CN216563566U

CN216563566U - Electrical connection assembly

Info

Publication number: CN216563566U
Application number: CN202122416440.3U
Authority: CN
Inventors: 李彪; 高自强; 陈志宏
Original assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2021-10-08
Filing date: 2021-10-08
Publication date: 2022-05-17
Anticipated expiration: 2031-10-08

Abstract

The application provides an electrical connection assembly, including first electronic component and the second electronic component of electricity connection, first electronic component include first body and set up in an at least first pad of first body, second electronic component include the second body and set up in an at least second pad of second body, each first pad deviates from the surface of first body is equipped with the sunken of a plurality of interval setting, each the second pad deviates from the surface of second body is equipped with the arch that a plurality of interval set up, each protruding correspondence embedding one with the electricity is connected in sunken first electronic component with second electronic component is favorable to promoting the steadiness of electricity connection, reduces the risk of peeling off between the pad.

Description

Electrical connection assembly

Technical Field

The present application relates to the field of electrical connections, and in particular, to an electrical connection assembly.

Background

With the development of electronic products towards light weight, thinness, high density, multi-functionalization and the like, higher requirements are put forward on assembly and packaging technologies, and the size of the bonding pad is refined. The pad is used as a necessary medium for welding the circuit board and the electronic component, the size of the pad is refined, so that the reliability of the pad is greatly challenged, generally, the smaller the size of the pad is, the smaller the peeling force between the pad and the pad is, the upper pad and the lower pad are easily affected by vibration, pulling and the like in the subsequent assembly process or the actual use process of a product to cause the contact separation of the upper pad and the lower pad, and the open circuit phenomenon is generated.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problem, an object of the present application is to provide an electrical connection assembly, which is beneficial to improving the stability of electrical connection and reducing the risk of peeling between pads.

The utility model provides an electrical connection assembly, including first electronic component and the second electronic component of electricity connection, first electronic component include first body and set up in an at least first pad of first body, second electronic component include the second body and set up in an at least second pad of second body, each first pad deviates from the surface of first body is equipped with the cave-in that a plurality of interval set up, each the second pad deviates from the surface of second body is equipped with the arch that a plurality of interval set up, each protruding correspondence embedding is one in the cave-in with the electricity connection first electronic component with second electronic component.

As a scheme of the application, the number of the first pads is multiple, and the multiple first pads are distributed at intervals; the number of the second bonding pads is multiple, and the second bonding pads are distributed at intervals.

As a solution to the present application, the protrusions and the corresponding recesses are profiled.

As an aspect of the present application, the electrical connection assembly further includes solder disposed in the recess to connect the protrusion and the recess.

As a scheme of this application, the electrical connection component still includes the conducting resin, the conducting resin set up in the sunken, in order to connect protruding with sunken.

As an aspect of the present application, the first electronic component is a circuit board, and the second electronic component is a circuit board.

The utility model provides an electrical connection assembly, because first pad is including sunken, the second pad is including protruding, just sunken with protruding mutual gomphosis makes area of contact between the pad increase to be favorable to promoting the steadiness of electric connection, reduce the risk of peeling off between the pad.

Drawings

Fig. 1 is a schematic structural diagram of an electrical connection assembly according to an embodiment of the present disclosure.

Fig. 2 is a top view of a first electronic component according to an embodiment of the disclosure.

Fig. 3 is a partial enlarged structural view of the first electronic component shown in fig. 2 at an angle III.

Fig. 4 is a top view of a second electronic component according to an embodiment of the disclosure.

Fig. 5 is a schematic diagram of a partial enlarged structure of the second electronic component shown in fig. 4 at another angle at V.

FIG. 6 is a cross-sectional view of one embodiment of the electrical connection assembly shown in FIG. 1 taken along the direction VI-VI.

Fig. 7 is a cross-sectional view of another embodiment of the electrical connection assembly shown in fig. 1.

Description of the main elements

Electrical connection assembly	100
		First electronic component	10
Second electronic component	30
		First body	11
First bonding pad	13
		Depressions	130
Second body	31
		Second bonding pad	33
Projection	330
		Solder	50

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solution of the present application will be clearly and completely described below with reference to specific embodiments. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, an electrical connection assembly 100 according to an embodiment of the present disclosure includes a first electrical component 10 and a second electrical component 30 electrically connected to each other.

In the present embodiment, the first electronic component 10 and the second electronic component 30 are each a circuit board. Each of the circuit boards may be a flexible circuit board, a rigid circuit board, or a rigid-flex circuit board. In some embodiments, the first electronic component 10 and the second electronic component 30 may also be electrically conductive structures other than circuit boards.

