CN216413049U - COB ceramic substrate assembly with efficient heat dissipation structure - Google Patents
COB ceramic substrate assembly with efficient heat dissipation structure Download PDFInfo
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- CN216413049U CN216413049U CN202123221014.0U CN202123221014U CN216413049U CN 216413049 U CN216413049 U CN 216413049U CN 202123221014 U CN202123221014 U CN 202123221014U CN 216413049 U CN216413049 U CN 216413049U
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Abstract
The utility model discloses a COB (chip on Board) ceramic substrate assembly with a high-efficiency heat dissipation structure, which comprises a clamping and fixing mechanism, a ceramic substrate main body and a heat dissipation mechanism, wherein the ceramic substrate main body is arranged on the inner side of the clamping and fixing mechanism, the heat dissipation mechanism is arranged at the middle end of the inner side of the clamping and fixing mechanism, a fiber yarn layer is arranged at the joint of the lower end of the clamping and fixing mechanism and the heat dissipation mechanism, the clamping and fixing mechanism comprises a clamping plate, an outer plate, a spring assembly and an inner plate, the outer plate is arranged on the inner side of the clamping plate, and the inner plate is embedded in the inner side of the outer plate. This COB ceramic substrate subassembly with high-efficient heat radiation structure adopts mutually supporting between a plurality of mechanisms, and is functional strong, links to each other ceramic substrate and heat dissipation mechanism, can correspond the ceramic substrate of different specifications, under the tight stable circumstances of ceramic substrate clamp guaranteeing, carries out the heat dissipation of iterative fan to inside to utilize the fibrous layer of laminating department, carry out filtration, guarantee the long-term use of this COB ceramic substrate subassembly.
Description
Technical Field
The utility model relates to the technical field of ceramic substrate assemblies, in particular to a COB ceramic substrate assembly with a high-efficiency heat dissipation structure.
Background
Nowadays, a ceramic substrate refers to a special process plate in which a copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at a high temperature, and is widely favored by the market due to its excellent electrical insulating property, high thermal conductivity, excellent solderability and high adhesion strength.
COB ceramic substrate assemblies on the market are formed by adding a plastic shell to a substrate, but heat is generated and accumulated in the substrate in the use process of the substrate, so that the substrate and electronic elements are damaged, and the service life of the substrate is shortened.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a COB ceramic substrate assembly with an efficient heat dissipation structure, so as to solve the problems that the COB ceramic substrate assembly in the market proposed in the above background art is an assembly formed by a substrate and a plastic shell, but heat is accumulated in the substrate during the use of the substrate, which damages the substrate and electronic components and reduces the service life of the substrate.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a COB ceramic substrate subassembly with high-efficient heat radiation structure, includes centre gripping fixed establishment, ceramic substrate main part and heat dissipation mechanism, centre gripping fixed establishment's inboard is provided with the ceramic substrate main part, centre gripping fixed establishment's inboard middle-end is provided with heat dissipation mechanism, centre gripping fixed establishment's lower extreme and heat dissipation mechanism junction are provided with the fibre yarn layer, centre gripping fixed establishment includes grip block, planking, spring unit and inner panel, the inboard department of grip block is provided with the planking, the inboard gomphosis of planking has the inner panel, planking and inner panel port department junction are provided with spring unit.
Furthermore, the clamping plates are distributed in a hook shape, and the clamping plates are embedded with the ceramic substrate main body in size.
Furthermore, the clamping plate and the outer plate form a fixed structure, and the outer plate is symmetrically distributed along the central axis of the inner plate.
Furthermore, the outer plate and the inner plate form an elastic structure through the spring assembly, and the outer plate and the inner plate form a sleeve-shaped sliding structure.
Further, the heat dissipation mechanism comprises a frame, a limiting channel and a heat dissipation fan, the symmetrical heat dissipation fan is installed at the inner side of the frame, and the limiting channel is formed in the two ends of the inside of the frame.
Furthermore, the frame is matched with the outer plate through a limiting channel.
Furthermore, the frame is attached to the ceramic substrate body through the fiber yarn layer.
