CN216354209U

CN216354209U - LED lamp panel and display screen

Info

Publication number: CN216354209U
Application number: CN202122779244.2U
Authority: CN
Inventors: 杨梅慧; 林伟瀚; 于海
Original assignee: Konka Group Co Ltd
Current assignee: Konka Group Co Ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-04-19
Anticipated expiration: 2031-11-12

Abstract

The utility model discloses an LED lamp panel and a display screen, comprising: a base plate; LED chip module, it is a plurality of LED chip module array sets up one side of bottom plate, in same row or/and same line, LED chip module includes: the LED chip comprises two blue LED chips and a green LED chip, wherein the green LED chip is positioned between the two blue LED chips; and the multilayer is glued, the multilayer is glued and is set up deviate from on the LED chip subassembly one side of bottom plate direction, the multilayer is glued and is included: the red quantum dot glue layer is arranged on the blue light LED chip and is positioned on one side of the green light LED chip. The problem of among the prior art when the booth apart from LED display lamp plate adopts flip-chip COB or half flip-chip COB method, red light is with high costs and ruddiness inefficiency is solved.

Description

LED lamp panel and display screen

Technical Field

The utility model relates to the technical field of LED display, in particular to an LED lamp panel and a display screen.

Background

LED displays are direct display technologies with the same high gamut and high contrast as OLEDs, but with higher brightness, better reliability and lifetime than OLEDs. In recent years, the proportion of LED display screens, especially small-spacing display screens, is continuously increased, especially the MiniLED and MicroLED process technologies are continuously mature, the pixel spacing of the LED display screens is continuously developed towards the miniaturization direction, and the PPI requirement of the display screens is higher and higher.

In the prior art, LED display is LED packaging lamp bead display, the LED packaging size is generally more than 1mm, and one pixel point consists of three LEDs of red, green and blue, so that the pixel interval is generally more than 2mm, and the PPI value is a single digit. With the technical development of MiniLED and micro led, RGB in the same package and COB process are developed, the pixel pitch is continuously reduced, and PPI is continuously improved. The COB process adopts the direct solid crystal of flip-chip RGB bare chip on the drive substrate, has saved the packaging process, and the MiniLED chip size is generally in 100um and below, therefore the display pixel interval can be accomplished very little.

However, since the price of the RGB three chips, especially the flip chip, is expensive, especially the price of the red chip is substantially 2.5 times that of the blue chip. Therefore, a semi-flip type mode is adopted, namely a green light and blue light flip chip and a red light chip are positively installed, and although the cost can be reduced to a certain extent, the gold wire bonding of the positively installed red light chip is increased, so that the reliability and the brightness of the product are influenced. More importantly, the voltage of red light is generally about 1.8V, while the voltage of blue-green chips is generally about 2.6-3V, so two driving voltages are needed by adopting an RGB three-color chip form, if the red light chips are driven by the blue light voltage, the extra voltage drop is loaded on a driving circuit element to form heat, and the temperature of the LED lamp panel is increased greatly.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

In view of the defects of the prior art, the utility model aims to provide an LED lamp panel and a display screen, and aims to solve the problems of high red light cost and low red light efficiency when a flip Chip On Board (COB) or semi-flip Chip On Board (COB) method is adopted by a small-spacing LED display lamp panel in the prior art.

The technical scheme of the utility model is as follows:

an LED lamp panel, comprising: a base plate;

LED chip module, it is a plurality of LED chip module array sets up one side of bottom plate, in same row or/and same line, LED chip module includes: the LED chip comprises two blue LED chips and a green LED chip, wherein the green LED chip is positioned between the two blue LED chips;

and the multilayer is glued, the multilayer is glued and is set up deviate from on the LED chip subassembly one side of bottom plate direction, the multilayer is glued and is included: the red quantum dot glue layer is arranged on the blue light LED chip and is positioned on one side of the green light LED chip.

Further, the multilayer glue further comprises:

and the black ink layer is arranged on the base plate, is positioned between the blue light LED chip and the green light LED chip, and is positioned between the blue light LED chip and the blue light LED chip.

Further, the black ink layer is higher than the LED chip assembly.

Further, the multilayer glue also comprises a transparent glue layer,

the transparent glue layer is arranged on the green LED chip and filled between the black ink layers on the two sides of the green LED chip; and

the transparent glue layer is arranged on the blue light LED chip on the other side of the green light LED chip and is filled between the black ink layers on the two sides of the blue light LED chip.

Further, the upper surface of the transparent glue layer is flush with the upper surface of the black ink layer;

the upper surface of the transparent glue layer is flush with the upper surface of the red quantum dot glue layer.

Further, the LED lamp panel still includes:

the waterproof oxygen barrier layer is arranged on one side, deviating from the direction of the LED chip assembly, of the multilayer adhesive.

