CN216528765U - Packaging hardware for semiconductor production - Google Patents
Packaging hardware for semiconductor production Download PDFInfo
- Publication number
- CN216528765U CN216528765U CN202122839278.6U CN202122839278U CN216528765U CN 216528765 U CN216528765 U CN 216528765U CN 202122839278 U CN202122839278 U CN 202122839278U CN 216528765 U CN216528765 U CN 216528765U
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- China
- Prior art keywords
- packaging
- case
- frame
- motor
- semiconductor manufacturing
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000007599 discharging Methods 0.000 claims abstract description 25
- 230000007306 turnover Effects 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 9
- 238000012840 feeding operation Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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Abstract
The application discloses packaging hardware for semiconductor manufacture includes: the middle part of the top end of the case is rotatably provided with a rotating plate, and four corners of the rotating plate are respectively provided with a groove plate for inserting the packaging box in a turnover way; the material receiving and discharging assembly comprises a conveying belt and a material discharging frame which are assembled above the case, and the middle part of the material discharging frame is provided with a material discharging motor which is used for guiding out the packaging boxes in the corresponding slot plates; the technical key points are that the receiving and discharging component and the processing component are arranged on the case, so that feeding operation, assembling operation, packaging operation and feeding operation are all concentrated on a single case, and the occupied space of the whole packaging device is small due to the adoption of rotary operation while the help of other workpieces is avoided; the rotatable groove plates are arranged on the rotating plates, the deflection angles of the groove plates on different stations are different, different operation environments can be dealt with, the use flexibility is higher, the whole packaging treatment can be carried out on batch operation in a full-automatic mode, and the working efficiency of the whole operation is improved.
Description
Technical Field
The utility model belongs to the technical field of semiconductor processing, and particularly relates to a packaging device for semiconductor production.
Background
The semiconductor technology refers to various semiconductor processing technologies, including wafer growth technology, thin film deposition, photolithography, etching, doping technology, process integration and the like; semiconductor technology is a technology for manufacturing components and integrated circuits by using semiconductors as materials; elements in the periodic table can be roughly classified into three categories, i.e., conductors, semiconductors, and insulators, according to conductivity; the most common semiconductor is silicon, but it can also be a compound of two elements, such as gallium arsenide, but compound semiconductors are mostly used in optoelectronics;
when a semiconductor is processed, the semiconductor needs to be packaged, and generally, manual work and mechanical work are combined in one production line, so that the following technical problems occur when the packaging operation is specifically performed:
traditional banding assembly line occupies more space in the factory building easily, adopts artifical and mechanical combination's mode simultaneously, when manual operation takes place the mistake, leads to whole encapsulation operation's work efficiency to reduce easily, uses comparatively complicatedly.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Aiming at the defects of the prior art, the utility model provides a packaging device for semiconductor production, which solves the problems mentioned in the prior background art.
(II) technical scheme
In order to achieve the purpose, the utility model is realized by the following technical scheme:
a packaging apparatus for semiconductor manufacturing, comprising:
the middle part of the top end of the case is rotatably provided with a rotating plate, and four corners of the rotating plate are respectively provided with a groove plate for inserting the packaging box in a turnover mode;
the material receiving and discharging assembly comprises a conveying belt and a material discharging frame which are assembled above the case, and the middle part of the material discharging frame is provided with a material discharging motor which is used for guiding out the packaging boxes in the corresponding slot plates; and
and the processing assembly comprises a feeding frame and a rotating rod frame which are assembled above the case, a clamp used for clamping the semiconductor is arranged at the top end of the feeding frame, and a pressing mechanism used for packaging the case cover is arranged at one end of the rotating rod frame.
Furthermore, the cross section of the rotating plate is in a cross shape, and the groove plates on the four end surfaces of the rotating plate respectively correspond to four stations, namely a material conveying position, an assembling position, a packaging position and a material placing position; the slot that is used for cartridge packaging box is seted up to the inside of frid, and is connected through setting up micro motor between frid and the commentaries on classics board, and the angle of adjustment of this frid is 0-180, and frid and commentaries on classics board are in the laminating state during normal use.
Furthermore, a blanking port is formed in the position, corresponding to the discharging frame, of the upper surface of the case, and a supporting rod of the discharging motor is provided with a supporting rod, and the supporting rod is made of rubber.
Furthermore, the side of the case, the position corresponding to the feeding frame and the rotating rod frame are provided with a case body which is respectively used for filling semiconductors and a case cover matched with the packaging box.
Furthermore, the position department of pay-off frame avris and quick-witted case link installs the rotation motor, anchor clamps contain two splint and are used for driving the motor that the splint are close to each other or keep away from.
Furthermore, the position department of the avris of the rotating rod frame and the connecting end of the case is provided with a rotating motor, the pressing mechanism comprises an air cylinder and a sucker arranged on the end of a piston rod of the air cylinder in a matched manner, and the air cylinder is used for driving the sucker to move up and down.
