CN216528942U - Color conversion substrate and display panel - Google Patents

Abstract

The utility model relates to a color conversion substrate and a display panel. The color conversion substrate includes: the color conversion device comprises a substrate, a first retaining wall layer, a plurality of color conversion units and an encapsulation structure. The first retaining wall layer is arranged on one side of the substrate and provided with a plurality of first openings. The color conversion unit is disposed in the first opening. The packaging structure comprises a second barrier layer and a plurality of packaging films; the second baffle wall layer is positioned on the surface of the first baffle wall layer, which is far away from the substrate, and is provided with a plurality of second openings; the packaging film is positioned in the second opening and covers the surface of the color conversion unit, which faces away from the substrate. The color conversion substrate and the display panel can improve color crosstalk on the basis of well packaging the color conversion unit so as to improve the color display quality of the display panel.

Description

Color conversion substrate and display panel

Technical Field

The utility model relates to the technical field of display, in particular to a color conversion substrate and a display panel.

Background

With the continuous development and progress of display technology, it is very important that the display panel can present natural colors in the largest range and bring more real and shocking visual experience to people. In the implementation mode of the wide color gamut, the quantum dot light-emitting spectrum is narrow, the color purity is high, and the method has unique advantages.

At present, quantum dot materials can be applied in color conversion substrates. For example, the Color conversion substrate is a Quantum Dot Color Filter (QDCF) substrate. The quantum dot color film substrate comprises a red conversion unit, a green conversion unit and a blue conversion unit, wherein the red conversion unit comprises a red quantum dot layer, and the green conversion unit comprises a green quantum dot layer. Moreover, the color conversion units in the quantum dot color film substrate need to be encapsulated by a flat layer (transparent organic resin) to avoid water and oxygen corrosion.

The quantum dot color film substrate can be matched with the display back plate so as to excite the red quantum dot layer and the green quantum dot layer in the quantum dot color film substrate to emit light by utilizing an optical signal emitted by the display back plate, thereby realizing full-color display. However, since the flat layer is located on the light incident side of the color conversion unit, under the irradiation of the light signal emitted from the display backplane, the flat layer is equivalent to a lateral light guide layer, which is easy to generate lateral transmission of the light signal, thereby causing color crosstalk, resulting in impure display chromaticity and reduced display color gamut of the display panel.

Therefore, how to package the color conversion unit well and reduce the color crosstalk risk of the color conversion substrate is an urgent problem to be solved.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the present application aims to provide a color conversion substrate and a display panel, which aims to solve the problem of how to package a color conversion unit well and reduce the color crosstalk risk of the color conversion substrate.

The embodiment of the application provides a color conversion substrate, which comprises a substrate, a first baffle wall layer, a plurality of color conversion units and an encapsulation structure. The first retaining wall layer is arranged on one side of the substrate and is provided with a plurality of first openings. The color conversion unit is arranged in the first opening. The packaging structure comprises a second barrier layer and a plurality of packaging films; the second baffle wall layer is positioned on the surface of the first baffle wall layer, which is far away from the substrate, and is provided with a plurality of second openings; the packaging film is positioned in the second opening and covers the surface of the color conversion unit, which faces away from the substrate.

In the color conversion substrate, the second barrier layer is arranged on the surface of the first barrier layer, which is far away from the substrate, and the packaging films are respectively formed in the second openings of the second barrier layer, so that the packaging films cover the color conversion units in a one-to-one correspondence manner. Therefore, the second barrier layer can effectively block the transverse transmission of optical signals between the adjacent packaging films on the basis of effectively packaging the corresponding color conversion units by utilizing each packaging film by utilizing the packaging structure formed by the second barrier layer and the plurality of packaging films. And the second retaining wall layer is positioned on the surface of the first retaining wall layer, which is far away from the substrate. That is, the second barrier layer and the first barrier layer are in direct contact, and a long light blocking path may be formed between adjacent color conversion units to effectively block lateral crosstalk of optical signals between the adjacent color conversion units. Therefore, the color conversion unit can be well packaged, and the color cross risk of the color conversion substrate is reduced, so that the purity of the display chromaticity and the width of the display color gamut in the display panel are ensured.

