CN216491200U - Circuit board with smooth heat conduction - Google Patents
Circuit board with smooth heat conduction Download PDFInfo
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- CN216491200U CN216491200U CN202122680441.9U CN202122680441U CN216491200U CN 216491200 U CN216491200 U CN 216491200U CN 202122680441 U CN202122680441 U CN 202122680441U CN 216491200 U CN216491200 U CN 216491200U
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- heat
- circuit board
- adhesive layer
- heat conducting
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Abstract
The utility model discloses a circuit board with smooth heat conduction, and belongs to the technical field of circuit boards. The circuit board comprises a circuit board body, wherein a heat conducting adhesive layer wraps the outside of the circuit board body, a plurality of heat conducting pipes are sleeved outside the heat conducting adhesive layer and are fixedly connected with the heat conducting adhesive layer, heat radiating fins are arranged below the heat conducting adhesive layer, one side of each heat radiating fin is in contact with one side of each heat conducting pipe, a plurality of positioning rings are symmetrically fixed on the outer walls of four sides of the heat conducting adhesive layer, and a plurality of limiting rings matched with the positioning rings are fixed on the four side walls of each heat radiating fin. The utility model can conveniently and rapidly conduct the heat generated by the circuit board into the radiating fins, and rapidly discharge the heat through the radiating fins, thereby improving the heat-extraction and heat-conduction effect of the circuit board, and simultaneously playing the roles of buffering and protecting the circuit board.
Description
Technical Field
The utility model relates to a circuit board with smooth heat conduction, and belongs to the technical field of circuit boards.
Background
With the rapid development of electronic technology, the PCB becomes an indispensable component of electronic products, and because part of electronic components have relatively large power in the working process, a large amount of heat is generated in the working process, and when the temperature reaches a certain degree, the electronic components are easily damaged, so that the PCB cannot work normally.
In the application document with publication number CN201797689U, a circuit board with a heat conduction and dissipation structure is disclosed, which comprises a circuit board, a heat sink, an electrical component, a heat conducting fin, and a heat dissipation groove, wherein the electrical component is disposed on the circuit board, and the heat conducting fin is disposed on the electrical component.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the utility model provides a smooth and easy circuit board of heat conduction, it has solved the heat conduction simple structure of current device, and can not absorb every electronic component's heat, influences the holistic heat conduction of circuit board and the problem of heat extraction efficiency.
The technical problem to be solved by the utility model is realized by adopting the following technical scheme:
the utility model provides a smooth and easy circuit board of heat conduction, includes the circuit board body, the outside parcel of circuit board body has the heat-conducting glue layer, just the outside cover of heat-conducting glue layer is equipped with many heat pipes, and is a plurality of the heat pipe all with heat-conducting glue layer fixed connection, the below of heat-conducting glue layer is equipped with heat radiation fins, just one side of heat radiation fins contacts with one side of many heat pipes, four side outer walls of heat-conducting glue layer all symmetry are fixed with a plurality of holding rings, heat radiation fins's four lateral walls all are fixed with a plurality ofly and holding ring assorted spacing ring, every the lateral wall of spacing ring all is fixed with the elastic rod, just the other end of elastic rod all is fixed with the fixture block, every the lateral wall of holding ring all seted up with fixture block assorted bayonet socket.
Preferably, every the below of spacing ring all is equipped with the sleeve pipe, just sheathed tube bottom is fixed with the buffering rubber ring, every the top of holding ring all is equipped with the screw rod, just the one end of screw rod passes holding ring, spacing ring and sleeve pipe in proper order and outwards extends.
Preferably, the top of each clamping block abuts against the screw head of the screw.
Preferably, a heat conducting fin is arranged between the heat radiating fins and the heat conducting adhesive layer, and the heat conducting fin is abutted against the plurality of heat conducting pipes and the heat radiating fins.
Preferably, a plurality of workpiece mounting holes are formed in the top of the heat conducting adhesive layer, and each workpiece mounting hole is formed between two heat conducting pipes.
Preferably, the side wall of one side of each clamping block facing the positioning ring is provided with an inclined surface, and the side wall of one side of each clamping block facing away from the positioning ring is fixed with a pulling block.
