CN216491274U - Low-impedance multilayer circuit board - Google Patents

Abstract

The utility model discloses an low impedance multilayer circuit board relates to circuit board technical field, specifically is a low impedance multilayer circuit board, which comprises a circuit board, the fixed surface of circuit board installs the technology limit, the mounting groove has all been seted up to the left and right sides on technology limit, fixed mounting has the support column in the mounting groove that the technology limit left and right sides was seted up, the middle part fixed mounting of support column surface has the fixed block. This low impedance multilayer circuit board, through pressing the drive plate, make two gag lever posts remove towards the direction of fixed block, then put into the inside spacing groove of seting up of fixed frame with the gag lever post, the elasticity that utilizes spacing spring to provide this moment can carry on spacingly to the gag lever post, make the technology limit be in the inboard of fixed frame, so can dismantle the circuit board when the circuit board is dismantled to needs, only can dismantle the circuit board through pressing the drive plate, when having improved staff dismouting efficiency, avoid the problem that the circuit board appears damaging.

Description

Low-impedance multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is a low impedance multilayer circuit board.

Background

The circuit board is also called as the circuit board, it has high density of distribution, light in weight, the thickness is thin, the characteristic with good bending property, the circuit board makes the circuit miniaturized, it is visual, play an important role in the batch production of the fixed circuit and optimizing the electric apparatus layout, the circuit board is while using, the impedance size has very big influence to the use of the circuit board, and the circuit board works and can produce the heat, the too high impedance that can cause the internal impedance of the circuit board to increase of the heat, therefore need the multilayer circuit board of the low impedance, the preparation method of the multilayer circuit board of the low impedance is generally made first by the inner layer figure, then make the single-sided or double-sided base plate with the printing etching method, and incorporate into the appointed interlaminar, heat, pressurize and bind; the low impedance multilayer circuit board is used for various electronic devices, and all pass through the mounting screw on electronic equipment when low impedance multilayer circuit board is installed, the method of this kind of installation can make the installation and dismantle loaded down with trivial details in, lead to the screw hole to appear smooth silk phenomenon easily after dismantling many times, and lead to the unable fixed problem of circuit board to appear, and in weather hot, the component operating time on the circuit board is long, lead to the components and parts to generate heat easily, cause the problem of component damage to appear, so it solves above-mentioned problem to propose a low impedance multilayer circuit board here.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a low impedance multilayer circuit board has solved the problem of proposing in the above-mentioned background art.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a low impedance multilayer circuit board, includes the circuit board, the fixed surface of circuit board installs the technology limit, the mounting groove has all been seted up to the left and right sides on technology limit, fixed mounting has the support column in the mounting groove that the left and right sides of technology limit was seted up, the middle part fixed mounting of support column surface has the fixed block, the equal fixedly connected with spacing spring in both sides around the fixed block, the other end fixedly connected with gag lever post of spacing spring, fixed frame has been cup jointed in the surface activity of gag lever post.

Optionally, a driving plate is fixedly mounted on the upper surface of the limiting rod, and driving grooves matched with the driving plate are formed in the left side and the right side of the upper surface of the craft edge.

Optionally, the equal fixed mounting in four corners department of fixed frame has rubber crash pad, rubber crash pad's shape is L shape, rubber crash pad's the department of buckling shape is the arc.

Optionally, the four corners of the top of the fixing frame are provided with limiting thread grooves, and the limiting thread grooves formed in the top of the fixing frame are connected with positioning bolts through threads.

Optionally, condensate pipe is all installed to both sides around the fixed frame inner chamber, miniature heat dissipation fan is all installed to both sides around the fixed frame upper surface.

Optionally, the shape of gag lever post is L shape, the left and right sides of fixed frame upper surface has all been seted up and has been got the groove, get the width of taking the groove and the width looks adaptation of gag lever post.

