CN216488046U - Packaging chip frame structure - Google Patents

Abstract

The utility model discloses a packaged chip frame structure, which comprises a chip and a packaged frame positioned outside the chip, wherein the packaged frame comprises an upper packaged frame and a lower packaged frame, the lower packaged frame comprises four first angle plates and four first inner plates, the first angle plates and the first inner plates form a rectangular structure, a plurality of first signal connecting grooves are arranged on the upper side surfaces of the first angle plates and the first inner plates, the upper packaged frame comprises four second angle plates and four second inner plates, the second angle plates and the second inner plates also form a rectangular structure, a plurality of second signal connecting grooves are arranged on the lower side surfaces of the second angle plates and the second inner plates, pins of the chip are inserted into a space formed by the first signal connecting grooves and the second signal connecting grooves, the utility model solves the problem that the existing chip package needs to be stably installed on a mainboard in a welding mode, the problem that the chip is inconvenient to rapidly disassemble and assemble to replace is solved.

Description

Packaging chip frame structure

Technical Field

The utility model relates to a chip package technical field specifically is a package chip frame construction.

Background

The shell that the installation semiconductor integrated circuit chip used plays and lays, fixes, seals, protects the chip and strengthens the effect of electric heat performance, and still link up the bridge of chip inside world and external circuit-on the contact of chip is connected to the pin of encapsulation shell with the wire, these pins establish through the wire on the printing board again and be connected with other devices, consequently, the encapsulation all plays important effect to CPU and other LSI integrated circuits, current chip package need through the welded mode stable mounting on the mainboard, the inconvenient quick assembly disassembly chip of this kind of mode is changed it, in order to solve this problem, the utility model discloses the inventor has designed this scheme.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a package chip frame construction aims at improving the current chip package and need stably install on the mainboard through the welded mode, and the inconvenient quick assembly disassembly chip of this kind of mode carries out the problem changed to it.

The utility model discloses a realize like this:

a packaged chip frame structure comprises a chip and a packaged frame positioned outside the chip, wherein the packaged frame comprises an upper packaged frame and a lower packaged frame, the lower packaged frame comprises four first angle plates and four first inner plates, the first angle plates and the first inner plates form a rectangular structure, a plurality of first signal connecting grooves are respectively arranged on the upper side surfaces of the first angle plates and the first inner plates, the upper packaged frame comprises four second angle plates and four second inner plates, the second angle plates and the second inner plates also form a rectangular structure, a plurality of second signal connecting grooves are arranged on the lower side surfaces of the second angle plates and the second inner plates, pins of the chip are inserted into a space formed by the first signal connecting grooves and the second signal connecting grooves, the novel chip convenient to package is conveniently provided by the arrangement of the utility model, the chip is stably installed on a mainboard through the work of the upper packaged frame and the lower packaged frame, and a stable channel is provided for the transmission of signals, meanwhile, the mode that the conventional chip is welded on the mainboard is changed, so that according to the chip capable of being quickly disassembled and assembled, the lower packaging frame is convenient to install on the mainboard and is communicated with the circuit of the mainboard, the transmission of signals between the chip and the mainboard is realized, the first angle plate and the first inner plate are convenient to cooperate to form the completed lower packaging frame, so that when one first angle plate or one first inner plate is damaged, the lower packaging frame is quickly replaced, the waste of resources caused by the replacement of the whole packaging frame is avoided, the second angle plate and the second inner plate are convenient to cooperate to form the completed upper packaging frame, so that when one second angle plate or one second inner plate is damaged, the quick replacement is avoided, the waste of resources caused by the replacement of the whole packaging frame is avoided, and the first signal connecting groove and the second signal connecting groove are convenient to cooperate with pins of the chip to provide a stable path for the transmission of the signals.

Furthermore, the outer end angle of the first angle plate is fixedly connected with a screw rod, the end face, close to the first inner plate, of the first angle plate is provided with a first signal slot, the arrangement of the screw rod is convenient for being matched with a connecting device to stably connect the upper packaging frame and the lower packaging frame, and the upper packaging frame and the lower packaging frame can be conveniently assembled and disassembled quickly.

Furthermore, the two end faces of the first inner plate are vertically and fixedly connected with a first signal inserting plate, the first signal inserting plate is inserted into the first signal slot, the first inner plate and the first corner plate are conveniently installed in an inserting mode through the first signal inserting plate inserted into the first signal slot, and signal transmission is met while the first inner plate and the first corner plate are conveniently and quickly disassembled and assembled according to requirements.

Furthermore, the outer end angle of the second angle plate is fixedly connected with a column body, a counter bore is vertically formed in the lower end face of the column body, a second signal slot is vertically formed in the end face, close to the second inner plate, of the second angle plate, and a space is conveniently provided for installation of a connecting device due to the arrangement of the counter bore.

