CN216337922U - Funnel formula sputtering tool - Google Patents
Funnel formula sputtering tool Download PDFInfo
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- CN216337922U CN216337922U CN202121722691.8U CN202121722691U CN216337922U CN 216337922 U CN216337922 U CN 216337922U CN 202121722691 U CN202121722691 U CN 202121722691U CN 216337922 U CN216337922 U CN 216337922U
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Abstract
The utility model relates to a funnel type sputtering jig which comprises a jig body, wherein the jig body is funnel-shaped, the upper part of the jig body is large, the lower part of the jig body is small, the jig body comprises a bottom plate (1) and a side plate (2), the side plate (2) is obliquely arranged, and a glue film (3) is attached to the inner side wall of the side plate (2). The funnel type sputtering jig provided by the utility model has the advantages that the BGA product is clamped on the side wall of the jig through the inclination angle of the jig, the tin ball at the bottom of the product is protected, and the sputtering process of the BGA product or other products with irregular bottoms is realized.
Description
Technical Field
The utility model relates to a funnel type sputtering jig which is suitable for double-sided packaging or POP and other packaging modes requiring ball planting and sputtering, and belongs to the technical field of semiconductor packaging.
Background
The existing sputtering process scheme of the BGA product generally protects the solder balls at the bottom of the product by means of a UV film or a double-sided adhesive tape. The UV film scheme is that the bottom solder balls are embedded into the UV film, and the solder balls (the height of the balls is about 60 um) are embedded into the UV film, so that the bottom of the BGA product is protected from being sputtered; the double-sided adhesive scheme is characterized in that through a middle opening, the tin balls at the bottom of the BGA are placed in the hole, and the edge of the bottom of the BGA is carried on the double-sided adhesive, so that the back of the BGA is protected from being sputtered.
BGA products have no better proposal at present, mainly because the height of the solder ball is higher, the thickness of the UV glue film is limited, and the solder ball can not be completely embedded to cause the overflow plating; in addition, the solder ball is close to the edge of the product and cannot be carried on the double-sided adhesive. Therefore, the current BGA products must be adjusted in the design section to meet the UV film scheme or the double-sided tape scheme.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the present invention is to provide a funnel type sputtering jig for the above prior art, in which the BGA product is clamped on the sidewall of the jig through the inclination angle of the jig, so as to protect the solder balls at the bottom of the product, thereby realizing the sputtering process of the BGA product or other products with irregular bottoms.
The technical scheme adopted by the utility model for solving the problems is as follows: the utility model provides a funnel formula sputtering tool, it includes the tool body, the tool body is big-end-up's hourglass hopper-shaped, the tool body includes bottom plate and curb plate, the curb plate slope is arranged, the side wall inside wall upper band has the glued membrane.
Optionally, the center of the bottom plate is provided with a first through hole.
Optionally, a layer of buffer material is laid on the surface of the bottom plate.
Optionally, the buffer material is provided with a second through hole at a position corresponding to the first through hole.
Compared with the prior art, the utility model has the advantages that:
the funnel type sputtering jig provided by the utility model has the advantages that the BGA product is clamped on the side wall of the jig through the inclination angle of the jig, the tin ball at the bottom of the product is protected, and the sputtering process of the BGA product or other products with irregular bottoms is realized.
Drawings
FIG. 1 is a schematic view of a funnel sputtering jig according to the present invention in an operating state.
FIG. 2 is a schematic view of a funnel sputtering jig in another working state according to the present invention.
Fig. 3 is a schematic diagram of the dimensional relationship between the jig and the product.
Wherein:
First through hole 4
A second through hole 6.
Detailed Description
The utility model is described in further detail below with reference to the accompanying examples.
As shown in fig. 1 to 3, the funnel-type sputtering jig according to the present invention comprises a jig body, wherein the jig body is funnel-shaped with a large top and a small bottom, the jig body comprises a bottom plate 1 and a side plate 2, the side plate 2 is obliquely arranged, and a glue film 3 is adhered to the inner side wall of the side plate 2;
a first through hole 4 is formed in the center of the bottom plate 1;
the base plate 1Inner partA layer of buffer material 5 is laid on the surface;
the buffering material 5 is provided with a second through hole 6 at the corresponding position of the first through hole 4;
the buffer material 5 is foam;
when the solder ball at the bottom of the product contacts the buffer material: the diameter of the product solder ball is set as D, the distance from the edge of the product to the edge of the solder ball is set as e, the length of the product is set as X, the height of the product is set as Z, the inclination angle of the jig is set as theta, the length of the upper opening of the jig is set as a, the length of the lower opening of the jig is set as b, and the height of the lower opening of the jig is set as c.
As shown in fig. 3, when the solder ball at the bottom of the product contacts the buffer material at the bottom of the fixture, in order to ensure that the periphery of the inclined fixture does not touch the solder ball, at this time, tan θ is D/e, so θ is arc tan D/e, and the range of the angle of the side plate of the fixture is: and the arc tan D/X is not more than theta and is less than 90 degrees.
In order to ensure that the product can have enough space to be put into the jig, the height C of the jig must be more than or equal to Z + D, the length b of the bottom of the jig must be less than the length X of the product, and the length a of the upper opening of the jig satisfies the following formula: 2Z × e/D + X > a > X.
As shown in fig. 1 and 2, the working principle of a funnel type sputtering jig according to the present invention is as follows:
utilize the sputtering tool of this kind of funnel formula, put into the tool with the BGA product through the suction nozzle in, let the bottom of BGA product or lateral wall card on the glued membrane 3 of tool curb plate 2 inside walls, the bottom tin ball of BGA product can contact buffer material 5 or bottom tin ball does not contact buffer material 5 this moment, the main objective of sputtering tool is around blocking the BGA product for the lateral wall, and protection BGA product bottom is not sputtered the metal, and the buffer material 5 of bottom prevents bottom tin ball damage for the protection cushioning effect. Meanwhile, the bottom of the jig and the middle area of the buffer material are hollowed to form a through hole, and the ejector pin can be ejected upwards from the bottom when the jig is finally separated from the buffer material, so that the sputtered BGA product can be taken away by matching with the suction nozzle on the upper portion.
In addition, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.
Claims (4)
1. A funnel formula sputtering tool which characterized in that: it includes the tool body, the tool body is big-end-up's hourglass hopper-shaped, the tool body includes bottom plate (1) and curb plate (2), curb plate (2) slope is arranged, it has glued membrane (3) to paste on curb plate (2) inside wall.
2. The funnel-type sputtering jig of claim 1, wherein: the center of the bottom plate (1) is provided with a first through hole (4).
3. The funnel-type sputtering jig of claim 1, wherein: a layer of buffer material (5) is laid on the surface of the bottom plate (1).
4. A funnel-type sputtering jig according to claim 3, wherein: and a second through hole (6) is formed in the foam (5) at the corresponding position of the first through hole (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121722691.8U CN216337922U (en) | 2021-07-28 | 2021-07-28 | Funnel formula sputtering tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121722691.8U CN216337922U (en) | 2021-07-28 | 2021-07-28 | Funnel formula sputtering tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216337922U true CN216337922U (en) | 2022-04-19 |
Family
ID=81159760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121722691.8U Active CN216337922U (en) | 2021-07-28 | 2021-07-28 | Funnel formula sputtering tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216337922U (en) |
-
2021
- 2021-07-28 CN CN202121722691.8U patent/CN216337922U/en active Active
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