CN216437788U - Rear circuit board heat dissipation mounting structure of host power supply - Google Patents

Rear circuit board heat dissipation mounting structure of host power supply Download PDF

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Publication number
CN216437788U
CN216437788U CN202122909677.5U CN202122909677U CN216437788U CN 216437788 U CN216437788 U CN 216437788U CN 202122909677 U CN202122909677 U CN 202122909677U CN 216437788 U CN216437788 U CN 216437788U
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circuit board
power supply
heat dissipation
rear circuit
board assembly
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CN202122909677.5U
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Chinese (zh)
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樊华
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Chengdu Yifeixi Technology Co ltd
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Chengdu Yifeixi Technology Co ltd
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Abstract

The utility model belongs to the technical field of computer hosts, and discloses a rear circuit board heat dissipation mounting structure of a host power supply, which comprises a power supply main body and a rear circuit board assembly, wherein the power supply main body comprises a power supply shell, the end part of the power supply shell is provided with a plurality of mounting parts extending towards the rear circuit board assembly, and the rear circuit board assembly is mounted on the end part of the power supply shell through a plurality of mounting parts, so that a heat dissipation interval for heat dissipation is formed between the rear circuit board assembly and the power supply shell; the rear circuit board assembly comprises a frame mounting plate connected with the mounting part and a circuit board component mounted on the frame mounting plate, and the frame mounting plate is made of a metal material with heat conductivity. The utility model discloses a set up back circuit board assembly at power shell's a plurality of installation departments, can constitute the radiating heat dissipation interval of being convenient for before back circuit board assembly and power main part to the cooperation has the metal material of heat conductivity such as aluminium material can realize the effective heat dissipation to back circuit board assembly.

