CN216437845U - Heat sink device - Google Patents

Abstract

The utility model relates to a heat abstractor, include: a support plate; the cold plate radiator is connected with the supporting plate and is used for radiating heat of a main chip on the mainboard in contact with the integrated stabilized voltage power supply; the fan is connected with the supporting plate, the fan and the cold plate radiator are respectively arranged on two sides of the supporting plate along the thickness direction of the fan, an air passing hole at least aligned to the memory on the mainboard is formed in the supporting plate, an air outlet of the fan is aligned to the air passing hole, and the fan is at least used for air cooling and heat dissipation of the memory. The heat dissipation device can meet the heat dissipation requirement during full-pressure detection of the electrical components in the server, so that the server can perform full-pressure detection before shipment or use, existing faults are detected as completely as possible, the fault rate in the subsequent use process is reduced, and the product competitiveness is improved.

Description

Heat sink device

Technical Field

The utility model relates to a server heat dissipation technical field especially relates to heat abstractor.

Background

When the server works, electrical components in the server can emit more heat, and therefore, in the working process of the server, a heat dissipation device needs to be arranged to cool and dissipate the heat of the electrical components so as to ensure that the electrical components can work normally. Correspondingly, the server also needs to be provided with a heat dissipation device for heat dissipation in the production or after-sale maintenance process so as to meet the heat dissipation requirements of electrical components during various detections. However, some heat dissipation methods commonly used in the production or maintenance process have limited heat dissipation capability, and only can meet in-place detection or low-load detection, and cannot meet the heat dissipation requirement of full-voltage detection, so that after the production or maintenance is completed, full-voltage detection cannot be performed on electrical components, and thus, there is a risk that a fault is not detected.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model provides a heat abstractor can satisfy the heat dissipation demand when electrical components full pressure testing in the server for the server can carry out full pressure testing before shipment or use, and the trouble that will exist is whole to try hard to detect, thereby reduces the fault rate in the follow-up use, improves product competitiveness.

A heat sink, comprising:

a support plate;

the cold plate radiator is connected with the supporting plate and is used for radiating heat of a main chip on the mainboard in contact with the integrated stabilized voltage power supply;

the fan is connected with the supporting plate, the fan and the cold plate radiator are respectively arranged on two sides of the supporting plate along the thickness direction of the fan, an air passing hole at least aligned to the memory on the mainboard is formed in the supporting plate, an air outlet of the fan is aligned to the air passing hole, and the fan is at least used for air cooling and heat dissipation of the memory.

In one embodiment, a positioning piece for concave-convex matching with the main chip and the integrated stabilized voltage power supply is arranged on a heat source contact surface of the cold plate radiator. The positioning piece which can be matched with the main chip and the integrated stabilized voltage supply in a concave-convex mode is arranged on the heat source contact surface of the cold plate radiator, so that the positioning piece can be quickly positioned when radiating, the height difference of different positions of electrical elements is made up, and unreal contact is avoided.

In one embodiment, the heat source contact surface of the cold plate heat sink is provided with an elastic heat conducting pad. The elastic heat conducting pad arranged on the heat source contact surface of the cold plate radiator can accelerate heat transfer between electrical components such as a main chip and an integrated stabilized voltage power supply and the cold plate radiator, so that the heat dissipation efficiency is improved, and when the electrical components are extruded, the elastic heat conducting pad can have certain telescopic allowance, so that the height difference of each electrical component at different positions can be made up, and unreal contact is avoided.

In one embodiment, a plurality of cold plate radiators are connected to the supporting plate, and each cold plate radiator is used for radiating heat of the main chip at the corresponding position and the integrated voltage-stabilized power supply in a contact mode. Set up a plurality of cold drawing, can realize respectively the heat dissipation to electrical components such as a plurality of main chips and integrated constant voltage power supply, provide the environment that the total pressure detected for a plurality of electrical components to make and to carry out the total pressure to a plurality of electrical components simultaneously and detect, detection efficiency is higher.

In one embodiment, an elastic member is disposed between the support plate and the cold plate radiator, and the cold plate radiator can elastically float relative to the support plate under the action of external pressure. Through setting up the elastic component for each cold plate radiator can be when receiving the electrical components extrusion of corresponding self-adaptation adjusting position, thereby guarantee to have better laminating degree between each cold plate radiator and the electrical components that corresponds.

