CN216283287U

CN216283287U - Wafer spacing measuring device after wafer packaging

Info

Publication number: CN216283287U
Application number: CN202121626092.6U
Authority: CN
Inventors: 周明勇; 王潞; 袁忠奎; 陈康
Original assignee: Shenzhen Oumigao Intelligent Technology Co ltd
Current assignee: Shenzhen Oumigao Intelligent Technology Co ltd
Priority date: 2021-07-17
Filing date: 2021-07-17
Publication date: 2022-04-12
Anticipated expiration: 2031-07-17

Abstract

The utility model relates to the technical field of wafers, and discloses a wafer spacing measuring device after wafer packaging, which comprises a main frame body and PC computer vision analysis software arranged on the outer surface of the main frame body, wherein the main frame body comprises a workbench arranged in the main frame body, a Y-axis servo motion module and a Z-axis servo motion module which are arranged on the upper surface of the workbench, and a CCD vision photographing component arranged on one side of the Z-axis servo motion module, and an R-axis rotation module and a light source auxiliary photographing assembly which are arranged on the upper surface of the workbench, so that the problems that the interval between each wafer is different due to the interval error of each wafer in a special customized packing box and the risk of abnormal impact is caused when an automatic manipulator takes materials are solved, and the CCD non-contact photographing measurement solves the problem that the wafer cannot touch a wafer product manually during measurement due to the fact that the wafer has extremely high requirements on surface cleanliness, scratches, dirt and the like.

Description

Wafer spacing measuring device after wafer packaging

Technical Field

The utility model relates to the technical field of wafers, in particular to a wafer spacing measuring device after wafer packaging.

Background

The wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. In the semiconductor industry, particularly in the field of integrated circuits, the shadows of wafers are ubiquitous. The wafer is a thin and round high-purity silicon wafer, and various circuit element structures can be processed and manufactured on the high-purity silicon wafer to form an IC product with a specific electrical function.

At present, when wafers are packaged by wafer production enterprises, data measurement is carried out on the distance between the used special customized packaging boxes and the wafers, which are required to be packaged into the packaging boxes, in each batch every day, and the requirements of the wafers on the cleanliness, scratches, dirt and the like of the surfaces are extremely high, so that the wafers cannot be touched by workers during measurement, the cleanliness of the measurement environment is prevented from being polluted, the cleanliness of the wafers is difficult to guarantee, and the collision risk caused by interval difference exists.

Therefore, a wafer spacing measuring device after wafer packaging is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer spacing measuring device after wafer packaging, which is used for working, so that the problems that in the background, due to the fact that the requirements of the wafer on surface cleanliness, scratches, dirt and the like are extremely high, when the wafer is measured, a wafer product cannot be touched by people, the measurement environment is prevented from being polluted, cleanliness is guaranteed, cleanliness of the wafer is difficult to guarantee, and collision risks caused by interval differences exist are solved.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a wafer space measuring device after wafer packing, includes the body frame body and sets up the PC visual analysis software on the body frame body surface, and the body frame body is including setting up the workstation at body frame internal portion, sets up at the Y axle servo motion module and the Z axle servo motion module of workstation upper surface, sets up the CCD vision subassembly of shooing in Z axle servo motion module one side to and set up the supplementary subassembly of shooing of R axle rotation module and light source at the workstation upper surface.

Furthermore, the upper surface of workstation still is provided with vertical backplate and transverse guide, and Z axle servo motion module is connected with vertical backplate, and vertical backplate passes through Y axle servo motion module and transverse guide swing joint.

Further, the CCD vision shooting assembly is connected with one end of the Z-axis servo motion module, and the CCD vision shooting assembly is movably connected with the vertical backboard through the Z-axis servo motion module.

Further, the upper surface of the main frame body is provided with a filter laminar flow hood, the inside of the filter laminar flow hood is provided with a HEPA filter screen, and the main frame body is communicated with an external fan through the filter laminar flow hood.

Further, CCD vision subassembly of shooing is including setting up the mounting panel in Z axle servo motion module one end, the mounting hole of setting on the mounting panel surface to and set up the curb plate in mounting panel one side, be provided with the CCD camera on the surface of curb plate.

Further, the R-axis rotating module comprises a bottom plate arranged on the upper surface of the workbench, a rotating seat arranged at the upper end of the bottom plate, and a jig platform arranged at the upper end of the rotating seat.

Further, the supplementary subassembly of shooing of light source sets up the fixed plate at the riser lower extreme including setting up the riser in workstation one side to and set up the light trough on the fixed plate surface, and the riser is connected with the workstation through the fixed plate.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the wafer spacing measuring device after wafer packaging, the filter laminar flow cover is arranged on the upper surface of the main frame body, the HEPA filter screen is arranged inside the filter laminar flow cover, the main frame body is communicated with an external fan through the filter laminar flow cover, the fan sucks air from the top of the filter laminar flow cover and filters the air through the HEPA filter screen, and the filtered clean air is uniformly sent out on the whole air outlet surface, so that the cleanliness of a measuring environment is guaranteed.