Optionally, the encapsulation film is located at the light incident side of the color conversion unit. Therefore, under the blocking effect of the second barrier layer, the optical signal incident to the packaging film can be transmitted to the corresponding color conversion unit with maximum efficiency, and particularly under the condition that the second barrier layer has high light reflectivity, the color conversion substrate can be ensured to have high light emitting efficiency.

Optionally, a distance from a surface of the second barrier layer facing away from the first barrier layer to the substrate is greater than a distance from a surface of the encapsulation film facing away from the color conversion unit to the substrate.

In the color conversion substrate, the height of the second barrier layer is greater than the thickness of the packaging film, so that the packaging film is conveniently formed in the second opening of the second barrier layer under the condition of lower process precision, the second barrier layer can also be in surface contact with the display back plate to support the display back plate by using the second barrier layer, and the transverse transmission of optical signals between adjacent light-emitting units in the display back plate is effectively blocked.

Optionally, an orthographic projection of the first opening on the substrate is located within an orthographic projection of the second opening on the substrate. That is, the planar size of the second opening may be larger than the planar size of the first opening to ensure that the encapsulation film formed in the second opening can cover the entire surface of the corresponding color conversion unit and a portion of the surface of the first barrier layer, thereby ensuring that the encapsulation film has a good encapsulation effect on the color conversion unit.

Optionally, the first barrier layer and the second barrier layer are made of different materials.

For example, the first barrier layer includes: and a photoresist barrier layer.

For example, the second barrier layer includes: the titanium powder-doped epoxy resin wall blocking layer or the titanium dioxide wall blocking layer.

The second barrier layer is formed by adopting epoxy resin doped with titanium powder or a titanium dioxide material, and can have a higher OD value so as to ensure that the second barrier layer has excellent light blocking performance and light reflection performance, thereby being beneficial to ensuring that the color conversion substrate has higher light emitting efficiency.

Optionally, the encapsulation film includes: a silicon nitride film, a silicon oxide film, an aluminum oxide film, or a tetrafluoroethylene film.

In the color conversion substrate, the packaging structure is composed of the second barrier layer and the packaging film, so that the packaging film has a larger selection space for materials and preparation processes. In this way, the packaging film is a silicon nitride film, a silicon oxide film, an aluminum oxide film or a tetrafluoroethylene film, and the thickness of the packaging film can be kept small on the basis of well packaging the color conversion unit, so that the light path between the color conversion unit and the display back plate is reduced. Thereby being beneficial to improving the light-emitting brightness of the color conversion substrate. Moreover, the encapsulation film can be formed by adopting a deposition process so as to ensure that the encapsulation film can well cover the surface of the color conversion unit and the side wall of the second opening. Thereby being beneficial to reducing the process difficulty and ensuring the packaging effect of the packaging film on the premise of convenient preparation.

Optionally, the thickness value range of the encapsulation film includes: 50 nm-1000 nm.

The thickness of the packaging film is small, for example, the packaging film is in a nanometer level, so that the light path between the color conversion unit and the display back plate can be effectively shortened on the basis of ensuring good packaging of the color conversion unit, and the light emitting brightness of the color conversion substrate can be improved.

Optionally, the plurality of color conversion units include: a red conversion unit, a green conversion unit and a blue conversion unit; wherein, red converting unit includes: a red quantum dot layer; the green conversion unit includes: a green quantum dot layer; the blue conversion unit includes: a scattering sublayer.

Based on the same inventive concept, the embodiment of the present application further provides a display panel, including: a display backplane and a color converting substrate as described in some embodiments above; the display back plate is attached to the light incident side of the color conversion substrate. The technical effects that can be achieved by the color conversion substrate can be achieved by the display panel, and the details are not described herein.

Drawings

Fig. 1 is a partial cross-sectional view of a color conversion substrate according to an embodiment of the utility model;

FIG. 2 is a schematic diagram of a distribution of first openings and second openings according to an embodiment of the present invention;

FIG. 3 is a partial cross-sectional view of a display panel according to an embodiment of the present invention;

fig. 4 is a partial cross-sectional view of another display panel according to an embodiment of the utility model.