In one embodiment, the cooling device further comprises a guide post mounted on the support plate, the guide post penetrates through the cold plate radiator, the elastic member is sleeved on the guide post, and two ends of the elastic member respectively and elastically abut against the support plate and the cold plate radiator. Can lead and spacing the flexible of elastic component through the guide post, improve the stability of motion.

In one embodiment, the cold plate radiator further comprises a fastener, one end of the guide post penetrates through the cold plate radiator and then is detachably connected with the fastener, and in a natural state, the cold plate radiator is abutted against the fastener under the driving of the resilience force of the elastic piece. The guide post can be dismantled with the fastener and be connected, if some parts break down, can be convenient for maintain and change trouble part.

In one embodiment, the other end of the guide post passes through a mounting hole in the support plate and is hung on the support plate, and the guide post is in clearance fit with the mounting hole. The guide post and the mounting hole are in clearance fit, so that certain movement allowance of the guide post along the radial direction of the mounting hole can be guaranteed, and the guide post can swing along the radial direction when the surface of the electrical appliance element is uneven so as to improve the fitting degree.

In one embodiment, the main board further comprises a driving member connected with the supporting plate, and the driving member is used for driving the supporting plate to move downwards along the vertical direction to be close to the main board. Manual driving is replaced by the driving piece, so that labor can be saved and efficiency can be improved; the moving direction of the support plate close to the main plate is limited to be vertical downward, and the support plate can be better pressed on an electrical element under the action of the gravity of the cold plate radiator, so that the attaching degree is improved.

In one embodiment, the cold plate radiator further comprises a placing table, the placing table is arranged below the cold plate radiator at intervals, a tray used for bearing the main plate is arranged on the placing table, and the tray can horizontally move on the placing table to be switched between a heat dissipation station and a loading and unloading station. The tray moves between the heat dissipation station and the feeding and discharging station, so that feeding and discharging and heat dissipation detection are completed, feeding and discharging are more convenient, and detection efficiency is higher.

Above-mentioned heat abstractor, when electrical components full pressure detects in the server, can carry out the contact heat dissipation through the great main chip of heat flux density and integrated constant voltage power supply on the mainboard through the cold plate radiator that the heat-sinking capability is stronger, and simultaneously, the fan that is less through the heat-sinking capability is carried out the forced air cooling heat dissipation to the less memory of heat flux density on the mainboard, promptly through cold plate radiator and fan cooperation, the corresponding heat dissipation of electrical components with different heat flux densities on the mainboard, thereby the better heat dissipation demand that satisfies all kinds of electrical components and examine time measuring at full pressure, make the server can carry out full pressure before shipment or use and detect, the trouble that will exist is whole as far as possible all to detect, thereby reduce the fault rate in the follow-up use, improve product competitiveness.

Drawings

Fig. 1 is a schematic structural diagram of a main board according to an embodiment of the present invention;

fig. 2 is a schematic view of an overall structure of a heat dissipation device according to an embodiment of the present invention;

FIG. 3 is a schematic view of the heat dissipation device shown in FIG. 2 from another angle;

FIG. 4 is a schematic diagram of the structure of a support plate, a graphics processor cold plate heat sink, a CPU cold plate heat sink, etc. of the heat dissipation device shown in FIG. 2;

FIG. 5 is a schematic view of another angle of the support plate, the graphics processor cold plate heat sink, the CPU cold plate heat sink, and the like in the heat dissipation apparatus shown in FIG. 2;

FIG. 6 is a schematic view of the heat dissipation device shown in FIG. 2 with a support plate, a graphics processor cold plate heat sink, a CPU cold plate heat sink, and the like, in a different angle;

FIG. 7 is a diagram illustrating a cold plate heat sink of the graphics processor of the heat dissipation device of FIG. 2;

fig. 8 is a schematic structural view of the elastic member, the guide post and the fastening member in fig. 7.

Reference numerals:

a support plate 100, an air passing hole 110;

a cold plate radiator 210, a chip contact surface 211, an integrated regulated power supply contact surface 212, an elastic heat conduction pad 213 and a fan 220;

a main water inlet pipe 310, a branch water inlet pipe 311, a main water outlet pipe 320 and a branch water outlet pipe 321;

the guide post 410, the body rod part 411, the limiting part 412, the clamping groove 413, the fastener 420 and the elastic element 430;

a driving member 510, a pressing plate 520 and a fixing column 530;

a placing table 610, a tray 611, a sliding rail 612 and a mounting rack 620;

motherboard 700, graphics processor 710, central processing unit 720, and memory 730.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 and 4, an embodiment of the present invention provides a heat dissipation apparatus for dissipating heat from a motherboard 700, the heat dissipation apparatus includes a supporting board 100, a cold plate heat sink 210 and a fan 220, the cold plate heat sink 210 and the fan 220 are both connected to the supporting board 100, the cold plate heat sink 210 is used for dissipating heat from a main chip on the motherboard 700 by contacting with an integrated voltage-stabilized power supply, an air outlet of the fan 220 can at least align with a memory 730 on the motherboard 700, and the fan 220 is at least used for dissipating heat from the memory 730 by air cooling.