Compared with the prior art, the utility model has the beneficial effects that: this COB ceramic substrate subassembly with high-efficient heat radiation structure adopts mutually supporting between a plurality of mechanisms, and is functional strong, links to each other ceramic substrate and heat dissipation mechanism, can correspond the ceramic substrate of different specifications, under the tight stable circumstances of ceramic substrate clamp guaranteeing, carries out the heat dissipation of iterative fan to inside to utilize the fibrous layer of laminating department, carry out filtration, guarantee the long-term use of this COB ceramic substrate subassembly.
1. According to the utility model, the clamping and fixing mechanism is an external component of the ceramic substrate main body, the clamping plate at the four corners is utilized to clamp the ceramic substrate main body, the spring component at the inner side is utilized to enable the outer plate to elastically slide at the outer side of the inner plate, the connection strength of the connection part is ensured by utilizing the elasticity, the structure is stable, and the stability of the whole component is ensured.
2. According to the utility model, the frame is used as an external structure of the heat dissipation mechanism, the heat dissipation mechanism is in a horizontal state by utilizing the limiting channel to be attached to the lower surface of the ceramic substrate main body, the fiber yarn layer is attached to the attachment part, and when two heat dissipation fans at the bottom end blow air for heat dissipation, impurities in the air can be filtered to ensure the cleanness of the ceramic substrate main body.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front enlarged view of the present invention;
fig. 3 is a schematic bottom view of the present invention.
In the figure: 1. a clamping and fixing mechanism; 101. a clamping plate; 102. an outer plate; 103. a spring assembly; 104. an inner plate; 2. a ceramic substrate body; 3. a heat dissipation mechanism; 301. a frame; 302. a limiting channel; 303. a heat radiation fan; 4. and a fiber yarn layer.
Detailed Description
As shown in fig. 1-2, the present invention provides a technical solution: a COB ceramic substrate assembly with efficient heat dissipation structure, comprising: the ceramic substrate clamping and fixing mechanism comprises a clamping and fixing mechanism 1, a ceramic substrate main body 2 and a heat dissipation mechanism 3, the ceramic substrate main body 2 is arranged on the inner side of the clamping and fixing mechanism 1, the heat dissipation mechanism 3 is arranged at the middle end of the inner side of the clamping and fixing mechanism 1, a fiber yarn layer 4 is arranged at the joint of the lower end of the clamping and fixing mechanism 1 and the heat dissipation mechanism 3, the clamping and fixing mechanism 1 comprises a clamping plate 101, an outer plate 102, a spring assembly 103 and an inner plate 104, the outer plate 102 is arranged at the inner side of the clamping plate 101, the inner plate 104 is embedded at the inner side of the outer plate 102, and the spring assembly 103 is arranged at the joint of the port of the outer plate 102 and the inner plate 104. The holding plates 101 are distributed in a hook shape, and the holding plates 101 and the ceramic substrate body 2 are fitted to each other in size. The clamping plate 101 and the outer plate 102 form a fixed structure, and the outer plate 102 is symmetrically distributed along the central axis of the inner plate 104. The outer plate 102 forms an elastic structure through the spring assembly 103 and the inner plate 104, the outer plate 102 and the inner plate 104 form a sleeve-shaped sliding structure, the clamping and fixing mechanism 1 is an external component of the ceramic substrate main body 2, the clamping plate 101 at four corners is utilized to clamp the ceramic substrate main body 2, the inner spring assembly 103 is utilized to enable the outer plate 102 to elastically slide outside the inner plate 104, the connection strength of the connection position is guaranteed through elasticity, and the structure is stable to guarantee the stability of the whole assembly.
As shown in fig. 3, the present invention provides a technical solution: the utility model provides a COB ceramic substrate subassembly with high-efficient heat radiation structure, heat dissipation mechanism 3 includes frame 301, spacing passageway 302 and cooling fan 303, and the inboard department of frame 301 installs the cooling fan 303 of symmetry, and the inside both ends of frame 301 have seted up spacing passageway 302. Frame 301 is mated to outer plate 102 through a retaining channel 302. Frame 301 is laminated mutually through fibre yarn layer 4 and ceramic substrate main part 2, and frame 301 utilizes spacing passageway 302 as the exterior structure of heat dissipation mechanism 3, makes heat dissipation mechanism 3 be in the level form, comes to laminate in the lower surface of ceramic substrate main part 2 to there is fibre yarn layer 4 in the department of laminating is attached to, when two cooling fan 303 of bottom heat dissipation blow the heat dissipation, can filter impurity in the air, in order to guarantee the cleanness of ceramic substrate main part 2 itself.
