CN216311757U

CN216311757U - Three-dimensional embedded packaging structure

Info

Publication number: CN216311757U
Application number: CN202122599579.6U
Authority: CN
Inventors: 陈先明; 洪业杰; 黄本霞; 黄高
Original assignee: Zhuhai Yueya Semiconductor Co ltd
Current assignee: Zhuhai Yueya Semiconductor Co ltd
Priority date: 2021-10-27
Filing date: 2021-10-27
Publication date: 2022-04-15
Anticipated expiration: 2031-10-27

Abstract

The utility model discloses a three-dimensional embedded packaging structure which comprises a connecting soft board, a first bearing board, a second bearing board and a packaging layer. The connecting soft board is provided with a connecting circuit; one end of the first bearing plate is connected with the first end of the connecting soft plate, a first component and a first circuit are arranged on the first bearing plate, and the first circuit is electrically connected with the first component and the connecting circuit respectively; one end of the second bearing plate is connected with the second end of the connecting soft plate, a bending included angle is formed between the second bearing plate and the first bearing plate through the connecting soft plate, the bending included angle is smaller than 180 degrees, a second component and a second circuit are arranged on the second bearing plate, and the second circuit is electrically connected with the second component and the connecting circuit respectively; the packaging layer is connected with the first bearing plate and the second bearing plate respectively. The three-dimensional embedded packaging structure disclosed by the utility model is beneficial to reducing the sizes of the packaging body in the X direction and the Y direction.

Description

Three-dimensional embedded packaging structure

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a three-dimensional embedded packaging structure.

Background

With the development of technology, the current electronic devices are being developed toward miniaturization, light weight and multiple functions, which leads to more and more complex integrated circuits and more components of semiconductor packages, and this in itself restricts the development of miniaturization and light weight of packages. At present, the packaging methods mainly used include Wire Bonding (WB) packaging and Flip Chip (FC) packaging. However, in both of these packaging methods, components need to be mounted on the surface of the substrate in a tiled manner, and with the increase of components, the size of the package cannot be effectively reduced in the X direction and the Y direction, and it is difficult to meet the development requirements of high-density integration and miniaturization.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a three-dimensional embedded packaging structure which can reduce the size of a packaging body in the X direction and the Y direction.

The three-dimensional embedded packaging structure provided by the embodiment of the utility model comprises: the connecting soft board is provided with a connecting circuit; one end of the first bearing plate is connected with the first end of the connecting soft plate, a first component and a first circuit are arranged on the first bearing plate, and the first circuit is electrically connected with the first component and the connecting circuit respectively; one end of the second bearing plate is connected with the second end of the connecting soft plate, a bending included angle is formed between the second bearing plate and the first bearing plate through the connecting soft plate, the bending included angle is smaller than 180 degrees, a second binary device and a second circuit are arranged on the second bearing plate, and the second circuit is electrically connected with the second binary device and the connecting circuit respectively; and the packaging layer is respectively connected with the first bearing plate and the second bearing plate.

The three-dimensional embedded packaging structure provided by the embodiment of the utility model at least has the following beneficial effects: connect first loading board and second loading board through connecting the soft board to make the second loading board buckle relatively first loading board, promptly, form a contained angle of buckling between first loading board and the second loading board, and then reduce the encapsulation body at the ascending size of X direction and Y direction, be favorable to the high density of encapsulation body to integrate and the miniaturization. In addition, the relative position between the first bearing plate and the second bearing plate is fixed through the packaging layer, and the packaging layer is used for protecting the first bearing plate, the second bearing plate and the connecting soft plate so as to improve the stability and the reliability.

According to some embodiments of the present invention, the bending included angle is less than or equal to 90 degrees, so as to effectively reduce the size of the package in the X direction and the Y direction.

According to some embodiments of the present invention, the first carrier plate is provided with a first metal pillar, and the first metal pillar penetrates through the first carrier plate and is electrically connected to the first circuit, so as to facilitate supporting of the first carrier plate and facilitate heat dissipation.

According to some embodiments of the present invention, a second metal pillar is disposed on the second carrier plate, and the second metal pillar penetrates through the second carrier plate and is electrically connected to the second circuit, so as to facilitate supporting of the second carrier plate and facilitate heat dissipation.

According to some embodiments of the present invention, the first line is located on a first side of the first loading board, the second line is located on a first side of the second loading board, the first loading board is connected to the encapsulation layer through the first side of the first loading board, and the second loading board is connected to the encapsulation layer through the first side of the second loading board, so as to hide the first line and the second line, thereby protecting the first line and the second line through the encapsulation layer.