Compared with the prior art, the utility model provides the circuit board with smooth heat conduction, which has the following beneficial effects:
1. this smooth and easy circuit board of heat conduction through heat-conducting glue layer, heat pipe, heat radiation fins, holding ring, spacing ring, elastic rod and the fixture block that is equipped with, can be convenient for heat the heat that the circuit board produced fast to in the heat radiation fins to discharge the heat fast through heat radiation fins, improved the heat extraction heat conduction effect of circuit board.
2. This smooth and easy circuit board of heat conduction through heat-conducting adhesive layer, sleeve pipe, buffering rubber ring and the screw rod that is equipped with, can install fixedly to the circuit board, can play the effect of buffering and protection to the circuit board simultaneously.
The heat dissipation device has the advantages that the heat generated by the circuit board can be conveniently and quickly conducted into the heat dissipation fins, the heat can be quickly discharged through the heat dissipation fins, the heat extraction and heat conduction effects of the circuit board are improved, and meanwhile, the effects of buffering and protecting the circuit board can be achieved.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board with smooth heat conduction according to the present invention;
fig. 2 is an enlarged view of a portion a of fig. 1.
In the figure: the circuit board comprises a circuit board body 1, a heat-conducting glue layer 2, a heat-conducting pipe 3, heat-radiating fins 4, a positioning ring 5, a limiting ring 6, an elastic rod 7, a clamping block 8, a sleeve 9, a buffering rubber ring 10, a screw rod 11, heat-conducting fins 12, a workpiece mounting hole 13 and a pull block 14.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purpose and the efficacy of the utility model easy to understand, the utility model is further described with reference to the specific drawings.
As shown in fig. 1-2, a circuit board with smooth heat conduction, including a circuit board body 1, a heat conductive adhesive layer 2 is wrapped on the outside of the circuit board body 1, and the outside of the heat conductive adhesive layer 2 is sleeved with a plurality of heat conductive pipes 3, and the plurality of heat conductive pipes 3 are all fixedly connected with the heat conductive adhesive layer 2, a heat dissipation fin 4 is arranged below the heat conductive adhesive layer 2, and one side of the heat dissipation fin 4 contacts with one side of the plurality of heat conductive pipes 3, a plurality of positioning rings 5 are symmetrically fixed on the outer walls of four sides of the heat conductive adhesive layer 2, a plurality of limiting rings 6 matched with the positioning rings 5 are fixed on the four side walls of the heat dissipation fin 4, an elastic rod 7 is fixed on the side wall of each limiting ring 6, a fixture block 8 is fixed on the other end of the elastic rod 7, and a bayonet matched with the fixture block 8 is set on the side wall of each positioning ring 5.
The below of every spacing ring 6 all is equipped with sleeve pipe 9, and the bottom of sleeve pipe 9 is fixed with buffering rubber ring 10, and the top of every holding ring 5 all is equipped with screw rod 11, and the one end of screw rod 11 passes holding ring 5, spacing ring 6 and sleeve pipe 9 in proper order and outwards extends.
The top of each clamping block 8 is abutted against the screw head of the screw 11, and the position of the clamping block 8 can be limited.
The heat conducting fins 12 are arranged between the heat radiating fins 4 and the heat conducting adhesive layer 2, and the heat conducting fins 12 are abutted against the plurality of heat conducting pipes 3 and the heat radiating fins 4, so that the gaps between the heat radiating fins 4 and the heat conducting adhesive layer 2 are reduced, and the heat conducting efficiency is ensured.
A plurality of work piece mounting holes 13 have been seted up at the top of heat conduction glue film 2, and every work piece mounting hole 13 all is located and sets up between two heat pipes 3, can be convenient for install fixedly connecting the work piece.
Every fixture block 8 is all seted up the inclined plane towards the lateral wall of holding ring 5 one side, and every fixture block 8 is all fixed with pull block 14 back to the lateral wall of holding ring 5 one side, can make elastic rod 7 take place deformation when holding ring 5 offsets with the inclined plane of fixture block 8, is convenient for block card 8 block to the bayonet socket in.
