CN216356658U

CN216356658U - Crystal oscillator with protection function

Info

Publication number: CN216356658U
Application number: CN202122700965.XU
Authority: CN
Inventors: 陈新荣
Original assignee: Shenzhen Yikang Ruida Technology Co ltd
Current assignee: Shenzhen Yikang Ruida Technology Co ltd
Priority date: 2021-11-06
Filing date: 2021-11-06
Publication date: 2022-04-19
Anticipated expiration: 2031-11-06

Abstract

The utility model discloses a crystal oscillator with a protection function, which comprises a bonding pad and a ceramic base, wherein the ceramic base is arranged at the top end of the bonding pad, an IC chip is arranged at the top end of the ceramic base, a quartz wafer is arranged at the top end of the IC chip, a silver-plated electrode is arranged in the quartz wafer, pins are arranged at the bottom end of the ceramic base, a protection upper cover is arranged at the top end of the bonding pad, and outer flanges are arranged on the protection upper cover and two sides of the protection upper cover. This crystal oscillator that possesses safeguard function is through being provided with outer flange, the groove is glued to the point, epoxy seals glue, the outer flange edge that adopts fillet technology is not sharp, the risk of the improper operation stabbed the hand when reducing the overhaul, the closed compact structure of outer flange and interior shirt rim is reasonable, epoxy seals glue the leakproofness better, the structural design in cooperation point gluey groove improves waterproof performance from both sides, outside automatic drainage can be realized on the slope of protection upper cover top both sides, avoid rivers along the joint line infiltration, the poor problem of waterproof nature has been solved.

Description

Crystal oscillator with protection function

Technical Field

The utility model relates to the technical field of crystal oscillator manufacturing, in particular to a crystal oscillator with a protection function.

Background

The crystal oscillator and the whole crystal oscillator form a piezoelectric effect through mechanical deformation and voltage to form stable resonance frequency, thereby realizing an electronic element capable of converting mechanical energy and electric energy mutually. The crystal oscillator is divided into an active crystal oscillator and a passive crystal oscillator, wherein the passive crystal oscillator needs an external circuit to work in series, and the active crystal oscillator can vibrate.

Active crystal oscillator cost is higher than passive crystal oscillator, nevertheless in actual production process, because the volume is less, is difficult to the accuse precision, and some crystal oscillator's pin does not have the protection, receives the extrusion easily to produce deformation and causes the damage, and life is shorter, and whole waterproof performance that does not teach well, in addition, because the volume is less, must open the screw when overhauing inside electronic component, frequently overhaul can cause the junction wearing and tearing. The crystal oscillator with the protection function is improved in waterproof performance through transformation of the packaging structure, better protection is formed on the inner portion, cost is low, and later-stage maintenance is facilitated.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a crystal oscillator with a protection function, and aims to solve the problems that pins of the crystal oscillator are unprotected, easily deformed and damaged by extrusion and short in service life in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a crystal oscillator that possesses safeguard function, includes pad and ceramic substrate, the top of pad is provided with ceramic substrate, ceramic substrate's top is provided with the IC chip, the top of IC chip is provided with quartz wafer, quartz wafer's inside is provided with silver-plated electrode, ceramic substrate's bottom is provided with the pin, the top of pad is provided with the protection upper cover, protection upper cover and both sides are provided with outer flange.

Preferably, four groups of pins are arranged, and the pins extend from the bottom end of the ceramic base to the bottom end of the bonding pad.

Preferably, cushion blocks are arranged between the four corners of the bottom end of the pin and the four corners of the bottom end of the bonding pad, and the cushion blocks are connected with the bonding pad in an adhesive mode.

Preferably, the protection upper cover is made of metal, and slopes are arranged on two sides of the top end of the protection upper cover.

Preferably, both sides of the bonding pad are provided with inner skirt edges, and the inner skirt edges and the outer retaining edges are embedded to form glue dispensing grooves.