2. The utility model provides a device for measuring the distance between wafers after packaging wafers, wherein a vertical back plate and a transverse guide rail are arranged on the upper surface of a workbench, a Z-axis servo motion module is connected with the vertical back plate, the vertical back plate is movably connected with the transverse guide rail through a Y-axis servo motion module, a CCD visual shooting assembly is connected with one end of the Z-axis servo motion module, the CCD visual shooting assembly is movably connected with the vertical back plate through the Z-axis servo motion module, one end of the Z-axis servo motion module is provided with a mounting plate, a mounting hole is arranged on the outer surface of the mounting plate, one side of the mounting plate is provided with a side plate, a CCD camera is arranged on the outer surface of the side plate, the upper surface of the workbench is provided with a bottom plate, the upper end of the bottom plate is provided with a rotating seat, the upper end of the rotating seat is provided with a jig platform, and the CCD visual shooting assembly is moved to a focal position with clear image through the Y-axis servo motion module, then automatically moving the CCD visual photographing component to the initial position of the wafer to be measured by using the Z-axis servo motion module, finally automatically photographing by using a CCD camera, then automatically rotating the R-axis rotation module to the back of the wafer packaging box, photographing and measuring the wafer on the back of the wafer packaging box by using the same method, finally transmitting the obtained picture to PC computer visual analysis software by using the CCD visual photographing component, analyzing and measuring the photographed picture, outputting a measurement result and evaluating OK \ NG, solving the problem that the interval between each wafer is different due to the interval error in a special customized packaging box, the risk of abnormal impact when the automatic manipulator takes the material, and solving the problem that the wafer cannot be touched by manpower when measuring due to the extremely high requirements on the cleanliness, scratch, dirt and the like of the surface by using CCD non-contact type photographing measurement, the quality and efficiency of the wafer from production to back-end test, cutting and packaging factories are greatly improved in the semiconductor industry, particularly in the field of integrated circuits.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the interior of the main frame body of the present invention;

FIG. 3 is a schematic structural diagram of a CCD visual photographing assembly according to the present invention;

FIG. 4 is a schematic structural diagram of an R-axis rotation module according to the present invention;

fig. 5 is a schematic structural diagram of a light source-assisted photographing assembly according to the present invention.

In the figure: 1. a main frame body; 11. a filter laminar flow hood; 2. PC computer vision analysis software; 3. a work table; 31. a vertical back plate; 32. a transverse guide rail; 4. a Y-axis servo motion module; 5. a Z-axis servo motion module; 6. a CCD visual shooting component; 61. mounting a plate; 62. mounting holes; 63. a side plate; 64. a CCD camera; 7. an R-axis rotation module; 71. a base plate; 72. a rotating base; 73. a jig platform; 8. a light source assisted photographing assembly; 81. a vertical plate; 82. a fixing plate; 83. a lamp groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, a wafer spacing measuring device after wafer packaging comprises a main frame body 1 and PC computer vision analysis software 2 arranged on the outer surface of the main frame body 1, wherein the main frame body 1 comprises a worktable 3 arranged inside the main frame body 1, a Y-axis servo motion module 4 and a Z-axis servo motion module 5 arranged on the upper surface of the worktable 3, a CCD vision photographing assembly 6 arranged on one side of the Z-axis servo motion module 5, and an R-axis rotation module 7 and a light source auxiliary photographing assembly 8 arranged on the upper surface of the worktable 3.

Referring to fig. 2, the upper surface of the workbench 3 is further provided with a vertical back plate 31 and a transverse guide rail 32, the Z-axis servo motion module 5 is connected to the vertical back plate 31, the vertical back plate 31 is movably connected to the transverse guide rail 32 through the Y-axis servo motion module 4, the CCD vision photographing assembly 6 is connected to one end of the Z-axis servo motion module 5, and the CCD vision photographing assembly 6 is movably connected to the vertical back plate 31 through the Z-axis servo motion module 5.

Please refer to fig. 1 and 3, the upper surface of the main frame 1 is provided with a filter laminar flow hood 11, the inside of the filter laminar flow hood 11 is provided with an HEPA filter screen, and the main frame 1 is communicated with an external fan through the filter laminar flow hood 11, the fan sucks air from the top of the filter laminar flow hood 11 and filters the air through the HEPA filter screen, the filtered clean air is uniformly sent out on the whole air outlet surface, the cleanliness of the measurement environment is ensured, the CCD vision photographing assembly 6 comprises a mounting plate 61 arranged at one end of the Z-axis servo motion module 5, a mounting hole 62 arranged on the outer surface of the mounting plate 61, and a side plate 63 arranged on one side of the mounting plate 61, and a CCD camera 64 is arranged on the outer surface of the side plate 63.

