CN216491218U

CN216491218U - High level and smooth flexible printed circuit board

Info

Publication number: CN216491218U
Application number: CN202122844170.6U
Authority: CN
Inventors: 赵玲
Original assignee: Kunshan Datang Electronics Co ltd
Current assignee: Kunshan Datang Electronics Co ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-05-10
Anticipated expiration: 2031-11-19

Abstract

The utility model relates to the technical field of circuit boards, and discloses a high-flatness flexible printed circuit board, which comprises a substrate and a flattening surface, wherein the flattening surface is arranged above the substrate, a plurality of groups of wire combing grooves are formed in the upper surface of the substrate, a plurality of groups of pressing blocks are integrally connected with the lower surface of the flattening surface, a plurality of groups of clamping seats are arranged between the wire combing grooves on the upper surface of the substrate, the clamping seats are embedded in the substrate and fixedly connected with the substrate, the lower surface of the flattening surface corresponds to the clamping seats, the clamping seats are embedded in the flattening surface and fixedly connected with the flattening surface, the substrate and the flattening surface are fixedly connected with the clamping seats and the pressing blocks through the clamping seats, wires are arranged in the wire combing grooves, and are fixed on the inner wall of the wire combing groove. The radiating efficiency of the circuit board is accelerated, and the service life of the flexible circuit board is prolonged.

Description

High level and smooth flexible printed circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-flatness flexible printed circuit board.

Background

The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent property, is called as a flexible printed circuit board or FPC for short, and has the characteristics of high wiring density, light weight and thin thickness.

Due to the characteristic of flexible folding of the flexible printed circuit board, the flexible printed circuit board is mainly used for small electronic products, such as mobile phones, computers, CD walkmans and the like, but the flexible printed circuit board after being folded has poor heat dissipation capability, so that the service life of the flexible printed circuit board is easily reduced, and due to high wiring density of the flexible printed circuit board, the surface of the circuit board is easily uneven in the bending process, electromagnetic influence is generated among multiple lines, and even a short circuit phenomenon is caused.

Therefore, a high-flatness flexible printed circuit board is designed.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a high-flatness flexible printed circuit board, which solves the problems in the background art.

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a high level and smooth flexible printed circuit board, includes base plate and whole face of pressing, the base plate top is equipped with whole face of pressing, a plurality of groups comb line groove have been seted up to the base plate upper surface, whole face of pressing lower surface an organic whole is connected with the tight briquetting of a plurality of groups, tight briquetting is the same with comb line groove number and the position is corresponding, be equipped with a plurality of groups cassette between the base plate upper surface comb line groove, the cassette inlays in the base plate inside and base plate fixed connection, whole face of pressing lower surface is equipped with the buckle with the corresponding position of cassette, the buckle inlays in whole face of pressing inside and whole face of pressing fixed connection, the base plate passes through buckle and cassette and sticiss a fixed connection with whole face of pressing, the comb line inslot is equipped with the wire, the wire is fixed in comb line inslot wall.

Furthermore, the base plate comprises copper foil layer, insulating layer and heat dissipation layer, and the copper foil layer is pasted on the insulating layer upper surface, and the insulating layer is pasted on heat dissipation layer upper surface, and is equipped with a plurality of groups of fin between insulating layer and the heat dissipation layer, and the upper and lower surface of fin respectively with insulating layer and heat dissipation layer fixed connection, and the insulating layer is used for separating copper foil layer and fin, prevents that fin and copper foil layer contact from causing the short circuit.

Furthermore, the copper foil layer is made of rolled copper material, the thickness of the copper foil layer is 0.5-1 oz, the ductility of the rolled copper is good, and the contractibility of the flexible circuit board can be improved.

Furthermore, the insulating layer is woven by insulating fiber material and is made, and the heat dissipation layer is woven by nylon materials and is made, and heat dissipation layer weaving density is less than the insulating layer, and the heat dissipation layer mainly used is fixed in the fin on the insulating layer, and its weaving density is little, is convenient for the fin heat dissipation.

Furthermore, the radiating fins are made of brass materials, the thickness of each radiating fin is 0.05-0.1mm, a gap is reserved between every two adjacent groups of radiating fins, the radiating fins are thin and high in toughness, the radiating fins can be bent and folded together with the substrate, and the radiating plates are spaced from each other, so that mutual influence between the radiating plates during bending can be prevented.

Further, buckle lower surface an organic whole is connected with the snap ring, and the cassette upper surface is seted up flutedly, is equipped with two sets of kellies in the recess, kellies both ends respectively with cassette inner wall fixed connection, the kellies have certain elasticity, can bend when appropriate atress, can resume linear type when not atress, is convenient for fix the snap ring.

