CN216362125U

CN216362125U - Wafer rewinding device

Info

Publication number: CN216362125U
Application number: CN202123213078.6U
Authority: CN
Inventors: 王仁书; 薛新兵
Original assignee: Yangzhou Jingxin Electronic Co ltd
Current assignee: Yangzhou Jingxin Electronic Co ltd
Priority date: 2021-12-20
Filing date: 2021-12-20
Publication date: 2022-04-22
Anticipated expiration: 2031-12-20

Abstract

The utility model belongs to the technical field of semiconductor chip manufacturing, and particularly relates to a wafer rewinding device. The wafer pushing device comprises a box body, a positioning assembly and a pushing assembly, wherein a bearing platform used for placing two opposite sheet racks with openings is formed in the top of the box body, the positioning assembly is arranged on the bearing platform, the pushing assembly is connected with the inside of the box body in a sliding mode, the pushing assembly can reciprocate along a first direction, and the pushing assembly is used for moving from the first position to a second position along the first direction so as to push a wafer in one sheet rack into the other sheet rack. The utility model is used for solving the problem of inconvenient positioning of the wafer in the rewinding process.

Description

Wafer rewinding device

Technical Field

The utility model belongs to the technical field of semiconductor chip manufacturing, and particularly relates to a wafer rewinding device.

Background

In the field of semiconductor chip manufacturing, wafers are usually mounted in a rack, and the wafers need to be transferred and transferred in different processes or places during production, and the wafers need to be transferred between the rack and the rack in a mutually-reversed manner. In the process that the wafers fall down between the wafer racks, the phenomenon of surface scratch, fragment and the like of the wafers can be generated due to the irregular operation, and defective products are generated.

The patent CN201310185042.2 rolling type sheet rewinding method provides a sheet rewinding method, but due to manual operation, the wafer is easily scratched, and during the operation, the wafer is not easy to slip off due to poor handling, and a certain proportion of fragments are brought.

In actual production, some simple devices are used for rewinding, but the positioning is inconvenient. Some automatic equipment specially used for rewinding is available abroad, but the equipment is large in size, high in price and low in efficiency.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application embodiment will solve lies in overcoming prior art not enough, provides a wafer device of falling piece for solve the inconvenient problem of wafer location at the fall piece in-process.

The technical scheme for solving the technical problems in the embodiment of the application is as follows: a wafer flipping device, comprising:

the top of the box body is provided with a bearing platform for placing two racks with opposite openings;

the positioning assembly is arranged on the bearing platform;

the push handle assembly is connected with the interior of the box body in a sliding mode and can move back and forth along a first direction;

the pushing assembly is used for moving from a first position to a second position along a first direction so as to push the wafer in one rack into the other rack.

Compared with the prior art, the technical scheme has the following beneficial effects:

the bearing platform that utilizes the surface formation of box is placed two framves opening on it relatively, and two framves of location restriction that locating component on the bearing platform can be better, with box sliding connection's pushing hands subassembly, can pass another framves with the whole wafer that passes in a framves when moving along the first direction in, accomplish the rewinding operation, and the accurate convenient operation of whole process location is simple, compares in mechanical rewinding has faster speed, and the rewinding efficiency is higher.

Furthermore, the positioning assembly comprises right-angle positioning blocks arranged at four corners of the bearing platform.

Through the locating pieces arranged at the four corners, the two sheet frames are arranged in the locating pieces, and the bottoms of the two sheet frames with opposite openings can be located.

Furthermore, the positioning assembly further comprises positioning strips arranged on the edges of the two sides of the bearing platform, and positioning notches used for limiting the flash of the opening of the sheet frame are respectively arranged on the opposite surfaces of the two positioning strips.

The positioning strips on the two sides of the bearing platform and the positioning notches formed in the positioning strips are used for clamping the flash at the opening of the wafer frame, the opening and the bottom of the wafer frame are limited together with the positioning blocks at the four corners, the positioning is accurate, and wafers in the two wafer frames can be smoothly transferred.