Furthermore, the two end faces of the second inner plate are vertically and fixedly connected with a second signal inserting plate, the second signal inserting plate is inserted into the second signal slot, the second inner plate and the second angle plate are conveniently installed in an inserting mode, signal transmission is met, and meanwhile the signal transmission device is convenient to assemble and disassemble rapidly as required.

Further, go up the encapsulation sheet frame still including the connecting device who is located the counter bore position, connecting device includes the internal thread pipe, install the polygon post in internal thread pipe upper end and install the fender crown plate at internal thread pipe lower extreme, it is intraductal that the upper end of screw rod inserts the internal thread, connecting device's setting is convenient for rotate under the effect of external force, and with the screw rod cooperation with go up encapsulation frame and encapsulate frame stable connection down, the setting of fender crown plate is convenient for make connecting device stable mounting in the outside of second scute with the structure cooperation of counter bore, simultaneously can rotate under the effect of external force, the polygon post is located the outside of counter bore so that the user of service exerts the effort to it and drives the internal thread pipe rotation.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a setting is convenient for provide neotype chip of being convenient for encapsulation, through last encapsulation frame with the work of encapsulation frame down with the chip stable mounting on the mainboard, and provide stable passageway for the transmission of signal, the mode of chip bonding on the mainboard in the past is changed simultaneously, so that according to the quick assembly disassembly chip, first scute and first inner panel, the setting of second scute and second inner panel is so that when a certain first scute or first inner panel, quick replacement when a certain second scute or second inner panel damaged, avoid causing the waste of resource because of the replacement of whole encapsulation frame.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings which are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained according to these drawings without inventive efforts.

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of the lower package frame of the present invention;

fig. 3 is a schematic diagram of a first corner plate structure of the present invention;

fig. 4 is a schematic structural view of a first inner plate of the present invention;

fig. 5 is a schematic structural view of the upper package frame of the present invention;

FIG. 6 is a schematic view of a second corner plate according to the present invention;

fig. 7 is a schematic structural view of a second inner plate of the present invention;

fig. 8 is a schematic structural diagram of the connector of the present invention;

in the figure: 1. a chip; 2. a lower package frame; 21. a first inner panel; 22. a first gusset; 221. a first signal slot; 222. a screw; 23. a first signal connection slot; 3. an upper packaging frame; 31. a second gusset; 311. a counter bore; 312. a second signal slot; 32. a second inner panel; 321. a second signal board; 33. a connecting device; 331. an internally threaded tube; 332. a retaining ring plate; 333. a polygonal column; 34. a second signal connection slot.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.

Example (b): referring to fig. 1-8: a packaged chip frame structure comprises a chip 1 and a packaged frame positioned on the outer side of the chip 1, wherein the packaged frame comprises an upper packaged frame 3 and a lower packaged frame 2, the lower packaged frame 2 comprises four first corner plates 22 and four first inner plates 21, the first corner plates 22 and the first inner plates 21 form a rectangular structure, a plurality of first signal connecting grooves 23 are respectively formed in the upper side surfaces of the first corner plates 22 and the first inner plates 21, a screw rod 222 is fixedly connected to the outer end corners of the first corner plates 22, a first signal slot 221 is formed in the end surface, close to the first inner plates 21, of the first corner plates 22, a first signal plug plate 211 is vertically and fixedly connected to the two end surfaces of the first inner plates 21, the first signal plug plate 211 is inserted into the first signal slot 221, the upper packaged plate frame 3 comprises four second corner plates 31 and four second inner plates 32, the second corner plates 31 and the second inner plates 32 also form a rectangular structure, a plurality of second signal connecting grooves 34 are formed in the lower side surfaces of the second corner plates 31 and the second inner plates 32, the plug of the chip 1 is inserted into the space formed by the first signal connection groove 23 and the second signal connection groove 34, the outer end corner of the second angle plate 31 is fixedly connected with a column, the lower end face of the column is vertically provided with a counter bore 311, the end face of the second angle plate 31 close to the second inner plate 32 is vertically provided with a second signal slot 312, the two end faces of the second inner plate 32 are vertically and fixedly connected with a second signal inserting plate 321, the second signal inserting plate 321 is inserted into the second signal slot 312, the upper packaging plate frame 3 further comprises a connecting device 33 located at the position of the counter bore 311, the connecting device 33 comprises an internal threaded pipe 331, a polygonal column 333 arranged at the upper end of the internal threaded pipe 331 and a retaining ring plate 332 arranged at the lower end of the internal threaded pipe 331 are arranged, and the upper end of a screw 222 is inserted into the internal threaded pipe 331.

