CN216525568U - Automatic turn-over device of semiconductor material - Google Patents
Automatic turn-over device of semiconductor material Download PDFInfo
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- CN216525568U CN216525568U CN202122580916.7U CN202122580916U CN216525568U CN 216525568 U CN216525568 U CN 216525568U CN 202122580916 U CN202122580916 U CN 202122580916U CN 216525568 U CN216525568 U CN 216525568U
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Abstract
The utility model discloses an automatic semiconductor material turning device, which belongs to the technical field of semiconductor material performance parameter testing, and is arranged above a testing platform, a semiconductor material testing workbench is also arranged above the testing platform, the automatic semiconductor material turning device and the semiconductor material testing workbench are arranged adjacently, the automatic semiconductor material turning device comprises a rotary table, a manipulator and a transfer table, the outer diameter of the transfer table is smaller than that of a semiconductor material, the manipulator is arranged above the rotary table, a rotary joint is arranged at the arm end of the manipulator, and the end part of the rotary joint is connected with a mechanical clamping jaw; the mechanical clamping jaw can grab the semiconductor material and turn over the semiconductor material, so that the surface of the semiconductor material can be prevented from being polluted, the turned semiconductor material can be placed on the transfer table for transfer, the semiconductor material can be prevented from directly and vertically falling onto the surface of the semiconductor test workbench, and mechanical damage is avoided.
Description
Technical Field
The utility model belongs to the technical field of semiconductor material performance parameter testing, and particularly relates to an automatic turnover device for a semiconductor material.
Background
In the process of testing the performance parameters of the semiconductor material, the conductivity is an important test item, and when the conductivity of the semiconductor material is tested by adopting a non-contact measurement method, the semiconductor material can be prevented from being damaged in the test process, and new defects can not be introduced, so that the method is a commonly used test method at present.
In actual tests, in order to improve the accuracy of performance test results, the front and back of a semiconductor material are often required to be tested respectively, so that the semiconductor material needs to be turned over, and the conventional operation at present adopts manual turning, so that the risk of manual operation polluting the surface of the semiconductor material is increased, and the test results are influenced; meanwhile, for a semiconductor material with thicker thickness and larger mass, the semiconductor material cannot be horizontally and slowly placed on the workbench during manual turnover, so that the possibility of collision between the surface of the semiconductor material and the workbench easily occurs, great potential safety hazards are brought to the surface of the semiconductor material, and great loss is easily caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an automatic turnover device for a semiconductor material, which aims to solve the technical problems in the background technology.
In order to achieve the purpose, the utility model discloses a semiconductor material automatic turn-over device which is arranged above a test platform, wherein a semiconductor material test workbench is also arranged above the test platform, the semiconductor material automatic turn-over device and the semiconductor material test workbench are arranged adjacently, the semiconductor material automatic turn-over device comprises a rotary table and a manipulator, the rotary table is fixedly arranged above the test platform, the manipulator is arranged above the rotary table, a rotary joint is arranged at the arm end of the manipulator, and the end part of the rotary joint is connected with a mechanical clamping jaw.
Furthermore, the automatic semiconductor material turnover device further comprises a transfer table, the transfer table is fixedly arranged above the test platform, the transfer table is located within the rotating radius of the manipulator, and the outer diameter of the top of the transfer table is smaller than that of the semiconductor material.
Further, the turntable is located between the turntable stage and the semiconductor material test table.
Further, the transfer platform is of a cylindrical structure.
Further, the outside of the mechanical claw is coated with wear-resistant rubber.
The working principle of the automatic semiconductor material turnover device is as follows: the mechanical clamping jaw grabs the side face of the semiconductor material to be turned over, the rotary joint drives the mechanical clamping jaw to rotate 180 degrees, the lower surface of the semiconductor material is turned over to the upper side, and when the thickness of the mechanical clamping jaw is equal to or smaller than that of the semiconductor material, the turned semiconductor material is directly placed on a semiconductor material testing workbench; when the thickness of the mechanical clamping jaw is larger than that of the semiconductor material, the semiconductor material after overturning is placed on the transfer platform, and then the semiconductor material is placed on the semiconductor material test workbench after being grabbed by the mechanical clamping jaw.
Compared with the prior art, the automatic turnover device for the semiconductor material has the following advantages:
(1) the automatic semiconductor material overturning device is provided with the manipulator and the transfer platform, the manipulator can grab and overturn the semiconductor material, the surface of the semiconductor material is not polluted, and the accuracy of a test result can be ensured.
(2) According to the automatic semiconductor material overturning device, when the thickness of the semiconductor material is thinner, the overturned semiconductor material can be placed on the transfer platform in a transfer mode, and then the semiconductor material is placed on the semiconductor material testing workbench after being grabbed by the manipulator, so that the semiconductor material after overturning can be prevented from directly and vertically falling onto the surface of the semiconductor testing workbench, and mechanical damage to the semiconductor material is avoided.