Further, the height of the water-resisting and oxygen-resisting layer is less than 10 microns.

Further, the LED lamp panel still includes:

and the organic protective layer is arranged on one side of the water-resisting and oxygen-resisting layer, which deviates from the direction of the multilayer adhesive.

Further, the height of the organic protective layer is set to 50-100 μm.

A display screen, comprising: the LED lamp panel is as described above.

The beneficial effect of this scheme: according to the LED lamp panel and the display screen provided by the utility model, the plurality of LED chip assemblies are arranged on one side of the base plate in an array manner, the green LED chip is positioned between the two blue LED chips in the same row or/and in the same line, the multilayer adhesive is arranged on one side of the LED chip assemblies, which is far away from the direction of the base plate, the multilayer adhesive comprises a red quantum dot adhesive layer, the red quantum dot adhesive layer is arranged on the blue LED chip positioned on one side of the green LED chip to enable the blue LED chip to emit red light, the red quantum dot adhesive layer is coated on the blue LED chip adjacent to one side of the green LED chip, so that the cost is reduced, the photoelectric conversion efficiency is improved, different driving voltage circuits of the red LED chip are reduced, the wiring of a driving circuit is simplified, the PCB manufacturing process is simplified, and the cost of a driving substrate is reduced, the LED lamp panel has excellent photoelectric characteristics.

Drawings

FIG. 1 is a schematic view of an LED lamp panel structure of an embodiment of an LED lamp panel and a display screen of the utility model;

FIG. 2 is an array diagram of LED chip assemblies according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a black ink layer of an embodiment of an LED lamp panel and a display screen according to the utility model;

FIG. 4 is a schematic view of a transparent glue layer of an embodiment of an LED lamp panel and a display screen according to the utility model;

FIG. 5 is a schematic view of a red quantum dot dispensing layer of an embodiment of an LED lamp panel and a display screen of the utility model;

FIG. 6 is a schematic view of a water-resistant and oxygen-resistant layer of an embodiment of an LED lamp panel and a display screen according to the utility model;

description of reference numerals: 100. a base plate; 200. an LED chip assembly; 210. a blue LED chip; 220. a green LED chip; 300. a plurality of layers of glue; 310. a red quantum dot glue layer; 320. a black ink layer; 330. a transparent glue layer; 400. a water-resistant and oxygen-resistant layer; 500. and an organic protective layer.

Detailed Description

The utility model provides an LED lamp panel and a display screen, and in order to make the purpose, technical scheme and effect of the utility model clearer and clearer, the utility model is further described in detail below by referring to the attached drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The first embodiment is as follows:

as shown in fig. 1, the present invention provides an LED lamp panel, including: bottom plate 100, LED chip subassembly 200 to and multilayer is glued 300, bottom plate 100 can be the drive circuit base plate, and is a plurality of LED chip subassembly 200 array sets up in one side of bottom plate 100, in same row or/and same line, LED chip subassembly 200 includes: two blue LED chips 210 and a green LED chip 220 (in fig. 1, B denotes a blue LED chip 210, and G denotes a green LED chip 220), the green LED chip 220 being located between the two blue LED chips 210; the multi-layer adhesive 300 is disposed on a side of the LED chip assembly 200 facing away from the bottom plate 100, and the multi-layer adhesive 300 includes: a red quantum dot glue layer 310, wherein the red quantum dot glue layer 310 is disposed on the blue LED chip 210 at one side of the green LED chip 220. Through the setting, lieing in green glow LED chip 220 one side scribble on blue light LED chip 210 red quantum dot glue film 310 makes it send ruddiness, has avoided using ruddiness LED chip, has reduced LED chip cost, need not use the voltage of drive ruddiness LED chip simultaneously for RGB three-colour chip no longer need use two kinds of driving voltage, the heat of having avoided the pressure drop loading that comes out to form on the drive circuit component, makes the temperature of LED lamp plate rise a lot of problems.

In the above solution, by arranging the plurality of LED chip assemblies 200 in an array on one side of the base plate 100, and in the same column or/and the same row, the green LED chip 220 is located between two blue LED chips 210, and the multilayer adhesive 300 is arranged on one side of the LED chip assembly 200 away from the direction of the base plate 100, the multilayer adhesive 300 includes a red quantum dot adhesive layer 310, and the red quantum dot adhesive layer 310 is arranged on the blue LED chip 210 on one side of the green LED chip 220, so that the blue LED chip 210 emits red light, and the red quantum dot adhesive layer 310 is coated on the blue LED chip 210 adjacent to one side of the green LED chip 220, which not only reduces the cost, but also improves the photoelectric conversion efficiency, and also reduces different driving voltage circuits of the red LED chip, simplifies the wiring of the driving circuit, and simplifies the PCB manufacturing process, the cost of the driving substrate is reduced, and the LED lamp panel has excellent photoelectric characteristics.