(III) advantageous effects
Firstly, the receiving and discharging component and the processing component are arranged on the case, so that feeding operation, assembling operation, packaging operation and feeding operation are concentrated on a single case, and the occupied space of the whole packaging device is small due to the adoption of rotary operation while the help of other workpieces is avoided;
secondly, the rotatable groove plates are arranged on the rotating plate, the deflection angles of the groove plates on different stations are different, different operation environments can be dealt with, the use flexibility is higher, the whole packaging treatment can be carried out in a full-automatic mode, and the working efficiency of the whole operation is improved;
thirdly, the conveying belt is provided with a sucker opening, the rotary rod frame is provided with a sucker, the workpieces are positioned or fixedly adsorbed by utilizing the adsorption force, the use flexibility of the whole device is reflected, and an air suction pump or an air release pump can be added on the sucker when necessary, so that the stability of the position of the adsorbed workpieces is further ensured.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of the partial structure A of FIG. 1 of the present invention;
fig. 3 is a schematic of the conveyor belt structure of the present invention.
Reference numerals: 1. a chassis; 2. a material placing frame; 3. a conveyor belt; 31. a sucker port; 4. a feeding frame; 41. a clamp; 5. a rotating rod frame; 51. a pressing mechanism; 6. rotating the plate; 61. a groove plate; 7. a discharging motor; 8. and (4) a feed opening.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. In addition, for the convenience of description, the terms "upper", "lower", "left" and "right" are used to refer to the same direction as the upper, lower, left, right, etc. of the drawings, and the terms "first", "second", etc. are used for descriptive distinction and have no special meaning.
Example 1:
in the embodiment, a specific structure of the slot plate is given, as shown in fig. 2, a rotating plate 6 is rotatably arranged in the middle of the top end of a chassis 1, and four corners of the rotating plate 6 are all assembled with a slot plate 61 for inserting a packaging box in a turnover manner;
referring to fig. 2, the cross section of the rotating plate 6 is cross-shaped, and the slot plates 61 on the four end surfaces of the rotating plate 6 correspond to four stations respectively, which are a feeding station (where the slot plates 61 are tangent to the outer surface of the rotating shaft on the conveyor belt 3), an assembling station, a packaging station, and a discharging station.
Referring to fig. 2, a slot for inserting the package box is formed in the slot plate 61, the slot plate 61 is connected with the rotating plate 6 through a micro motor, the adjusting angle of the slot plate 61 is 0-180 °, and the slot plate and the rotating plate are in a fit state during normal use.
The packaging boxes on the conveyor belt 3 firstly enter the groove plate 61 at the material feeding position;
by adopting the technical scheme:
Example 2:
the embodiment shows a specific structure of the material receiving and discharging assembly, as shown in fig. 1 and 2, the material receiving and discharging assembly comprises a conveying belt 3 and a material discharging frame 2 assembled above the chassis 1, and a material discharging motor 7 is installed in the middle of the material discharging frame 2 and used for guiding out the packaging boxes in the corresponding slot plates 61.
Referring to fig. 2, the surface of the belt body of the conveyor belt 3 is uniformly provided with the suction cup ports 31, the suction cup ports 31 are used for adsorbing the packaging box, and after the packaging box is adsorbed and fixed by the suction cup ports 31, the suction cup ports 31 are separated from the packaging box after the packaging box enters the corresponding groove plate 61;
referring to fig. 2, a feed opening 8 is formed in the upper surface of the case 1 at a position corresponding to the discharge frame 2, and a push rod is assembled at one end of a piston rod matched with the discharge motor 7;
and finally, the packaged semiconductor and the packaged box enter a material placing position, a material placing motor 7 drives a support rod to move downwards, and the support rod pushes the packaged box to enter a material discharging opening 8, so that the final collection operation is completed.
By adopting the technical scheme:
compared with the embodiment 3, the material receiving and discharging component and the processing component are arranged on the case 1, so that feeding operation, assembling operation, packaging operation and feeding operation are concentrated on a single case 1, and the occupied space of the whole packaging device is small due to the adoption of rotary operation while the help of other workpieces is avoided.
Example 3:
the present embodiment shows a specific structure of a processing assembly, as shown in fig. 1 and 2, the processing assembly includes a feeding frame 4 and a rotating rod frame 5 which are assembled above a chassis 1, a clamp 41 for clamping a semiconductor is installed at the top end of the feeding frame 4, and a pressing mechanism 51 for encapsulating a box cover is installed at one end of the rotating rod frame 5;
referring to fig. 2, boxes are respectively arranged at the side of the case 1 corresponding to the feeding frame 4 and the rotating rod frame 5, and are respectively used for filling semiconductors and a box cover matched with the packaging box.
After the semiconductor packaging machine is used for the feeding frame 4, after the clamp 41 on the end of the feeding frame 4 clamps the semiconductor, the feeding frame 4 enters an assembly position under the driving of a corresponding motor, then the semiconductor is loosened to enter a packaging box, and then the rotating plate 6 continues to rotate to enter the next station (assembly position).