Furthermore, the positioning device also comprises two positioning bosses which are arranged at intervals along the first direction, and the two positioning bosses are respectively provided with a limiting groove which is matched with the side surface of the sheet frame.

Because the side of part sheet rack has the edge of horizontal arrangement, forms H type structure with the sheet rack side, through setting up the spacing groove on the boss of location with the edge card of sheet rack side wherein, the locating piece and the locating bar formation two relative H type of constant head tanks of type of location boss and four corners simultaneously, can make things convenient for quick arranging in wherein with two relative sheet racks of opening, the removal of restriction sheet rack that the spacing groove on the boss and the while location can be further, makes the location accurate.

Further, still include first spacing subassembly, first spacing subassembly includes:

the limiting plate is fixed in the box body;

and the limit stop is fixed on the pushing assembly to limit the pushing assembly to move to the first position.

Through limiting plate and limit stop who mutually supports, when the pushing hands subassembly removed toward the primary importance, can stop the pushing hands subassembly limit and be located the primary importance, no longer remove toward the outside, prevent that pushing hands subassembly and box break away from the slippage.

Furthermore, a first limiting opening is formed in the pushing assembly, and a second limiting opening matched with the first limiting opening is formed in the box body to limit the pushing assembly to move to a second position.

Can limit the pushing hands subassembly through the spacing mouthful of first spacing mouthful of mutually supporting and second and stop to be located the second position, no longer move toward the box side, avoid pushing the wafer back in another piece frame, the displacement once more leads to the wafer to receive the extrusion damage.

Furthermore, a track arranged along the first direction is arranged inside the box body, and a sliding block connected with the track in a sliding mode is arranged at the bottom of the push handle assembly.

Further, the pusher assembly comprises:

the first end of the fixing plate extends into the box body and is fixedly connected with the sliding block;

and the flag panel is fixed at the second end of the fixing plate, and the first end surface of the flag panel is used for being in contact with the wafer in the wafer frame.

The fixed plate extends into the box body and is fixed with the sliding block, so that the whole pushing assembly can stably slide along a first direction, and in the displacement process, the first end face of the flag panel on the fixed plate can push the wafer into another sheet frame together.

Furthermore, the height of the first end surface of the flag panel is not more than the surface distance of the inner side surface of the sheet frame in the vertical direction and not less than the maximum distance of the sheet grooves on two sides in the sheet frame;

the thickness of the first end face of the flag panel is not more than the horizontal width of the opening on the bottom surface of the film frame.

By controlling the height range of the first end face of the flag panel, each wafer can be completely pushed when the flag panel extends into the wafer rack, and meanwhile, the flag panel does not interfere with the wafer rack.

The maximum distance between the two side sheet grooves is understood as the distance formed by the outer side surface between the two outermost sheet grooves in the sheet frame, namely the sum of the groove widths of all the sheet grooves in the sheet frame and the distance between the sheet grooves, so that when the flag panel extends into the sheet frame, the wafer in the flag panel can be completely pushed out.

Further, when the pushing handle assembly is located at the first position, the first end surface of the flag panel is located at the first position side and outside the bottom surface of the film frame; when the pushing handle assembly is located at the second position, the first end face of the flag panel is located at the second position side and is located 0-3mm away from the inner side of the opening of the film frame.

Through limiting the specific stop positions of the first position and the second position, if the second position is stopped at the position where the first end face of the flag panel extends into the opening of the wafer frame, the distance between the second position and the opening of the wafer frame is 0-3mm, the wafer is prevented from being damaged due to the fact that the wafer is pressed due to excessive pushing, and in addition, the flag panel is completely positioned on the outer side of the wafer frame when the first position is adopted, so that the wafer frame can be conveniently placed on the bearing platform.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic overall top view structure according to an embodiment of the present invention.

Fig. 2 is a schematic front view of the structure of fig. 1.

