CN216291569U

CN216291569U - PCBA module heat radiation structure

Info

Publication number: CN216291569U
Application number: CN202122477112.4U
Authority: CN
Inventors: 李中亮
Original assignee: Shenzhen Zhiruitong Technology Co ltd
Current assignee: Shenzhen Zhiruitong Technology Co ltd
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2022-04-12
Anticipated expiration: 2031-10-14

Abstract

The utility model discloses a PCBA module heat dissipation structure, and relates to the field of PBCA plates.

Description

PCBA module heat radiation structure

Technical Field

The utility model relates to the field of PBCA (printed circuit board assembly) boards, in particular to a PCBA module heat dissipation structure.

Background

At present, a Printed Circuit Board Assembly (PCBA) is widely used, which is the core of a computer and an embedded system, and almost all electronic devices need to be supported by the printed circuit board, so that the printed circuit board is the highest-rate product in the market share of the global electronic component products, and the printed circuit board is also called as a printed circuit board and a printed circuit board, and commonly uses english abbreviations.

The heat dispersion of present PCBA board is relatively poor, leads to PCBA base plate high temperature of PCBA inboard portion, not only accelerates the loss rate of PCBA board, influences PCBA board life, and has great use safety hidden danger, and the practicality is poor, and simultaneously, PCBA board most of adopt the fan to dispel the heat, but the fan adopts the integral type fixed with PCBA board, is difficult to change after the fan damages, and then can't effectually dispel the heat to PCBA.

SUMMERY OF THE UTILITY MODEL

Accordingly, the present invention is directed to a heat dissipation structure of a PCBA module, so as to solve the technical problems of poor heat dissipation and inconvenient replacement of a fan.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a PCBA module heat radiation structure, includes the PCBA plate body, the bottom of PCBA plate body is provided with the absorber plate, the bottom both sides of absorber plate are fixed with the water tank through the mount, be provided with the conducting strip in the middle of the bottom of absorber plate, just the bottom of conducting strip extends to the inside of water tank, the both sides of conducting strip are provided with heat radiation fins, the inside of water tank is provided with the baffling board, the mounting groove has been seted up to the inboard of mount, inside one side of mounting groove is fixed with the magnetic stripe, the inside of mounting groove is provided with the installation piece, the fixed slot has been seted up to one side of installation piece, one side of installation piece is fixed with the fan.

Furthermore, the conducting strips are provided with a plurality of groups, and the plurality of groups of conducting strips are arranged at equal intervals.

Through adopting above-mentioned technical scheme, the multiunit conducting strip can be more comprehensive to the PCBA board heat dissipation, has promoted the radiating rate.

Furthermore, the multiple groups of heat conducting fins are wavy, and are made of copper materials.

By adopting the technical scheme, the wavy copper heat conducting fins have better heat conducting effect and improve the heat radiating effect.

Furthermore, the heat absorbing plate is tightly attached to the bottom of the PCBA body, and the heat absorbing plate is made of graphene materials.

Through adopting above-mentioned technical scheme, the absorber plate of graphite alkene material can be fast effectual siphons away the heat on the PCBA board to can reduce the temperature of PCBA board self.

Furthermore, circulating pipes penetrate through two sides of the water tank.

Through adopting above-mentioned technical scheme, the circulating pipe is connected with external circulating pump, and then makes the coolant liquid in the water tank can the circulation flow to can avoid the coolant liquid to continuously heat up and influence the heat exchange effect.

In summary, the utility model mainly has the following beneficial effects:

1. according to the utility model, the fan, the water tank, the heat absorbing plate and the heat conducting fins are arranged, the heat absorbing plate absorbs heat on the PCBA, the heat conducting fins guide the heat into the water tank, cooling liquid in the water tank exchanges heat with the heat conducting fins, meanwhile, the fan blows air to the heat conducting fins, and the heat dissipation on the heat conducting fins can be accelerated by performing water cooling and air cooling simultaneously, and the heat conducting fins are wavy, and the heat radiating fins are arranged on both sides of the heat conducting fins, so that the contact area of the heat conducting fins with water and wind is increased, the heat dissipation is more sufficient and rapid, and the service life of the PCBA is prolonged;

2. according to the fan fixing device, the mounting groove, the mounting block, the magnetic strip and the fixing groove are arranged, when the fan is damaged and needs to be replaced, a worker slides the mounting block out of the mounting groove, and meanwhile the magnetic strip is separated from the fixing groove, so that the purpose of disassembly is achieved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a structure of a heat-conducting sheet according to the present invention;

FIG. 3 is a schematic top view of the tank of the present invention;

fig. 4 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.

In the figure: 1. a PCBA plate body; 2. a heat absorbing plate; 3. a fixed mount; 4. a water tank; 5. a heat conductive sheet; 6. heat dissipation fins; 7. mounting grooves; 8. mounting blocks; 9. a magnetic strip; 10. fixing grooves; 11. a fan; 12. a baffle plate; 13. a circulation pipe.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The following describes an embodiment of the present invention based on its overall structure.