Specifically, the integrated regulated power supply is disposed on the main chip, and the cold plate heat sink 210 may perform contact heat dissipation on the main chip and the integrated regulated power supply disposed on the main chip. The main chip may be the graphics processor 710 or the central processing unit 720, and correspondingly, the cold plate heat sink 210 is a graphics processor cold plate heat sink for dissipating heat of the graphics processor 710 and the integrated regulated power supply disposed thereon, or a central processing unit cold plate heat sink for dissipating heat of the central processing unit 720 and the integrated regulated power supply disposed thereon. The air outlet of the fan 220 can be aligned with at least the memory 730 on the motherboard 700, so that when the fan 220 works, at least the memory 730 can be cooled by air. The fan 220 may also perform air cooling and heat dissipation on other electrical components disposed on the motherboard 700 and located within the range of the air outlet.

According to the heat dissipation device, when electrical components such as the graphic processor 710, the central processing unit 720, the integrated stabilized voltage power supply and the memory 730 in the server are subjected to full-voltage detection, the main chip with high heat flow density and the integrated stabilized voltage power supply arranged on the main chip can be subjected to contact heat dissipation through the cold plate heat sink 210 with high heat dissipation capacity, meanwhile, the memory 730 with low heat flow density is subjected to air-cooled heat dissipation through the fan 220 with relatively low heat dissipation capacity, namely, the cold plate heat sink 210 is matched with the fan 220 to carry out targeted heat dissipation on the electrical components with different heat flow densities on the main board 700, so that the heat dissipation requirements of various electrical components during full-voltage detection are well met, the server can carry out full-voltage detection before delivery or use, existing faults are detected completely as much as possible, the fault rate in the subsequent use process is reduced, and the product competitiveness is improved.

Referring to fig. 4 and 5, in some embodiments, the fan 220 and the cold plate heat sink 210 are respectively disposed on two sides of the supporting plate 100 along the thickness direction thereof, the supporting plate 100 is disposed with an air passing hole 110 at least aligned with the memory 730, and the air outlet is aligned with the air passing hole 110. Specifically, the cold plate heat sink 210 is disposed on a side of the supporting plate 100 close to the main plate 700, and the fan 220 is disposed on a side away from the main plate 700. The airflow flowing out of the air outlet of the fan 220 may be blown to the memory 730 through the air holes 110, so as to cool and dissipate the memory 730. The installation of the fan 220 and the cold plate radiator 210 can be realized by fully utilizing the space on the two sides of the supporting plate 100 along the thickness direction of the supporting plate, so that the whole structure is more compact, and the occupied space is smaller. In addition, since the fan 220 and the cold plate heat sink 210 are separately disposed on two sides, the cold plate heat sink 210 can be contacted with the corresponding electrical component by only moving the cold plate heat sink 210 close to the motherboard 700, and the fan 220 is disposed on the other side, which does not hinder the contact.

Referring to fig. 7, in some embodiments, the heat source contact surface of the cold plate heat sink 210 is provided with a positioning member for concave-convex matching with the main chip and the integrated regulated power supply. Specifically, the surfaces of the cold plate heat sink 210 for contacting various electrical components are heat source contact surfaces, which include a chip contact surface 211 for contacting a main heating area on the main chip, and an integrated regulated power supply contact surface 212 for contacting an integrated regulated power supply on the main chip. The shape of the positioning piece arranged on the heat source contact surface is matched with the corresponding position on the electric appliance element, and the positioning is carried out through concave-convex matching. For example, the positioning element is a protrusion protruding outward, and the corresponding position on the electrical component for heat dissipation is a groove; the positioning piece is a groove, and the corresponding position on the electric appliance element for heat dissipation is a lug. The positioning piece can be in the shape of column, square, triangle and the like, or can also be in an irregular shape. In this embodiment, the positioning can be performed quickly by the concave-convex matching between the positioning member and the electrical component, so that the probability of displacement of the electrical component in the heat dissipation process is reduced, the height difference of different positions of the electrical component is compensated, the unreal contact between the cold plate radiator 210 and the electrical component is avoided, the fitting degree between the cold plate radiator 210 and the electrical component is better, and the heat dissipation effect is better.