Fig. 3 is a schematic sectional view along the direction of a-a in fig. 1.

Fig. 4 is a schematic top view of the handle assembly in the first position according to the present embodiment.

Fig. 5 is a schematic top view of the handle assembly in the second position according to the present embodiment.

Fig. 6 is an elevational cross-sectional structural schematic view of the push handle assembly in the first position in this embodiment.

Fig. 7 is an elevational sectional structural schematic view of the push handle assembly in the second position in this embodiment.

Reference numerals:

1. a box body; 2. a load-bearing platform;

3. a positioning assembly;

31. positioning blocks; 32. a positioning bar; 33. positioning the notch; 34. positioning the boss; 35. a limiting groove;

4. a push handle assembly;

41. a fixing plate; 42. a flag panel;

5. a limiting plate; 6. a limit stop block;

7. a first limit port; 8. a second limit port;

9. a track; 10. a slider;

11. a sheet rack; 12. and (5) a wafer.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the utility model pertains.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1 to 7, an embodiment of the utility model provides a wafer 12 flip chip apparatus, which includes: the box body 1, the positioning group 3 and the pushing assembly 4 are used for transferring the wafer 12 loaded in one rack 11 to another empty rack 11, and the two racks 11 have the same structure.

As shown in fig. 1 and 2, a carrying platform 2 for placing two racks 11 with opposite openings is formed at the top of a box 1, the racks 11 for loading wafers 12 are placed at the right side of the carrying platform 2, a positioning set 3 is disposed on the carrying platform 2 to limit and position the two racks 11 placed on the carrying platform 2, a pushing assembly 4 is slidably connected with the inside of the box 1, the pushing assembly 4 can move back and forth along a first direction, specifically, a through hole matched with the pushing assembly 4 is formed at one side of the box 1, the pushing assembly 4 extends into the box 1 through the through hole to be slidably connected with the box 1, as shown in fig. 1, the length direction along the pushing assembly 4 is the first direction, as shown in fig. 4 and 6, the rightmost limit position of the pushing assembly 4 is the first position, as shown in fig. 5 and 7, the leftmost limit position of the pushing assembly 4 is the second position, the pushing assembly 4 is configured to move from a first position to a second position along a first direction to push a wafer 12 in one of the wafer shelves 11 into another of the wafer shelves 11, and can completely push the wafer 12 in the right wafer shelf 11 into the left wafer shelf 11 from the first position to the second position, specifically, the wafer shelf 11 near the right first position is a wafer discharging shelf 11, and the wafer shelf 11 near the left second position is a wafer receiving shelf 11.

Utilize bearing platform 2 of box 1's surface formation to place two 11 openings of sheet frame on it relatively, two sheet frames 11 of location restriction that location group 3 on the bearing platform 2 can be better, with box 1 sliding connection's pushing hands subassembly 4, can all pass another sheet frame 11 with the wafer 12 in a sheet frame 11 when moving along the first direction, accomplish the rewinding operation, the accurate convenient operation in whole process location is simple, compare and have faster speed in mechanical rewinding, the rewinding efficiency is higher.

The positioning group 3 comprises right-angle positioning blocks 31 arranged at four corners of the bearing platform 2, the height of each positioning block 31 is 1-5cm, and the four right-angle positioning blocks 31 form a frame-shaped structure and can position the bottoms of the two racks 11 with opposite openings.

Further, in order to make the two racks 11 positioned on the carrying platform 2 more stably, the positioning set 3 further includes positioning strips 32 disposed on the two side edges of the carrying platform 2, and positioning notches 33 for limiting the opening flash of the racks 11 are respectively disposed on the opposite surfaces of the two positioning strips 32, specifically, the two positioning strips 32 are respectively disposed between the two positioning blocks 31 on the upper side and between the two positioning blocks 31 on the lower side, the two positioning strips 32 and the four positioning blocks 31 form a frame enclosing the two racks 11 therein, the height of the positioning strip 32 is set to be 1-3mm, the positioning notch 33 in the positioning strip 32 is mainly matched with the protruding flash of the opening end face of the rack 11 to limit the racks 11, the flash of the opening of the rack 11 is clamped by the positioning strips 32 on the two sides of the carrying platform 2 and the positioning notches 33 disposed on the positioning strips 32, and the positioning blocks 31 at the four corners limit the opening and the bottom of the rack 11, the positioning accuracy is ensured, and the wafers 12 in the two racks 11 can be smoothly transferred.

