CN216465479U

CN216465479U - Lining plate and slicing device

Info

Publication number: CN216465479U
Application number: CN202122509301.5U
Authority: CN
Inventors: 毛剑波; 迪大明; 刘晓东; 成路
Original assignee: Longi Green Energy Technology Co Ltd
Current assignee: Longi Green Energy Technology Co Ltd
Priority date: 2021-10-18
Filing date: 2021-10-18
Publication date: 2022-05-10
Anticipated expiration: 2031-10-18

Abstract

The application discloses welt and section device relates to solar photovoltaic technical field. The lining plate specifically comprises: first and second opposing surfaces; the first surface is close to the silicon rod, and the second surface is close to the crystal support; wherein, be equipped with the liquid guide groove that a plurality of intervals set up on the first surface, the extending direction in liquid guide groove is the angle setting of predetermineeing with the length direction of welt. In the embodiment of the application, when the cutting line is cut to the central position area of the silicon rod, the cutting liquid in the liquid guide groove can play an effective lubricating and cooling role, so that the abnormalities such as edge breakage and broken line are reduced, and the cutting quality of the silicon rod is effectively improved.

Description

Lining plate and slicing device

Technical Field

The application belongs to the technical field of solar photovoltaic, concretely relates to welt and section device.

Background

With the development of photovoltaic technology, solar energy is widely popularized as a green, environment-friendly and renewable energy source. The silicon wafer is used as the most important raw material in the solar power generation system, and the cost reduction of the silicon wafer plays an important role in the cost reduction of the solar power generation system.

In the prior art, when a silicon rod is sliced, the silicon rod is usually adhered to a lining plate, then is connected with a crystal support so as to fix the silicon rod, and finally is cut by a cutting line. In the silicon rod cutting process, cutting fluid is generally used for lubricating and cooling so as to improve the silicon rod cutting quality and avoid edge breakage, wire breakage and the like. However, since the cutting lines have line bows, the cutting lines on both sides cut into the lining plate during the cutting stage, so that a large amount of cutting liquid attached to the cutting lines is consumed on the lining plate and cannot enter the center of the silicon rod, and particularly, the problem is more serious along with the increase of the size of the silicon wafer, which easily causes the abnormalities such as edge breakage and line breakage, and the cutting quality of the silicon wafer is affected.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide a lining plate and a slicing device, and the problems that the edge of a silicon wafer is broken and the cutting line is broken due to the fact that cutting fluid is insufficient during slicing can be solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a lining plate, which is connected between a crystal support and a silicon rod, and includes: first and second opposing surfaces;

the first surface is close to the silicon rod, and the second surface is close to the crystal support;

the first surface is provided with a plurality of liquid guide grooves arranged at intervals, and the extending direction of the liquid guide grooves and the length direction of the lining plate are arranged at a preset angle.

Optionally, in two adjacent liquid guide grooves, a projection of an end point of one of the liquid guide grooves along the first direction falls on the other liquid guide groove;

wherein the first direction is a direction perpendicular to the length of the liner plate.

Optionally, in two adjacent liquid guide grooves, a projection of an end point of one of the liquid guide grooves along the first direction is located at the center of the other liquid guide groove, or a projection of an end point of one of the liquid guide grooves along the first direction coincides with an end point of the other liquid guide groove.

Optionally, the plurality of liquid guide grooves are uniformly distributed on the first surface.

Optionally, the liquid guide groove penetrates from one end of the lining plate to the other end of the lining plate.

Optionally, the liquid guide groove extends from one end of the lining plate to a central axis of the lining plate in the length direction.

Optionally, the size of the liquid guide groove is 6mm to 15mm along the extending direction perpendicular to the liquid guide groove.

Optionally, the size of the liquid guide groove is 2mm to 8mm along the direction from the first surface to the second surface.

Optionally, the distance between two adjacent liquid guide grooves gradually decreases from the edge of the lining plate to the center of the lining plate.

In a second aspect, an embodiment of the present application further provides a slicing apparatus, where the slicing apparatus includes: the lining plate is provided.

In the embodiment of the application, the liquid guide grooves are formed in the first surface of the lining plate at intervals, and the extending direction of the liquid guide grooves and the length direction of the lining plate are arranged at a preset angle, so that in the silicon rod slicing process, particularly in the cutter discharging stage, cutting liquid can enter the central position area of the silicon rod through the liquid guide grooves, and thus when the cutting line is cut to the central position area of the silicon rod, the cutting liquid in the liquid guide grooves can play an effective role in lubrication and cooling, further the abnormalities such as edge breakage and line breakage are reduced, and the cutting quality of the silicon rod is effectively improved.