A PCBA module radiating structure is disclosed, as shown in figures 1-4, comprising a PCBA plate body 1, wherein the bottom of the PCBA plate body 1 is provided with a heat absorbing plate 2, two sides of the bottom of the heat absorbing plate 2 are fixed with a water tank 4 through a fixing frame 3, the middle of the bottom of the heat absorbing plate 2 is provided with a heat conducting sheet 5, the bottom end of the heat conducting sheet 5 extends to the inside of the water tank 4, two sides of the heat conducting sheet 5 are provided with radiating fins 6, the heat conducting sheets 5 are provided with a plurality of groups, the groups of heat conducting sheets 5 are arranged at equal intervals, the heat conducting sheets 5 can radiate the PCBA plate more comprehensively, the radiating speed is improved, the inside of the water tank 4 is provided with a baffle plate 12, the inner side of the fixing frame 3 is provided with a mounting groove 7, one side of the inside of the mounting groove 7 is fixed with a magnetic strip 9, the inside of the mounting groove 7 is provided with a mounting block 8, one side of the mounting block 8 is provided with a fixing groove 10, one side of the mounting block 8 is fixed with a fan 11, two sides of the water tank 4 are all penetrated with circulating pipes 13, the circulating pipe 13 is connected with an external circulating pump, so that the cooling liquid in the water tank 4 can circularly flow, and the heat exchange effect can be prevented from being influenced by the continuous temperature rise of the cooling liquid.

Referring to fig. 1-2, the plurality of groups of heat-conducting fins 5 are wavy, the heat-conducting fins 5 are made of copper material, and the wavy copper heat-conducting fins 5 have better heat-conducting effect and improve heat-dissipating effect.

Referring to fig. 1, the heat absorbing plate 2 is tightly attached to the bottom of the PCBA plate body 1, the heat absorbing plate 2 is made of graphene materials, and the heat absorbing plate 2 made of graphene materials can rapidly and effectively absorb heat on the PCBA plate, so that the temperature of the PCBA plate can be reduced.

The implementation principle of the embodiment is as follows: firstly, a worker installs the PCBA plate body 1 and then connects the circulating pipe 13, when heat dissipation is carried out, the circulating pipe 13 inputs cooling liquid into the water inlet tank 4, the heat absorbing plate 2 absorbs heat on the PCBA plate body 1, the heat conducting fins 5 guide the heat into the water tank 4, the cooling liquid in the water tank 4 exchanges heat with the heat conducting fins 5, meanwhile, the fan 11 blows the heat conducting fins 5, water cooling and air cooling are carried out simultaneously, heat dissipation on the heat conducting fins 5 can be accelerated, the heat conducting fins 5 are wavy, the radiating fins 6 are arranged on two sides, the contact area between the heat conducting fins 5 and water and wind is increased, heat dissipation is more sufficient and rapid, the speed of the cooling liquid is reduced under the left and right sides of the baffle plate 12, the contact time between the cooling liquid and the heat conducting fins 5 is more sufficient, when the fan 11 is damaged and needs to be replaced, the worker slides the installation block 8 out of the installation groove 7, meanwhile, magnetic stripe 9 also breaks away from with fixed slot 10 to reach the purpose of dismantling, when needs were installed, the staff aimed at fixed slot 10 with magnetic stripe 9, and installation piece 8 aimed at mounting groove 7, then will install in piece 8 pushed mounting groove 7, magnetic stripe 9 adsorbs with fixed slot 10, and then has reached the purpose fixed to fan 11, prevents that fan 11 from breaking away from.

Although embodiments of the present invention have been shown and described, the present embodiments are merely illustrative of the present invention and are not intended to limit the present invention, and the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and those skilled in the art can make modifications, substitutions, variations, etc. of the embodiments as required without departing from the principle and spirit of the present invention, but within the scope of the claims of the present invention.

Claims

1. The utility model provides a PCBA module heat radiation structure, includes PCBA plate body (1), its characterized in that: the bottom of PCBA plate body (1) is provided with absorber plate (2), the bottom both sides of absorber plate (2) are fixed with water tank (4) through mount (3), be provided with conducting strip (5) in the middle of the bottom of absorber plate (2), just the bottom of conducting strip (5) extends to the inside of water tank (4), the both sides of conducting strip (5) are provided with heat radiation fins (6), the inside of water tank (4) is provided with baffling board (12), mounting groove (7) have been seted up to the inboard of mount (3), inside one side of mounting groove (7) is fixed with magnetic stripe (9), the inside of mounting groove (7) is provided with installation piece (8), fixed slot (10) have been seted up to one side of installation piece (8), one side of installation piece (8) is fixed with fan (11).

2. The PCBA module heat dissipation structure as recited in claim 1, wherein: the heat conducting fins (5) are provided with a plurality of groups, and the plurality of groups of heat conducting fins (5) are arranged at equal intervals.

3. The PCBA module heat dissipation structure as recited in claim 2, wherein: the multiple groups of heat conducting fins (5) are wavy, and the heat conducting fins (5) are made of copper materials.

4. The PCBA module heat dissipation structure as recited in claim 1, wherein: the heat absorbing plate (2) is tightly attached to the bottom of the PCBA body (1), and the heat absorbing plate (2) is made of graphene materials.

5. The PCBA module heat dissipation structure as recited in claim 1, wherein: circulating pipes (13) penetrate through two sides of the water tank (4).