CN216283945U - Photosensitive module and terminal equipment - Google Patents
Photosensitive module and terminal equipment Download PDFInfo
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- CN216283945U CN216283945U CN202122220354.5U CN202122220354U CN216283945U CN 216283945 U CN216283945 U CN 216283945U CN 202122220354 U CN202122220354 U CN 202122220354U CN 216283945 U CN216283945 U CN 216283945U
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- circuit substrate
- optical sensor
- circuit board
- photosensitive module
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Abstract
A photosensitive module comprises a circuit board, an optical sensor and a colloid. A containing groove is formed in one surface of the circuit board; the optical sensor is positioned in the accommodating groove and is electrically connected with the circuit board; the colloid is accommodated in the accommodating groove and covers the optical sensor, and the transparency of the colloid is greater than or equal to 90%. The photosensitive module is reliable in connection, pollution-proof and low in manufacturing cost. The application also provides a terminal device.
Description
Technical Field
The application relates to the sensitization field especially relates to a sensitization module and terminal equipment.
Background
In some terminal devices, an ambient light sensor is usually provided to detect light in the environment and feed back to the terminal device, so that the terminal device can be adjusted as required.
The ambient light sensor is usually connected with two circuit boards, and the two circuit boards need to be subjected to SMT (surface mount technology) twice, so that the manufacturing period is long, and the cost is increased; in addition, the two circuit boards are connected with each other through the conductive material, so that the connection reliability of electric conduction and signal transmission is poor, and the thickness of the product is increased; when the product vibrates or falls, the ambient light sensor is easy to loosen and easily pollutes the photosensitive area of the ambient light sensor.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a photosensitive module and a terminal device with reliable connection, contamination prevention, and low manufacturing cost.
A photosensitive module comprises a circuit board, an optical sensor and a colloid. A containing groove is arranged on one surface of the circuit board; the optical sensor is positioned in the accommodating groove and is electrically connected with the circuit board; the colloid is accommodated in the accommodating groove and covers the optical sensor, and the transparency of the colloid is greater than or equal to 90%.
In some embodiments, the circuit board includes a connection pad exposed to the receiving groove, and the optical sensor is connected to the connection pad.
In some embodiments, the circuit board includes a first circuit substrate and a second circuit substrate stacked on each other, the circuit board includes a first outer surface, the accommodating groove penetrates the second circuit substrate from the first outer surface, a surface of the first circuit substrate is exposed to the accommodating groove, a surface of the adhesive body facing away from the first circuit substrate is a second outer surface, and the second outer surface does not exceed the first outer surface.
In some embodiments, the optical sensor includes a top wall and a side wall, the top wall is a surface of the optical sensor facing away from the first circuit substrate, and the side wall surrounds the top wall; the accommodating groove comprises an inner wall and a bottom wall, the bottom wall is the surface of the first circuit substrate exposed to the second circuit substrate, and the inner wall is connected with the bottom wall; the distance between the side wall and the inner wall is greater than or equal to 200 μm.
In some embodiments, the distance of the top wall to the first outer surface is less than or equal to 500 μm; the distance between the top wall and the second outer surface is 10-200 μm.
In some embodiments, the circuit board further includes a stopper pad, a portion of the stopper pad is exposed to the receiving groove, and a width of the stopper pad is greater than or equal to 400 μm.
In some embodiments, the circuit board further includes a solder mask layer, the solder mask layer is located on a surface of the second circuit substrate facing away from the first circuit substrate, and the first outer surface is a surface of the solder mask layer facing away from the second circuit substrate.
In some embodiments, the colloid has a haze of less than or equal to 1%.
In some embodiments, the optical sensor is one of an ambient light sensor, an infrared light sensor, and an ultraviolet light sensor.
A terminal device comprises the photosensitive module.
According to the photosensitive module, the optical sensor is embedded in the circuit board, and the optical sensor and the circuit board are bonded into a whole through the colloid, so that the connection reliability of the optical sensor and the circuit board is improved; in addition, the colloid also has the function of protecting the optical sensor and preventing external impurities from polluting the optical sensor; the photosensitive module of this application only needs a circuit board, reduces the cost of manufacture.
Drawings
Fig. 1 is a schematic structural diagram of a terminal device according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of a photosensitive module according to an embodiment of the present disclosure.
Fig. 3 is a schematic cross-sectional view of a first circuit substrate and a second circuit substrate according to an embodiment of the present disclosure.