The utility model provides a low impedance multilayer circuit board possesses following beneficial effect:

1. this low impedance multilayer circuit board, through pressing the drive plate, make two gag lever posts remove towards the direction of fixed block, then put into the inside spacing groove of seting up of fixed frame with the gag lever post, the elasticity that utilizes spacing spring to provide this moment can carry on spacingly to the gag lever post, make the technology limit be in the inboard of fixed frame, so can dismantle the circuit board when the circuit board is dismantled to needs, only can dismantle the circuit board through pressing the drive plate, when having improved staff dismouting efficiency, avoid the problem that the circuit board appears damaging.

2. This low impedance multilayer circuit board can effectually absorb the heat that components and parts gived off through the condensate pipe, utilizes miniature heat dissipation fan can be further dispel the heat to components and parts, avoids components and parts to lead to damaging because of the high temperature, has improved the life of circuit board, utilizes miniature heat dissipation fan can effectually avoid the surface of circuit board the deposition phenomenon to appear simultaneously.

Drawings

FIG. 1 is a schematic side view of the present invention;

fig. 2 is a schematic three-dimensional structure diagram of the driving plate of the present invention;

FIG. 3 is a schematic view of the structure of the picking groove of the present invention;

fig. 4 is a schematic structural view of a section of the fixing frame of the present invention;

fig. 5 is a schematic structural view of the process edge three-dimensional explosion of the present invention.

In the figure: 1. a circuit board; 2. a process edge; 3. a support pillar; 4. a fixed block; 5. a limiting spring; 6. a limiting rod; 7. a drive plate; 8. a fixing frame; 9. taking the groove; 10. a rubber crash pad; 11. positioning the bolt; 12. a condensate pipe; 13. a miniature heat dissipation fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1, fig. 4 and fig. 5, the present invention provides a technical solution: a low-impedance multilayer circuit board comprises a circuit board 1, a technical edge 2 is fixedly installed on the outer surface of the circuit board 1, installation grooves are formed in the left side and the right side of the technical edge 2, support columns 3 are fixedly installed in the installation grooves formed in the left side and the right side of the technical edge 2, a fixing block 4 is fixedly installed in the middle of the outer surface of each support column 3, limiting springs 5 are fixedly connected to the front side and the rear side of each fixing block 4, when each limiting spring 5 is extruded by each limiting rod 6, each limiting rod 6 is installed inside a fixing frame 8, when a driving plate 7 is loosened, each limiting spring 5 can elastically deform to reset the corresponding limiting rod 6, a limiting rod 6 is fixedly connected to the other end of each limiting spring 5, each fixing frame 8 is movably sleeved on the outer surface of each limiting rod 6, each limiting groove is formed inside each fixing frame 8, and the corresponding limiting rods 6 and the fixing frames 8 can be mutually blocked, thereby achieving the mounting of the wiring board 1.

Please refer to fig. 3, the rubber crash pad 10 is fixedly mounted at the four corners of the fixed frame 8, the rubber crash pad 10 is L-shaped, the bending part of the rubber crash pad 10 is arc-shaped, the rubber crash pad 10 can increase the crash performance of the fixed frame 8, the four corners of the fixed frame 8 are effectively protected, the service life of the fixed frame 8 is prolonged, and meanwhile, the problem that the bending part of the fixed frame 8 is hurt to the hands of the worker can be avoided.

Referring to fig. 1 and 3, the four corners of the top of the fixing frame 8 are provided with limiting thread grooves, the top of the fixing frame 8 is provided with a positioning bolt 11, the fixing frame 8 is fixed on a machine through the positioning bolt 11, the circuit board 1 and the fixing frame 8 can be detached, and the phenomenon that the positioning bolt 11 is frequently detached to cause thread sliding in the limiting thread grooves inside the fixing frame 8 can be effectively avoided.

