CN216349887U - Heat conduction adhesive heat conduction test sample block preparation clamp - Google Patents

Heat conduction adhesive heat conduction test sample block preparation clamp Download PDF

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Publication number
CN216349887U
CN216349887U CN202122873605.XU CN202122873605U CN216349887U CN 216349887 U CN216349887 U CN 216349887U CN 202122873605 U CN202122873605 U CN 202122873605U CN 216349887 U CN216349887 U CN 216349887U
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China
Prior art keywords
plate
side plate
heat conduction
die cavity
half die
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CN202122873605.XU
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Chinese (zh)
Inventor
张广达
葛超
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Shanghai Kelanbai New Material Technology Co.,Ltd.
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Shanghai Rezdun Functional Material Technology Co ltd
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Priority to CN202122873605.XU priority Critical patent/CN216349887U/en
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Abstract

The utility model discloses a heat conduction test sample block preparation clamp of a heat conduction adhesive, which comprises a forming assembly and a pressing plate detachably covered on the forming assembly, wherein the forming assembly comprises a bottom plate and a forming plate detachably covered on the bottom plate, the forming plate is formed by splicing and assembling a first single side plate and a second single side plate, the inner side wall of the first single side plate is provided with at least one first half die cavity, the position of the inner side wall of the second single side plate, which corresponds to the first half die cavity, is provided with at least one second half die cavity, the first half die cavity and the second half die cavity are combined to form a forming cavity, a locking assembly for locking the first single side plate and the second single side plate is arranged between the first single side plate and the second single side plate, the top surface of the first single side plate is provided with a first overflow groove communicated with the first half die cavity, the top surface of the second single side plate is provided with a second overflow groove communicated with the second half die cavity, the first end of the pressing plate is provided with a first handle, and the second end of the pressing plate is provided with a second handle.