The utility model has the beneficial effects that: 1. the utility model discloses a, through addding whole pressure face, install a plurality of groups buckle on the whole pressure face, install a plurality of groups cassette on the base plate, make whole pressure face fixed laminating on the base plate through buckle and cassette, and seted up comb wire casing on the base plate, whole pressure face is last to have and sticiss the piece, when whole pressure face hugs closely the base plate, it compresses tightly fixedly to sticiss the piece card with the wire in the comb wire casing in comb wire casing, the wire removes when preventing the circuit board bending and leads to the surface unevenness, it is fixed to influence the circuit board, effectively solved because flexible printed circuit board distribution density is high, cause circuit board surface unevenness easily in bending process, produce electromagnetic influence between the multiline, cause the problem of short circuit phenomenon even.

2. The utility model discloses a, through addding the fin, the fin is located inside the base plate, can be with the heat transfer who produces on the base plate to the outside air for the radiating efficiency of circuit board, and fin thickness is less, and toughness is stronger, can the bending folding, and it is not good effectively to have solved flexible printed circuit board heat-sinking capability after folding, reduces flexible printed circuit board's life's problem easily.

Drawings

FIG. 1 is a schematic structural view of the present invention; FIG. 2 is an enlarged view of A in FIG. 1; FIG. 3 is a schematic structural view of a substrate and a pressing surface according to the present invention; FIG. 4 is a schematic view of the internal structure of the substrate according to the present invention; fig. 5 is a schematic structural view of the clip and the clip seat of the present invention.

In the figure: 1. a substrate; 2. pressing the dough; 3. combing a wire groove; 4. pressing the block tightly; 5. a wire; 6. buckling; 7. a card holder; 8. an insulating layer; 9. a heat dissipation layer; 10. a heat sink; 11. a snap ring; 12. a clamping rod; 13. and a copper foil layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, 2 and 3, a highly smooth flexible printed circuit board includes a substrate 1 and a pressing surface 2, the pressing surface 2 is disposed above the substrate 1, a plurality of groups of wire combing grooves 3 are disposed on the upper surface of the substrate 1, a plurality of groups of pressing blocks 4 are integrally connected to the lower surface of the pressing surface 2, the pressing blocks 4 are the same as the wire combing grooves 3 in number and correspond to the positions of the wire combing grooves 3, a plurality of groups of clamping seats 7 are disposed between the wire combing grooves 3 on the upper surface of the substrate 1, the clamping seats 7 are embedded in the substrate 1 and fixedly connected with the substrate 1, buckles 6 are disposed at positions corresponding to the lower surface of the pressing surface 2 and the clamping seats 7, the buckles 6 are embedded in the pressing surface 2 and fixedly connected with the pressing surface 2, the substrate 1 and the pressing surface 2 are fixedly connected with the clamping seats 7 and the pressing blocks 4 through the buckles 6, wires 5 are disposed in the wire combing grooves 3, and the wires 5 are fixed on the inner walls of the wire combing grooves 3.

Referring to fig. 4, the substrate 1 is composed of a copper foil layer 13, an insulating layer 8 and a heat dissipation layer 9, the copper foil layer 13 is adhered to the upper surface of the insulating layer 8, the insulating layer 8 is adhered to the upper surface of the heat dissipation layer 9, a plurality of sets of heat dissipation fins 10 are arranged between the insulating layer 8 and the heat dissipation layer, the upper surface and the lower surface of each heat dissipation fin 10 are fixedly connected with the insulating layer 8 and the heat dissipation layer 9 respectively, and the insulating layer 8 is used for separating the copper foil layer 13 from the heat dissipation fins 10 to prevent the heat dissipation fins 10 from contacting with the copper foil layer 13 to cause short circuit.

The copper foil layer 13 is made of rolled copper material, the thickness of the copper foil layer is 0.5-1 oz, the ductility of the rolled copper is good, and the contractibility of the flexible circuit board can be improved.

The insulating layer 8 is made of insulating fiber materials in a weaving mode, the heat dissipation layer 9 is made of nylon materials in a weaving mode, the weaving density of the heat dissipation layer 9 is smaller than that of the insulating layer 8, the heat dissipation layer 9 is mainly used for fixing the radiating fins 10 on the insulating layer 8, the weaving density is small, and the radiating fins 10 are convenient to radiate.

The radiating fins 10 are made of brass materials, the thickness of each radiating fin 10 is 0.05-0.1mm, a gap is reserved between every two adjacent groups of radiating fins 10, the radiating fins 10 are thin and high in toughness, can be bent and folded together with the substrate 1, and gaps are reserved among the radiating plates, so that mutual influence among the radiating plates during bending can be prevented.