Description of reference numerals:

1000-a display panel; 101-color conversion substrate; 102-a display backplane; 11-a first substrate;

12-a color resist layer; 121-black matrix pattern; 122-red color resistance; 123-green color resistance;

124-blue color resistance; 13-a first retaining wall layer; 14-a color conversion unit; 141-red quantum dot layer;

142-a green quantum dot layer; 143-a scattering sublayer; 15-packaging the structure; 151-second barrier layer;

152-an encapsulation film; 21-a second substrate; 22-a light emitting unit;

k1 — first opening; k2 — second opening; t-thickness of the encapsulation film;

d1-distance from the surface of the second barrier layer facing away from the first barrier layer to the first substrate;

d2 — distance of surface of the encapsulation film facing away from the color conversion cell to the first substrate.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The quantum dot material may be applied in a color conversion substrate. For example, the Color conversion substrate is a Quantum Dot Color Filter (QDCF) substrate. The quantum dot color film substrate comprises a red conversion unit, a green conversion unit and a blue conversion unit; the red conversion unit comprises a red quantum dot layer, the green conversion unit comprises a green quantum dot layer, and the blue conversion unit comprises a scattering sublayer under the condition that the light emitting diode chip in the display back plate is a blue light emitting diode chip. Moreover, the color conversion units in the quantum dot color film substrate need to be encapsulated by a flat layer (transparent organic resin) to avoid water and oxygen corrosion.

The quantum dot color film substrate can be matched with the display backboard so as to utilize an optical signal emitted by the blue light diode chip in the display backboard to excite the red quantum dot layer and the green quantum dot layer in the quantum dot color film substrate to emit light, thereby realizing full-color display.

However, a planarization layer is typically disposed on the light incident side of the color conversion unit. Moreover, the surface of the color conversion unit after being prepared is generally in a shape of "ox horn", that is, the surface of the color conversion unit is easily a surface with convex edges but concave middle, which also easily results in an increase in the thickness of the flat layer. Therefore, under the irradiation of the light signals emitted by the blue light diode chip, the flat layer is equivalent to a transverse light guide layer, so that the transverse transmission of the light signals is easy to generate. In particular, the greater the thickness of the planar layer, the greater the lateral light guiding effect of the planar layer. Therefore, color crosstalk is easily caused in the quantum dot color film substrate, and the problems of impure display chromaticity, reduced display color gamut and the like of the display panel are caused.

Therefore, how to package the color conversion unit well and reduce the color crosstalk risk of the color conversion substrate is an urgent problem to be solved.

Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.

Fig. 1 is a partial cross-sectional view of a color conversion substrate according to an embodiment of the utility model.

Referring to fig. 1, an embodiment of the present invention provides a color conversion substrate 101, which includes a first substrate 11, a first barrier layer 13, a plurality of color conversion units 14, and a package structure 15.

Here, the first substrate 11 is a light-transmitting substrate. Optionally, the first substrate 11 is a glass substrate or a flexible substrate.

In one example, the first substrate 11 is a flexible substrate, for example formed using polyethylene terephthalate (PET) or Polyimide (PI) material. Thus, the color conversion substrate 101 can have better bending capability, which is beneficial to preparing a curved display panel.

Optionally, with reference to fig. 1, the color conversion substrate 101 further includes a color resist layer 12 disposed between the first substrate 11 and the first barrier layer 13. The color resist layer 12 includes: a black matrix pattern 121, a red color resist 122, a green color resist 123, and a blue color resist 124; wherein, the black matrix pattern 121 has a plurality of sub-pixel openings; the red color resistor 122, the green color resistor 123 and the blue color resistor 124 are respectively disposed in the corresponding sub-pixel openings.

The first barrier layer 13 is disposed on a side of the first substrate 11, for example, on a surface of the black matrix pattern 121 facing away from the first substrate 11. The first barrier layer 13 has a plurality of first openings K1, and the first openings K1 correspond to the sub-pixel openings one to one.

The color conversion units 14 are disposed in the first openings K1 in a one-to-one correspondence. The plurality of color conversion units 14 correspond to a plurality of color sub-pixels.

Optionally, the color conversion unit 14 includes a red conversion unit 141, a green conversion unit 142, and a blue conversion unit 143. The red conversion unit 141 is disposed on a surface of the red color resistor 122 away from the first substrate 11, and the red conversion unit 141 is, for example, a red quantum dot layer. The green conversion unit 142 is disposed on a surface of the green color resistor 123 away from the first substrate 11, and the green conversion unit 142 is, for example, a green quantum dot layer. The blue conversion unit 143 is disposed on a surface of the blue color filter 124 facing away from the first substrate 11, and the blue conversion unit 143 is, for example, a scattering sublayer, and the scatterer is, for example, titanium dioxide particles or other particles with good optical scattering performance.