Description

Heat conduction adhesive heat conduction test sample block preparation clamp
Technical Field
The utility model relates to a heat conduction testing sample block preparation clamp for a heat conduction adhesive.
Background
Before the heat conduction adhesive is used for conducting heat conduction testing, the heat conduction adhesive is needed to be used for preparing a test sample block, but the test sample block is large in thickness, and after the test sample block is prepared by using a mold, the test sample block is difficult to take down from the mold, demolding is difficult, and the preparation efficiency is low.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a heat conduction testing sample block preparation clamp for a heat conduction adhesive.
The technical scheme adopted by the utility model for solving the technical problems is as follows: constructing a heat conduction testing sample block preparing clamp of a heat conduction adhesive, wherein the preparing clamp comprises a forming assembly and a pressing plate which is detachably covered on the forming assembly, the forming assembly comprises a bottom plate and a forming plate which is detachably covered on the bottom plate, the forming plate is formed by splicing and assembling a first single side plate and a second single side plate, the inner side wall of the first single side plate is provided with at least one first half die cavity, the position of the inner side wall of the second single side plate, which corresponds to the first half die cavity, is provided with at least one second half die cavity, the first half die cavity and the second half die cavity are combined to form a forming cavity, a locking assembly for locking the first single side plate and the second single side plate is arranged between the first single side plate and the second single side plate, the top surface of the first single side plate is provided with a first overflow groove communicated with the first half die cavity, the top surface of the second single side plate is provided with a second overflow groove communicated with the second half die cavity, the first end of the pressing plate is provided with a first handle, and the second end of the pressing plate is provided with a second handle.
In the jig for preparing a heat conduction test sample block of a heat conduction adhesive according to the present invention, the first overflow groove extends to the outer side wall of the first single-sided board to form a first overflow port, and the second overflow groove extends to the outer side wall of the second single-sided board to form a second overflow port.
In the heat conduction testing sample block preparation clamp for the heat conduction adhesive, at least two first locking holes penetrating through the first single-side plate along the width direction of the first single-side plate are formed in the first single-side plate, at least two second locking holes penetrating through the second single-side plate along the width direction of the second single-side plate are formed in the second single-side plate, the first locking holes and the second locking holes are opposite in position, and the locking assembly comprises a screw rod capable of penetrating through the first locking holes and the second locking holes and a locking nut screwed on the screw rod.
In the heat conduction testing sample block preparation clamp of the heat conduction adhesive, the positions of the four peripheral corners and the middle part of the pressing plate are provided with the first connecting holes, the positions of the first single side plate and the second single side plate, which correspond to the first connecting holes, are provided with the second connecting holes, and the position of the bottom plate, which corresponds to the first connecting holes, is provided with the third connecting holes.
In the heat conduction testing sample block preparation clamp of the heat conduction adhesive, the pressure plate is made of a stainless steel material, and the surface of the pressure plate is coated with a Teflon coating.
In the heat conduction testing sample block preparation clamp of the heat conduction adhesive, the bottom plate, the first single-side plate and the second single-side plate are all made of polytetrafluoroethylene plastic materials.
The heat conduction adhesive heat conduction test sample block preparation clamp has the following beneficial effects: when the heat conduction adhesive heat conduction test sample block is used for preparing a clamp, the first single-side plate and the second single-side plate can be combined and locked through the locking assembly, then the forming plate formed by combination is fixed with the bottom plate, a certain amount of heat conduction adhesive is poured into the forming cavity formed by combination of the first half die cavity and the second half die cavity, then the pressing plate is pressed on the forming plate, the pressing plate, the forming plate and the bottom plate are fixed, in the fixing and extruding process, redundant materials in the forming cavity can flow out from the first overflow groove and the second overflow groove, and meanwhile, in the pressing process, an operator can also press downwards through the first handle and the second handle until the test sample block is formed. And then the pressing plate and the bottom plate are taken down from the forming plate, the first single-side plate and the second single-side plate are separated, and the test sample block positioned between the first single-side plate and the second single-side plate can be automatically demoulded, so that the demoulding efficiency is improved.
Drawings
The utility model will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic structural view of a fixture for preparing a heat conduction test sample block of a heat conductive adhesive according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, in a first embodiment of the clamp for preparing a heat conduction test sample block of a heat conduction adhesive according to the present invention, the clamp 1 comprises a molding assembly and a pressing plate 2 detachably covering the molding assembly, the molding assembly comprises a bottom plate 3 and a molding plate 4 detachably covering the bottom plate 3, the molding plate 4 is formed by splicing and assembling a first single-side plate 5 and a second single-side plate 6, the inner side wall of the first single-side plate 5 is provided with at least one first half mold cavity 7, the inner side wall of the second single-side plate 6 is provided with at least one second half mold cavity 8 at a position corresponding to the first half mold cavity 7, the first half mold cavity 7 and the second half mold cavity 8 are combined to form a molding cavity 9, a locking assembly for locking the first single-side plate 5 and the second single-side plate 6 is arranged between the first single-side plate 5 and the second single-side plate 6, the top surface of the first single-side plate 5 is provided with a first overflow groove 10 communicated with the first half mold cavity 7, the top surface of the second single-side plate 6 is provided with a second overflow trough 11 communicated with the second half die cavity 8, a first end of the pressing plate 2 is provided with a first handle 12, and a second end of the pressing plate 2 is provided with a second handle 13.
When the clamp 1 is prepared by using the heat conduction testing sample block of the heat conduction adhesive, the first single side plate 5 and the second single side plate 6 can be combined and locked through the locking assembly, then the forming plate 4 formed by combination and the bottom plate 3 are fixed, a certain amount of heat conduction adhesive is poured into the forming cavity 9 formed by combining the first half die cavity 7 and the second half die cavity 8, then the pressing plate 2 is pressed on the forming plate 4, and the pressing plate 2, the forming plate 4 and the bottom plate 3 are fixed, in the fixing and extruding process, redundant materials in the forming cavity 9 can flow out from the first overflow groove 10 and the second overflow groove 11, and meanwhile, in the pressing process, an operator can also press downwards through the first grip 12 and the second grip 13 until the testing sample block is formed. And then the pressing plate 2 and the bottom plate 3 are taken down from the forming plate 4, the first single-side plate 5 and the second single-side plate 6 are separated, and the test sample block positioned between the first single-side plate 5 and the second single-side plate 6 can be automatically demoulded, so that the demoulding efficiency is improved.
Specifically, the first overflow groove 10 extends to the outer side wall of the first single-sided plate 5 to form a first overflow port, and the second overflow groove 11 extends to the outer side wall of the second single-sided plate 6 to form a second overflow port.
In this embodiment, the first single-side plate 5 is provided with at least two first locking holes penetrating through the first single-side plate 5 along the width direction of the first single-side plate 5, the second single-side plate 6 is provided with at least two second locking holes penetrating through the second single-side plate 6 along the width direction of the second single-side plate 6, the first locking holes and the second locking holes are opposite in position, and the locking assembly includes a screw rod 14 capable of penetrating through the first locking holes and the second locking holes and a locking nut 15 screwed on the screw rod 14.
Furthermore, in order to fixedly connect the pressing plate 2, the forming plate 4 and the bottom plate 3, first connecting holes 16 are formed in the positions of the four corners and the middle of the pressing plate 2, second connecting holes 17 are formed in the positions, corresponding to the first connecting holes 16, of the first single-side plate 5 and the second single-side plate 6, and third connecting holes 18 are formed in the positions, corresponding to the first connecting holes 16, of the bottom plate 3.
When the pressing plate 2, the forming plate 4 and the bottom plate 3 need to be fixed, the pressing plate 2, the forming plate 4 and the bottom plate 3 can also be locked and fixed by using bolts and nuts.
Preferably, in order to increase the downward pressure of the pressure plate 2, the pressure plate 2 is made of stainless steel material, and the surface of the pressure plate 2 is coated with teflon.
In order to facilitate demoulding, the bottom plate 3, the first single-side plate 5 and the second single-side plate 6 are all made of polytetrafluoroethylene plastic materials.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (6)