Drawings

FIG. 1 is a schematic structural view of a liner plate according to an embodiment of the present application;

FIG. 2 is a schematic view of the installation of the liner plate according to the embodiment of the present application;

fig. 3 is a schematic cut view of the liner in an embodiment of the present application.

Description of reference numerals:

10: a liner plate; 20: a silicon rod; 30: crystal support; 40: cutting a line; 50: a liquid spraying port; 11: a first surface; 111: a liquid guide groove.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the utility model.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The lining board and the slicing device provided by the embodiments of the present application are described in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.

Referring to fig. 1, a schematic structural diagram of a liner plate according to an embodiment of the present application is shown.

In the embodiment of the present application, the lining plate 10 is connected between the crystal support 30 and the silicon rod 20 to fix the silicon rod 20. The liner 10 may specifically include: first 11 and second 11 opposed surfaces; the first surface 11 is adjacent to the silicon rod 20, and the second surface is adjacent to the crystal support 30; the first surface 11 is provided with a plurality of liquid guiding grooves 111 arranged at intervals, and the extending direction of the liquid guiding grooves 111 and the length direction of the lining plate 10 are arranged at a preset angle.

In the embodiment of the present application, since the liquid guide grooves 111 are disposed on the first surface 11 at a plurality of intervals, the extending direction of the liquid guide grooves 111 and the length direction of the lining board 10 are at a preset angle, so that in the slicing process of the silicon rod 20, especially in the cutting stage, the cutting liquid can enter the central position area of the silicon rod 20 through the liquid guide grooves 111, and thus, when the cutting line 40 is cut to the central position area of the silicon rod 20, the cutting liquid in the liquid guide grooves 111 can play an effective role in lubrication and cooling, thereby effectively improving the cutting quality of the silicon rod 20, and reducing the abnormalities such as edge breakage and line breakage.

In the embodiment, the direction perpendicular to the length direction of the lining board 10 is the width direction of the lining board 10. The extending direction of the liquid guiding groove 111 forms a predetermined angle with the length direction of the lining board 10, and it can also be understood that the extending direction of the liquid guiding groove 111 forms a predetermined angle with the axial lead of the length direction of the lining board 10. In practical application, the preset included angle can be any angle within the range of 0-180 degrees. For example, the preset angle may be 15 °, 30 °, 45 °, 50 °, 65 °, 80 °, … … 175 °, etc. In the case where the extending direction of the liquid guide groove 111 and the longitudinal direction of the lining board 10 form an acute angle, the extending direction of the liquid guide groove 111 and the longitudinal direction of the lining board 10 may be regarded as an obtuse angle complementary to the acute angle from the other direction, and therefore, in the embodiment of the present application, the extending direction of the liquid guide groove 111 and the longitudinal direction of the lining board 10 form an acute angle.

It can be understood that, in the case that the preset angle is an acute angle, compared with the case that the preset angle is 90 °, the length of the liquid guide groove 111 may be longer, and the cutting liquid stored in the liquid guide groove 111 is also more, so that the cutting liquid is more favorably introduced into the center of the silicon rod 20, and the cutting quality of the silicon rod 20 is improved.

In the embodiment of the application, in two adjacent liquid guide grooves 111, the projection of the end point of one liquid guide groove 111 along the first direction falls on the other liquid guide groove 111; wherein the first direction is a direction perpendicular to the length of the liner 10. It should be noted that, in two adjacent liquid guide grooves 111, the projection of the end point of one liquid guide groove 111 along the first direction may fall at any position of the other liquid guide groove 111. In the embodiment of the present application, because the projection of the end point of one of the liquid guiding grooves 111 along the first direction falls on the other liquid guiding groove 111 in the two adjacent liquid guiding grooves 111, the distance between the two adjacent liquid guiding grooves 111 can be controlled within a reasonable range, that is, the density of the liquid guiding grooves 111 does not affect the bonding strength of the silicon rod 20 too much, and does not affect the liquid carrying and lubricating effects too little.