As shown in fig. 1, in the structure of the specific embodiment of the present invention, taking the LED lamp panel as an example, which is horizontally placed on a horizontal plane, the LED lamp panel faces downward in a direction toward the bottom plate 100, and faces upward in a direction toward the LED chip assembly 200, the multilayer adhesive 300 further includes: a black ink layer 320, wherein the black ink layer 320 is disposed on the base plate 100, and is located between the blue LED chip 210 and the green LED chip 220, and between the blue LED chip 210 and the blue LED chip 210. The black ink layer 320 separates the blue LED chip 210 from the green LED chip 220, so that the LED chip assembly 200 emits upward light to block the light emitted from the blue LED chip 210 and the green LED chip 220 to the side. Specifically, the black ink layer 320 is arranged in the array at the blank between the LED chip assemblies 200, and is a black Bank matrix grid arranged in the array, the black ink layer 320 is printed out in an ink printing manner, wherein the black ink layer 320 is higher than the LED chip assemblies, that is, the black Bank matrix grid is higher than the LED chips, and the black Bank matrix grid is printed out and then needs to be cured, so that the black ink layer 320 is finally formed.

Specifically, the multilayer adhesive 300 further includes a transparent adhesive layer 330, and the transparent adhesive layer 330 is disposed on the green LED chip 220 and filled between the black ink layers 320 on two sides of the green LED chip 220; and the transparent glue layer 330 is disposed on the blue LED chip 210 on the other side of the green LED chip 220, and is filled between the black ink layers 320 on the two sides of the blue LED chip 210. The transparent glue layer 330 is disposed on the green LED chip 220 and the blue LED chip 210 on one side of the green LED chip 220, so that the green LED chip 220 and the blue LED chip 210 on one side of the green LED chip 220 can display the colors of the green LED chip 220 and the blue LED chip 210 themselves, and thus, the red and green colors are displayed together with the blue LED chip 210 on the other side of the green LED chip 220, and the transparent glue layer 330 can be disposed on the green LED chip 220 and the blue LED chip 210 on one side of the green LED chip 220 by printing. It is easy to think that the transparent glue layer 330 can also be set as a semi-transparent glue layer 330, without affecting the green LED chip 220 and the color of the blue LED chip 210 on one side of the green LED chip 220.

Specifically, the upper surface of the transparent glue layer 330 is flush with the upper surface of the black ink layer 320, and the upper surface of the transparent glue layer 330 is flush with the upper surface of the red quantum dot glue layer 310. Therefore, the black ink layer 320, the transparent adhesive layer 330 and the red quantum dot adhesive layer 310 are on the same horizontal plane, and the smoothness of the internal structure of the LED lamp panel is guaranteed.

As shown in fig. 1, in a structure of a specific embodiment of the present invention, the LED lamp panel further includes: a water-blocking oxygen-blocking layer 400 and an organic protective layer 500. The water-resisting and oxygen-resisting layer 400 is arranged on one side of the multilayer adhesive 300, which deviates from the direction of the LED chip assembly 200. That is, a water-blocking oxygen-blocking layer 400 may be coated on the red quantum dot adhesive layer 310 by an ALD atomic layer deposition process, and the water-blocking oxygen-blocking layer 400 is an inorganic coating layer and plays a role in blocking water and oxygen of the red quantum dot adhesive layer 310. Specifically, the height of the water-resisting and oxygen-blocking layer 400 is smaller than 10 μm, and the thickness of the water-resisting and oxygen-blocking layer 400 is reduced as much as possible on the premise that the water and oxygen blocking of the red quantum dot adhesive layer 310 is guaranteed, so that the thickness of the LED lamp plate is guaranteed. The organic protective layer 500 is arranged on the water-resisting oxygen-resisting layer 400 and deviates from one side of the direction of the multilayer glue 300, the organic protective layer 500 can be manufactured in a coating mode and is subjected to UV curing after being coated, the organic protective layer 500 is an organic coating and can play a physical and mechanical protection role on the water-resisting oxygen-resisting layer 400, specifically, the height of the organic protective layer 500 can be set to be 50-100 mu m, and the thickness of the organic protective layer 500 is thinned as much as possible on the premise that the water-resisting oxygen-resisting layer 400 is protected, so that the thickness of the LED lamp plate is guaranteed.

The LED lamp panel provided by the utility model has the following specific processing steps:

the method comprises the following steps: as shown in fig. 2, on the driving circuit substrate, the blue LED chips and the green LED chips are flip-chip distributed and die-bonded on the bottom board in a bulk transfer manner, the bottom board is on the driving substrate, and the blue LED chips and the green LED chips are specifically arranged in a blue-green blue sequence, that is, bgbbgbbgb. The LED chip assembly is set to be a flip MiniLED chip or a MicroLED chip with the size smaller than 100 um. PPI can be improved because the pixel pitch can be reduced only if the LED chip size is small enough.