According to some embodiments of the present invention, the first component is located on a first side of the first carrier board, the second component is located on a second side of the second carrier board, the first carrier board is connected to the package layer through the first side of the first carrier board, and the second carrier board is connected to the package layer through the first side of the second carrier board, so as to hide the first component and the second component, thereby protecting the first component and the second component through the package layer.

According to some embodiments of the present invention, the second surface of the first loading plate is provided with a first insulating layer, the second surface of the second loading plate is provided with a second insulating layer, the second surface of the first loading plate is opposite to the first surface of the first loading plate, and the second surface of the second loading plate is opposite to the first surface of the second loading plate, so as to facilitate insulation and protect the first loading plate and the second loading plate.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic view of a three-dimensional embedded package structure according to an embodiment of the utility model.

The reference numbers are as follows:

the package structure includes a connection flexible printed circuit board 100, a connection line 110, a first carrier 200, a first component 210, a first circuit 220, a first metal pillar 230, a first insulating layer 240, a second carrier 300, a second component 310, a second circuit 320, a second metal pillar 330, a second insulating layer 340, and a package layer 400.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and more than, less than, more than, etc. are understood as excluding the present number, and more than, less than, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1, a three-dimensional embedded package structure includes a connection flexible printed circuit board 100, a first carrier 200, a second carrier 300, and a package layer 400. The connection flexible printed circuit board 100 is provided with a connection line 110; one end of the first carrier board 200 is connected to the first end of the connection flexible printed circuit board 100, a first component 210 and a first circuit 220 are disposed on the first carrier board 200, and the first circuit 220 is electrically connected to the first component 210 and the connection circuit 110, respectively; one end of the second carrier plate 300 is connected to the second end of the connection flexible printed circuit board 100, a bending included angle is formed between the second carrier plate 300 and the first carrier plate 200 through the connection flexible printed circuit board 100, the bending included angle is smaller than 180 degrees, a second component 310 and a second circuit 320 are arranged on the second carrier plate 300, and the second circuit 320 is electrically connected to the second component 310 and the connection circuit 110 respectively; the encapsulation layer 400 is connected to the first carrier 200 and the second carrier 300, respectively.

The connection line 110 is used for establishing an electrical connection relationship between the first line 220 and the second line 320; the first carrier 200 is used for carrying a first component 210 and a first line 220; the second carrier board 300 is used to carry the second component 310 and the second line 320. The first loading board 200 and the second loading board 300 are connected by the connection flexible board 100, so that the second loading board 300 can be bent relative to the first loading board 200, that is, a bending included angle is formed between the first loading board 200 and the second loading board 300, and then the size of the package body in the X direction and the Y direction is reduced, which is beneficial to the high-density integration and miniaturization of the package body. In addition, the encapsulation layer 400 serves to fix the relative position between the first loading plate 200 and the second loading plate 300, and at the same time, to protect the first loading plate 200, the second loading plate 300, and the connection flexible printed circuit board 100, so as to improve stability and reliability.

It should be noted that the bending included angle is less than 180 degrees, so as to reduce the size of the package body in the X direction and the Y direction; in some embodiments, the bending included angle is less than or equal to 90 degrees, so as to more effectively reduce the size of the package body in the X direction and the Y direction. In addition, the number of the second carrier plate 300 is at least one, and the number of the connecting flexible boards 100 corresponds to the number of the second carrier plate 300.

Note that, referring to fig. 1, the Y direction is perpendicular to the X direction and the Z direction.

Referring to fig. 1, a first metal pillar 230 is disposed on the first carrier 200, and the first metal pillar 230 penetrates through the first carrier 200 and is electrically connected to the first circuit 220. Wherein, the number of the first metal posts 230 is at least one. The first metal posts 230 are used for supporting the first carrier plate 200, so as to improve the strength of the first carrier plate 200, and at the same time, the first metal posts 230 are also used for dissipating heat. Through the arrangement of the first metal column 230, the overall strength of the package body is improved, and the heat dissipation effect is improved. In addition, the first metal pillar 230 may also be used to lead out a port on the first circuit 220 for connection with the outside.

Referring to fig. 1, a second metal pillar 330 is disposed on the second carrier 300, and the second metal pillar 330 penetrates through the second carrier 300 and is electrically connected to the second circuit 320. Wherein, the number of the second metal posts 330 is at least one. The second metal posts 330 are used for supporting the second carrier plate 300 so as to improve the strength of the second carrier plate 300, and meanwhile, the second metal posts 330 are also used for dissipating heat. Through the setting of second metal column 330, be favorable to improving the bulk strength of packaging body to improve the radiating effect. In addition, the second metal pillar 330 may also be used to lead out a port for connection with the outside on the second line 320.

