CN216358016U

CN216358016U - Feeding mechanism

Info

Publication number: CN216358016U
Application number: CN202122616027.1U
Authority: CN
Inventors: 王言田; 赵大涛
Original assignee: Suzhou Yirui Optoelectronics Technology Co ltd; Jiangsu Yirong Photoelectric Technology Co ltd
Current assignee: Suzhou Yirui Optoelectronics Technology Co ltd; Jiangsu Yirong Photoelectric Technology Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2022-04-19
Anticipated expiration: 2031-10-28

Abstract

The application relates to a feed mechanism, with the butt joint of chip mounter, include: a body having a guide groove; the conveying assembly is connected with the body and used for conveying the material belt from one end, far away from the chip mounter, of the guide groove to one end, close to the chip mounter, of the guide groove; the cushioning component is arranged in the guide groove; the cushioning component comprises a pressing part pressed against the material belt and a cushioning part arranged below the material belt. Through be provided with damper unit in the guide slot, this damper unit includes the part of bearing against with the material area and sets up the damper in the material area bottom, and the part of bearing against and damper mutually supports in order to prevent the material area vibration, convenient and fast.

Description

Feeding mechanism

[ technical field ] A method for producing a semiconductor device

The application relates to a feeding mechanism, and belongs to the technical field of printed circuit board manufacturing.

[ background of the invention ]

SMT is a Surface Mount Technology (Surface Mount Technology) (abbreviation) called Surface Mount or Surface Mount Technology. Is the most popular technology and process in the electronic assembly industry at present. The surface-mounted component (SMC/SMD, chip component in Chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is soldered and assembled by methods such as reflow soldering or dip soldering.

In the prior art, the material strip is generally conveyed to a chip mounter through a feeding mechanism. The material area can take place the shake in data send process, and then causes the device in the material area to turn on one's side the scheduling problem to lead to inhaling of chip mounter equipment to expect badly, not only cause to throw the material seriously, but also increased the manpower and removed the maintenance, seriously influenced production efficiency

Accordingly, there is a need for improvements in the art that overcome the deficiencies in the prior art.

[ Utility model ] content

An object of this application is to provide a feed mechanism, and it can slow down the shake in material area to make the material area carry stably.

The purpose of the application is realized by the following technical scheme: a feed mechanism interfaces with a placement machine, comprising:

a body having a guide groove;

the conveying assembly is connected with the body and used for conveying a material belt from one end, far away from the chip mounter, of the guide groove to one end, close to the chip mounter, of the guide groove; and

the cushioning component is arranged in the guide groove; the shock absorption component comprises a pressing part pressed against the material belt and a shock absorption part arranged below the material belt.

In one embodiment, the cushioning member is a pad, and the pad is attached to the bottom of the material belt.

In one embodiment, the surface of the gasket facing the tape is smooth.

In one embodiment, the gasket is made of rubber or silica gel.

In one embodiment, the pressing part has a pressing part, and the pressing surface of the pressing part is a smooth surface.

In one embodiment, the pressing surface is an outer convex arc surface.

In one embodiment, the pressing surface is an inclined surface, and the inclined surface is consistent with the moving direction of the material belt.

Compared with the prior art, the method has the following beneficial effects: through be provided with damper unit in the guide slot, this damper unit includes the part of bearing against with the material area and sets up the damper in the material area bottom, and the part of bearing against and damper mutually supports in order to prevent the material area vibration, convenient and fast.

[ description of the drawings ]

Fig. 1 is a schematic structural view of a feeding mechanism of the present application.

[ detailed description ] embodiments

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "comprising" and "having," as well as any variations thereof, in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, a feeding mechanism in a preferred embodiment of the present application is butted with a chip mounter to transport a device to the chip mounter, which is convenient and fast.

The feeding mechanism comprises a body 1 and a conveying assembly connected with the body 1, wherein the body 1 is provided with a guide groove, the guide groove is used for placing a material belt, the conveying assembly conveys the material belt from one end, far away from the chip mounter, of the guide groove to one end, close to the chip mounter, of the guide groove, and therefore the suction mechanism of the chip mounter can conveniently suck devices in the material belt.