In the embodiment of the present application, in two adjacent liquid guide grooves 111, the projection of the end point of one liquid guide groove 111 along the first direction is located at the center of the other liquid guide groove 111, or the projection of the end point of one liquid guide groove 111 along the first direction is overlapped with the end point of the other liquid guide groove 111, so that the cutting line 40 can be cut to the at least one liquid guide groove 111 regardless of the position of the cutting line on the first surface 11, and the cutting liquid in the at least one liquid guide groove 111 is brought to the center of the silicon rod 20, thereby improving the cutting quality of the silicon rod 20. In the above case, the extending direction of the liquid guiding groove 111 and the length direction of the lining plate 10 may form a predetermined included angle within a range of 0 to 180 °. For example, when the preset included angle is 45 °, a projection of an end point of one liquid guide groove 111 in the first direction of two adjacent liquid guide grooves 111 coincides with an end point of the other liquid guide groove 111.

In the embodiment of the present application, the material of the liner plate 10 includes, but is not limited to, plastic, resin, glass, etc. In practical applications, the liner plate 10 may be manufactured by injection molding or machining, and those skilled in the art can select the liner plate according to practical situations, which is not limited in the embodiments of the present application.

In the embodiment of the present application, the plurality of liquid guiding grooves 111 may be uniformly distributed on the first surface 11, so that the distribution of the cutting liquid on the first surface 11 is more uniform, which is more favorable for the cutting liquid to uniformly enter the center of the silicon rod 20 along with the cutting line 40, and the cutting quality of the silicon wafer is more stable. Of course, the plurality of liquid guide grooves 111 may be arranged in a non-uniform manner in the distance from the liquid ejecting port 50 (the liquid ejecting port 50 is an outlet for ejecting the cutting liquid). For example, the distance between two adjacent liquid guiding grooves 111 decreases gradually from the edge of the lining plate 10 to the center of the lining plate 10, that is, the density of the liquid guiding grooves 111 increases, so that the central position of the lining plate 10 corresponds to the central position of the silicon rod 20, the number of the liquid guiding grooves 111 is large, the cutting liquid carried in the liquid guiding grooves 111 is also large, the cutting liquid can enter the center of the silicon rod 20 along with the cutting line 40 with a higher probability, and the cutting quality at the central position of the silicon rod 20 is improved.

In the embodiment of the present invention, the liquid guiding grooves 111 all start from the side edges of the width direction of the end plates, that is, at least one end of the liquid guiding groove 111 is exposed, or at least one end of the liquid guiding groove 111 penetrates through the side edges of the lining plate 10 to be exposed.

Referring to fig. 2, a schematic view of the installation of the liner plate according to the embodiment of the present application is shown. In the embodiment of the present invention, when the backing plate 10 is not connected between the susceptor 30 and the silicon rod 20, as shown in fig. 1, the liquid guide grooves 111 on the first surface 11 can be regarded as an array of open grooves extending through the width direction of the backing plate 10. When the backing plate 10 is connected between the tray 30 and the silicon rod 20, as shown in fig. 2, the silicon rod 20 is bonded to the first surface 11, the liquid guide groove 111 may be regarded as a liquid guide hole penetrating the backing plate 10 in the width direction, and the cutting liquid enters the liquid guide groove 111 from the liquid guide holes at both ends and enters the central region of the silicon rod 20, thereby cooling and lubricating the cutting in the central region.

In the embodiment of the present application, the liquid guiding groove 111 may penetrate from one end of the lining board 10 to the other end of the lining board 10, so that when the silicon rod 20 is bonded on the lining board 10, the cutting liquid may enter from both ends of the liquid guiding groove 111, and the cutting liquid in the liquid guiding groove 111 may enter more easily. Of course, the liquid guiding groove 111 may also extend from one end of the lining plate 10 to the central axis of the length direction of the lining plate 10 or near the central axis, so that when the cutting line 40 is cut to the central position of the silicon rod 20, the cutting liquid in the liquid guiding groove 111 may play a role in cooling and lubricating, and further, the cutting quality and efficiency of the cutting line 40 may be improved.

In the embodiment of the present application, the dimension of the liquid guide groove 111 is 6mm to 15mm in the direction perpendicular to the extending direction of the liquid guide groove 111. The width of the liquid guide groove 111 in the direction perpendicular to the extending direction of the liquid guide groove 111 can be understood as the width of the liquid guide groove 111, and in the embodiment of the present application, the width dimension of the liquid guide groove 111 can be any value in the range of 6mm to 15 mm. For example, the width of the liquid guide groove 111 may be 6mm, 8mm, 10mm, 11mm, 15mm, or the like.

