the second lifting mechanism 62 to push the semiconductor chip from the tray assembly 5 into the material conveying device 3 or push the tray assembly 5 from the material conveying device 3.

The working principle of the utility model is as follows: an appropriate magazine 23 is selected for storage according to the semiconductor chips to be cleaned, and the clamping assembly 22 is adjusted to fix the magazine 23 at the output end of the first elevating mechanism 21, at which time the initial position of the magazine 23 is located at the lower portion of the first elevating mechanism 21. Then, the first translation set and the tray assembly 5 are adjusted, so that the material conveying assembly 33 on the left side plate 31 and the material conveying assembly 33 on the right side plate 32 correspond to the material box 23, and the semiconductor chips can be conveyed to the tray assembly 5 by the material conveying device 3. Because the positions of the central surfaces of the material boxes 23 in different groups are unchanged when the material boxes 23 in different models are replaced, the positions of the first push claw 42 and the second push claw 63 do not need to be adjusted, the function of reducing the number of adjusting parts is realized, and the adjusting steps are simplified. After the adjustment is completed, the first lifting mechanism 21 drives the magazine 23 to gradually move upwards, the third translation mechanism 41 drives the first pusher 42 to push the semiconductor chip positioned on the uppermost layer in the magazine 23 out to the material conveying device 3, the material conveying assembly 33 on the left side plate 31 and the material conveying assembly 33 on the right side plate 32 convey the semiconductor chip forwards, and the second pusher 63 pushes the semiconductor chip on the material conveying device 3 to the tray assembly 5 under the cooperation of the fourth translation mechanism 61 and the second lifting mechanism 62; the semiconductor chip on the material tray assembly 5 is cleaned by a plasma cleaning machine; after the cleaning is completed, the second pusher 63 pushes the body chip pushed on the tray assembly 5 to the material conveying device 3 under the cooperation of the fourth translation mechanism 61 and the second lifting mechanism 62, the material conveying device 3 conveys the cleaned semiconductor chip towards the direction of the material box 23, and then the second pusher pushes the semiconductor chip on the material conveying device 3 into the material box 23 again under the cooperation of the fourth translation mechanism 61 and the second lifting mechanism 62, so that the cleaning work of one layer of semiconductor chip can be completed.

In order to realize that the clamping assembly 22 can fix the magazine 23 and ensure that the central plane of each magazine 23 is unchanged, referring to fig. 2, the clamping assembly 22 includes a mounting plate 221, a left clamping bar 222, a right clamping bar 223, a positioning mechanism 224 and a pressing mechanism 225, the mounting plate 221 is disposed at the output end of the first lifting mechanism 21, the positioning mechanism 224 and the pressing mechanism 225 are both mounted on the mounting plate 221, and a plurality of right clamping bars 223 are mounted on the positioning mechanism 224, in this embodiment, the number of the right clamping bars 223 is five, the positioning mechanism 224 is used for uniformly adjusting the distance between the right clamping bars 223 and the central plane of the magazine 23 to be half of the distance of the magazine 23, and a plurality of left clamping bars 222 are mounted on the pressing mechanism 225 and cooperate with the right clamping bars 223 to clamp the magazine 23 under the effect of the pressing mechanism 225, in this embodiment, the number of the left clamping bars 222 is five. It should be noted that the first lifting mechanism 21 may be a ball screw transmission mechanism, and drives the mounting plate 221 to move up and down.

Specifically, referring to fig. 2 and 3, the positioning mechanism 224 includes a first screw 2242 in threaded connection with the second connecting plate 2241 slidably connected to the mounting plate 221 and the mounting plate 221, five right holding bars 223 are fixed on the second connecting plate 2241 at equal intervals, the first screw 2242 is rotationally connected to the second connecting plate 2241, the position of the second connecting plate 2241 is adjusted by rotating the first screw 2242, and a hand wheel 2243 convenient for rotating the first screw 2242 is fixed at the end of the first screw 2242.

Further, referring to fig. 2 and 3, the pressing mechanism 225 includes a first connecting plate 2251 slidably connected to the mounting plate 221 and a first driving cylinder 2252 mounted on the mounting plate 221, the first connecting plate 2251 is connected to an end of an extension rod of the first driving cylinder 2252, five push plates 2253 are disposed on the first connecting plate 2251, and a spring 2254 is disposed between the left gib 222 and the push plates 2253. The extension rod of the first driving cylinder 2252 extends to drive the left clamping bar 222 to move towards the right clamping bar 223, so that the left clamping bar 222 and the right clamping bar 223 are matched to clamp the magazine 23. Furthermore, a spring 2254 is provided, which ensures that the left clamping bar 222 is pressed sufficiently against the magazine 23.