The body 1 comprises a first component 11 and a second component 12 connected with the first component 11, wherein in the height direction of the feeding mechanism, the first component 11 is arranged in a manner of inclining from bottom to top from one side far away from the chip mounter to one side close to the chip mounter, and the inclining manner of the second component 12 is the same as that of the first component 11, which is not repeated herein. The channels open on the first part 11 and the second part 12.

The conveying assembly comprises a driving motor and a wheel set connected with the driving motor, the wheel set at least comprises two guide wheels, and the two guide wheels are respectively arranged at two ends of the guide groove. The material belt is sleeved on the wheel set, so that the driving motor drives the wheel set to rotate and then drives the material belt to move. The arrangement mode of the driving motor and the wheel set is a conventional mode, and the installation mode among the driving motor, the wheel set and the body 1 is also conventional, which is not described herein.

Among the prior art, because the length of guide slot is longer, the material area can take place to shake at the transmission in-process of drive assembly, can cause the device that holds in the material area to take place to squint and upset to lead to inhaling the material mechanism and can't absorb the device accuracy.

In order to solve the above technical problem, the feeding mechanism of the present application further includes a cushioning assembly 2. This damper sets up in the guide slot to slow down the vibrations in material area, prevent then that the device in the material area from taking place the phenomenon of upset or aversion.

Specifically, the cushioning component 2 includes a pressing member 22 pressing against the material belt, and a cushioning member 23 disposed below the material belt. The pressing element 22 is fixedly connected to the body 1 through the connecting element 21 and is disposed above the material belt to cooperate with the shock absorbing element 23 disposed below the material belt to prevent the material belt from vibrating. It should be noted that the pressing force of the pressing member 22 against the material belt is: and the material belt is attached to the material belt and cannot be deformed.

In the present embodiment, the number of the pressing members 22 and the shock absorbers 23 is not limited. In order to ensure the damping effect, a pressing part 22 and a damping part 23 are arranged on one side of the guide groove close to the chip mounter, the middle part of the guide groove and one side of the guide groove far away from the chip mounter.

In this embodiment, the shock absorbing member 23 is a pad, and the pad is attached to the bottom of the material belt. The surface of the gasket facing the material belt is a smooth surface. And, the material of gasket is rubber or silica gel, can not cause the destruction to the bottom in material area.

The pressing member 22 has a pressing portion, and a pressing surface of the pressing portion is a smooth surface. In one embodiment, the pressing surface is an outer convex arc surface; in another embodiment, the pressing surface is an inclined surface, and the inclined surface is in accordance with the moving direction of the material belt.

In summary, the following steps: through being provided with damper unit in the guide slot, this damper unit includes the part 22 and the shock attenuation piece of setting in the material area bottom that support with the material area, and part 22 and shock attenuation piece mutually support in order to prevent the material area vibration, convenient and fast.

The above is only one specific embodiment of the present application, and any other modifications based on the concept of the present application are considered as the protection scope of the present application.

Claims

1. The utility model provides a feed mechanism, with the butt joint of chip mounter, its characterized in that includes:

a body having a guide groove;

2. The feeding mechanism as recited in claim 1, wherein said cushioning member is a pad, said pad being attached to a bottom of said strip of material.

3. The feed mechanism as recited in claim 2, wherein a surface of said spacer facing said strip of material is smooth.

4. The feeding mechanism as recited in claim 2, wherein the gasket is made of rubber or silicone.

5. The feed mechanism as claimed in claim 1, wherein said pressing member has a pressing portion, and a pressing surface of said pressing portion is a smooth surface.

6. The feed mechanism as recited in claim 5, wherein said abutment surface is an arcuate convex surface.

7. The feeding mechanism as recited in claim 5, wherein said pressing surface is a sloped surface, said sloped surface being aligned with a direction of movement of said strip of material.