Further, in order to better match the sheet frame 11 with the H-shaped protrusion on the positioning side surface, the positioning set 3 further includes two positioning bosses 34 arranged at intervals along the first direction, the two positioning bosses 34 are respectively provided with a limiting groove 35 matched with the side surface of the sheet frame 11, and specifically, the height of the positioning bosses 34 is 1-3 mm.

Because the side of part of the sheet frame 11 has the transversely arranged edge, and the side of the sheet frame 11 forms an H-shaped structure, the edge of the side of the sheet frame 11 is clamped in the positioning boss 34 through the limiting groove 35 arranged on the positioning boss, and meanwhile, the positioning boss 34, the positioning blocks 31 and the positioning strips 32 at four corners form two opposite H-shaped positioning grooves, so that the sheet frame 11 with two opposite openings can be conveniently and quickly arranged in the positioning boss, and meanwhile, the positioning boss 34 and the limiting groove 35 on the positioning boss can further limit the movement of the sheet frame 11, and the positioning is accurate.

In this embodiment, as shown in fig. 3, the apparatus further includes a first limiting assembly, where the first limiting assembly includes: limiting plate 5 and limit stop 6, limiting plate 5 are fixed in the box 1, limit stop 6 is fixed in on the pushing hands subassembly 4, in order to restrict pushing hands subassembly 4 removes to the primary importance, and when limiting stop 6 and limiting plate 5 contact on pushing hands subassembly 4, pushing hands subassembly 4 was in the primary importance this moment, can't move right again, through limiting plate 5 and the limit stop 6 of mutually supporting, when pushing hands subassembly 4 removed toward the primary importance, can stop pushing hands subassembly 4 limit and be located the primary importance, no longer remove toward the outside, prevent that pushing hands subassembly 4 and box 1 from breaking away from the slippage.

In this embodiment, as shown in fig. 1 and 2, a first limiting opening 7 is formed in the pushing assembly 4, a second limiting opening 8 matched with the first limiting opening 7 is formed in the box body 1, the second limiting opening 8 is located on the box body 1 close to the first position side to limit the pushing assembly 4 to move to the second position, the pushing assembly 4 can be limited to be located at the second position through the first limiting opening 7 and the second limiting opening 8 which are matched with each other, namely, when the first limiting opening 7 is matched with the second limiting opening 8 in a propping manner, the pushing assembly 4 is limited not to move to the box body 1 side any more when the bottom of the first limiting opening 7 and the bottom of the second limiting opening 8 are contacted, and is located at the second position at this time, so that the wafer 12 is prevented from being extruded and damaged due to displacement again after being pushed into another shelf 11.

The box body 1 is internally provided with a track 9 arranged along the first direction, and the bottom of the push handle component 4 is provided with a slide block 10 connected with the track 9 in a sliding manner.

The push handle assembly 4 comprises: the first end of the fixing plate 41 extends into the box body 1 and is fixedly connected with the slider 10, specifically, the slider 10 is fixed at the bottom of the fixing plate 41, the flag panel 42 is fixed at the second end of the fixing plate 41, the first end face of the flag panel 42 is used for contacting with the wafer 12 in the wafer frame 11, and the second end face of the flag panel 42, which is far away from the first end face, is provided with a handle, so that the flag panel is convenient to hold in hand during pushing and pulling.

The fixing plate 41 is inserted into the box 1 and fixed with the slider 10, so that the entire pushing handle assembly 4 can stably slide along the first direction, and during the displacement process, the first end surface of the flag panel 42 on the fixing plate 41 can push the wafer 12 into another sheet frame 11 together.