Fig. 4 is a schematic cross-sectional view of a first circuit board, a bonding sheet, and a second circuit board stacked in this order.
Fig. 5 is a schematic cross-sectional view illustrating the first circuit substrate, the bonding sheet and the second circuit substrate in fig. 4 after being bonded and forming conductive vias.
Fig. 6 is a schematic cross-sectional view illustrating the second circuit substrate shown in fig. 5 and areas corresponding to the through holes are removed to form receiving grooves and solder masks are formed on the surfaces of the first circuit substrate and the second circuit substrate.
Fig. 7 is a schematic cross-sectional view illustrating a conductive paste applied on the connection pad shown in fig. 6.
Fig. 8 is a schematic cross-sectional view illustrating the optical sensor disposed in the receiving groove of fig. 7 and electrically connected to the first circuit substrate through the conductive paste.
Description of the main elements
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.
In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly. It is to be understood that the following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1, an embodiment of the present application provides a terminal device 200, where the terminal device 200 includes a photosensitive module 100. Terminal equipment 200 can be smart machine such as cell-phone, wrist-watch, display device, terminal equipment 200 can make corresponding adjustment according to the change through light sensing module 100 sensing light in the external environment. For example, in an embodiment, taking the terminal device 200 as a mobile phone as an example, when the light in the external environment becomes dark, the mobile phone may decrease the brightness of the display screen.
Referring to fig. 2, the photosensitive module 100 includes a circuit board 10, an optical sensor 20 and a colloid 30, the optical sensor 20 is accommodated in the circuit board 10, the colloid 30 is used for bonding the optical sensor 20 to the circuit board 10, and the colloid 30 is a transparent adhesive, so that the optical sensor 20 can sense the change of the external environment light.
The circuit board 10 may be a flexible board, a rigid board or a rigid-flex board.
The circuit board 10 is a multilayer circuit board 10. The circuit board 10 includes a first circuit substrate 11 and a second circuit substrate 13 which are stacked, the first circuit substrate 11 includes a first dielectric layer 112 and a first circuit layer 114 which are stacked, and the second circuit substrate 13 includes a second dielectric layer 132 and a second circuit layer 134 which are stacked. The first circuit layer 114 and the second circuit layer 134 can be electrically connected through the conductive via 50.
The circuit board 10 further includes a solder mask layer 60, wherein the solder mask layer 60 is located on a surface of the first circuit substrate 11 deviating from the second circuit substrate 13 and on a surface of the second circuit substrate 13 deviating from the first circuit substrate 11.
The circuit board 10 includes a first outer surface 62, where the first outer surface 62 is a surface of the solder mask layer 60 covering the second circuit substrate 13 and facing away from the second circuit substrate 13. The circuit board 10 further includes a receiving groove 15, the receiving groove 15 penetrates the solder mask layer 60 and the second circuit substrate 13 from the first outer surface 62, and the surface of the first circuit substrate 11 is exposed to the receiving groove 15. The first circuit layer 114 includes a connection pad 116, the connection pad 116 is exposed to the receiving groove 15, and the connection pad 116 is used for electrically connecting the optical sensor 20.
The first circuit layer 114 further includes a stop pad 118, a portion of the stop pad 118 is exposed to the receiving groove 15, and a portion of the stop pad 118 is embedded in the second circuit substrate 13, and the stop pad 118 is used for preventing the first dielectric layer 112 from being over-etched by the laser when the receiving groove 15 is formed in the process of manufacturing the photosensitive module 100.
The accommodating groove 15 includes an inner wall 154 and a bottom wall 152, the inner wall 154 is connected to the bottom wall 152, the bottom wall 152 is a surface of the first circuit substrate 11 exposed to the second circuit substrate 13, and the inner wall 154 is a surface of the second circuit substrate 13 connected to the bottom wall 152.
The optical sensor 20 includes, but is not limited to, an ambient light sensor, an infrared light sensor, an ultraviolet light sensor, and the like, and the optical sensor 20 is used for sensing a change of external light.
The optical sensor 20 is accommodated in the accommodating groove 15 and connected to the connecting pad 116 exposed in the accommodating groove 15, so that the optical sensor 20 is electrically connected to the circuit board 10. The optical sensor 20 is spaced apart from the inner wall 154, i.e., there is a gap between the optical sensor 20 and the circuit board 10.