Further, the first driving cylinder 2252 is a stroke-adjustable cylinder or a magnetic switching cylinder to control the extension amount of the extension rod of the first driving cylinder 2252.

To achieve synchronous horizontal movement of the left side plate 31 and the right side plate 32, referring to figures 1, 4 and 5, the translation group comprises a bottom plate 34 arranged on the machine base 1, a first translation mechanism 35 arranged on the bottom plate 34, a second translation mechanism 36 arranged on the bottom plate 34 and a baffle 37 arranged on the bottom plate 34, a guide rail 39 is fixed on the bottom plate 34, the left side plate 31 and the right side plate 32 are connected with the guide rail 39 in a sliding way, five left side plates 31 are arranged at the output end of the first translation mechanism 35, the first translation mechanism 35 drives the left side plate 31 to move horizontally, five right side plates 32 are arranged at the output end of the second translation mechanism 36, the second translation mechanism 36 drives the right side plate 32 to move horizontally, and the left side plate 31 and the right side plate 32 move towards or away from each other correspondingly one by one, the moving distances of the left side plate 31 and the right side plate 32 are the same, the baffle 37 is positioned in the middle of the guide rail 39, and the distance measuring sensors 38 are respectively arranged on the left side plate 31 and the right side plate 32 close to the baffle 37. The distance measuring sensor 38 can be an ultrasonic sensor, a laser sensor or an infrared sensor, and can detect the distance between the left side plate 31, the right side plate 32 and the baffle 37, so as to ensure that the moving distance between the left side plate 31 and the right side plate 32 is the same, and realize that the material conveying assembly 33 on the left side plate 31 and the material conveying assembly 33 on the right side plate 32 are matched to convey semiconductor chips with different widths. It should be noted that the first translation mechanism 35 and the second translation mechanism 36 may be ball screw transmission mechanisms, and are configured to drive the left side plate 31 and the right side plate 32 to move horizontally.

In order to realize the forward transportation of the semiconductor chip by the material transporting assembly 33, referring to fig. 4 and 5, the material transporting assembly 33 includes an upper pressing wheel mechanism 331, a lower transporting mechanism 332 and a first material supporting strip 333, the first material supporting strip 333 is installed on the left side plate 31 or the right side plate 32, a first horizontal through groove 3331 is opened on the first material supporting strip 333, the first horizontal through groove 3331 is used for supporting the semiconductor chip, the upper pressing wheel mechanism 331 and the lower transporting mechanism 332 are both installed on the left side plate 31 or the right side plate 32, the upper pressing wheel mechanism 331 is above the first horizontal through groove 3331, the lower transporting mechanism 332 is located below the first horizontal through groove 3331, and the upper pressing wheel mechanism 331 and the lower transporting mechanism 332 cooperate to transport the semiconductor chip forward.

Further, referring to fig. 5, the two upper pinch roller mechanisms 331 are symmetrically arranged on the left side plate 31 or the right side plate 32, and the two symmetrically arranged upper pinch roller mechanisms 331 are respectively located above two end positions of the first material receiving strip 333. The upper pinch roller mechanism 331 includes a mounting base 3311, a wheel base 3312, a second screw 3313 and a tension spring 3314. The mounting base 3311 is installed on the left side board 31 or the right side board 32, the extension spring 3314 is installed between the mounting base 3311 and the wheel base 3312, the second screw 3313 is in threaded connection with the mounting base 3311, the lower end of the second screw is abutted to the wheel base 3312, the wheel base 3312 is rotatably connected with the upper roller 3315, and the upper roller 3315 penetrates through the first material holding strip 333 and extends into the first horizontal through groove 3331. The mounting position of the upper roller 3315 is adjusted by screwing in or out the second screw 3313, so that the distance between the lower conveying surface of the upper roller 3315 and the upper conveying surface of the lower feeding assembly 33 is equal to the thickness of the side of a semiconductor chip, thereby realizing the forward conveying of the semiconductor chip by the cooperation of the upper roller 3315 and the lower feeding assembly 33.