Referring to fig. 5, the lower surface of the buckle 6 is integrally connected with a snap ring 11, the upper surface of the clamp seat 7 is provided with a groove, two sets of clamping rods 12 are arranged in the groove, two ends of each clamping rod 12 are fixedly connected with the inner wall of the clamp seat 7 respectively, each clamping rod 12 has certain elasticity, can be bent when being stressed properly, can recover to be linear when not stressed, and is convenient for fixing the snap ring 11.

In summary, when the present invention is used, the wires 5 are orderly arranged in the comb slot 3, then the pressing surface 2 is fixed on the substrate 1 through the buckle 6 and the clamping seat 7, when the buckle 6 is connected with the clamping seat 7, the snap ring 11 on the lower surface of the buckle 6 is aligned with the groove on the upper surface of the clamping seat 7, then the snap ring 11 is pressed into the groove of the clamping seat 7 with force, when the snap ring 11 moves downwards, the clamping rod 12 is forced to bend towards two sides until the snap ring 11 can move between the two sets of clamping rods 12, when the snap ring 11 moves to the bottom of the groove of the clamping seat 7, the clamping rod 12 loses the external force extrusion and returns to the original shape, when the pressing surface 2 is tightly attached to the substrate 1, the pressing block 4 is clamped in the comb slot 3 to prevent the wires 5 from moving randomly, when a flexible circuit board is mounted, the circuit board is bent, because of the pressing surface 2, the wires 5 are fixed in the comb slot 3 and bend together with the substrate 1 and do not protrude on the substrate 1, high flatness of the flexible circuit board is realized.

Because the radiating fins 10 are arranged in the substrate 1, the density of the radiating layer 9 is low, so that one surface of each radiating fin 10 can be in contact with the outside air, the radiating fins 10 are high in heat conduction capability, heat generated by the copper foil layer 13 can be transferred to the outside, the circuit board can be quickly radiated, and the possibility that the service life of the circuit board is reduced due to poor radiating capability is reduced.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a high level flexible printed circuit board, includes base plate (1) and coining face (2), its characterized in that: the improved comb-line groove structure is characterized in that a pressing face (2) is arranged above the base plate (1), a plurality of groups of comb-line grooves (3) are formed in the upper surface of the base plate (1), a plurality of groups of pressing blocks (4) are integrally connected to the lower surface of the pressing face (2), the pressing blocks (4) are the same in number and correspond to the comb-line grooves (3), a plurality of groups of clamping seats (7) are arranged between the comb-line grooves (3) on the upper surface of the base plate (1), the clamping seats (7) are embedded in the inner portion of the base plate (1) and fixedly connected with the base plate (1), the lower surface of the pressing face (2) is provided with buckles (6) corresponding to the clamping seats (7), the buckles (6) are embedded in the pressing face (2) and fixedly connected with the pressing face (2), the base plate (1) and the pressing face (2) are fixedly connected with the clamping seats (7) and the pressing blocks (4) through the buckles (6), wires (5) are arranged in the comb-line grooves (3), and the wires (5) are fixed on the inner wall of the comb-line grooves (3).

2. A high-flatness flexible printed circuit board according to claim 1, characterized in that: the base plate (1) comprises a copper foil layer (13), an insulating layer (8) and a heat dissipation layer (9), wherein the copper foil layer (13) is pasted on the upper surface of the insulating layer (8), the insulating layer (8) is pasted on the upper surface of the heat dissipation layer (9), a plurality of groups of heat dissipation fins (10) are arranged between the insulating layer (8) and the heat dissipation layer, and the upper surface and the lower surface of each heat dissipation fin (10) are fixedly connected with the insulating layer (8) and the heat dissipation layer (9) respectively.

3. A high-flatness flexible printed circuit board according to claim 2, characterized in that: the copper foil layer (13) is made of a rolled copper material and has a thickness of 0.5-1 oz.

4. A high-flatness flexible printed circuit board according to claim 2, characterized in that: the insulating layer (8) is woven by insulating fiber materials, the heat dissipation layer (9) is woven by nylon materials, and the weaving density of the heat dissipation layer (9) is smaller than that of the insulating layer (8).

5. A high-flatness flexible printed circuit board according to claim 2, characterized in that: the radiating fins (10) are made of brass materials, the thickness of each radiating fin (10) is 0.05-0.1mm, and a space is reserved between every two adjacent groups of radiating fins (10).

6. A high-flatness flexible printed circuit board according to claim 1, characterized in that: the lower surface of the buckle (6) is integrally connected with a clamping ring (11), the upper surface of the clamping seat (7) is provided with a groove, two groups of clamping rods (12) are arranged in the groove, and two ends of each clamping rod (12) are fixedly connected with the inner wall of the clamping seat (7) respectively.