Preferably, the bottom end of the outer flange is in a fillet process, epoxy resin sealing glue is arranged in the dispensing groove, and the inner skirt edge and the outer flange are bonded and fixed through the epoxy resin sealing glue.

Preferably, two sides of the protective upper cover are flush with two sides of the bonding pad, and the quartz wafer, the IC chip and the ceramic base are all packaged inside the protective upper cover and the bonding pad.

Compared with the prior art, the utility model has the beneficial effects that: the crystal oscillator with the protection function not only realizes stable vibration frequency, better conversion effect, enhanced protection on pins, simple process, low manufacturing cost and convenient maintenance, but also realizes better waterproof performance;

(1) the crystal oscillator is provided with the ceramic base, the quartz wafer, the cushion block and the pins, the crystal oscillator is composed of the ceramic base, the quartz wafer and the pins, the pins are provided with a plurality of groups, silver-plated electrodes are arranged in the quartz wafer, the crystal oscillator has better elasticity, the conductivity of the crystal oscillator is improved, the vibration frequency is stabilized, the conversion effect is better, the four groups of pins extend to four corners of the bottom end of the bonding pad, the cushion block is arranged between the pins and the bonding pad, the pins can be prevented from being extruded and deformed by the pad due to extrusion vibration, the protection on the pins is effectively enhanced on the premise of not increasing the cost and the volume greatly, the structure is simple and practical, and the service life of the crystal oscillator is prolonged;

(2) the protective upper cover is made of metal materials and is tightly pressed with the bonding pad, two groups of outer flanges of the protective upper cover are matched with the inner skirt of the bonding pad, during packaging, packaging can be achieved only by dispensing packaging glue into the dispensing groove formed between the inner skirt and the outer flanges, the protective upper cover and the bonding pad are integrally formed through pressing by a die, the process is simple, the manufacturing cost is low, screw fixing is not needed, the problems of disassembly and repair abrasion or screw loss caused by the fact that the size of a screw is too small are solved, the maintenance circuit of the protective upper cover is more rapid when the protective upper cover is opened, dispensing is performed again for sealing, dispensing automatically overflows the dispensing groove, the condition of sealing failure caused by abrasion is avoided, and later maintenance is facilitated;

(3) through being provided with outer flange, the point is glued the groove, epoxy seals glue, the outer flange edge that adopts fillet technology is not sharp, the risk of the improper manipulation stabbed the hand when reducing the overhaul, the closed structure of outer flange and interior shirt rim is compact reasonable, epoxy seals the glue leakproofness better, the structural design in cooperation point gluey groove improves waterproof performance from both sides, outside automatic drainage can be realized on the slope of protection upper cover top both sides, avoid rivers along the joint line infiltration, thereby form better protection to internal element.

Drawings

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is an enlarged partial cross-sectional view taken at A in FIG. 1 according to the present invention;

FIG. 4 is a schematic top view of a quartz wafer according to the present invention.

In the figure: 1. a protective upper cover; 2. a quartz wafer; 3. an IC chip; 4. a ceramic base; 5. cushion blocks; 6. a pad; 7. a pin; 8. sealing epoxy resin; 9. dispensing a glue groove; 10. an outer flange; 11. an inner skirt edge; 12. a slope; 13. and (5) plating silver electrodes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1: referring to fig. 1-4, a crystal oscillator with a protection function includes a bonding pad 6 and a ceramic base 4, the ceramic base 4 is disposed on the top of the bonding pad 6, an IC chip 3 is disposed on the top of the ceramic base 4, a quartz wafer 2 is disposed on the top of the IC chip 3, a silver-plated electrode 13 is disposed inside the quartz wafer 2, a pin 7 is disposed at the bottom of the ceramic base 4, a protection upper cover 1 is disposed on the top of the bonding pad 6, and outer flanges 10 are disposed on the protection upper cover 1 and two sides of the protection upper cover 1;