Referring to fig. 2, a rotating motor is installed at a position of a connection end of the feeding frame 4 side and the chassis 1, and the clamp 41 includes two clamping plates and a motor for driving the clamping plates to approach or separate from each other.
Referring to fig. 2, a rotating motor is installed at a position of a connection end of the side of the rotating rod frame 5 and the chassis 1, the pressing mechanism 51 includes a cylinder and a suction cup which is arranged on the end of a piston rod of the cylinder in a matching manner, and the cylinder is used for driving the suction cup to move up and down.
After the packaging box with the semiconductor enters the packaging position, the motor drives the rotating rod frame 5 to rotate, so that the pressing mechanism 51 drives the box cover to rotate, then the operation of pressing is carried out, the box cover is pressed on the packaging box, the packaging box enters the next station (material placing position) after the packaging processing is finished
By adopting the technical scheme:
set up sucking disc mouth 31 on conveyer belt 3 to set up the sucking disc on bull stick frame 5, all utilize the adsorption affinity to accomplish the location or adsorb fixed processing to the work piece, embodied the use flexibility of whole device, still can add aspiration pump or air release pump on the sucking disc when necessary, further ensure the firm of adsorbed work piece position.
The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (8)
1. A packaging device for semiconductor production, comprising:
the middle part of the top end of the case (1) is rotatably provided with a rotating plate (6), and four corners of the rotating plate (6) are respectively provided with a groove plate (61) for inserting the packaging box in a turnover way;
the material receiving and discharging assembly comprises a conveying belt (3) and a material discharging frame (2) which are assembled above the case (1), and a material discharging motor (7) is installed in the middle of the material discharging frame (2) and used for guiding out the packaging boxes in the corresponding groove plates (61); and
the processing assembly comprises a feeding frame (4) and a rotating rod frame (5) which are assembled above the case (1), a clamp (41) used for clamping a semiconductor is installed at the top end of the feeding frame (4), and a pressing mechanism (51) used for packaging a box cover is installed at one end of the rotating rod frame (5).
2. A packaging apparatus for semiconductor manufacturing as claimed in claim 1, wherein: the section of the rotating plate (6) is in a cross shape, and the groove plates (61) on the four end faces of the rotating plate (6) correspond to four stations respectively.
3. A packaging apparatus for semiconductor manufacturing as claimed in claim 1, wherein: the slot for inserting the packaging box is formed in the groove plate (61), the groove plate (61) is connected with the rotating plate (6) through a micro motor, and the adjusting angle of the groove plate (61) is 0-180 degrees.
4. A packaging apparatus for semiconductor manufacturing as claimed in claim 1, wherein: the surface of the belt body of the conveying belt (3) is uniformly provided with a sucker opening (31), and the sucker opening (31) is used for adsorbing the packaging box.
5. A packaging apparatus for semiconductor manufacturing as claimed in claim 1, wherein: the upper surface of the case (1) is provided with a feed opening (8) at a position corresponding to the feeding frame (2), and one end of a piston rod matched with the feeding motor (7) is provided with a support rod.
6. A packaging apparatus for semiconductor manufacturing as claimed in claim 1, wherein: and box bodies are arranged at the positions of the side of the case (1) corresponding to the feeding frame (4) and the rotating rod frame (5) and are respectively used for filling semiconductors and box covers matched with the packaging boxes.
7. A packaging apparatus for semiconductor manufacturing as claimed in claim 1, wherein: the position department of pay-off frame (4) avris and quick-witted case (1) link installs the rotation motor, anchor clamps (41) contain two splint and are used for driving the motor that the splint are close to each other or keep away from.
8. A packaging apparatus for semiconductor manufacturing as claimed in claim 1, wherein: the rotary motor is installed at the position of the connecting end of the side of the rotating rod frame (5) and the case (1), the pressing mechanism (51) comprises an air cylinder and a sucking disc matched with the air cylinder on the end of a piston rod of the air cylinder, and the air cylinder is used for driving the sucking disc to move up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122839278.6U CN216528765U (en) | 2021-11-19 | 2021-11-19 | Packaging hardware for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122839278.6U CN216528765U (en) | 2021-11-19 | 2021-11-19 | Packaging hardware for semiconductor production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216528765U true CN216528765U (en) | 2022-05-13 |
Family
ID=81531074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122839278.6U Expired - Fee Related CN216528765U (en) | 2021-11-19 | 2021-11-19 | Packaging hardware for semiconductor production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216528765U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117012699A (en) * | 2023-09-26 | 2023-11-07 | 深圳市曜通科技有限公司 | Automatic clamping device for semiconductor parts |
-
2021
- 2021-11-19 CN CN202122839278.6U patent/CN216528765U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117012699A (en) * | 2023-09-26 | 2023-11-07 | 深圳市曜通科技有限公司 | Automatic clamping device for semiconductor parts |
| CN117012699B (en) * | 2023-09-26 | 2024-01-12 | 深圳市曜通科技有限公司 | Automatic clamping device for semiconductor parts |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220513 |