Description

Rear circuit board heat dissipation mounting structure of host power supply
Technical Field
The utility model belongs to the technical field of the computer, concretely relates to back circuit board heat dissipation mounting structure of host computer power.
Background
The host POWER supply means a POWER supply (POWER) used in a computer host or a server host, and is a switching POWER supply as well as a PC (personal computer) POWER supply.
The existing host power supply generally comprises a power supply main body and a rear circuit board assembly connected to the rear end of the power supply main body, and because the rear circuit board assembly needs heat dissipation, a heat dissipation fan can be arranged between the rear circuit board assembly and the power supply main body, so that the heat dissipation and cooling of the rear circuit board assembly can be realized, the occupied space is increased, and the overall weight and cost are increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a back circuit board heat dissipation mounting structure of host computer power solves current host computer power and dispels the heat and lead to the great and higher problem of cost of occupation space through radiator fan to the back circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a rear circuit board heat dissipation mounting structure of a host power supply comprises a power supply main body and a rear circuit board assembly, wherein the power supply main body comprises a power supply shell, a plurality of mounting parts extending towards the rear circuit board assembly are arranged at the end part of the power supply shell, and the rear circuit board assembly is mounted on the end part of the power supply shell through the mounting parts, so that a heat dissipation interval for heat dissipation is formed between the rear circuit board assembly and the power supply shell;
the rear circuit board assembly comprises a frame mounting plate connected with the mounting part and a circuit board component mounted on the frame mounting plate, and the frame mounting plate is made of a metal material with heat conductivity.
In a possible implementation manner, the mounting part comprises a connecting support lug which is integrally formed with the power supply shell, the connecting support lug is provided with a first connecting part which is parallel to the frame mounting plate, and a first connecting hole is formed in the first connecting part;
the circuit board part is provided with a through second connecting hole corresponding to the first connecting hole, and the first connecting part is connected together through a fastener penetrating through the first connecting hole and the second connecting hole.
In a possible implementation manner, a second connecting portion is arranged on the inner side of the frame mounting plate and corresponds to the fastener, and a second connecting hole for the fastener to pass through is formed in the second connecting portion.
In a possible implementation manner, the connecting support lug is also provided with a limiting part which is perpendicular to the frame mounting plate, and a limiting notch matched with the limiting part is formed in the outer side edge of the frame mounting plate;
the circuit board component is arranged on the inner side of the frame mounting plate.
In a possible implementation manner, the power supply main body further comprises at least one power supply module arranged in the power supply shell, and the power supply module comprises a sub power supply shell, a main circuit board, a power supply plugboard and a limiting plate;
the inner bottom of one end of the sub power supply shell, which is adjacent to the rear circuit board assembly, is provided with the limiting plate, the limiting plate is fixedly provided with the power supply plug board, and the power supply plug board is connected with a power supply plug connector connected to the rear circuit board assembly in a plug-in manner; the main circuit board is longitudinally arranged in the sub power supply shell, a positioning notch is formed in one end, close to the limiting plate, of the main circuit board, and the main circuit board abuts against one side of the limiting plate through the positioning notch.
In a possible implementation manner, the height of the positioning notch is greater than or equal to the sum of the heights of the main circuit board and the limiting plate.
In a possible implementation manner, the limiting plate and the power supply jack board are fixedly connected in the sub power supply shell.
In a possible implementation manner, the circuit board component includes a first circuit board and a second circuit board which are respectively installed at two sides of the frame installation board, and the first circuit board and the second circuit board are parallel to each other and perpendicular to the power supply housing.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses a back circuit board heat dissipation mounting structure of host computer power sets up back circuit board subassembly through a plurality of installation departments at power shell, can constitute radiating heat dissipation interval of being convenient for before back circuit board subassembly and power supply main body, this heat dissipation interval is equivalent to heat dissipation channel to the cooperation has the metal material of heat conductivity and can realize the effective heat dissipation to back circuit board subassembly like the aluminium material, fungible radiator fan, and then the required occupation space of reducible heat dissipation, the cost is reduced, structural design is more reasonable.
And, the setting of main circuit board accessible limiting plate and location breach of the interior sub-power unit of power main body can avoid the dress of main circuit board to can realize the quick installation of main circuit board, it is more convenient, practical, novel structure.
Drawings
Fig. 1 is a schematic first perspective view of a rear circuit board heat dissipation mounting structure of a host power supply according to an embodiment of the present disclosure;
fig. 2 is a front view of a rear circuit board heat sink mounting structure of a host power supply according to an embodiment of the present disclosure;
fig. 3 is a schematic partial structural view illustrating a connection between a supporting portion of a rear circuit board heat dissipation mounting structure of a host power supply and a rear circuit board according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a rear circuit board assembly of a rear circuit board heat dissipation mounting structure of a host power supply according to an embodiment of the present application;
fig. 5 is a schematic second perspective view of a rear circuit board heat dissipation mounting structure of a host power supply according to an embodiment of the present application, which conceals a power supply housing;
fig. 6 is a schematic third perspective view of a rear circuit board heat dissipation mounting structure of a host power supply according to an embodiment of the present application, which further hides a side surface of a sub power supply housing from fig. 3;
fig. 7 is a partially enlarged schematic view of fig. 6.