four groups of pins 7 are arranged, the pins 7 extend from the bottom end of the ceramic base 4 to the bottom end of the bonding pad 6, cushion blocks 5 are arranged between the pins 7 and four corners of the bottom end of the bonding pad 6, and the cushion blocks 5 are connected with the bonding pad 6 in an adhesive mode;

specifically, as shown in fig. 1, fig. 2 and fig. 4, this crystal oscillator is by ceramic substrate 4, quartz wafer 2, and pin 7 constitute, pin 7 is provided with the multiunit, be provided with silvered electrode 13 in the quartz wafer 2, better elasticity has, improve this crystal oscillator's electric conductivity, thereby stabilize vibration frequency, the conversion effect is better, four group's pins 7 extend to 6 bottom four corners of pad, through be provided with cushion 5 between pin 7 and pad 6, can avoid pin 7 to receive extrusion vibration and pad 6 to cause extrusion deformation, under the prerequisite that does not increase cost and volume by a wide margin, effectively strengthen the protection to pin 7, simple structure is practical, crystal oscillator's life has been improved.

Example 2: the protective upper cover 1 is made of metal, slopes 12 are arranged on two sides of the top end of the protective upper cover 1, inner skirt edges 11 are arranged on two sides of a bonding pad 6, a glue dispensing groove 9 is formed by embedding the inner skirt edges 11 and outer blocking edges 10, the bottom end of each outer blocking edge 10 is in a fillet process, epoxy resin sealing glue 8 is arranged in each glue dispensing groove 9, and the inner skirt edges 11 and the outer blocking edges 10 are fixedly bonded through the epoxy resin sealing glue 8;

specifically, as shown in fig. 1, fig. 2 and fig. 3, the protective upper cover 1 is made of metal and is tightly pressed with the bonding pad 6, two groups of outer flanges 10 of the protective upper cover 1 are matched with the inner skirt 11 of the bonding pad 6, during packaging, the protective upper cover 1 and the bonding pad 6 are formed by integrally pressing and molding a die only by inserting packaging glue into a dispensing groove 9 formed between the inner skirt 11 and the outer flange 10, the protective upper cover 1 and the bonding pad 6 are sealed by the die, the process is simple, the manufacturing cost is low, screw fixation is not needed, the problem that the screw is lost or is solved due to small screw size, the maintenance circuit is more quickly maintained by opening the protective upper cover 1, the maintenance is sealed again after the maintenance is finished, the dispensing glue automatically overflows into the dispensing groove 9, the situation that the sealing is not good due to the abrasion is avoided, and the later maintenance is facilitated.

Example 3: the bottom end of the outer flange 10 adopts a fillet process, an epoxy resin sealing adhesive 8 is arranged in the dispensing groove 9, the inner skirt 11 and the outer flange 10 are fixedly bonded through the epoxy resin sealing adhesive 8, two sides of the protective upper cover 1 are flush with two sides of the bonding pad 6, and the quartz wafer 2, the IC chip 3 and the ceramic base 4 are all packaged inside the protective upper cover 1 and the bonding pad 6;

specifically, as shown in fig. 1, 2 and 3, the edge of the outer flange 10 adopting the fillet process is not sharp, the risk of stabbing hands by misoperation during overhaul is reduced, the closed structure of the outer flange 10 and the inner skirt 11 is compact and reasonable, the sealing performance of the epoxy resin sealing adhesive 8 is good, the waterproof performance is improved from two sides by matching the structural design of the adhesive dispensing groove 9, the slope 12 on two sides of the top end of the protective upper cover 1 can realize external automatic drainage, and water flow is prevented from permeating along a joint line, so that the internal elements are protected well.