Referring to fig. 7, in some embodiments, a resilient thermal pad 213 is disposed on the heat source contacting surface of the cold plate heat sink 210. Specifically, the elastic thermal pad 213 may be made of a material with good thermal conductivity and certain elasticity, such as rubber or silicone with good thermal conductivity. The resilient thermal pad 213 may rapidly conduct heat from the electrical components to the cold plate heat spreader 210, thereby accelerating heat dissipation. Meanwhile, when the electric appliance element extrudes, the elastic heat conducting pad 213 has a certain expansion allowance, so that the height difference of different positions of the electric appliance element can be made up, the unreal contact between the cold plate radiator 210 and the electric appliance element is avoided, the adhesion degree of the cold plate radiator 210 and the electric appliance element is better, and the heat dissipation effect is better.

Referring to fig. 1, 4 to 6, in some embodiments, a plurality of cold plate heat sinks 210 are connected to the supporting plate 100, and each cold plate heat sink 210 is used for dissipating heat of the main chip and the integrated regulated power supply in a corresponding position in a contact manner. Specifically, 8 graphic processors 710 and 2 central processing units 720 are distributed on the motherboard 700 in fig. 1, and correspondingly, 10 cold plate heat sinks 210 are connected to the support plate 100, wherein 8 are used for dissipating heat of the graphic processors 710, and 2 are used for dissipating heat of the central processing units 720. Every cold drawing radiator 210 matches with the position of the main chip that corresponds to the realization is simultaneously to a plurality of main chips and set up in the contact heat dissipation of the integrated constant voltage power supply of main chip, for a plurality of main chips and set up in the integrated constant voltage power supply of main chip provides the environment that the total pressure detected, so that can carry out the total pressure to a plurality of main chips and set up in the integrated constant voltage power supply of main chip simultaneously and detect, detection efficiency is higher.

Preferably, in some embodiments, a resilient member 430 is disposed between the support plate 100 and the cold plate heat sink 210, and the cold plate heat sink 210 is capable of resiliently floating relative to the support plate 100 under external pressure. Specifically, by providing the elastic member 430, the cold plate heat sink 210 is in elastic contact with the electrical component, so that damage to the electrical component due to hard contact can be avoided. And when the cold plate radiators 210 are extruded by the corresponding electrical components, the positions of the cold plate radiators 210 can be adjusted in a self-adaptive manner through the elastic pieces 430, so that the height difference between the electrical components corresponding to the cold plate radiators 210 is made up, the cold plate radiators 210 and the corresponding electrical components are guaranteed to have good fitting degree, and the overall heat dissipation effect is better.

Specifically, in some embodiments, the elastic member 430 is preferably a block with elasticity, and one end of the elastic member 430 is fixedly connected to the support plate 100 and the other end is fixedly connected to the cold plate heat sink 210. When the cold plate heat spreader 210 is pressed by the corresponding electrical component, the elastic member 430 is compressed and deformed, so that the cold plate heat spreader 210 elastically abuts against the electrical component.

Referring to fig. 5 to 8, or, in some embodiments, in addition to the elastic member 430, the cooling plate heat sink further includes a guiding pillar 410 installed on the supporting plate 100, the guiding pillar 410 penetrates through the cooling plate heat sink 210, the elastic member 430 is sleeved on the guiding pillar 410, and two ends of the elastic member 430 respectively elastically abut against the supporting plate 100 and the cooling plate heat sink 210. Specifically, the elastic member 430 is a spring sleeved on the outer peripheral surface of the guiding post 410, and in a natural state where the cold plate heat sink 210 is not in contact with the electrical component, the spring is in a compressed state, and one end of the spring elastically abuts against the supporting plate 100, and the other end elastically abuts against the cold plate heat sink 210. When the cold plate heat dissipater 210 is pressed by the corresponding electrical components, the spring is compressed and deformed along the axial direction of the guide column 410, and the cold plate heat dissipater 210 slides along the axial direction of the guide column 410 to adjust the position, so that the height difference between the electrical components corresponding to each cold plate heat dissipater 210 is made up, the good fitting degree between each cold plate heat dissipater 210 and the corresponding electrical components is ensured, and the overall heat dissipation effect is better. In this embodiment, by providing the guiding post 410, the extension of the spring and the movement of the cold plate heat sink 210 can be guided and limited, thereby improving the stability of the movement. Preferably, the guide posts 410 are in clearance fit with each other when passing through the cold plate heat sink 210, and the clearance is in the range of 0mm to 2mm, and the clearance range can ensure that the cold plate heat sink 210 can slide along the axial direction of the guide posts 410.

