CN216349913U - Dielectric property sample preparation facilities that laboratory was glued with heat conduction structure - Google Patents
Dielectric property sample preparation facilities that laboratory was glued with heat conduction structure Download PDFInfo
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- CN216349913U CN216349913U CN202122874138.2U CN202122874138U CN216349913U CN 216349913 U CN216349913 U CN 216349913U CN 202122874138 U CN202122874138 U CN 202122874138U CN 216349913 U CN216349913 U CN 216349913U
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Abstract
The utility model discloses a dielectric property sample preparation device for laboratory heat-conducting structural adhesive, which comprises a forming plate and a pressing plate detachably covered on the forming plate, wherein the forming plate is provided with at least one forming cavity and overflow grooves which are positioned at two sides of the forming cavity and communicated with the forming cavity, the overflow grooves extend to the side wall of the forming plate and form overflow ports, a first handle is arranged at a first end of the pressing plate, and a second handle is arranged at a second end of the pressing plate. During the use, pour every shaping intracavity on the shaping board with a certain amount of heat-conducting adhesive, then aim at the clamp plate and compress tightly downwards the shaping board, at this in-process, the first handle of operating personnel hand and the downward application of force of second handle, the heat-conducting adhesive suppression in with the shaping intracavity is full of the shaping chamber for the heat-conducting adhesive shaping. By using the preparation device provided by the utility model, the dielectric property test sample of the heat-conducting structural adhesive can be rapidly prepared in batches, the preparation efficiency is improved, and the quality of the test sample is ensured.
Description
Technical Field
The utility model relates to a preparation device for a dielectric property sample of a heat-conducting structural adhesive for a laboratory.
Background
Before carrying out heat conduction gluing agent dielectric test, need use heat conduction gluing agent preparation test sample, current heat conduction gluing agent test style preparation process is comparatively complicated, the quick preparation of being not convenient for.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a preparation device for a dielectric property sample of a heat-conducting structural adhesive for a laboratory.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model provides a dielectric property sample preparation facilities that laboratory was glued with heat conduction structure, this preparation facilities include the profiled sheeting and can dismantle the clamp plate that the lid was located on this profiled sheeting, be equipped with at least one shaping chamber on this profiled sheeting and be located this shaping chamber both sides and with the overflow launder of this shaping chamber intercommunication, this overflow launder extends to this profiled sheeting lateral wall and forms the overflow mouth, the first end of this clamp plate is equipped with first handle, this clamp plate second end is equipped with the second handle.
In the device for preparing the dielectric property sample of the heat-conducting structural adhesive for the laboratory, the depth of the overflow groove is less than or equal to the depth of the forming cavity.
In the device for preparing the dielectric property sample of the heat-conducting structural adhesive for the laboratory, the connecting part of the overflow groove and the forming cavity is provided with a convex rib protruding out of the forming cavity, and the height of the convex rib is less than the depth of the forming cavity.
In the device for preparing the dielectric property sample of the heat-conducting structural adhesive for the laboratory, the cross section of the convex rib is in a triangular shape, wherein the thickness of the bottom end of the convex rib is larger than that of the top end of the convex rib.
In the dielectric property sample preparation device for the laboratory heat-conducting structural adhesive, the positions of the peripheral corners and the middle part of the bottom end of the pressing plate are respectively provided with a first connecting hole, and the position of the forming plate corresponding to the first connecting hole is provided with a second connecting hole.
In the dielectric property sample preparation device for the laboratory heat-conducting structural adhesive, the pressure plate is a stainless steel pressure plate, and the surface of the pressure plate is coated with a Teflon coating.
In the dielectric property sample preparation device of the heat-conducting structural adhesive for the laboratory, the forming plate is made of a polytetrafluoroethylene plastic material.
In the dielectric property sample preparation device for the laboratory heat-conducting structural adhesive, the forming plate is a cuboid plate-shaped forming plate, a first accommodating groove which is sunken in the forming plate is formed in the middle of a first side wall of the forming plate, a second accommodating groove which is sunken in the forming plate is formed in the middle of a second side wall of the forming plate, the first side wall of the forming plate and the second side wall of the forming plate are two adjacent side walls of the forming plate, a first bubble level meter is horizontally and fixedly placed in the first accommodating groove, and a second bubble level meter is horizontally and fixedly placed in the second accommodating groove.