The glue 30 is located in the accommodating groove 15, fills a gap between the optical sensor 20 and the circuit board 10, and also covers the optical sensor 20. The colloid 30 is used for bonding the optical sensor 20 and the circuit board 10, so that the optical sensor 20 and the circuit board 10 are fixedly connected into a whole, and the optical sensor 20 and the circuit board 10 are prevented from generating relative displacement when the photosensitive module 100 is subjected to an external force (such as collision), so that the reliability of the electrical connection between the circuit board 10 and the optical sensor 20 is improved; in addition, the colloid 30 is filled in the gap between the circuit board 10 and the optical sensor 20, so that the optical sensor 20 is prevented from being damaged due to mutual collision between the circuit board 10 and the optical sensor 20; moreover, the adhesive 30 also covers the surface of the optical sensor 20 away from the first circuit substrate 11, so as to protect the optical sensor 20, isolate the connection between the optical sensor 20 and the outside, and prevent the optical sensor 20 from being contaminated.
The transparency of the colloid 30 is greater than or equal to 90%, which facilitates to improve the sensitivity of the optical sensor 20 for rapidly sensing the change of the external light. In some embodiments, the transparency of the colloid 30 is greater than or equal to 95%.
The haze of the colloid 30 is less than or equal to 1%, so that the optical sensor 20 can sense the change of the external light more sensitively.
In some embodiments, the colloid 30 has a haze of less than or equal to 0.5%.
The optical sensor 20 includes a top wall 22 and a side wall 24, the top wall 22 is a surface of the optical sensor 20 facing away from the first circuit substrate 11, and the side wall 24 surrounds the top wall 22 and is parallel to the stacking direction. The surface of the colloid 30 facing away from the first circuit substrate 11 is a second outer surface 32.
In the stacking direction, the second outer surface 32 does not extend beyond the first outer surface 62, and the top wall 22 is located between the bottom wall 152 and the second outer surface 32.
The distance D1 between the side wall 24 and the inner wall 154 is greater than or equal to 200 μm, so as to avoid the direct rigid contact between the optical sensor 20 and the circuit board 10 caused by too small distance, and in addition, the relatively large distance facilitates the placement of the optical sensor 20 in the accommodating groove 15 during the process of manufacturing the photosensitive module 100.
The distance D2 from the top wall 22 to the first outer surface 62 is less than or equal to 500 μm, so as to avoid the optical sensor 20 being located too deep in the accommodating groove 15 and increasing the thickness of the circuit board 10; in addition, the influence of the peripheral edge of the second circuit board 13 on the light sensitivity of the optical sensor 20 can be reduced.
The distance D3 between the top wall 22 and the second outer surface 32 is 10 μm to 200 μm, so that the photosensitive sensitivity of the optical sensor 20 to light is prevented from being affected by the excessively thick glue 30 on the premise that the protective effect of the glue 30 on the optical sensor 20 is satisfied.
The width D4 of the stop pad 118 along the direction perpendicular to the stacking direction is greater than or equal to 400 μm, so that the stop pad has sufficient margin in the process of forming the accommodating groove 15 by etching.
The application provides a manufacturing method of a photosensitive module 100, which comprises the following steps:
step S1: referring to fig. 3, a first circuit substrate 11 and a second circuit substrate 13 are provided.
The first circuit substrate 11 includes a first dielectric layer 112 and a first circuit layer 114, the first circuit layer 114 is disposed on two opposite surfaces of the first dielectric layer 112, the first circuit layer 114 includes a connection pad 116 and a stop pad 118, and the stop pad 118 and the connection pad 116 are disposed on the same surface of the first dielectric layer 112.
The second circuit substrate 13 includes a second dielectric layer 132 and copper layers on two opposite surfaces of the second dielectric layer 132, and the copper layers are used for forming a second circuit layer 134 in a subsequent processing process. In some embodiments, the second circuit substrate 13 may also include a second dielectric layer 132 and a second circuit layer 134 on two opposite surfaces of the second dielectric layer 132.
Step S2: referring to fig. 4, a bonding sheet 40 is provided, wherein the bonding sheet 40 has a through hole 42. The first circuit substrate 11, the bonding sheet 40, and the second circuit substrate 13 are sequentially stacked, the connection pad 116 is exposed to the through hole 42, and a portion of the stopper pad 118 is exposed to the through hole 42.
Step S3: referring to fig. 5, the first circuit substrate 11, the bonding sheet 40 and the second circuit substrate 13 are bonded together, the connecting pads 116 are exposed to the through holes 42, and portions of the stopping pads 118 are exposed to the through holes 42.