Specifically, in other embodiments, a fastener 420 is further included, one end of the guide post 410 is detachably connected to the fastener 420 after passing through the cold plate heat sink 210, and in a natural state, the cold plate heat sink 210 is supported against the fastener 420 under the driving of the resilience of the elastic member 430. Because the guide column 410 is detachably connected with the fastener 420, if any part fails, the guide column can be detached, and the failed part is convenient to repair and replace. Under the effect of the resilience of the elastic member 430, the cold plate heat sink 210 tends to move away from the support plate 100, the fastener 420 may limit the position of the cold plate heat sink 210, and the cold plate heat sink 210 elastically abuts against the end face of the fastener 420. Specifically, one end of the guiding post 410 passes through the cold plate heat sink 210 and then is connected with the fastener 420 in a snap-fit manner, and the guiding post is detachable, simple in structure and easy to disassemble and assemble. Further, an annular clamping groove 413 is formed in the guide column 410, and the fastening member 420 is a clamping spring, such as an E-shaped clamping spring shown in the drawing, and the E-shaped clamping spring is clamped in the annular clamping groove 413. Of course, in addition to the E-type clamp spring, an O-type clamp spring is also possible. In other embodiments, if the removal factor is not considered, the position of the guide pillar 410 where the fastening member 420 is disposed may be integrally formed with an annular protrusion protruding outward in the radial direction of the guide pillar 410 for limiting the cold plate heat sink 210.

In some embodiments, the other end of the guiding post 410 passes through the mounting hole of the supporting plate 100 and is hung on the supporting plate 100, and the guiding post 410 is in clearance fit with the mounting hole. Specifically, the guiding column 410 includes a main body rod portion 411 and a limiting portion 412 axially distributed along the guiding column, and the aforementioned locking slot 413 is disposed at an end of the main body rod portion 411 far away from the limiting portion 412. Along the radial direction of the guide post 410, the limiting portion 412 protrudes out of the main body rod portion 411, the main body rod portion 411 passes through the mounting hole on the support plate 100, and the limiting portion 412 is blocked by the support plate 100 on one side of the support plate 100 far away from the cold plate radiator 210, so that the guide post 410 is hung. The main body rod part 411 is in clearance fit with the mounting hole on the support plate 100, and the main body rod part 411 has a certain movement allowance along the radial direction of the mounting hole. If some areas of the surfaces of the corresponding electrical components are uneven, the guide posts 410 can swing along the radial direction of the mounting holes to adjust the positions in a self-adaptive manner, so that the fitting degree of the corresponding electrical components is improved, and the heat dissipation effect is better. Preferably, the clearance between the main body rod 411 and the mounting hole on the support plate 100 is in the range of 0mm-2mm, which can ensure that the cold plate heat sink 210 has sufficient swing space. Of course, if the above-mentioned factors are not considered, the end of the guiding post 410 away from the fastening member 420 may be directly and fixedly connected to the supporting plate 100.

Referring to fig. 2, 3 and 5, in some embodiments, a driving member 510 is further included, and the driving member 510 is connected to the supporting plate 100, and is configured to drive the supporting plate 100 to move downward in a vertical direction to be close to the main plate 700. Specifically, the driving member 510 may be a cylinder, a linear motor, or the like. Of course, the driving member 510 may also drive the supporting plate 100 to move in the vertical direction through a transmission assembly, for example, the driving member 510 may be a rotating motor or a rotating cylinder, and the transmission assembly may be a screw rod assembly or a rack and pinion assembly. By replacing the manual drive with the drive member 510, labor can be saved and efficiency improved. The moving direction of the supporting plate 100 close to the main plate 700 is defined to be vertically downward, and the supporting plate can be better pressed on the electrical component by the gravity action of the cold plate heat sink 210, so that the fitting degree is improved. In the embodiment shown in the drawings, the driving member 510 is an air cylinder, and the telescopic end of the air cylinder is fixedly connected to the pressing plate 520, and the pressing plate 520 is disposed above the supporting plate 100 at an interval and is fixedly connected to the supporting plate through a plurality of fixing posts 530.

