CN216451594U - Novel multilayer circuit board of high integration - Google Patents
Novel multilayer circuit board of high integration Download PDFInfo
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- CN216451594U CN216451594U CN202123145385.5U CN202123145385U CN216451594U CN 216451594 U CN216451594 U CN 216451594U CN 202123145385 U CN202123145385 U CN 202123145385U CN 216451594 U CN216451594 U CN 216451594U
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Abstract
The utility model discloses a novel high-integration-level multilayer circuit board which comprises a top plate, wherein a placing plate is movably arranged below the top plate, a bottom plate is movably arranged below the placing plate, an air inlet frame is fixedly arranged above the top plate, an air inlet mechanism is fixedly arranged on the upper surface of the air inlet frame, an air distribution frame is fixedly arranged on the surface of one side of the top plate, vent frames are fixedly arranged on the surfaces of the bottom plate and one side of the placing plate, insulating heat-conducting plates are movably arranged on the lower surfaces of the top plate, the bottom plate and the placing plate, the lower surface of the vent frame on one side of the bottom plate is of a closed structure, and spherical grooves are formed in the upper surfaces of the bottom plate and the placing plate close to four corners. The novel high-integration-level multilayer circuit board can directly disassemble a damaged single-layer circuit board so as to avoid disassembling the circuit board layer by layer, accelerate maintenance speed, and quickly lead out heat dissipated by the circuit board so as to avoid heat accumulation between the circuit board and the circuit board.
Description
Technical Field
The utility model relates to the field of multilayer circuit boards, in particular to a novel multilayer circuit board with high integration level.
Background
The multilayer board is produced by making inner layer pattern, making single-sided or double-sided base board by printing and etching method, putting it in the appointed layer, heating, pressurizing and bonding, then drilling hole, the same as the plating through hole method of double-sided board, the existing multilayer board is made by bonding single-layer boards, the single-layer board is made by pressing lead layer and insulating layer, the lead layer is used for lead of printed circuit board, the single-layer boards are isolated electrically by insulating layer, preventing each single-layer board from electrifying;
the notice number is: CN209545985U, the published "a multilayer circuit board, includes the circuit board, contain lead layer and insulating layer in the circuit board, the insulating layer is connected to the lower extreme of lead layer, be equipped with the patchhole in the distolateral of circuit board, the patchhole interpolation is equipped with the spliced pole, and the lower extreme of the circuit board of downside is equipped with the circular slot, insert the plectane in the circular slot, the upper end central point of plectane puts the lower extreme of connecting the spliced pole. The screw is screwed out from the screw hole by using a screwdriver, the circuit boards can be detached from the connecting column one by one, until the circuit boards to be replaced are taken off, the inserting holes in the circuit boards to be replaced are inserted into the connecting column, the inserting holes of the circuit boards correspond to the connecting column in sequence, then the screws are screwed into the screw holes, and the screw heads of the screws press the upper end of the circuit board on the top side.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a novel multilayer circuit board with high integration level, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a novel multilayer circuit board of high integration, includes the roof, roof below movable mounting has places the board, it has the bottom plate to place board below movable mounting, roof top fixed mounting has the frame of admitting air, admit air frame upper surface fixed mounting has the mechanism of admitting air, roof one side fixed surface installs and divides the gas frame, the bottom plate with place the equal fixed mounting in board side surface and have the frame of ventilating, roof, bottom plate with place the equal movable mounting of board lower surface and have insulating heat-conducting plate.
Preferably, the lower surface of the ventilation frame on one side of the bottom plate is of a closed structure, spherical grooves are formed in the upper surfaces of the bottom plate and the placing plate close to four corners, and limiting holes are formed in the lower surfaces of the top plate and the placing plate.
Preferably, the upper surface of the insulating heat conducting plate is fixedly provided with a limiting block at a position close to the outer side surface, and the limiting block is movably connected with the top plate and the placing plate through the limiting hole respectively.
Preferably, the upper surface of the air inlet frame is provided with an air inlet hole, the air inlet frame is fixedly connected with the air distribution frame, the air inlet frame is communicated with the air distribution frame, and the air inlet frame is movably connected with the ventilation frame.
Preferably, the lower surface of the insulating heat conducting plate is close to four corners and is fixedly provided with a support column, the surface of the lower end of the support column is fixedly provided with an elastic spherical block, and the elastic spherical block passes through the spherical groove and is respectively movably connected with the placing plate and the bottom plate.
Preferably, the front surface and the rear surface of the bottom plate are fixedly provided with threaded sleeves, the lower surface of the insulating heat-conducting plate is fixedly provided with a radiating fin, and the surface of one side of the air distribution frame and the surface of one side of the air ventilation frame are provided with hole grooves.