Step two: as shown in fig. 3, the black ink layer 320, that is, a black Bank matrix grid, arranged in an array is printed between the blue LED chip 210 and the green LED chip 220 and between the blue LED chip 210 and the blue LED chip 210 by an ink printing method, and the black Bank grid is higher than the LED chips and is cured after printing.

Step three: as shown in fig. 4, in the BGBBGB-arranged chip, in the order of.gb.gb., one empty cell is the blue LED chip 210, the transparent glue layer 330 is printed over the green LED chip 220G and the blue LED chip 210B, and the transparent glue layer 330 is transparent glue or semi-transparent glue.

Step four: as shown in fig. 5, the red quantum dot paste layer 310, i.e., the red quantum dot paste array, is printed on the blue LED chip 210B of the blank, and then the red quantum dot paste layer 310 is cured. Thus, the blue LED chip 210B emits blue light, and after the blue light is irradiated into the red quantum dot adhesive layer 310, the red light is formed through photoluminescence conversion, i.e., the dot array forms a red light array. And combining the adjacent green light chip and the blue light chip to form the RGB full-color pixel. Because the light-emitting wave bands of the red light quantum dots and the blue-green light chip are narrow, and the full width at half maximum is about 20nm, the color gamut of the LED display screen is very high. Because the luminous efficiency of the red light quantum dots and the blue-green light chip is high, the brightness of the LED display screen is high. Meanwhile, due to the existence of the black ink layer 320, the contrast of the LED display screen is higher.

Step five: as shown in fig. 6, on one side above the red quantum dot adhesive layer 310, a layer of the water-blocking and oxygen-blocking layer 400, i.e., an inorganic plating layer, below 10um is plated through an ALD atomic layer deposition process, and the inorganic plating layer plays a role in blocking water and oxygen for the quantum dot material of the red quantum dot adhesive layer 310.

Step six: as shown in fig. 1, 50-100 um of the organic protective layer 500 is prepared above the inorganic coating layer by a coating method, and is subjected to UV curing after coating, and the organic protective layer 500 plays a role in physical and mechanical protection for the water-blocking and oxygen-blocking layer 400. Through the procedures, the LED lamp panel with RGB direct display can be manufactured.

Example two:

on the basis of the first embodiment, in a specific structure of the first embodiment of the present invention, the present invention provides a display screen, which includes the LED lamp panel according to the first embodiment. A circuit can be LED out of the back or the side of the LED lamp panel in the form of an FPC or a connector to be connected with an external system circuit, and one or more LED lamp panels are spliced into the display screen. Through the arrangement, the display screen only uses the blue light LED chip 210 and the green light LED chip 220, the driving voltage is close to the blue light LED chip, only one path of VCC driving circuit can be used, the driving circuit is simple, and the manufacturing cost is low.

In summary, according to the LED lamp panel and the display screen provided by the present invention, the plurality of LED chip assemblies 200 are arranged on one side of the base plate 100 in an array manner, and in the same column or/and the same row, the green LED chip 220 is located between two blue LED chips 210, and the multilayer adhesive 300 is arranged on one side of the LED chip assemblies 200 away from the direction of the base plate 100, the multilayer adhesive 300 includes a red quantum dot adhesive layer 310, and the red quantum dot adhesive layer 310 is arranged on the blue LED chip 210 located on one side of the green LED chip 220, so that the blue LED chip 210 emits red light, and the red quantum dot adhesive layer 310 is coated on the blue LED chip 210 adjacent to one side of the green LED chip 220, which not only reduces the cost, but also improves the photoelectric conversion efficiency, also reduces different driving voltage circuits of the red LED chips, and simplifies the driving circuit wiring, the PCB manufacturing process is simplified, the cost of the driving substrate is reduced, and the LED lamp panel has excellent photoelectric characteristics.

It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.

Claims

1. The utility model provides a LED lamp plate, its characterized in that includes: a base plate;

2. The LED lamp panel of claim 1, wherein the multilayer adhesive further comprises:

3. The LED lamp panel of claim 2, wherein the black ink layer is higher than the LED chip assembly.

4. The LED lamp panel of claim 2, wherein the multi-layer glue further comprises a transparent glue layer,

5. The LED lamp panel according to claim 4, wherein the upper surface of the transparent glue layer is flush with the upper surface of the black ink layer;

6. The LED lamp panel of claim 1, further comprising:

7. The LED lamp panel according to claim 6, wherein the height of the water-resisting and oxygen-resisting layer is less than 10 μm.

8. The LED lamp panel of claim 6, further comprising:

9. The LED lamp panel according to claim 8, wherein the height of the organic protective layer is set to be 50-100 μm.

10. A display screen, comprising: the LED lamp panel of any one of claims 1-9.