The dielectric property sample preparation device for the laboratory heat-conducting structural adhesive has the following beneficial effects: when the dielectric property sample preparation device for the laboratory heat-conducting structural adhesive is used, a certain amount of heat-conducting adhesive is poured into each forming cavity on the forming plate, then the pressing plate is aligned to the forming plate and is pressed downwards, in the process, an operator can hold the first handle and the second handle to apply force downwards, the heat-conducting adhesive in the forming cavity is pressed and filled in the forming cavity, and the heat-conducting adhesive is formed. And the redundant heat-conducting adhesive in the molding cavity can flow out from overflow grooves at two sides of the molding cavity in the extrusion process. By using the preparation device provided by the utility model, the dielectric property test sample of the heat-conducting structural adhesive can be rapidly prepared in batches, the preparation efficiency is improved, and the quality of the test sample is ensured.
Drawings
The utility model will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic structural diagram of a dielectric property sample preparation device of the heat-conducting structural adhesive for the laboratory.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, in a first embodiment of the apparatus for preparing a dielectric property sample of a laboratory heat-conducting structural adhesive according to the present invention, the apparatus 1 includes a forming plate 2 and a pressing plate 3 detachably covering the forming plate 2, the forming plate 2 is provided with at least one forming cavity 4 and overflow grooves 5 located at two sides of the forming cavity 4 and communicated with the forming cavity 4, the overflow grooves 5 extend to a side wall of the forming plate 2 and form an overflow port, a first end of the pressing plate 3 is provided with a first handle 6, and a second end of the pressing plate 3 is provided with a second handle 7.
When the dielectric property sample preparation device 1 for the laboratory heat-conducting structural adhesive is used, a certain amount of heat-conducting adhesive is poured into each forming cavity 4 on the forming plate 2, then the pressing plate 3 is aligned to the forming plate 2 and pressed downwards, in the process, an operator can hold the first handle 6 and the second handle 7 to apply force downwards, the heat-conducting adhesive in the forming cavity 4 is pressed and filled in the forming cavity 4, and the heat-conducting adhesive is formed. And the redundant heat-conducting adhesive in the cavity 4 can flow out from overflow grooves 5 at two sides of the molding cavity 4 in the extrusion process. By using the preparation device 1 disclosed by the utility model, the dielectric property test sample of the heat-conducting structural adhesive can be rapidly prepared in batches, the preparation efficiency is improved, and the quality of the test sample is ensured.
In this embodiment, the depth of the overflow launder 5 is less than or equal to the depth of the forming cavity 4. Preferably, the depth of the overflow channel 5 is equal to the depth of the forming cavity 4.
Furthermore, a convex rib 8 protruding out of the molding cavity 4 is arranged at the joint of the overflow groove 5 and the molding cavity 4, and the height of the convex rib 8 is smaller than the depth of the molding cavity 4. After the heat-conducting structural adhesive flows into the overflow groove 5, the test sample in the overflow groove 5 and the forming cavity 4 is cut by the convex ribs 8 to form a folding line, so that the redundant part on the periphery of the test sample can be conveniently broken and removed in the later period.
Preferably, the rib 8 has a triangular shape in cross section with a bottom thickness greater than a top thickness.
Furthermore, the positions of the peripheral corners and the middle position of the bottom end of the pressing plate 3 are respectively provided with a first connecting hole 9, and the position of the forming plate 2 corresponding to the first connecting hole 9 is provided with a second connecting hole 10. In fixedly connecting the pressing plate 3 and the molding plate 2, butterfly bolts may be used for fixing through the first connection holes 9 and the second connection holes 10.
In order to facilitate the demoulding of the test sample, the pressing plate 3 is a stainless steel pressing plate 3, and the surface of the pressing plate 3 is coated with a Teflon coating.
Further, the forming plate 2 is made of a teflon plastic material.