Referring to fig. 2 and 3, the first electronic component 10 includes a first body 11 and at least one first pad 13 disposed on the first body 11 and electrically connected to the first body 11. The surface of each first pad 13 facing away from the first body 11 is provided with a plurality of recesses 130 arranged at intervals. In this embodiment, the number of the first pads 13 is plural, and the plural first pads 13 are distributed at intervals.

In the present embodiment, each of the recesses 130 has a rectangular parallelepiped shape.

Referring to fig. 4 and 5, the second electronic component 30 includes a second body 31 and at least one second pad 33 disposed on the second body 31 and electrically connected to the second body 31. The surface of each second pad 33 facing away from the second body 31 is provided with a plurality of protrusions 330 arranged at intervals. In this embodiment, the number of the second pads 33 is plural, and the plural second pads 33 are distributed at intervals.

In the present embodiment, each of the protrusions 330 has a rectangular parallelepiped shape.

Referring to fig. 6, each protrusion 330 is correspondingly embedded in one of the recesses 130, so that each second bonding pad 33 is embedded in one of the first bonding pads 13, thereby achieving electrical connection between the first electronic component 10 and the second electronic component 30. Due to the fact that the first bonding pad 13 and the second bonding pad 33 are embedded, the contact area between the bonding pads is increased, the stability of electric connection is improved, and the risk of peeling between the bonding pads is reduced.

In some embodiments, each of the recesses 130 may also be arc-shaped, cuspate-shaped, or have other regular or irregular shapes, such as a saw-tooth shape or a wave shape on the surface of each of the first pads 13 facing away from the first body 11. Each protrusion 330 may also be other regular or irregular shapes, and it is only necessary to ensure that the protrusion 330 can be engaged with the corresponding recess 130. Preferably, the protrusions 330 are designed to be substantially conformal with the corresponding recesses 130.

The recesses 130 and the protrusions 330 may be formed by, but not limited to, etching, mechanical cutting, laser ablation, etc.

Referring to fig. 7, the electrical connection assembly 100 may further include solder 50. The solder 50 is disposed in the recess 130 to connect the protrusion 330 and the recess 130, so as to increase the connection firmness between the protrusion 330 and the recess 130, thereby further improving the connection firmness and reducing the risk of peeling between the pads. Furthermore, the solder 50 is disposed in the recess 130, which is beneficial to reducing adverse effects caused by overflow of the solder 50 when the first electronic component 10 and the second electronic component 30 are electrically connected.

The solder 50 may be, but is not limited to, a solder paste.

In some embodiments, the solder 50 may also be replaced with a conductive paste.

The electrical connection assembly 100 of the present application, because the first pad 13 includes the recess 130, the second pad 33 includes the protrusion 330, and the recess 130 and the protrusion 330 are mutually embedded, so that the contact area between the pads is increased, thereby being beneficial to improving the stability of the electrical connection and reducing the risk of peeling between the pads.

The above embodiments are preferred embodiments of the present application, but the embodiments of the present application are not limited to the above embodiments, and the above embodiments are only used for explaining the claims. The scope of protection of the application is not limited to the description. Any changes or substitutions that may be easily conceived by a person skilled in the art within the technical scope of the present disclosure are included in the scope of protection of the present application.

Claims

1. An electric connection assembly comprises a first electronic element and a second electronic element which are electrically connected, wherein the first electronic element comprises a first body and at least one first bonding pad arranged on the first body, the second electronic element comprises a second body and at least one second bonding pad arranged on the second body, and the electric connection assembly is characterized in that each first bonding pad deviates from the surface of the first body and is provided with a plurality of depressions arranged at intervals, each second bonding pad deviates from the surface of the second body and is provided with a plurality of bulges arranged at intervals, and each bulge is correspondingly embedded into one of the depressions to electrically connect the first electronic element and the second electronic element.

2. The electrical connection assembly of claim 1, wherein: the number of the first bonding pads is multiple, and the first bonding pads are distributed at intervals; the number of the second bonding pads is multiple, and the second bonding pads are distributed at intervals.

3. The electrical connection assembly of claim 1, wherein: the protrusions and the corresponding depressions are designed in a copying manner.

4. The electrical connection assembly of claim 1, wherein: the electrical connection assembly further comprises solder disposed in the recess to connect the protrusion and the recess.

5. The electrical connection assembly of claim 1, wherein: the electric connection component further comprises conductive adhesive, and the conductive adhesive is arranged in the recess to connect the protrusion and the recess.

6. The electrical connection assembly of claim 1, wherein: the first electronic component is a circuit board, and the second electronic component is a circuit board.