The package structure 15 includes a second barrier layer 151 and a plurality of package films 152.

With reference to fig. 1, the second barrier layer 151 is disposed on a surface of the first barrier layer 13 facing away from the first substrate 11, and has a plurality of second openings K2. That is, the surface of the first barrier layer 13 facing away from the first substrate 11 is flat, and the second barrier layer 151 is in direct surface contact with the first barrier layer 13. The material of the second barrier layer 151 may be the same as or different from that of the first barrier layer 13.

In some examples, the material of the second barrier layer 151 is the same as the material of the first barrier layer 13. Thus, the second retaining wall layer 151 and the first retaining wall layer 13 have good adaptability, and production cost is reduced.

In some examples, the material of the second barrier layer 151 is different from the material of the first barrier layer 13.

For example, the second barrier layer 151 is formed of a material having a high OD (Optical Density) value, and the thickness of the second barrier layer 151 may be set small. Specifically, the second barrier layer 151 may be formed of a titanium dioxide material, an epoxy resin doped with titanium powder, a black matrix material, or other materials capable of blocking lateral transmission of light signals, so as to ensure that the second barrier layer 151 may have excellent light blocking performance.

Here, both the titanium dioxide material and the titanium powder have a high light reflectance, the second barrier layer 151 is formed of the titanium dioxide material or the epoxy resin doped with the titanium powder, and the second barrier layer 151 may have an excellent light reflectance.

For example, the first barrier layer 13 is formed of a material having a small OD value and easily forming a large thickness, so that the first opening K1 in the first barrier layer 13 has a large space to accommodate the color conversion unit 14. Specifically, the first barrier layer 13 may be formed using a photoresist material, such as a negative photoresist material.

With reference to fig. 1, the encapsulation films 152 are disposed in the second openings K2 in a one-to-one correspondence manner, and cover the surface of the color conversion units 14 facing away from the first substrate 11. That is, one encapsulating film 152 is provided for each color conversion unit 14, and adjacent encapsulating films 152 may be effectively separated from each other by a corresponding portion of the second barrier layer 151.

Optionally, the encapsulation film 152 is located on the light incident side of the color conversion unit 14. In this manner, under the blocking action of the second barrier layer 151, the optical signal incident to the encapsulation film 152 can be transmitted into the corresponding color conversion unit 14 with maximum efficiency, especially in the example where the second barrier layer 151 has a high light reflectance, so that the color conversion substrate 101 can be ensured to have high light extraction efficiency.

The encapsulation film 152 is used to encapsulate the color conversion unit 14, and the encapsulation film 152 is made of a material having a good water and oxygen barrier ability. In the embodiment of the present application, the package structure 15 is composed of the second barrier layer 151 and the package film 152, so that the material and the manufacturing process of the package film 152 have a larger selection space. The material, shape and size of the encapsulation film 152 can be selected according to actual requirements.

Optionally, the encapsulation film 152 is a silicon nitride film, a silicon oxide film, an aluminum oxide film, or a tetrafluoroethylene film.

In one example, the encapsulation film 152 is a silicon nitride film. The thickness of the encapsulation film 152 can be kept small on the basis of well encapsulating the color conversion unit, so that the light path between the color conversion unit 14 and the display back panel is reduced, and the light-emitting brightness of the color conversion substrate 101 is improved. Moreover, the encapsulation film 152 may be formed by a deposition process to ensure that the encapsulation film 152 can well cover the surface of the color conversion unit 14 and the sidewalls of the second opening K2. Thereby facilitating the reduction of process difficulty to ensure the encapsulation effect of the encapsulation film 152 on the premise of convenient preparation.

Optionally, the thickness of the encapsulation film 152 ranges from: 50 nm-1000 nm. The thickness of the encapsulation film 152 is, for example: 50nm, 100nm, 300nm, 500nm, 800nm or 1000 nm. Thus, the thickness of the encapsulation film 152 is set to be small, for example, nanometer, which can effectively shorten the light path between the color conversion unit 14 and the display backplane on the basis of ensuring good encapsulation of the color conversion unit 14, and is beneficial to improving the brightness of the light emitted from the color conversion substrate 101.