Compared with the prior art, the utility model has the following beneficial effects:
in the utility model, the limit block is inserted into the limit hole, the circuit board is placed on the inner sides of the placing plate and the top plate, the lower surface of the circuit board is attached to the insulating heat-conducting plate, then the elastic spherical block is provided with a force for generating elastic deformation, the elastic spherical block is clamped into the spherical groove, the top plate, the placing plate and the bottom plate are sequentially installed, the number of the placing plate and the insulating heat-conducting plate is adjusted according to the number of the circuit board, the air distribution frame is communicated with the ventilation frame, when the circuit board works, the insulating heat-conducting plate transmits the heat of the circuit board to the radiating fin, the air inlet mechanism operates to introduce the outside air into the air inlet frame, then the outside air is blown to the surface of the radiating fin through the air distribution frame and the ventilation frame to guide out the heat of the radiating fin, thereby the heat radiated by the circuit board can be quickly guided out to prevent the heat between the circuit board and the circuit board from being accumulated together, and the top plate and the placing plate are pulled upwards during maintenance, give elastic spherical piece one take place elastic deformation's power, with the spherical piece of elasticity inside the spherical groove of removal, the board dismantlement of placing at the circuit board place that will damage to can directly dismantle the individual layer circuit board that damages, in order to dismantle the multilayer circuit board successive layer, accelerate the maintenance speed.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a novel multilayer circuit board with high integration level according to the present invention;
FIG. 2 is a disassembled view of the overall structure of the novel multilayer circuit board with high integration level of the utility model;
FIG. 3 is a cross-sectional view of an air inlet frame and an air distribution frame of the novel high-integration multilayer circuit board of the utility model;
fig. 4 is a sectional view of the joint of the spherical block, the bottom plate and the placing plate of the novel high-integration multilayer circuit board.
In the figure: 1. a top plate; 101. a limiting hole; 102. a spherical groove; 2. an air intake frame; 201. a gas distribution frame; 202. an air intake mechanism; 203. an air inlet; 204. a ventilation frame; 3. a base plate; 301. placing the plate; 302. a threaded sleeve; 4. an insulating heat-conducting plate; 401. a heat sink; 402. a pillar; 403. a resilient spherical block; 404. and a limiting block.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
The first embodiment is as follows:
as shown in fig. 1-4, a novel multilayer circuit board with high integration level comprises a top plate 1, a placing plate 301 is movably mounted below the top plate 1, a bottom plate 3 is movably mounted below the placing plate 301, an air inlet frame 2 is fixedly mounted above the top plate 1, an air inlet mechanism 202 is fixedly mounted on the upper surface of the air inlet frame 2, an air distribution frame 201 is fixedly mounted on the surface of one side of the top plate 1, an air vent frame 204 is fixedly mounted on the surface of one side of the bottom plate 3 and the placing plate 301, and an insulating heat conducting plate 4 is movably mounted on the lower surfaces of the top plate 1, the bottom plate 3 and the placing plate 301;
the lower surface of the ventilation frame 204 at one side of the bottom plate 3 is of a closed structure, the upper surfaces of the bottom plate 3 and the placing plate 301 close to four corners are provided with spherical grooves 102, and the lower surfaces of the top plate 1 and the placing plate 301 are provided with limiting holes 101; the upper surface of the insulating heat conducting plate 4 close to the outer side surface is fixedly provided with a limiting block 404, and the limiting block 404 is movably connected with the top plate 1 and the placing plate 301 through a limiting hole 101 respectively; the upper surface of the air inlet frame 2 is provided with an air inlet 203, the air inlet frame 2 is fixedly connected with the air distribution frame 201, the air inlet frame 2 is communicated with the air distribution frame 201, and the air inlet frame 2 is movably connected with the ventilation frame 204; pillars 402 are fixedly arranged on the lower surface of the insulating heat-conducting plate 4 close to four corners, elastic spherical blocks 403 are fixedly arranged on the lower end surfaces of the pillars 402, and the elastic spherical blocks 403 are movably connected with the placing plate 301 and the bottom plate 3 through spherical grooves 102 respectively; the front surface and the rear surface of the bottom plate 3 are fixedly provided with threaded sleeves 302, the lower surface of the insulating heat conducting plate 4 is fixedly provided with a heat radiating fin 401, the surface of one side of the air distributing frame 201 and the surface of one side of the air ventilating frame 204 are both provided with a hole groove, the insulating heat conducting plate 4 transmits the heat of the circuit board to the heat radiating fin 401, the air inlet mechanism 202 operates to guide the outside air into the air inlet frame 2, then the outside air is blown to the surface of the heat radiating fin 401 through the air distributing frame 201 and the air ventilating frame 204 to guide the heat of the heat radiating fin 401 out, so that the heat between the circuit board and the circuit board can be quickly guided out, the heat between the circuit board and the circuit board is prevented from being accumulated together, when in maintenance, the top plate 1 and the placing plate 301 are pulled upwards, the elastic spherical block 403 is given a force which generates elastic deformation, the elastic block 403 is moved out of the spherical groove 102, the placing plate 301 where the damaged circuit board is located is detached, so that the damaged single-layer circuit board can be directly detached, so as to avoid detaching the multilayer circuit board layer by layer and accelerate the maintenance speed.