In this embodiment, the first limiting opening 7 is formed at a joint of the bottom of the flag panel 42 and the fixing plate 41 and is close to one side of the box body 1.

In this embodiment, the limit stop 6 is disposed on the fixing plate 41 and located in the box 1.

The height of the first end surface of the flag panel 42 is not more than the surface spacing of the inner side surface of the sheet rack 11 in the vertical direction, and is not less than the maximum spacing of the sheet slots on the two sides in the sheet rack 11; the thickness of the first end surface of the flag panel 42 is not more than the horizontal width of the opening at the bottom surface of the sheet frame 11.

By controlling the height range of the first end surface of the flag panel 42, each wafer 12 can be completely pushed when the flag panel 42 extends into the wafer rack 11, and meanwhile, the flag panel does not interfere with the wafer rack 11.

The maximum distance between the two side slots is defined as the distance formed by the outer side surface between the two outermost slots in the sheet frame 11, that is, the sum of the slot widths of all the slots in the sheet frame 11 and the distance between the slots, so as to ensure that the flag panel 42 can completely push out the wafer 12 when extending into the sheet frame 11.

As shown in fig. 4 and 6, when the handle assembly 4 is located at the first position, the first end surface of the flag panel 42 is located at the first position side and outside the bottom surface of the sheet frame 11; as shown in fig. 5 and 7, when the pushing handle assembly 4 is located at the second position, the first end surface of the flag panel 42 is located at the second position side and is located 0-3mm inside the opening of the sheet frame 11, and by limiting the specific stop positions of the first position and the second position, if the second position is located at the specific stop position where the first end surface of the flag panel 42 extends into the opening of the sheet frame 11, the distance from the opening of the sheet frame 11 is 0-3mm, so as to avoid the wafer 12 from being damaged due to being pressed by excessive pushing, and when the first position is located, the flag panel 42 is completely located outside the sheet frame 11, so that the sheet frame 11 can be conveniently placed on the supporting platform 2.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer flip chip device, comprising:

the positioning assembly is arranged on the bearing platform;

2. The wafer reversing device of claim 1, wherein the positioning assembly comprises right-angle positioning blocks disposed at four corners of the supporting platform.

3. The wafer reversing device of claim 2, wherein the positioning assembly further comprises positioning strips disposed on edges of two sides of the supporting platform, and positioning notches for limiting flash of the opening of the wafer rack are respectively formed on opposite surfaces of the two positioning strips.

4. The wafer reversing device according to claim 3, further comprising two positioning bosses arranged at intervals along the first direction, wherein the two positioning bosses are respectively provided with a limiting groove matched with the side surface of the wafer frame.

5. The wafer flipping device of claim 1, further comprising a first stop assembly, the first stop assembly comprising:

the limiting plate is fixed in the box body;

6. The wafer rewinding device as claimed in claim 5, wherein the pushing assembly has a first limiting opening, and the box has a second limiting opening matching with the first limiting opening to limit the pushing assembly from moving to the second position.

7. The wafer rewinding device as claimed in claim 1, wherein a rail is disposed inside the box and arranged along the first direction, and a slider slidably connected to the rail is disposed at a bottom of the pusher assembly.

8. The wafer flipping apparatus of claim 7, wherein the pusher assembly comprises:

9. The wafer rewinding device as claimed in claim 8, wherein the height of the first end surface of the flag plate is not greater than the surface distance between the inner side surfaces of the film frame in the vertical direction and not less than the maximum distance between the film slots on the two sides of the film frame;

10. The wafer rewinding device as claimed in claim 8, wherein when the handle assembly is in the first position, the first end of the flag plate is located outside the bottom surface of the frame at the first position side; when the pushing handle assembly is located at the second position, the first end face of the flag panel is located at the second position side and is located 0-3mm away from the inner side of the opening of the film frame.