The working principle is as follows: when in use, the heat conducting glue layer 2 is arranged to absorb heat generated by the circuit board body 1, the plurality of limiting rings 6 on the heat radiating fins 4 are butted with the ring openings of the positioning rings 5 through the heat radiating fins 4, so that the clamping blocks 8 on the elastic rods 7 correspond to the bayonet openings, the clamping blocks 8 can be clamped into the bayonet openings through the elasticity of the elastic rods 7, the stability of fixation between the heat radiating fins 4 and the heat conducting glue layer 2 is ensured, the heat absorbed by the heat conducting glue layer 2 can be quickly transferred into the heat radiating fins 4 through the arranged heat conducting pipes 3, the heat can be quickly discharged through the heat radiating fins 4, the heat conducting and heat discharging effect of the circuit board is improved, the screw 11 penetrates through the limiting rings 5 and the positioning rings 6, the sleeve 9 is sleeved with the screw 7, and the circuit board body 1 can be fixed through the screw 7, and through buffering rubber ring 10 on sleeve pipe 7, can cushion outside vibration, improve the protection effect to the circuit board body.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that various changes and modifications may be made without departing from the spirit and scope of the utility model as defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a smooth and easy circuit board of heat conduction, includes circuit board body (1), its characterized in that: the circuit board body (1) is wrapped with a heat-conducting adhesive layer (2), a plurality of heat-conducting pipes (3) are sleeved outside the heat-conducting adhesive layer (2), the heat conduction pipes (3) are all fixedly connected with the heat conduction adhesive layer (2), heat dissipation fins (4) are arranged below the heat conduction adhesive layer (2), and one side of the heat radiating fins (4) is contacted with one side of the heat conducting pipes (3), a plurality of positioning rings (5) are symmetrically fixed on the outer walls of the four sides of the heat-conducting adhesive layer (2), a plurality of limiting rings (6) matched with the positioning rings (5) are fixed on the four side walls of the radiating fins (4), an elastic rod (7) is fixed on the side wall of each limiting ring (6), and the other end of the elastic rod (7) is fixed with a clamping block (8), and the side wall of each positioning ring (5) is provided with a bayonet matched with the clamping block (8).
2. The circuit board of claim 1, wherein: every the below of spacing ring (6) all is equipped with sleeve pipe (9), just the bottom of sleeve pipe (9) is fixed with buffering rubber ring (10), every the top of holding ring (5) all is equipped with screw rod (11), just holding ring (5), spacing ring (6) and sleeve pipe (9) are passed in proper order and outwards extend to the one end of screw rod (11).
3. The circuit board of claim 1, wherein: the top of each clamping block (8) is propped against the screw head of the screw (11).
4. The circuit board of claim 1, wherein: and a heat conducting sheet (12) is arranged between the heat radiating fins (4) and the heat conducting adhesive layer (2), and the heat conducting sheet (12) is abutted against the plurality of heat conducting pipes (3) and the heat radiating fins (4).
5. The circuit board of claim 1, wherein: a plurality of workpiece mounting holes (13) are formed in the top of the heat conducting adhesive layer (2), and each workpiece mounting hole (13) is formed between two heat conducting pipes (3).
6. The circuit board of claim 1, wherein: every fixture block (8) are all seted up the inclined plane in the lateral wall of holding ring (5) one side in opposite directions, and every fixture block (8) are all fixed with pull block (14) apart from the lateral wall of holding ring (5) one side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122680441.9U CN216491200U (en) | 2021-11-03 | 2021-11-03 | Circuit board with smooth heat conduction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122680441.9U CN216491200U (en) | 2021-11-03 | 2021-11-03 | Circuit board with smooth heat conduction |
Publications (1)
Publication Number | Publication Date |
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CN216491200U true CN216491200U (en) | 2022-05-10 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202122680441.9U Active CN216491200U (en) | 2021-11-03 | 2021-11-03 | Circuit board with smooth heat conduction |
Country Status (1)
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CN (1) | CN216491200U (en) |
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2021
- 2021-11-03 CN CN202122680441.9U patent/CN216491200U/en active Active
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