In summary, when the COB ceramic substrate assembly with the efficient heat dissipation structure is used, one side of the ceramic substrate main body 2 is first abutted against the inner wall of one side clamping plate 101, then one side clamping plate 101 is pushed outward to stretch and deform the spring assembly 103 on one side, so that the distance between the clamping plates 101 on both ends is lengthened, the other side of the ceramic substrate main body 2 is placed in the opposite clamping plate 101, so that the spring assembly 103 is used to stretch the clamping plates 101 on both sides, thereby fixing the ceramic substrate main body 2 at the inner side of the clamping plate 101, and adhering the heat dissipation fan 303 at the inner side of the clamping plate 101 to the lower surface of the ceramic substrate main body 2, when the ceramic substrate main body 2 is overheated, the heat dissipation fan 303 of TH-620A type can be started to diffuse heat of the ceramic substrate main body 2 to the outside by blowing air, thereby achieving an effect of efficient heat dissipation.
Claims (7)
1. A COB ceramic substrate assembly with a high-efficiency heat dissipation structure comprises a clamping and fixing mechanism (1), a ceramic substrate main body (2) and a heat dissipation mechanism (3), the inner side of the clamping and fixing mechanism (1) is provided with a ceramic substrate main body (2), it is characterized in that the middle end of the inner side of the clamping and fixing mechanism (1) is provided with a heat dissipation mechanism (3), a fiber yarn layer (4) is arranged at the joint of the lower end of the clamping and fixing mechanism (1) and the heat dissipation mechanism (3), the clamping and fixing mechanism (1) comprises a clamping plate (101), an outer plate (102), a spring assembly (103) and an inner plate (104), an outer plate (102) is arranged at the inner side of the clamping plate (101), an inner plate (104) is embedded at the inner side of the outer plate (102), and a spring assembly (103) is arranged at the joint of the port of the outer plate (102) and the port of the inner plate (104).
2. The COB ceramic substrate assembly with the efficient heat dissipation structure of claim 1, wherein: the clamping plates (101) are distributed in a hook shape, and the clamping plates (101) are embedded with the ceramic substrate main body (2) in size.
3. The COB ceramic substrate assembly with the efficient heat dissipation structure of claim 1, wherein: the clamping plate (101) and the outer plate (102) form a fixed structure, and the outer plate (102) is symmetrically distributed along the central axis of the inner plate (104).
4. The COB ceramic substrate assembly with the efficient heat dissipation structure of claim 1, wherein: the outer plate (102) forms an elastic structure through a spring assembly (103) and an inner plate (104), and the outer plate (102) and the inner plate (104) form a sleeve-shaped sliding structure.
5. The COB ceramic substrate assembly with the efficient heat dissipation structure of claim 1, wherein: the heat dissipation mechanism (3) comprises a frame (301), a limiting channel (302) and a heat dissipation fan (303), wherein the symmetrical heat dissipation fan (303) is installed at the inner side of the frame (301), and the limiting channel (302) is arranged at two ends of the inside of the frame (301).
6. The COB ceramic substrate assembly with the efficient heat dissipation structure of claim 5, wherein: the frame (301) is matched with the outer plate (102) through a limiting channel (302).
7. The COB ceramic substrate assembly with the efficient heat dissipation structure of claim 5, wherein: the frame (301) is attached to the ceramic substrate body (2) through the fiber yarn layer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123221014.0U CN216413049U (en) | 2021-12-17 | 2021-12-17 | COB ceramic substrate assembly with efficient heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123221014.0U CN216413049U (en) | 2021-12-17 | 2021-12-17 | COB ceramic substrate assembly with efficient heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216413049U true CN216413049U (en) | 2022-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123221014.0U Active CN216413049U (en) | 2021-12-17 | 2021-12-17 | COB ceramic substrate assembly with efficient heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216413049U (en) |
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2021
- 2021-12-17 CN CN202123221014.0U patent/CN216413049U/en active Active
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