In the figure: 1-a power supply body; 11-power supply housing; 12-a mounting portion; 121-connecting lugs; 122-a limiting part; 123-a first connection; 13-a power supply module; 131-a main circuit board; 132-a sub-power supply housing; 133-a positioning notch; 134-a limiting plate; 135-power supply plug board; 2-a rear circuit board assembly; 21-a frame mounting plate; 22-a first circuit board; 23-a limit notch; 24-power plug; 25-a second circuit board; 3-expanding the circuit board assembly; 4-heat dissipation interval.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1-4, an embodiment of the present application provides a rear circuit board heat dissipation mounting structure of a host power supply, including a power supply main body 1 and a rear circuit board assembly 2, where the power supply main body 1 includes a power supply housing 11, an end portion of the power supply housing 11 has a plurality of mounting portions 12 extending toward the rear circuit board assembly 2, and the rear circuit board assembly is mounted on an end portion of the power supply housing 11 through the plurality of mounting portions 12, so that a heat dissipation space 4 for dissipating heat is formed between the rear circuit board assembly and the power supply housing 11; the mounting portion 12 extends toward the rear circuit board assembly 2 and is used for mounting the rear circuit board assembly 2, so that a heat dissipation space 4 is formed between the rear circuit board assembly and the power supply main body 1, the heat dissipation space 4 is equivalent to a ventilation channel capable of dissipating heat, and heat dissipation of the rear circuit board assembly 2 can be achieved through the heat dissipation space 4.
The rear circuit board assembly 2 includes a frame mounting plate 21 connected to the mounting portion 12, and a circuit board component mounted on the frame mounting plate 21, where the frame mounting plate 21 is made of a metal material having thermal conductivity. When heat dissipation is carried out through heat dissipation interval 4, circuit board components can carry out heat conduction to the circuit board components of installing on it through the frame mounting panel 21 that the metal material that has the heat conductivity made, and then realize the heat dissipation to circuit board components, that is to say, circuit board components accessible frame mounting panel 21 parts and heat dissipation interval 4 realize the heat dissipation to fungible radiator fan has reduced occupation space, also the cost is reduced, and structural design is reasonable, practical.
Referring to fig. 2 and 3, in one embodiment, the mounting portion 12 includes a connecting support lug 121 integrally formed with the power supply housing 11, the connecting support lug 121 has a first connecting portion 123 parallel to the frame mounting plate 21, and the first connecting portion 123 has a first connecting hole; the circuit board part is provided with a through second connection hole corresponding to the first connection hole, and the first connection part 123 is connected together by a fastener passing through the first connection hole and the second connection hole.
In this way, the connection lugs 121 integrally formed with the power supply housing 11 can be connected to the circuit board member by the first connection portions 123 formed by bending the connection lugs, and the circuit board member is mounted on the frame mounting plate 21, so that the whole can be mounted on the mounting portion 12 by the fastening member.
In order to enhance the connection strength between the fastening member and the rear circuit assembly, a second connecting portion (not shown) is disposed on the inner side of the frame mounting plate 21 and corresponding to the fastening member, and the second connecting portion is provided with a second connecting hole for the fastening member to pass through. Through setting up the second connecting portion again, this second connecting portion sets up with frame mounting panel 21 is integrative, when connecting through the fastener like this, links together with the frame mounting panel again for whole frame mounting panel 21 can be more firm installs on power shell 11's installation department 12.
Further, as shown in fig. 2, in order to facilitate the quick installation of the supporting portion and the rear circuit board assembly 2, the connecting support lug 121 further has a limiting portion 122 perpendicular to the frame mounting plate 21, and a limiting notch 23 matched with the limiting portion 122 is formed in the outer side edge of the frame mounting plate 21; the circuit board components are provided inside the frame mounting plate 21. This spacing portion 122 can be convenient for back circuit board assembly 2 when the installation spacing breach 23 installation location on it of accessible, and then more quick installation, this spacing portion 122 can block in should dodge in the breach when the installation to because back circuit board assembly 2 is located the inboard of frame mount board 21, the back-and-forth movement of spacing portion 122 accessible restriction back circuit board assembly 2, it is more convenient, practical.
Referring to fig. 5 to 7, in the embodiment of the present application, the power supply main body 1 further includes at least one power supply module 13 disposed in the power supply housing 11, and the power supply module 13 includes a sub power supply housing 132, a main circuit board 131, a power supply socket board 135 and a limiting board 134; one or more power modules 13 can be arranged in the power supply housing 11, and the specific arrangement number can be determined according to actual conditions;
the inner bottom of one end of the sub power supply shell 132, which is close to the rear circuit board assembly, is provided with the limiting plate 134, the limiting plate 134 is fixedly provided with the power supply plug board 135, and the power supply plug board 135 is in plug-in connection with the power supply plug connector 24 connected to the rear circuit board assembly; the main circuit board 131 is longitudinally arranged in the sub power supply shell 132, a positioning notch 133 is formed in one end, adjacent to the limiting plate 134, of the main circuit board 131, and the main circuit board 131 abuts against one side of the limiting plate 134 through the positioning notch 133. Thus, when the main circuit board 131 of the power supply unit is mounted on the power supply housing 11, the mounting direction can be distinguished through the positioning notch 133, so that mounting errors are avoided, and the main circuit board 131 can be conveniently mounted through the positioning notch 133 and the limiting plate 134 arranged on the corresponding side to realize mounting positioning and limiting.
Specifically, the height of the positioning notch 133 is greater than or equal to the sum of the heights of the main circuit board 131 and the limiting plate 134. This enables the positioning notch 133 to avoid the power jack panel 135.
For better installation, the limiting plate 134 and the power plug plate 135 are fixedly connected inside the sub power supply housing 132. The power supply plug board 135 and the limit board 134 are detachably attached to the inside of the sub power supply case 132; specifically, the fastener may be a bolt or the like.