(3) The automatic semiconductor material turnover device is simple to operate and easy to realize.
Drawings
FIG. 1: the top view structure of the semiconductor material automatic turn-over device in embodiment 1 is schematically shown.
FIG. 2: the front view structure of the semiconductor material automatic turn-over device in embodiment 1 is schematically shown.
FIG. 3: the thickness of the mechanical claw is smaller than the schematic diagram of the turnover process when the thickness of the semiconductor material is smaller than the thickness of the mechanical claw.
FIG. 4: the thickness of the mechanical claw is larger than the schematic diagram of the turnover process when the thickness of the semiconductor material is larger than the thickness of the mechanical claw.
Wherein: 1. a test platform; 2. a semiconductor test stage; 3. a turntable; 4. a manipulator; 5. transferring the platform; 41. a revolute joint; 42. a mechanical jaw; 6. a semiconductor material.
Detailed Description
The technical solution of the present invention will be described in detail by the following specific examples.
Example 1
As shown in fig. 1-2, an automatic semiconductor material 6 turning device is arranged above a test platform 1, a test workbench for semiconductor material 6 is further arranged above the test platform 1, the automatic semiconductor material 6 turning device and the test workbench for semiconductor material 6 are arranged adjacent to each other, the automatic semiconductor material 6 turning device comprises a rotary table 3, a manipulator 4 and a rotary table 5, the rotary table 3 is located between the rotary table 5 and the test workbench for semiconductor material 6, the manipulator 4 is arranged above the rotary table 3, the manipulator 4 can rotate around the rotary table 3 under the driving of the rotary table 3, the rotary table 5 is located inside the rotation radius of the manipulator 4, the rotary table 5 is of a cylindrical structure, and the outer diameter of the top of the rotary table 5 is smaller than the outer diameter of the semiconductor material 6.
The arm end of the manipulator 4 is provided with a rotary joint 41, the rotary joint 41 can perform stepless rotation of 0-360 degrees relative to the arm end of the manipulator 4, and the end part of the rotary joint 41 is connected with a mechanical claw 42, and the mechanical claw 42 is used for grabbing the semiconductor material 6.
The mechanical claws 42 are coated with wear-resistant rubber, so that the wear resistance of the mechanical claws 42 can be improved, and the semiconductor material 6 can be prevented from being mechanically damaged in the process of clamping the semiconductor material 6 by the mechanical claws 42.
As shown in fig. 3 to 4, the automatic semiconductor material 6 turnover device in this embodiment 1 is used in two cases: the thickness of the mechanical jaw 42 is less than or equal to the thickness of the semiconductor material 6 and the thickness of the mechanical jaw 42 is greater than the thickness of the semiconductor material 6, in different cases the working steps are as follows:
the thickness of the mechanical jaw 42 is less than or equal to the thickness of the semiconductor material 6:
(1) starting the rotary table 3 and the mechanical arm 4, moving the mechanical claw 42 to the position above the semiconductor material 6 test workbench, grabbing the side face of the semiconductor material 6 to be subjected to turnover detection, and enabling the lower surface of the semiconductor material 6 to be flush with the lower surface of the mechanical claw 42;
in practical tests, if the thickness of the mechanical claws 42 is much smaller than that of the semiconductor material 6, the mechanical claws 42 can grab the middle part of the side surface of the semiconductor material 6, i.e. the lower surface of the semiconductor material 6 is lower than the lower surface of the mechanical claws 42;
(2) the rotary table 3 drives the manipulator 4 to move to the outside of the semiconductor material 6 test workbench, the rotary joint 41 drives the mechanical jaw 42 to rotate 180 degrees, and the lower surface of the semiconductor material 6 is turned over to the upper side;
(3) the mechanical clamping jaw 42 is moved to the position above the semiconductor material 6 testing workbench, the lower surface of the semiconductor material 6 after being turned over is placed above the semiconductor material 6 testing workbench, then the mechanical clamping jaw 42 is loosened, the rotary table 3 drives the mechanical arm 4 to move to the outer portion of the semiconductor material 6 testing workbench, and the semiconductor material 6 testing workbench can conduct conductivity testing on the semiconductor material 6 after being turned over.
In the process of turning over the semiconductor material 6 in this working condition, the mechanical claws 42 do not touch the surface of the semiconductor material 6, and the surface of the semiconductor material 6 is not contaminated, so that the accuracy of the test result can be ensured.