In the embodiment of the present application, the second barrier layer 151 is disposed on the surface of the first barrier layer 13 away from the first substrate 11, and the encapsulation films 152 are respectively formed in the plurality of second openings K2 of the second barrier layer 151, so that the encapsulation films 152 cover the color conversion units 14 in a one-to-one correspondence. In this manner, the package structure 15 constituted by the second barrier layer 151 and the plurality of encapsulation films 152 can effectively block the lateral transmission of optical signals between the adjacent encapsulation films 152 by the second barrier layer 151 on the basis of effectively encapsulating the corresponding color conversion unit 14 by each encapsulation film 152.

And, the second barrier layer 151 is located on a surface of the first barrier layer 13 facing away from the first substrate 11. That is, the second barrier layer 151 and the first barrier layer 13 are in direct contact, a long light blocking path can be formed between the adjacent color conversion units 14 to effectively block the optical signal lateral crosstalk between the adjacent color conversion units 14. Therefore, the color conversion unit 14 can be well packaged, and the color crosstalk risk of the color conversion substrate 101 can be reduced, so that the purity of the display chromaticity and the width of the display color gamut in the display panel can be ensured.

In addition, the package structure 15 in the embodiment of the present application adopts the above structure, which is also beneficial to reducing the process precision in the preparation process of the package structure 15, so as to improve the production efficiency of the color conversion substrate 101.

In some embodiments, with reference to fig. 1, a distance D1 from a surface of the second barrier layer 151 facing away from the first barrier layer 13 to the first substrate 11 is greater than a distance D2 from a surface of the encapsulation film 152 facing away from the color conversion unit 14 to the first substrate 11. Namely: d1 > D2. But not limited to, for example, it is also permissible that the surface of the second barrier layer 151 facing away from the first barrier layer 13 is flush with the surface of the encapsulating film 152 facing away from the color conversion unit 14.

In the color conversion substrate 101, the height of the second barrier layer 151 is greater than the thickness of the encapsulation film 152, so that the encapsulation film 152 is conveniently formed in the second opening K2 of the second barrier layer 151 under the condition of lower process precision, the second barrier layer 151 can be in surface contact with the display backplane, the display backplane is supported by the second barrier layer 151, and the transverse transmission of optical signals between adjacent light-emitting units in the display backplane is effectively blocked.

In addition, the height of the second barrier layer 151 is greater than the thickness of the encapsulation film 152. Thus, even if the surface of the color conversion unit 14 is "bull horn" shaped, that is, the edge of the surface of the color conversion unit 14 is convex and the middle is concave, the edge of the encapsulation film 152 may be convex with the edge of the surface of the color conversion unit 14 being convex and climb along the side wall of the second opening K2 in the second barrier layer 151. At the same time, a smaller thickness of the middle region of the encapsulation film 152 is ensured.

Fig. 2 is a schematic distribution diagram of first openings and second openings according to an embodiment of the present invention.

In some embodiments, referring to fig. 2, an orthographic projection of the first opening K1 on the first substrate 11 is located within an orthographic projection of the second opening K2 on the first substrate 11. That is, the planar size of the second opening K2 may be larger than the planar size of the first opening K1 to ensure that the encapsulation film 152 formed in the second opening K2 can cover the entire surface of the corresponding color conversion unit 14 and a portion of the surface of the first barrier layer 13, thereby ensuring that the encapsulation film 152 has a good encapsulation effect on the color conversion unit 14.

Here, the orthographic projection shapes of the first opening K1 and the second opening K2 on the first substrate 11 can be selectively set according to the shape of the corresponding sub-pixel.

Further, in some examples, it is also permissible that an orthographic projection of the first opening K1 on the first substrate 11 coincides with an orthographic projection of the second opening K2 on the first substrate 11.

Based on the same inventive concept, the embodiment of the application also provides a display panel. Fig. 3 and fig. 4 are partial cross-sectional views of a display panel according to some embodiments of the utility model.

Referring to fig. 3 and 4, the display panel 1000 includes: a display backplane 102, and a color conversion substrate 101 as described in some embodiments above; the display backplane 102 is disposed opposite to the color conversion substrate 101, and the display backplane 102 is bonded to the light incident side of the color conversion substrate 101, for example, the display backplane 102 is bonded to the color conversion substrate 101 by a sealant.