Referring to fig. 4 and 5, the R-axis rotation module 7 includes a bottom plate 71 disposed on the upper surface of the worktable 3, a rotation base 72 disposed on the upper end of the bottom plate 71, and a jig platform 73 disposed on the upper end of the rotation base 72, the light source auxiliary photographing assembly 8 includes a vertical plate 81 disposed on one side of the worktable 3, a fixing plate 82 disposed on the lower end of the vertical plate 81, and a light trough 83 disposed on the outer surface of the fixing plate 82, the vertical plate 81 is connected to the worktable 3 through the fixing plate 82, the CCD vision photographing assembly 6 is moved to a focal position with clear image by the Y-axis servo motion module 4, the CCD vision photographing assembly 6 is automatically moved to a wafer start position to be measured by the Z-axis servo motion module 5, and finally, the CCD camera 64 is used to photograph automatically, the R-axis rotation module is automatically rotated to the back surface of the wafer packing box, and the wafer on the back surface of the wafer packing box is measured in the same way, and finally, the obtained pictures are transmitted to the PC visual analysis software 2 through the CCD visual photographing component 6, the photographed pictures are analyzed and measured, and a measurement result and OK/NG evaluation are output, so that the problem that the interval between every two wafers is different due to the interval error in a special customized packaging box, the risk of abnormal impact when an automatic manipulator takes the materials is solved, the problem that the wafer cannot be touched by manpower during measurement due to high requirements on the cleanliness, scratch, dirt and the like of the surface of the wafer is solved through CCD non-contact type photographing measurement, and the semiconductor industry, particularly the field of integrated circuits, and the quality and the efficiency of a wafer from production to later stage are improved.

The working principle is as follows: the CCD visual photographing assembly 6 is moved to a focal length position with clear imaging through the Y-axis servo motion module 4, the CCD visual photographing assembly 6 is automatically moved to a wafer starting position to be measured through the Z-axis servo motion module 5, finally, automatic photographing is carried out through the CCD camera 64, then, the R-axis rotation module is automatically rotated to the back face of the wafer packaging box, the wafer on the back face of the wafer packaging box is photographed and measured through the same method, finally, the obtained picture is transmitted to the PC visual analysis software 2 through the CCD visual photographing assembly 6, analysis and measurement data are carried out on the photographed picture, and a measurement result and OK/NG evaluation are output.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer packing back wafer interval measuring device, includes the body frame body (1) and sets up PC computer visual analysis software (2) on the body frame body (1) surface, its characterized in that: the main frame body (1) comprises a workbench (3) arranged inside the main frame body (1), a Y-axis servo motion module (4) and a Z-axis servo motion module (5) which are arranged on the upper surface of the workbench (3), a CCD visual photographing assembly (6) arranged on one side of the Z-axis servo motion module (5), and an R-axis rotation module (7) and a light source auxiliary photographing assembly (8) which are arranged on the upper surface of the workbench (3).

2. The apparatus as claimed in claim 1, wherein: the upper surface of workstation (3) still is provided with vertical backplate (31) and transverse guide (32), and Z axle servo motion module (5) are connected with vertical backplate (31), and vertical backplate (31) are through Y axle servo motion module (4) and transverse guide (32) swing joint.

3. The apparatus as claimed in claim 2, wherein: CCD vision subassembly (6) of shooing is connected with the one end of Z axle servo motion module (5), and CCD vision subassembly (6) of shooing is through Z axle servo motion module (5) and vertical backplate (31) swing joint.

4. The apparatus as claimed in claim 1, wherein: the upper surface of the main frame body (1) is provided with a filter laminar flow hood (11), the inside of the filter laminar flow hood (11) is provided with a HEPA filter screen, and the main frame body (1) is communicated with an external fan through the filter laminar flow hood (11).

5. The apparatus as claimed in claim 1, wherein: CCD vision subassembly (6) of shooing is including setting up mounting panel (61) in Z axle servo motion module (5) one end, setting up mounting hole (62) on mounting panel (61) surface to and set up curb plate (63) in mounting panel (61) one side, be provided with CCD camera (64) on the surface of curb plate (63).

6. The apparatus as claimed in claim 1, wherein: the R-axis rotating module (7) comprises a bottom plate (71) arranged on the upper surface of the workbench (3), a rotating seat (72) arranged at the upper end of the bottom plate (71), and a jig platform (73) arranged at the upper end of the rotating seat (72).

7. The apparatus as claimed in claim 1, wherein: the supplementary subassembly (8) of shooing of light source is including setting up riser (81) in workstation (3) one side, setting up fixed plate (82) at riser (81) lower extreme to and set up light trough (83) on fixed plate (82) surface, riser (81) are connected with workstation (3) through fixed plate (82).