In the embodiment of the present application, the size of the liquid guiding groove 111 along the direction from the first surface 11 to the second surface is 2mm to 8 mm. In the embodiment of the present application, the dimension of the liquid guide groove 111 in the direction from the first surface 11 to the second surface may be understood as the depth dimension of the liquid guide groove 111. In practical applications, the depth of the liquid guiding groove 111 can be any value in the range of 2mm to 8 mm. For example, the depth of the liquid guide groove 111 may be 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 5mm, 8mm, or the like.

In the embodiment of the present application, the liquid guiding groove 111 may be any one of a square groove, a U-shaped groove, a V-shaped groove, an inverted trapezoidal groove, or a combination of the above grooves to form a groove with a variable cross-section. Alternatively, the cross-section of the liquid-guiding channel 111 may be rectangular, triangular, trapezoidal or semicircular.

In the embodiment of the present application, in order to enable the liquid guiding groove 111 to have the advantages of easy processing, more liquid storage, and no influence on the bonding strength of the silicon rod 20, optionally, the shape and size of the liquid guiding groove 111 may specifically be: the groove width is 8mm, the groove depth is 3mm, and the groove type is U-shaped.

Referring to fig. 3, a cutting schematic of the liner in an embodiment of the present application is shown. As shown in fig. 3, the liquid spraying ports 50 are disposed on two sides of the lining board 10, the cutting liquid sprayed from the liquid spraying ports 50 can be poured into the liquid guiding groove 111 from two ends of the liquid guiding groove 111, when the cutting line 40 is cut to the cutting stage, the cutting liquid in the liquid guiding groove 111 can enter the cutting area along with the cutting line 40, so that the liquid carrying distance of the cutting line 40 is greatly shortened, more cutting liquid is attached to the cutting line 40, and thus the cutting liquid can lubricate and cool the cutting area, and the cutting quality of the cutting surface can be greatly improved.

In summary, the lining board of the embodiment of the present application at least includes the following advantages:

in this application embodiment, because the liquid guide groove that is equipped with a plurality of intervals on the first surface and sets up, the extending direction in liquid guide groove is the angle setting of predetermineeing with the length direction of welt, consequently, at the silicon rod section in-process, especially, the sword stage, the central point that cutting fluid can enter into the silicon rod through the liquid guide groove puts the region, and like this, when the line of cut cuts the central point that puts to the silicon rod and puts the region, the cutting fluid in the liquid guide groove can play effectual lubrication and cooling effect, and then reduce and collapse the limit, unusual such as broken string, effectively promote the cutting quality of silicon rod.

The embodiment of the present application further provides a slicing apparatus, the slicing apparatus includes: the lining plate is provided.

In practical applications, the slicing apparatus may further include: and the crystal support is matched with the lining plate to fix the silicon rod. It should be noted that in the embodiment of the present application, the structure and the working principle of the liner plate are the same as those of the liner plates in the foregoing embodiments, and are not described herein again.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the utility model is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A liner plate, connected between a crystal support and a silicon rod, the liner plate comprising: first and second opposing surfaces;

2. The liner according to claim 1, wherein, in two adjacent liquid guide grooves, the projection of the end point of one liquid guide groove along the first direction falls on the other liquid guide groove;

3. The liner according to claim 2, wherein the projection of the end point of one of the liquid guide grooves along the first direction is located at the center of the other liquid guide groove, or the projection of the end point of one of the liquid guide grooves along the first direction is coincident with the end point of the other liquid guide groove.

4. The liner according to claim 1, wherein a plurality of the channels are evenly distributed over the first surface.

5. The liner plate according to claim 1, wherein the liquid guide groove penetrates from one end of the liner plate to the other end of the liner plate.

6. The liner plate according to claim 1, wherein the liquid guide groove extends from one end of the liner plate to a central axis of the liner plate in a length direction.

7. The liner plate according to claim 1, wherein the size of the liquid guide groove is 6-15 mm in the direction perpendicular to the extension direction of the liquid guide groove.

8. The liner according to claim 1, wherein the size of the liquid guiding groove is 2 mm-8 mm along the direction from the first surface to the second surface.

9. The liner according to claim 1, wherein the distance between two adjacent liquid guide grooves gradually decreases from the edge of the liner to the center of the liner.

10. A slicing apparatus, characterized in that the slicing apparatus comprises: the liner of any one of claims 1 to 9.