The bending included angle between the first bearing plate 200 and the second bearing plate 300 is smaller than 180 degrees by connecting the soft plate 100, the size of the packaging body in the X direction and the Y direction is reduced, and meanwhile, the distribution density of the components is improved, so that heat generated during the operation of the components is more concentrated, and the heat dissipation effect is improved through the first metal column 230 and the second metal column 330.

Referring to fig. 1, the first line 220 is located on the first surface of the first carrier 200, the second line 320 is located on the first surface of the second carrier 300, the first carrier 200 is connected to the package layer 400 through the first surface of the first carrier 200, and the second carrier 300 is connected to the package layer 400 through the first surface of the second carrier 300. The first circuit 220 is disposed between the first carrier 200 and the package layer 400, and the second circuit 320 is disposed between the second carrier 300 and the package layer 400, which is beneficial to protect the first circuit 220 and the second circuit 320 through the package layer 400, so as to prevent the first circuit 220 and the second circuit 320 from being exposed and worn, and to improve reliability.

Referring to fig. 1, the first component 210 is located on a first surface of the first carrier 200, the second component 310 is located on a second surface of the second carrier 300, the first carrier 200 is connected to the package layer 400 through the first surface of the first carrier 200, and the second carrier 300 is connected to the package layer 400 through the first surface of the second carrier 300. The first component 210 is disposed between the first carrier 200 and the package layer 400, and the second component 310 is disposed between the second carrier 300 and the package layer 400, which is beneficial for protecting the first component 210 and the second component 310 through the package layer 400, so as to prevent the first component 210 and the second component 310 from falling off due to exposure, thereby improving reliability.

The first wires 220, the second wires 320, the first component 210 and the second component 310 are protected by the packaging layer 400, which is beneficial to improving the strength and reliability of the packaging body in a limited space.

Referring to fig. 1, the second surface of the first carrier plate 200 is provided with a first insulating layer 240, the second surface of the second carrier plate 300 is provided with a second insulating layer 340, the second surface of the first carrier plate 200 is opposite to the first surface of the first carrier plate 200, and the second surface of the second carrier plate 300 is opposite to the first surface of the second carrier plate 300. The first insulating layer 240 is used to protect the first carrier plate 200 and realize insulation; the second insulating layer 340 is used to protect the second carrier plate 300 and to realize insulation. Through the arrangement of the first insulating layer 240 and the second insulating layer 340, the strength of the package body is improved, the package body is protected, and insulation is achieved to prevent external interference from affecting the normal operation of the first component 210 and the second component 310.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims

1. A three-dimensional embedded packaging structure is characterized by comprising:

the connecting soft board is provided with a connecting circuit;

one end of the first bearing plate is connected with the first end of the connecting soft plate, a first component and a first circuit are arranged on the first bearing plate, and the first circuit is electrically connected with the first component and the connecting circuit respectively;

one end of the second bearing plate is connected with the second end of the connecting soft plate, a bending included angle is formed between the second bearing plate and the first bearing plate through the connecting soft plate, the bending included angle is smaller than 180 degrees, a second binary device and a second circuit are arranged on the second bearing plate, and the second circuit is electrically connected with the second binary device and the connecting circuit respectively;

and the packaging layer is respectively connected with the first bearing plate and the second bearing plate.

2. The solid embedded package structure of claim 1, wherein the included bending angle is less than or equal to 90 degrees.

3. The package structure of claim 1, wherein a first metal pillar is disposed on the first carrier plate, and the first metal pillar is disposed through the first carrier plate and electrically connected to the first circuit.

4. The package structure of claim 1, wherein a second metal pillar is disposed on the second carrier, and the second metal pillar penetrates through the second carrier and is electrically connected to the second circuit.

5. The package structure of claim 1, wherein the first circuit is disposed on a first side of the first carrier board, the second circuit is disposed on a first side of the second carrier board, the first carrier board is connected to the package layer through the first side of the first carrier board, and the second carrier board is connected to the package layer through the first side of the second carrier board.

6. The package structure of claim 1, wherein the first component is disposed on a first side of the first carrier board, the second component is disposed on a second side of the second carrier board, the first carrier board is connected to the package layer through the first side of the first carrier board, and the second carrier board is connected to the package layer through the first side of the second carrier board.

7. The package structure of claim 5 or 6, wherein a first insulating layer is disposed on the second surface of the first carrier board, a second insulating layer is disposed on the second surface of the second carrier board, the second surface of the first carrier board is opposite to the first surface of the first carrier board, and the second surface of the second carrier board is opposite to the first surface of the second carrier board.