Please refer to fig. 2 and 3, condensate pipe 12 is all installed to both sides around the fixed frame 8 inner chamber, the specific heat capacity of utilizing water is enough big, can the effectual heat that absorbs components and parts and givend, miniature heat dissipation fan 13 is all installed to both sides around the fixed frame 8 upper surface, utilize miniature heat dissipation fan 13 can avoid the surface deposition ash of circuit board 1, after avoiding the circuit to be filled with the dust, because the dust is easily absorbed the moisture, the dust resistance that has had the moisture can reduce, make the wire with local electric leakage, cause the abnormal problem that heats even the fire that the control circuit work appears.

Please refer to fig. 2 and 3, the shape of the limiting rod 6 is L-shaped, the left and right sides of the upper surface of the fixing frame 8 are all provided with a taking groove 9, the taking groove 9 is adapted to the width of the limiting rod 6, the taking groove 9 is staggered with the limiting groove arranged inside the fixing frame 8, the circuit board 1 can be conveniently disassembled and assembled by a worker through changing the position of the limiting rod 6, the disassembling and assembling efficiency of the worker is improved, the upper surface of the limiting rod 6 is fixedly provided with a driving plate 7, the left and right sides of the upper surface of the technical edge 2 are provided with driving grooves adapted to the driving plate 7, the limiting rod 6 can extrude the limiting spring 5 by pressing the driving plate 7, thereby the position of the limiting rod 6 is changed, when the position of the limiting rod 6 is coincident with the taking groove 9, the disassembling and assembling of the limiting rod 6 can be conveniently realized, and the convenience of disassembling and assembling is improved

In conclusion, this low impedance multilayer circuit board, during the use, at first the staff presses drive plate 7, make gag lever post 6 extrude drive plate 7, make gag lever post 6 be close to fixed block 4, then install gag lever post 6 in the inside spacing groove of seting up of fixed frame 8, at this moment, spacing spring 5 can resume elastic deformation, thereby reset gag lever post 6, realize fixed circuit board 1's purpose, install fixed frame 8 on the machine through positioning bolt 11 after that, when needs are dismantled circuit board 1, need press drive plate 7, make gag lever post 6 with get and take groove 9 to coincide each other, then upwards lift whole circuit board 1, just can demolish whole circuit board 1, so can.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A low impedance multilayer wiring board comprising a wiring board (1), characterized in that: the outer fixed surface of circuit board (1) installs technology limit (2), the mounting groove has all been seted up to the left and right sides on technology limit (2), fixed mounting has support column (3) in the mounting groove that the left and right sides was seted up on technology limit (2), the middle part fixed mounting of support column (3) surface has fixed block (4), the equal fixedly connected with spacing spring (5) in both sides around fixed block (4), the other end fixedly connected with gag lever post (6) of spacing spring (5), fixed frame (8) have been cup jointed in the surface activity of gag lever post (6).

2. The low impedance multilayer wiring board of claim 1, wherein: the upper surface of the limiting rod (6) is fixedly provided with a driving plate (7), and the left side and the right side of the upper surface of the technical edge (2) are provided with driving grooves matched with the driving plate (7).

3. The low impedance multilayer wiring board of claim 1, wherein: the equal fixed mounting in four corners department of fixed frame (8) has rubber crash pad (10), the shape of rubber crash pad (10) is L shape, the department's shape of buckling of rubber crash pad (10) is the arc.

4. The low impedance multilayer wiring board of claim 1, wherein: the top four corners of the fixed frame (8) are provided with limiting thread grooves, and the top of the fixed frame (8) is provided with limiting thread grooves in which positioning bolts (11) are in threaded connection.

5. The low impedance multilayer wiring board of claim 1, wherein: condensate pipe (12) are all installed to both sides around fixed frame (8) inner chamber, miniature heat dissipation fan (13) are all installed to both sides around fixed frame (8) upper surface.

6. The low impedance multilayer wiring board of claim 1, wherein: the shape of gag lever post (6) is L shape, the left and right sides of fixed frame (8) upper surface has all been seted up and has been got and take groove (9), get the width of taking groove (9) and the width looks adaptation of gag lever post (6).

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