The utility model provides a setting is convenient for provide novel chip 1 convenient to encapsulate, through the work of upper packaging frame 3 and lower packaging frame 2 chip 1 is stably installed on the mainboard, and provide stable passageway for the transmission of signal, change the mode that chip 1 welds on the mainboard in the past simultaneously, so that according to quick assembly disassembly chip 1, the setting of lower packaging frame 2 is convenient for install on the mainboard and communicate with the circuit of mainboard, and then realize the transmission of signal between chip 1 and mainboard, the setting of first scute 22 and first inner panel 21 is convenient for cooperate the work to constitute the lower packaging frame 2 that accomplishes, so that when a certain first scute 22 or first inner panel 21 damages quick replacement, avoid the waste of resources caused by the replacement of whole packaging frame, the setting of second scute 31 and second inner panel 32 is convenient for cooperate the work to constitute upper packaging frame 3 that accomplishes, so that when a certain second scute 31 or second inner panel 32 damages, the first signal connecting groove 23 and the second signal connecting groove 34 are arranged to be convenient to match with the pins of the chip 1 to provide a stable path for signal transmission, so that resource waste caused by replacement of the whole packaging frame is avoided.

The screw 222 is arranged to be convenient for being matched with the connecting device 33 to stably connect the upper packaging frame 3 and the lower packaging frame 2, and is convenient for providing convenience for quickly disassembling and assembling the upper packaging frame 3 and the lower packaging frame 2.

The arrangement that the first signal plug board 211 is inserted into the first signal slot 221 facilitates the insertion and installation of the first inner board 21 and the first corner board 22, and the signal transmission is satisfied while the quick assembly and disassembly are performed as required.

The provision of counterbore 311 facilitates space for the installation of connector piece 33.

The second signal plug board 321 is inserted into the second signal slot 312, so that the second inner board 32 and the second angle board 31 can be conveniently inserted and installed, and the signal transmission is met, and meanwhile, the quick assembly and disassembly can be conveniently carried out according to the requirements.

The connecting device 33 is arranged to rotate under the action of external force, the upper packaging frame 3 and the lower packaging frame 2 are stably connected by matching with the screw rod 222, the retaining ring plate 332 is arranged to match with the structure of the counter bore 311, so that the connecting device 33 is stably installed on the outer side of the second angle plate 31 and can rotate under the action of external force, and the polygonal column 333 is located on the outer side of the counter bore 311 so that a user can apply acting force to the polygonal column to drive the internal threaded pipe 331 to rotate.

During the use, at first install lower encapsulation frame 2 on the mainboard and with the circuit intercommunication in the mainboard, place chip 1 again on lower encapsulation frame 2, place last encapsulation frame 3 at the mainboard simultaneously, and make lower encapsulation frame 2 and last encapsulation frame 3 stable connection through connecting device 33 and screw rod 222.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. A packaged chip frame structure comprising a chip (1), characterized in that: also comprises a packaging frame positioned at the outer side of the chip (1), the packaging frame comprises an upper packaging frame (3) and a lower packaging frame (2), the lower package frame (2) includes four first corner plates (22) and four first inner plates (21), the first angle plate (22) and the first inner plate (21) form a rectangular structure, a plurality of first signal connecting grooves (23) are respectively arranged on the upper sides of the first angle plate (22) and the first inner plate (21), the upper packaging frame (3) comprises four second corner plates (31) and four second inner plates (32), and the second gusset (31) and the second inner panel (32) also constitute a rectangular structure, a plurality of second signal connecting grooves (34) are arranged on the lower side surfaces of the second corner plate (31) and the second inner plate (32), the pins of the chip (1) are inserted into the space formed by the first signal connecting groove (23) and the second signal connecting groove (34).

2. The frame structure of a packaged chip as claimed in claim 1, wherein the first corner plate (22) has a screw (222) fixedly connected to an outer corner thereof, and a first signal slot (221) is formed in an end surface of the first corner plate (22) close to the first inner plate (21).

3. The frame structure of a packaged chip according to claim 2, wherein two end faces of the first inner board (21) are vertically and fixedly connected with first signal insertion boards (211), and the first signal insertion boards (211) are inserted into the first signal insertion slots (221).

4. The frame structure of claim 3, wherein a column is fixedly connected to an outer corner of the second corner plate (31), a counterbore (311) is vertically formed in a lower end surface of the column, and a second signal slot (312) is vertically formed in an end surface of the second corner plate (31) close to the second inner plate (32).

5. The frame structure of claim 4, wherein two end faces of the second inner board (32) are vertically and fixedly connected with a second signal board (321), and the second signal board (321) is inserted into the second signal slot (312).

6. The frame structure of a packaged chip according to claim 5, wherein the upper package frame (3) further comprises a connection device (33) located at the position of the counterbore (311), the connection device (33) comprises an internally threaded tube (331), a polygonal column (333) mounted at the upper end of the internally threaded tube (331), and a retainer ring plate (332) mounted at the lower end of the internally threaded tube (331), and the upper end of the screw rod (222) is inserted into the internally threaded tube (331).

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