Further, referring to fig. 4 and 5, the lower conveying mechanism 332 includes a power source 3321, a transmission rod 3322, a driving wheel 3323, driven wheels 3324 and a conveying belt 3325, the power source 3321 is mounted on the bottom plate 34, specifically, the power source 3321 may be a stepping motor or a servo motor, the transmission rod 3322 is rotatably connected to the bottom plate 34, the driving wheel 3323 is rotatably connected to the left side plate 31 or the right side plate 32, the driving wheel 3323 is slidably connected to the transmission rod 3322, and the transmission rod 3322 may drive the driving wheel 3323 to rotate, specifically, the transmission rod 3322 may be a pentagonal shaft, which enables the transmission rod 3322 to drive the driving wheel 3323 to rotate and the driving wheel 3323 to move in a translational manner on the transmission rod 3322, two driven wheels 3324 are rotatably connected to the left side plate 31 or the right side plate 32, respectively, and two driven wheels 3324 are located right below the two upper rollers 3315, the conveying belt 3325 is sleeved on the faces of the driving wheel 3323 and the driven wheels 3324, and the conveying surface of the conveying belt 3325 and the lower side surface of the first horizontal through groove 3331 are on the same horizontal plane, a transition wheel 3326 for compressing the conveying belt 3325 is rotatably connected to the left side plate 31 or the right side plate 32, the power source 3321 drives the transmission rod 3322 to rotate, the transmission rod 3322 drives the driving wheel 3323 to rotate, and the driving wheel 3323, the driven wheel 3324 and the conveying belt 3325 are matched to convey semiconductor chips. Further, a transition wheel 3326 is provided to secure a tension of the conveyor belt 3325.

Preferably, referring to fig. 1 and 7, the tray assembly 5 includes a second translation set, trays 51 and a third lifting mechanism 52, the second translation set is installed on the base 1, the two trays 51 are installed on the second translation set respectively, and are driven by the second translation set to be close to the material conveying device 3 alternately, specifically, the second translation set includes a fifth translation mechanism 53 and a sixth translation mechanism 54, both the fifth translation mechanism 53 and the sixth translation mechanism 54 are synchronous belt transmission mechanisms, so as to drive the two trays 51 to make alternate translation movement respectively, and the third lifting mechanism 52 is installed between the fifth translation mechanism 53 and the corresponding tray 51, so as to avoid the movement interference of the two trays 51.

Further, referring to fig. 1 and 7, a plurality of groups of second material supporting strips 511 respectively connected with the material tray 51 in a sliding manner are arranged on the material tray 51, in this embodiment, the number of the second material supporting strips 511 is five, two second material supporting strips 511 are arranged in each group, and the distance between the two second material supporting strips can be adjusted according to the width of the semiconductor chip. The second material bearing strip 511 is provided with a second horizontal through groove 5111 for supporting the semiconductor chip, and the two material trays 51 are driven by the second translation group to alternately bear the semiconductor chip on the material conveying device 3 and are transferred to the plasma cleaning machine for cleaning, so that the working efficiency of the plasma cleaning machine is improved.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims (10)

1. A loading and unloading device of a semiconductor chip plasma cleaning machine is characterized by comprising a machine base (1);

the storage device (2) comprises a first lifting mechanism (21) arranged on the machine base (1), a clamping component (22) arranged at the output end of the first lifting mechanism (21) and a plurality of material boxes (23) arranged on the clamping component (22);

the material conveying device (3) comprises a first translation group, a left side plate (31), a right side plate (32) and a material conveying assembly (33), wherein the first translation group is installed on the base (1) and is positioned at the discharge end of the material box (23), the left side plates (31) and the right side plates (32) are respectively installed at the output end of the first translation group and move towards or away from each other in a one-to-one correspondence manner under the driving of the first translation group, and the material conveying assembly (33) is installed on the left side plate (31) and the right side plate (32);

the first material pushing device (4) comprises a third translation mechanism (41) arranged on the base (1) and a plurality of first push claws (42) arranged at the conveying end of the third translation mechanism (41), the third translation mechanism (41) is positioned on one side of the material box (23) far away from the material conveying device (3), and the first push claws (42) push the semiconductor chips in the material box (23) out to the material conveying device (3);

the material tray assembly (5) is arranged on the base (1) and is used for alternately receiving the semiconductor chips on the material conveying device (3);

and the second material pushing device (6) comprises a fourth translation mechanism (61) arranged on the base (1), a second lifting mechanism (62) arranged at the output end of the fourth translation mechanism (61) and a plurality of second push claws (63) arranged at the output end of the second lifting mechanism (62), and the second push claws (63) are used for pushing the semiconductor chip into the material conveying device (3) from the material tray assembly (5) or pushing the material tray assembly (5) from the material conveying device (3).

2. The loading and unloading device of the semiconductor chip plasma cleaning machine as claimed in claim 1, wherein the clamping assembly (22) comprises a mounting plate (221), a left clamping bar (222), a right clamping bar (223), a positioning mechanism (224) and a pressing mechanism (225), the mounting plate (221) is arranged at the output end of the first lifting mechanism (21), the positioning mechanism (224) and the pressing mechanism (225) are both arranged on the mounting plate (221), a plurality of right clamping bars (223) are arranged on the positioning mechanism (224), a plurality of left clamping bars (222) are arranged on the pressing mechanism (225) and are matched with the right clamping bar (223) to clamp the magazine (23) under the action of the pressing mechanism (225).