Example two:
it should be noted that, the utility model is a novel multilayer circuit board with high integration, when in use, the limit block 404 is inserted into the limit hole 101, the circuit board is placed inside the placing plate 301 and the top plate 1, the lower surface of the circuit board is attached to the insulating heat conducting plate 4, then the elastic spherical block 403 is given an elastic deformation force, the elastic spherical block 403 is clamped into the spherical groove 102, the top plate 1, the placing plate 301 and the bottom plate 3 are sequentially installed, the number of the placing plate 301 and the insulating heat conducting plate 4 is adjusted according to the number of the circuit boards, the air distribution frame 201 is communicated with the ventilation frame 204, when the circuit board works, the insulating heat conducting plate 4 transfers the heat of the circuit board to the heat sink 401, the air inlet mechanism 202 operates, the outside air is guided into the air inlet frame 2, then passes through the air distribution frame 201 and the ventilation frame 204, and is blown to the surface of the heat sink 401 to guide the heat of the heat sink 401 out, and then can derive the radiating heat of circuit board fast to heat between circuit board and the circuit board piles up together, when the maintenance, upwards pull roof 1 and place board 301, give elastic spherical block 403 one the power that takes place elastic deformation, with inside elastic spherical block 403 shifts out spherical groove 102, the board 301 of placing at the circuit board place of will damaging dismantles, thereby can directly dismantle the individual layer circuit board of damage, in order to avoid dismantling the multilayer circuit board successive layer, accelerate maintenance speed.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a novel multilayer circuit board of high integration, its characterized in that: including roof (1), roof (1) below movable mounting has places board (301), place board (301) below movable mounting has bottom plate (3), roof (1) top fixed mounting has air intake frame (2), surface fixed mounting has air intake mechanism (202) on air intake frame (2), roof (1) one side fixed surface installs branch gas frame (201), bottom plate (3) with place board (301) a side surface equal fixed mounting have frame (204) of ventilating, roof (1), bottom plate (3) with place board (301) a lower surface equal movable mounting have insulating heat-conducting plate (4).
2. The novel multilayer circuit board with high integration level of claim 1, wherein: the lower surface of the ventilation frame (204) on one side of the bottom plate (3) is of a closed structure, spherical grooves (102) are formed in the positions, close to four corners, of the upper surfaces of the bottom plate (3) and the placing plate (301), and limiting holes (101) are formed in the lower surfaces of the top plate (1) and the placing plate (301).
3. The novel multilayer circuit board with high integration level of claim 2, wherein: the upper surface of the insulating heat conducting plate (4) is fixedly provided with a limiting block (404) close to the outer side surface, and the limiting block (404) is movably connected with the top plate (1) and the placing plate (301) through the limiting hole (101).
4. The novel multilayer circuit board of claim 3, wherein: air inlet hole (203) have been seted up to air intake frame (2) upper surface, air intake frame (2) with divide gas frame (201) fixed connection, just air intake frame (2) with divide gas frame (201) intercommunication, air intake frame (2) with ventilate frame (204) swing joint.
5. The novel multilayer circuit board with high integration level of claim 4, wherein: the lower surface of the insulating heat-conducting plate (4) is close to four corners and is fixedly provided with a support pillar (402), the lower end surface of the support pillar (402) is fixedly provided with an elastic spherical block (403), and the elastic spherical block (403) is respectively movably connected with the placing plate (301) and the bottom plate (3) through the spherical groove (102).
6. The novel multilayer circuit board with high integration level of claim 5, wherein: the heat-insulating and heat-conducting plate is characterized in that threaded sleeves (302) are fixedly mounted on the front surface and the rear surface of the base plate (3), heat-radiating fins (401) are fixedly mounted on the lower surface of the heat-insulating and heat-conducting plate (4), and hole grooves are formed in one side surface of the air distribution frame (201) and one side surface of the air ventilation frame (204).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123145385.5U CN216451594U (en) | 2021-12-15 | 2021-12-15 | Novel multilayer circuit board of high integration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123145385.5U CN216451594U (en) | 2021-12-15 | 2021-12-15 | Novel multilayer circuit board of high integration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216451594U true CN216451594U (en) | 2022-05-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123145385.5U Active CN216451594U (en) | 2021-12-15 | 2021-12-15 | Novel multilayer circuit board of high integration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216451594U (en) |
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2021
- 2021-12-15 CN CN202123145385.5U patent/CN216451594U/en active Active
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