The working principle is as follows: when the utility model is used, the two-pole electric field of the silver-plated electrode 13 of the quartz wafer 2 causes the wafer to generate mechanical deformation, the IC chip 3 applies a circuit to generate an alternating electric field to form stable vibration frequency, the integrated oscillator structure is formed by the IC chip and the pins 7, the silver-plated electrode 13 of the crystal oscillator has better elasticity, the conductivity of the crystal oscillator is improved, thereby stabilizing the vibration frequency and having better conversion effect, the four groups of pins 7 extend to four corners at the bottom end of the bonding pad 6, the cushion block 5 is arranged between the pins 7 and the bonding pad 6, the pins 7 can be prevented from being extruded and vibrated and extruded and deformed by the bonding pad 6, the protection of the pins 7 is enhanced, the protection upper cover 1 is made of metal material and is tightly pressed with the bonding pad 6, the two groups of outer flanges 10 of the protection upper cover 1 are matched with the inner skirt 11 of the bonding pad 6, when in packaging, the packaging can be sealed only by inserting packaging glue into a dispensing groove 9 formed between the inner skirt 11 and the outer flanges 10, protection upper cover 1 and pad 6 are by mould integrated into one piece press forming, the process is simple, the cost is with low costs, need not to adopt the screw fixation, avoid causing the problem of overhaul wearing and tearing or screw loss because the screw volume undersize, it is more swift to open protection upper cover 1 maintenance circuit, it is sealed to overhaul to finish the point again, the point is glued automatically and is overflowed a little glue groove 9, can not cause airtight improper condition because of wearing and tearing, the outer flange 10 edge that adopts fillet technology is sharp, reduce the risk of the improper stabbing hand of operation when overhauling, the closed structure of outer flange 10 and interior shirt rim 11 is compact reasonable, epoxy seals 8 leakproofness better, the structural design who glues groove 9 improves waterproof performance from both sides, outside automatic drainage can be realized to the slope 12 of protection upper cover 1 top both sides, avoid rivers along the infiltration of joint line, thereby form better protection to internal component.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A crystal oscillator with a protection function comprises a bonding pad (6) and a ceramic base (4), and is characterized in that: the top of pad (6) is provided with ceramic substrate (4), the top of ceramic substrate (4) is provided with IC chip (3), the top of IC chip (3) is provided with quartz wafer (2), the inside of quartz wafer (2) is provided with silver-plated electrode (13), the bottom of ceramic substrate (4) is provided with pin (7), the top of pad (6) is provided with protection upper cover (1), protection upper cover (1) and both sides are provided with outer flange (10).

2. The crystal oscillator with the protection function according to claim 1, characterized in that: the pins (7) are provided with four groups, and the pins (7) extend from the bottom end of the ceramic base (4) to the bottom end of the bonding pad (6).

3. The crystal oscillator with the protection function according to claim 1, characterized in that: cushion blocks (5) are arranged between the four corners of the bottom ends of the pins (7) and the bonding pads (6), and the cushion blocks (5) are in adhesive connection with the bonding pads (6).

4. The crystal oscillator with the protection function according to claim 1, characterized in that: the protection upper cover (1) is made of metal, and slopes (12) are arranged on two sides of the top end of the protection upper cover (1).

5. The crystal oscillator with the protection function according to claim 1, characterized in that: and inner skirt edges (11) are arranged on two sides of the bonding pad (6), and the inner skirt edges (11) and the outer flanges (10) are embedded to form a dispensing groove (9).

6. The crystal oscillator with the protection function according to claim 5, wherein: the bottom end of the outer flange (10) adopts a fillet process, an epoxy resin sealing adhesive (8) is arranged in the dispensing groove (9), and the inner skirt edge (11) and the outer flange (10) are fixedly bonded through the epoxy resin sealing adhesive (8).

7. The crystal oscillator with the protection function according to claim 1, characterized in that: the two sides of the protective upper cover (1) are flush with the two sides of the bonding pad (6), and the quartz wafer (2), the IC chip (3) and the ceramic base (4) are all packaged in the protective upper cover (1) and the bonding pad (6).