The display back plate 102 is used for emitting light signals, including visible light signals or invisible light signals. The visible light signal is, for example, a blue light signal. The invisible light signal is, for example, an ultraviolet light signal.

Optionally, the display back plate 102 includes: a second substrate 21, and a light emitting unit 22 disposed over the second substrate 21. The light emitting unit 22 includes a driving circuit, and a light emitting diode chip connected to the driving circuit. The light emitting diode chip is, for example, a blue light emitting diode chip. Thus, the display backplane 102 can be addressed and driven to light up individually by using the control of the driving circuit to the led chip.

Here, the second substrate 21 may be selectively disposed according to actual requirements. The second substrate 21 is, for example, a resin substrate or a glass substrate.

The driving circuit is used for driving the light emitting diode chips to emit light, and the structure of the driving circuit can be designed according to the number, the structure and the distribution positions of the light emitting diode chips, which is not limited in the embodiment of the present application.

The light emitting diode chip is used as a light emitting main body of the display backplane, and a Micro-LED or a Mini-LED can be adopted, which is not limited in the embodiment of the application. For example, the plurality of led chips may be distributed in an array, and the adjacent led chips have a space therebetween. Here, the size of the space between the adjacent light emitting diode chips is in the order of micrometers.

The color conversion substrate 101 is used for performing color conversion on the optical signal emitted from the display back plate 102 to realize color display of the display panel. The structure of the color conversion substrate 101 is as described above.

The technical effects that can be achieved by the color conversion substrate 101 can also be achieved by the display panel 1000, and the details thereof are not described herein.

In some embodiments, referring to fig. 3, the second barrier layer 151 on the color conversion substrate 101 is in direct surface contact with the display backplane 102. In this way, the second barrier layer 151 can support the display backplane 102 and effectively block the lateral transmission of optical signals between adjacent light emitting units 22 in the display backplane 102.

In other embodiments, as shown in fig. 4, the height of the second barrier layer 151 is slightly greater than the thickness of the encapsulation film 151. It is also allowable that the second barrier layer 151 on the color conversion substrate 101 has a space from the display back panel 102.

It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.

Claims (10)

1. A color conversion substrate, comprising:

a substrate;

the first baffle wall layer is arranged on one side of the substrate and is provided with a plurality of first openings;

a plurality of color conversion units disposed within the first opening; and the number of the first and second groups,

a package structure comprising: the second barrier layer and the plurality of packaging films;

the second baffle wall layer is positioned on the surface, away from the substrate, of the first baffle wall layer and is provided with a plurality of second openings; the packaging film is positioned in the second opening and covers the surface of the color conversion unit, which faces away from the substrate.

2. The color conversion substrate according to claim 1, wherein the encapsulating film is located on a light incident side of the color conversion unit.

3. The color conversion substrate of claim 1, wherein a distance from a surface of the second barrier layer facing away from the first barrier layer to the substrate is greater than a distance from a surface of the encapsulation film facing away from the color conversion unit to the substrate.

4. The color conversion substrate of claim 1, wherein an orthographic projection of the first opening on the substrate is located within an orthographic projection of the second opening on the substrate.

5. The color conversion substrate according to claim 1, wherein the first barrier layer and the second barrier layer are different in material.

6. The color conversion substrate according to claim 1, wherein the second barrier layer comprises: titanium dioxide retaining wall layer.

7. The color conversion substrate according to claim 1, wherein the encapsulation film comprises: a silicon nitride film, a silicon oxide film, an aluminum oxide film, or a tetrafluoroethylene film.

8. The color conversion substrate according to claim 7, wherein a thickness of the encapsulation film ranges from: 50 nm-1000 nm.

9. The color conversion substrate according to claim 1, wherein a plurality of the color conversion units comprise: a red conversion unit, a green conversion unit and a blue conversion unit; wherein the red conversion unit includes: a red quantum dot layer; the green conversion unit includes: a green quantum dot layer; the blue conversion unit includes: a scattering sublayer.

10. A display panel, comprising:

the color conversion substrate according to any one of claims 1 to 9; and

and the display back plate is attached to the light incident side of the color conversion substrate.

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