1. A heat conduction adhesive heat conduction test sample block preparation clamp is characterized by comprising a forming assembly and a pressing plate, wherein the pressing plate is detachably arranged on the forming assembly in a covering mode, the forming assembly comprises a bottom plate and a forming plate, the forming plate is detachably arranged on the bottom plate in a covering mode, the forming plate is formed by splicing and assembling a first single-side plate and a second single-side plate, at least one first half die cavity is arranged on the inner side wall of the first single-side plate, at least one second half die cavity is arranged at the position, corresponding to the first half die cavity, of the inner side wall of the second single-side plate, the first half die cavity and the second half die cavity are combined to form a forming cavity, a locking assembly for locking the first single-side plate and the second single-side plate is arranged between the first single-side plate and the second single-side plate, and a first overflow groove communicated with the first half die cavity is arranged on the top surface of the first single-side plate, the top surface of the second single-side plate is provided with a second overflow groove communicated with the second half die cavity, the first end of the pressing plate is provided with a first handle, and the second end of the pressing plate is provided with a second handle.
2. A heat conductive test sample block preparing jig according to claim 1, wherein the first overflow groove extends to a position of an outer side wall of the first single-sided board to form a first overflow port, and the second overflow groove extends to a position of an outer side wall of the second single-sided board to form a second overflow port.
3. The heat conduction adhesive heat conduction test sample block preparation jig of claim 1, wherein the first single-sided board is provided with at least two first locking holes penetrating through the first single-sided board along the width direction of the first single-sided board, the second single-sided board is provided with at least two second locking holes penetrating through the second single-sided board along the width direction of the second single-sided board, the first locking holes and the second locking holes are opposite in position, and the locking assembly comprises a screw rod capable of penetrating through the first locking holes and the second locking holes and a locking nut screwed on the screw rod.
4. The jig for preparing a thermal conductivity test piece according to claim 1, wherein the pressing plate has first connecting holes at four corners and a middle portion, the first and second single-sided plates have second connecting holes at positions corresponding to the first connecting holes, and the bottom plate has third connecting holes at positions corresponding to the first connecting holes.
5. The fixture for preparing a thermal conductivity test sample block of thermal conductive adhesive according to claim 1, wherein the pressing plate is made of stainless steel material, and a teflon coating is coated on the surface of the pressing plate.
6. The jig for preparing a thermal conductivity test sample block of thermal conductive adhesive according to claim 5, wherein the bottom plate, the first single-sided plate and the second single-sided plate are made of a teflon plastic material.
CN202122873605.XU 2021-11-22 2021-11-22 Heat conduction adhesive heat conduction test sample block preparation clamp Active CN216349887U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122873605.XU CN216349887U (en) 2021-11-22 2021-11-22 Heat conduction adhesive heat conduction test sample block preparation clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122873605.XU CN216349887U (en) 2021-11-22 2021-11-22 Heat conduction adhesive heat conduction test sample block preparation clamp

Publications (1)

Publication Number Publication Date
CN216349887U true CN216349887U (en) 2022-04-19

Family

ID=81152548

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122873605.XU Active CN216349887U (en) 2021-11-22 2021-11-22 Heat conduction adhesive heat conduction test sample block preparation clamp

Country Status (1)

Country Link
CN (1) CN216349887U (en)

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GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220823

Address after: Room 601-3, Building 14, No. 58, Wenxiang East Road, Songjiang District, Shanghai, 201600

Patentee after: Shanghai Kelanbai New Material Technology Co.,Ltd.

Address before: Room 601-1, building 14, No. 58, Wenxiang East Road, Songjiang District, Shanghai 201600

Patentee before: Shanghai rezdun functional material technology Co.,Ltd.

TR01 Transfer of patent right