3. The loading and unloading device of semiconductor chip plasma cleaning machine as claimed in claim 2, characterized in that, said positioning mechanism (224) includes the second connecting plate (2241) which is connected with the mounting plate (221) in a sliding way and the screw rod (2242) which is connected with the mounting plate (221) in a threaded way, several said right holding strip (223) is fixed on the second connecting plate (2241) in an equidistant way, the screw rod (2242) is connected with the second connecting plate (2241) in a rotating way, the end of the screw rod (2242) is fixed with the hand wheel (2243) which is convenient for rotating the screw rod (2242).

4. The loading and unloading device of a plasma cleaning machine for semiconductor chips as claimed in claim 2, wherein said pressing mechanism (225) comprises a first connection plate (2251) slidably connected to the mounting plate (221) and a first driving cylinder (2252) mounted on the mounting plate (221), the first connection plate (2251) is connected to the end of the extension rod of the first driving cylinder (2252), a plurality of push plates (2253) are disposed on the first connection plate (2251), and a spring (2254) is disposed between the left clamping bar (222) and the push plates (2253).

5. The loading and unloading device of a semiconductor chip plasma cleaner as claimed in claim 4, wherein said first driving cylinder (2252) is a stroke-adjustable cylinder or a cylinder with a magnetic switch.

6. The loading and unloading apparatus for a plasma cleaning machine for semiconductor chips as recited in claim 1, it is characterized in that the translation group comprises a bottom plate (34) arranged on the machine base (1), a first translation mechanism (35) arranged on the bottom plate (34), a second translation mechanism (36) arranged on the bottom plate (34) and a baffle (37) arranged on the bottom plate (34), a guide rail (39) is fixed on the bottom plate (34), the left side plate (31) and the right side plate (32) are connected with the guide rail (39) in a sliding way, a plurality of left side plates (31) are arranged at the output end of the first translation mechanism (35), a plurality of right side plates (32) are arranged at the output end of the second translation mechanism (36), and the left side plate (31) and the right side plate (32) move in opposite directions or far away in a one-to-one correspondence manner, the baffle (37) is positioned in the middle of the guide rail (39), and the distance measuring sensors (38) are arranged on the left side plate (31) and the right side plate (32) close to the baffle (37).

7. The loading and unloading apparatus of claim 6, wherein the material transporting assembly (33) includes an upper pressing wheel mechanism (331), a lower transporting mechanism (332) and a first material supporting strip (333), the first material supporting strip (333) is installed on the left side plate (31) or the right side plate (32), the first material supporting strip (333) is provided with a first horizontal through slot (3331), the upper pressing wheel mechanism (331) and the lower transporting mechanism (332) are both installed on the left side plate (31) or the right side plate (32), the upper pressing wheel mechanism (331) is above the first horizontal through slot (3331), and the lower transporting mechanism (332) is located below the first horizontal through slot (3331).

8. The loading and unloading apparatus of a semiconductor chip plasma cleaning machine according to claim 7, wherein the lower conveying mechanism (332) includes a power source (3321), a transmission rod (3322), a driving wheel (3323), driven wheels (3324) and a transmission belt (3325), the power source (3321) is installed on the bottom plate (34), the transmission rod (3322) is rotatably connected to the bottom plate (34), the driving wheel (3323) is rotatably connected to the left side plate (31) or the right side plate (32), the driving wheel (3323) is slidably connected to the transmission rod (3322), the transmission rod (3322) can drive the driving wheel (3323) to rotate, the two driven wheels (3324) are rotatably connected to the left side plate (31) or the right side plate (32), the transmission belt (3325) is sleeved on the wheel surfaces of the driving wheel (3323) and the driven wheels (3324), and the transmission surface of the transmission belt (3325) is on the same horizontal plane with the lower side surface of the first horizontal through groove (3331), and a transition wheel (3326) used for pressing the conveying belt (3325) is rotatably connected to the left side plate (31) or the right side plate (32).

9. The loading and unloading device of the semiconductor chip plasma cleaning machine according to claim 1, wherein the tray assembly (5) comprises a second translation set, a tray (51) and a third lifting mechanism (52), the second translation set is installed on the machine base (1), the two trays (51) are respectively installed on the second translation set and are driven by the second translation set to alternately approach the material conveying device (3), and the third lifting mechanism (52) is installed between the second translation set and one tray (51) thereof.

10. The loading and unloading device of a semiconductor chip plasma cleaning machine as claimed in claim 9, wherein said tray (51) is provided with a plurality of sets of second material supporting strips (511) respectively connected with the tray (51) in a sliding manner, and the second material supporting strips (511) are provided with second horizontal through grooves (5111) for supporting the semiconductor chips.

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