In the embodiment of the present application, the circuit board assembly includes a first circuit board 22 and a second circuit board 25 respectively mounted on both sides of the frame mounting plate 21, and the first circuit board 22 and the second circuit board 25 are parallel to each other and perpendicular to the power supply housing 11. The rear circuit board assembly 2 generally comprises two boards, namely a first circuit board 22 and a second circuit board 25, and the two circuit boards are perpendicular to the power supply housing 11, and such a mounting manner can be referred to as vertical mounting; specifically, the first circuit board is a control circuit board, and the second circuit board is a power distribution circuit board.
It should be noted that, the present application is a rear circuit board heat dissipation mounting structure of a host power supply in an embodiment, and does not relate to the improvement of the host power supply with respect to the circuit structure of the circuit board and the connection relationship between the circuit board and the related electrical components, so detailed description is omitted here.
In fig. 1 to 6, an extended circuit board assembly 3 for extended connection is connected to the rear side of the rear circuit board assembly 2, and the extended circuit board assembly 3 does not belong to the improvement point of the embodiment of the present application, and therefore, will not be described in detail; also, a housing is provided outside the rear circuit board assembly 2.
Finally, it should be noted that: the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. The utility model provides a back circuit board heat dissipation mounting structure of host computer power, includes power main part (1) and back circuit board subassembly (2), its characterized in that: the power supply main body (1) comprises a power supply shell (11), the end part of the power supply shell (11) is provided with a plurality of mounting parts (12) extending towards the rear circuit board assembly (2), and the rear circuit board assembly is mounted on the end part of the power supply shell (11) through the mounting parts (12), so that a heat dissipation interval (4) for dissipating heat is formed between the rear circuit board assembly and the power supply shell (11);
the rear circuit board assembly (2) comprises a frame mounting plate (21) connected with the mounting part (12) and a circuit board component mounted on the frame mounting plate (21), and the frame mounting plate (21) is made of a metal material with heat conductivity.
2. The heat dissipation mounting structure of the rear circuit board of the host power supply of claim 1, wherein: the mounting part (12) comprises a connecting support lug (121) which is integrally formed with the power supply shell (11), the connecting support lug (121) is provided with a first connecting part (123) which is parallel to the frame mounting plate (21), and a first connecting hole is formed in the first connecting part (123);
the circuit board part is provided with a through second connecting hole corresponding to the first connecting hole, and the first connecting part (123) is connected together through a fastener penetrating through the first connecting hole and the second connecting hole.
3. The heat dissipation mounting structure of the rear circuit board of the host power supply of claim 2, wherein: the inboard of frame mounting panel (21) just corresponds the fastener is equipped with the second connecting portion, and the second connecting portion are seted up and are supplied the second connecting hole that the fastener passed.
4. The heat dissipation mounting structure of the rear circuit board of the host power supply of claim 3, wherein: the connecting support lug (121) is also provided with a limiting part (122) which is perpendicular to the frame mounting plate (21), and the outer side edge of the frame mounting plate (21) is provided with a limiting notch (23) matched with the limiting part (122);
the circuit board component is arranged on the inner side of the frame mounting plate (21).
5. The rear circuit board heat dissipation mounting structure of a host power supply of any one of claims 1-4, wherein: the power supply main body (1) further comprises at least one power supply module (13) arranged in the power supply shell (11), and the power supply module (13) comprises an auxiliary power supply shell (132), a main circuit board (131), a power supply plug board (135) and a limiting plate (134);
the inner bottom of one end, adjacent to the rear circuit board assembly, of the sub power supply shell (132) is provided with the limiting plate (134), the power supply plug board (135) is fixedly arranged on the limiting plate (134), and the power supply plug board (135) is connected with a power supply plug connector (24) connected to the rear circuit board assembly in a plug-in mode; the main circuit board (131) is longitudinally arranged in the sub power supply shell (132), a positioning notch (133) is formed in one end, close to the limiting plate (134), of the main circuit board (131), and the main circuit board (131) abuts against one side of the limiting plate (134) through the positioning notch (133).
6. The heat dissipating mounting structure for the rear circuit board of the host power supply of claim 5, wherein: the height of the positioning notch (133) is greater than or equal to the sum of the heights of the power supply plug board (135) and the limiting board (134).
7. The heat dissipation mounting structure of the rear circuit board of the host power supply of claim 6, wherein: the limiting plate (134) and the power supply plug board (135) are fixedly connected in the sub power supply shell (132).
8. The heat dissipation mounting structure of the rear circuit board of the host power supply of claim 1, wherein: the circuit board component comprises a first circuit board (22) and a second circuit board (25) which are respectively installed on two sides of the frame installation plate (21), and the first circuit board (22) and the second circuit board (25) are parallel to each other and are perpendicular to the power supply shell (11).
CN202122909677.5U 2021-11-24 2021-11-24 Rear circuit board heat dissipation mounting structure of host power supply Active CN216437788U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122909677.5U CN216437788U (en) 2021-11-24 2021-11-24 Rear circuit board heat dissipation mounting structure of host power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122909677.5U CN216437788U (en) 2021-11-24 2021-11-24 Rear circuit board heat dissipation mounting structure of host power supply

Publications (1)

Publication Number Publication Date
CN216437788U true CN216437788U (en) 2022-05-03

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ID=81338580

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122909677.5U Active CN216437788U (en) 2021-11-24 2021-11-24 Rear circuit board heat dissipation mounting structure of host power supply

Country Status (1)

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CN (1) CN216437788U (en)

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