After the bonding step, conductive holes 50 penetrating through the second circuit substrate 13, the bonding sheet 40 and the first circuit substrate 11 are also formed to electrically connect the second circuit substrate 13 and the first circuit substrate 11.
Step S4: referring to fig. 6, the areas corresponding to the second circuit substrate 13 and the through holes 42 are removed, and the accommodating grooves 15 penetrating through the second circuit substrate 13 and the bonding sheets 40 are formed. Wherein the stop pad 118 prevents over-etching of the first dielectric layer 112.
After the receiving grooves 15 are formed, solder masks 60 are formed on the surfaces of the first circuit board 11 and the second circuit board 13.
The first circuit substrate 11 and the second circuit substrate 13 are bonded to form a circuit board 10 through a bonding sheet 40, and the connection is reliable.
Step S5: referring to fig. 7, a conductive paste 55 is coated on the connection pads 116.
The conductive paste 55 may be a solder paste, a silver paste, or the like.
Step S6: referring to fig. 8, the optical sensor 20 is disposed in the accommodating cavity 15 and electrically connected to the first circuit substrate 11 through the conductive paste 55.
Step S7: referring to fig. 2 again, the accommodating groove 15 is filled with a glue 30 to seal the optical sensor 20.
According to the photosensitive module 100 provided by the application, the optical sensor 20 is embedded in one circuit board 10, and the optical sensor 20 and the circuit board 10 are bonded into a whole through the colloid 30, so that the connection reliability of the optical sensor 20 and the circuit board 10 is improved; in addition, the colloid 30 also has the function of protecting the optical sensor 20, and prevents external impurities from polluting the optical sensor 20; the photosensitive module 100 of the present application only needs one circuit board 10, reducing the manufacturing cost.
Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.
Claims (10)
1. A photosensitive module, comprising:
a circuit board, wherein a holding groove is formed on one surface of the circuit board;
the optical sensor is positioned in the accommodating groove and is electrically connected with the circuit board; and
and the colloid is contained in the containing groove and covers the optical sensor, and the transparency of the colloid is greater than or equal to 90%.
2. The photosensitive module of claim 1 wherein the circuit board includes a connection pad exposed to the receiving cavity, the optical sensor being connected to the connection pad.
3. The photosensitive module of claim 1, wherein the circuit board includes a first circuit substrate and a second circuit substrate stacked on each other, the circuit board includes a first outer surface, the receiving groove penetrates the second circuit substrate from the first outer surface, a surface of the first circuit substrate is exposed to the receiving groove, a surface of the adhesive facing away from the first circuit substrate is a second outer surface, and the second outer surface does not exceed the first outer surface.
4. The photosensitive module according to claim 3, wherein the optical sensor includes a top wall and a side wall, the top wall is a surface of the optical sensor facing away from the first circuit substrate, and the side wall is surrounded on the top wall; the accommodating groove comprises an inner wall and a bottom wall, the bottom wall is the surface of the first circuit substrate exposed to the second circuit substrate, and the inner wall is connected with the bottom wall; the distance between the side wall and the inner wall is greater than or equal to 200 μm.
5. The photosensitive module of claim 4, wherein the distance from the top wall to the first outer surface is less than or equal to 500 μm; the distance between the top wall and the second outer surface is 10-200 μm.
6. The photosensitive module of claim 4, wherein the circuit board further comprises a stop pad, a portion of the stop pad is exposed to the receiving groove, and a width of the stop pad is greater than or equal to 400 μm.
7. The photosensitive module of claim 3, wherein the circuit board further comprises a solder mask layer, the solder mask layer is located on a surface of the second circuit substrate facing away from the first circuit substrate, and the first outer surface is a surface of the solder mask layer facing away from the second circuit substrate.
8. The photosensitive module of claim 1, wherein the colloid has a haze of less than or equal to 1%.
9. The photosensitive module of claim 1, wherein the optical sensor is one of an ambient light sensor, an infrared light sensor and an ultraviolet light sensor.
10. A terminal device, characterized in that the terminal device comprises the photosensitive module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122220354.5U CN216283945U (en) | 2021-09-14 | 2021-09-14 | Photosensitive module and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122220354.5U CN216283945U (en) | 2021-09-14 | 2021-09-14 | Photosensitive module and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216283945U true CN216283945U (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122220354.5U Active CN216283945U (en) | 2021-09-14 | 2021-09-14 | Photosensitive module and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216283945U (en) |
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2021
- 2021-09-14 CN CN202122220354.5U patent/CN216283945U/en active Active
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