The thickness of the mechanical jaw 42 is greater than the thickness of the semiconductor material 6:
(1) starting the rotary table 3 and the mechanical arm 4, moving the mechanical claw 42 to the position above the semiconductor material 6 test workbench, grabbing the side face of the semiconductor material 6 to be subjected to turnover detection, and enabling the lower surface of the semiconductor material 6 to be flush with the lower surface of the mechanical claw 42;
(2) the rotary table 3 drives the manipulator 4 to move to the outside of the semiconductor material 6 test workbench, the rotary joint 41 drives the mechanical clamping jaw 42 to rotate 180, and the lower surface of the semiconductor material 6 is turned over to the upper side;
(3) the mechanical clamping jaw 42 moves to the position above the transfer table 5, the lower surface of the semiconductor material 6 after being turned over is placed above the transfer table 5, then the mechanical clamping jaw 42 is loosened, the mechanical clamping jaw 42 moves upwards, when the lower surface of the mechanical clamping jaw 42 rises to be flush with the lower surface of the semiconductor material 6 after being turned over, the mechanical clamping jaw 42 grabs the side surface of the semiconductor material 6, the mechanical arm 4 is driven to move to the position above the semiconductor material 6 testing workbench under the action of the rotary table 3, the mechanical clamping jaw 42 is loosened after the lower surface of the semiconductor material 6 after being turned over is placed above the semiconductor material 6 testing workbench, the rotary table 3 drives the mechanical arm 4 to move to the outer portion of the semiconductor material 6 testing workbench, and the semiconductor material 6 testing workbench can conduct conductivity testing on the semiconductor material 6 after being turned over.
In the process of turning over the semiconductor material 6 under the working condition, after the semiconductor material 6 is turned over by the rotary joint 41, the semiconductor material 6 can be firstly placed above the turning table 5 with a smaller outer diameter due to the existence of the turning table 5, and the turned-over semiconductor material 6 is grabbed by the mechanical jaw 42 again, so that the lower surface of the turned-over semiconductor material 6 is flush with the lower surface of the mechanical jaw 42; after the semiconductor material 6 after being turned over is directly loosened by the mechanical clamping jaw 42, the semiconductor material 6 directly and vertically falls on the surface of the semiconductor test workbench 2 to cause mechanical damage to the semiconductor material 6, and the damage to the semiconductor material 6 is avoided on the premise of ensuring the accuracy of a test result.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like made within the design concept of the present invention should be included in the scope of the present invention.
Claims (5)
1. The utility model provides an automatic turn-over device of semiconductor material, locates the test platform top, and the test platform top still is equipped with semiconductor material test bench, and the automatic turn-over device of semiconductor material sets up its characterized in that adjacent with semiconductor material test bench: the automatic semiconductor material turn-over device comprises a rotary table and a mechanical arm, wherein the rotary table is fixedly arranged above the test platform, the mechanical arm is arranged above the rotary table, a rotary joint is arranged at the arm end of the mechanical arm, and the end part of the rotary joint is connected with a mechanical clamping jaw.
2. The automatic semiconductor material turnover device of claim 1, characterized in that: the automatic semiconductor material turnover device further comprises a transfer table, the transfer table is fixedly arranged above the test platform, the transfer table is located in the rotating radius of the manipulator, and the outer diameter of the top of the transfer table is smaller than that of the semiconductor material.
3. The automatic semiconductor material turnover device of claim 2, characterized in that: the rotary table is positioned between the rotary table and the semiconductor material testing workbench.
4. The automatic semiconductor material turnover device of claim 2, characterized in that: the transfer platform is of a cylindrical structure.
5. The automatic semiconductor material turnover device of claim 1, characterized in that: and wear-resistant rubber is coated outside the mechanical clamping jaw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122580916.7U CN216525568U (en) | 2021-10-26 | 2021-10-26 | Automatic turn-over device of semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122580916.7U CN216525568U (en) | 2021-10-26 | 2021-10-26 | Automatic turn-over device of semiconductor material |
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| Publication Number | Publication Date |
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| CN216525568U true CN216525568U (en) | 2022-05-13 |
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| CN202122580916.7U Active CN216525568U (en) | 2021-10-26 | 2021-10-26 | Automatic turn-over device of semiconductor material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115338171A (en) * | 2022-08-21 | 2022-11-15 | 浙江奥首材料科技有限公司 | Wafer protective coating cleaning equipment |
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2021
- 2021-10-26 CN CN202122580916.7U patent/CN216525568U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115338171A (en) * | 2022-08-21 | 2022-11-15 | 浙江奥首材料科技有限公司 | Wafer protective coating cleaning equipment |
| CN115338171B (en) * | 2022-08-21 | 2023-08-29 | 浙江奥首材料科技有限公司 | Wafer protective coating cleaning equipment |
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Address after: Room 205, 2nd Floor, Building 8, No.28, Jujin Road, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province, 215100 Patentee after: Jiuyu semiconductor technology (Suzhou) Co.,Ltd. Address before: 215000 unit 4-b201-024, creative industrial park, No. 328, Xinghu street, Suzhou Industrial Park, Jiangsu Province Patentee before: Jiuyu semiconductor technology (Suzhou) Co.,Ltd. |
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