The top of the supporting plate 100 is provided with a main water inlet pipe 310 and a main water outlet pipe 320, a plurality of water inlet branch pipes 311 corresponding to the cold plate heat sink 210 one by one are branched from each main water inlet pipe 310, and a plurality of water outlet branch pipes 321 corresponding to the cold plate heat sink 210 one by one are branched from each main water outlet pipe 320. The coolant flows into each water inlet branch pipe 311 from the water inlet main pipe 310, flows into the corresponding cold plate radiator 210, absorbs the heat transferred to the cold plate radiator 210, and then flows out of the water outlet branch pipes 321 after the temperature of the coolant is raised, and flows into the water outlet main pipe 320. The water inlet main pipe 310 and the water outlet main pipe 320 are both fixedly installed at the bottom of the pressure plate 520.

In some embodiments, the cold plate radiator further comprises a placing table 610, the placing table 610 is disposed below the cold plate radiator 210 at intervals, a tray 611 for carrying the main plate 700 is disposed on the placing table 610, and the tray 611 can move horizontally on the placing table 610 to switch between the heat dissipation station and the loading and unloading station. Specifically, the mounting frame 620 is fixedly mounted above the placing table 610, and the driving member 510 is fixedly mounted on the mounting frame 620. The heat dissipation station is located below the cold plate radiator 210, the feeding and discharging station is arranged in a manner of deviating from the heat dissipation station in the horizontal plane, and the tray 611 can feed and discharge materials in the feeding and discharging station deviating from the heat dissipation station so as to prevent the cold plate radiator 210 located above the heat dissipation station from blocking feeding and discharging. The tray 611 may be manually pushed to horizontally move on the placing table 610, or the tray 611 may be driven to horizontally move on the placing table 610 by a motor, an air cylinder, or the like. Preferably, a sliding rail 612 is arranged on the placing table 610, a sliding block slidably connected with the sliding rail 612 is correspondingly arranged at the bottom of the tray 611, and the sliding block is matched with the sliding rail 612 to guide and limit the movement of the tray 611.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. Heat abstractor for to the mainboard heat dissipation, its characterized in that includes:

a support plate;

the cold plate radiator is connected with the supporting plate and is used for radiating heat of a main chip on the mainboard in contact with the integrated stabilized voltage power supply;

the fan is connected with the supporting plate, the fan and the cold plate radiator are respectively arranged on two sides of the supporting plate along the thickness direction of the fan, an air passing hole at least aligned to the memory on the mainboard is formed in the supporting plate, an air outlet of the fan is aligned to the air passing hole, and the fan is at least used for air cooling and heat dissipation of the memory.

2. The heat dissipation device of claim 1, wherein a positioning member for concave-convex matching with the main chip and the integrated regulated power supply is arranged on the heat source contact surface of the cold plate radiator.

3. The heat dissipating device of claim 1, wherein the cold plate heat sink has a resilient thermally conductive pad disposed on the heat source contacting surface.

4. The heat dissipation device of any one of claims 1 to 3, wherein a plurality of the cold plate heat sinks are connected to the support plate, and each cold plate heat sink is used for heat dissipation by contact between the main chip and the integrated regulated power supply at a corresponding position.

5. The heat dissipating device of claim 4, wherein a spring is disposed between the support plate and the cold plate heat sink, the cold plate heat sink being resiliently floatable relative to the support plate under external pressure.

6. The heat dissipating device of claim 5, further comprising a guiding post mounted on the supporting plate, wherein the guiding post passes through the cold plate heat sink, the elastic member is sleeved on the guiding post, and two ends of the elastic member respectively elastically abut against the supporting plate and the cold plate heat sink.

7. The heat dissipating device of claim 6, further comprising a fastener, wherein one end of the guiding post passes through the cold plate heat sink and is detachably connected to the fastener, and in a natural state, the cold plate heat sink is supported against the fastener under the driving of the resilience of the elastic member.

8. The heat dissipating device of claim 7, wherein the other end of the guiding post passes through the mounting hole of the supporting plate and is hung on the supporting plate, and the guiding post is in clearance fit with the mounting hole.

9. The heat dissipating device of claim 1, further comprising a driving member connected to the supporting plate for driving the supporting plate to move downward in a vertical direction to be close to the main plate.

10. The heat dissipation device of claim 9, further comprising a placement table spaced below the cold plate heat sink, wherein a tray for carrying the motherboard is disposed on the placement table, and the tray can move horizontally on the placement table to switch between a heat dissipation station and a loading/unloading station.

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