For guaranteeing that profiled sheeting 2 level is placed, improve the shaping stability of sample, this profiled sheeting 2 is the platelike profiled sheeting 2 of cube, the first lateral wall middle part of this profiled sheeting 2 is equipped with the first storage tank to sunken in this profiled sheeting 2, the second lateral wall middle part of this profiled sheeting 2 is equipped with the second storage tank to sunken in this profiled sheeting 2, the first lateral wall of this profiled sheeting 2 and the second lateral wall of profiled sheeting 2 are two adjacent lateral walls of profiled sheeting 2, the level is fixed to be placed first bubble spirit level 11 in this first storage tank, the level is fixed to be placed second bubble spirit level 12 in this second storage tank.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The utility model provides a dielectric property sample preparation facilities that heat conduction structure glued is used in laboratory, its characterized in that, preparation facilities include the profiled sheeting and can dismantle the lid and locate the clamp plate on the profiled sheeting, be equipped with at least one shaping chamber on the profiled sheeting and be located shaping chamber both sides and with the overflow launder of shaping chamber intercommunication, the overflow launder extends to the profiled sheeting lateral wall forms the overflow mouth, clamp plate first end is equipped with first handle, clamp plate second end is equipped with the second handle.
2. The apparatus for preparing dielectric property sample of heat-conducting structural adhesive for laboratory use according to claim 1, wherein the depth of the overflow groove is less than or equal to the depth of the forming cavity.
3. The apparatus for preparing the dielectric property sample of the laboratory heat-conducting structural adhesive according to claim 2, wherein a rib protruding from the molding cavity is arranged at the joint of the overflow groove and the molding cavity, and the height of the rib is less than the depth of the molding cavity.
4. The apparatus for preparing dielectric property sample of laboratory heat-conducting structural adhesive according to claim 3, wherein the cross section of the convex rib is triangular with a bottom thickness larger than a top thickness.
5. The apparatus for preparing dielectric property sample with heat conducting structural adhesive for laboratory according to claim 1, wherein the pressing plate has first connecting holes at the corners and the middle part of the bottom, and the forming plate has second connecting holes at the corresponding positions of the first connecting holes.
6. The apparatus for preparing the dielectric property sample of the laboratory heat-conducting structural adhesive according to claim 1, wherein the pressing plate is a stainless steel pressing plate, and a Teflon coating is coated on the surface of the pressing plate.
7. The apparatus for preparing dielectric property sample of laboratory heat-conducting structural adhesive according to claim 6, wherein the forming plate is made of polytetrafluoroethylene plastic material.
8. The apparatus for preparing a dielectric property sample of a laboratory heat-conducting structural adhesive according to claim 1, wherein the molding plate is a cubic plate-shaped molding plate, a first accommodating groove is formed in the middle of a first side wall of the molding plate, the first accommodating groove is recessed into the molding plate, a second accommodating groove is formed in the middle of a second side wall of the molding plate, the first side wall of the molding plate and the second side wall of the molding plate are two adjacent side walls of the molding plate, a first bubble level gauge is horizontally and fixedly placed in the first accommodating groove, and a second bubble level gauge is horizontally and fixedly placed in the second accommodating groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122874138.2U CN216349913U (en) | 2021-11-22 | 2021-11-22 | Dielectric property sample preparation facilities that laboratory was glued with heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122874138.2U CN216349913U (en) | 2021-11-22 | 2021-11-22 | Dielectric property sample preparation facilities that laboratory was glued with heat conduction structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216349913U true CN216349913U (en) | 2022-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122874138.2U Active CN216349913U (en) | 2021-11-22 | 2021-11-22 | Dielectric property sample preparation facilities that laboratory was glued with heat conduction structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216349913U (en) |
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2021
- 2021-11-22 CN CN202122874138.2U patent/CN216349913U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20220829 Address after: Room 601-3, Building 14, No. 58, Wenxiang East Road, Songjiang District, Shanghai, 201600 Patentee after: Shanghai Kelanbai New Material Technology Co.,Ltd. Address before: Room 601-1, building 14, No. 58, Wenxiang East Road, Songjiang District, Shanghai 201600 Patentee before: Shanghai rezdun functional material technology Co.,Ltd. |