CN216282939U - Ultrathin heat pipe with copper powder filled inside - Google Patents
Ultrathin heat pipe with copper powder filled inside Download PDFInfo
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- CN216282939U CN216282939U CN202122274362.8U CN202122274362U CN216282939U CN 216282939 U CN216282939 U CN 216282939U CN 202122274362 U CN202122274362 U CN 202122274362U CN 216282939 U CN216282939 U CN 216282939U
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Abstract
The utility model discloses an ultrathin heat pipe with copper powder filled inside, which comprises a flat copper pipe and a conducting liquid, wherein an accommodating cavity is formed in the flat copper pipe, first sintered copper powder layers are arranged in the accommodating cavity along two pairs of side edges of the flat copper pipe in the width direction, an evaporation through cavity which extends through the flat heat pipe in the length direction is reserved between the first sintered copper powder layers of the two pairs of side edges, and the conducting liquid is arranged in the evaporation through cavity. According to the utility model, the first sintering copper powder layers are arranged in the accommodating cavity of the flat copper pipe along two pairs of side edges of the width direction of the flat copper pipe, the evaporation through cavity which extends and runs through along the length direction of the flat heat pipe is reserved between the first sintering copper powder layers on the two pairs of side edges, the heat conduction performance of the heat pipe is improved by means of the first sintering copper powder layers, meanwhile, the first sintering copper powder layers are arranged on the two pairs of side edges of the width direction of the flat copper pipe, the arrangement of the first sintering copper powder layers and the space design of the evaporation through cavity are considered, and the heat pipe is suitable for the thin heat pipe.
Description
Technical Field
The utility model relates to the technical field of heat pipes, in particular to an ultrathin heat pipe filled with copper powder on the inner side.
Background
In a traditional heat pipe, a copper pipe is filled with a conducting liquid, and then the copper pipe is vacuumized, exhausted and sealed. When the heat pipe is actually used, when one end of the heat pipe is heated, the conduction liquid of the heat pipe is rapidly evaporated under negative pressure, and the heat is brought to the low-temperature position at the other end and is dissipated through the radiator. In order to further improve the heat conduction performance of the heat pipe, a copper mesh is laid in the heat pipe, but in the case of a small size of the heat pipe (mainly referring to the internal cross section of the heat pipe), the copper mesh laying operation is inconvenient.
Therefore, the applicant researches a structural form that the flat copper pipe adopts two pairs of side edges in the width direction to sinter the copper powder layers, so as to improve the heat conduction performance of the thin heat pipe.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to a copper powder filled ultra-thin heat pipe, which has a first sintered copper powder layer to improve the heat conductivity of the heat pipe. Meanwhile, the first sintering copper powder layer is arranged on the two pairs of side edges in the width direction of the flat copper pipe, so that the first sintering copper powder layer and the space design of the evaporation through cavity are considered, and the thin heat pipe is suitable for the thin heat pipe.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides an ultra-thin heat pipe of inboard copper powder of filling out, is including flat copper pipe, conduction liquid, wherein, the holding chamber has in the flat copper pipe, two pairs of sides along the width direction of flat copper pipe in the holding chamber all are provided with first sintering copper bisque, and, the evaporation that remains between the first sintering copper bisque of two pairs of sides and extend the length direction along the flat heat pipe and link up leads to the chamber, the conduction liquid sets up in evaporating and leads to the intracavity.
As a preferred scheme, the accommodating cavity of the flat copper pipe is provided with a first inner side surface and a second inner side surface which are arranged on opposite sides and are equal in size, the first inner side surface and the second inner side surface are parallel to the width direction of the flat copper pipe, the flat copper pipe is provided with a third inner side surface and a fourth inner side surface which are arranged on the other opposite sides and are equal in size, the third inner side surface and the fourth inner side surface are parallel to the thickness direction of the flat copper pipe, and the thickness of the flat copper pipe is smaller than the width; the first sintered copper powder layer is arranged on the third inner side face and the fourth inner side face respectively.
As a preferable scheme, the two ends of the accommodating cavity in the length direction of the flat copper pipe are respectively provided with a second sintered copper powder layer.
As a preferable scheme, the second sintered copper powder layer is in a honeycomb block shape, and the second sintered copper powder layer is sintered outside the flat copper pipe into a honeycomb block shape and then is plugged into the accommodating cavity of the flat copper pipe to achieve connection and positioning.
Preferably, the cross section of the evaporation through cavity is more than 4 times of the cross section of the first sintered copper powder layer.
Compared with the prior art, the heat pipe has the obvious advantages and beneficial effects, and particularly, according to the technical scheme, the first sintering copper powder layers are arranged on the two pairs of side edges of the accommodating cavity of the flat copper pipe along the width direction of the flat copper pipe, the evaporation through cavity which extends through along the length direction of the flat heat pipe is reserved between the first sintering copper powder layers on the two pairs of side edges, the conducting liquid is arranged in the evaporation through cavity, and the heat conducting performance of the heat pipe is improved by means of the first sintering copper powder layers. Meanwhile, the first sintering copper powder layer is arranged on the two pairs of side edges in the width direction of the flat copper pipe, so that the first sintering copper powder layer and the space design of the evaporation through cavity are considered, and the thin heat pipe is suitable for the thin heat pipe.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a perspective view of a first embodiment of the present invention;
fig. 2 is another perspective view (partially cut away to show the position relationship of the first sintered copper powder layer in the accommodating cavity) according to the first embodiment of the utility model;
FIG. 3 is an enlarged partial view of FIG. 2;
fig. 4 is a partially enlarged view of a second embodiment of the present invention.
The attached drawings indicate the following:
10. flat copper pipe 100, containing cavity
101. First medial side 102, second medial side
103. A third medial side 104 and a fourth medial side
11. Evaporation through cavity 20, first sintered copper powder layer
30. And a second sintered copper powder layer.
Detailed Description
In the description of the present invention, it should be noted that, for the orientation words, such as the terms "upper", "lower", "front", "rear", "left", "right", etc., indicating the orientation and positional relationship based on the orientation or positional relationship shown in the drawings, are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation and operation, and should not be construed as limiting the specific scope of the present invention.
Referring to fig. 1 to 4, specific structures of two embodiments of the present invention are shown.
An ultra-thin heat pipe with copper powder filled inside comprises a flat copper pipe 10 and a conductive liquid. Fig. 1 to 3 are a perspective view and a partially enlarged view showing a specific structure of an embodiment of the present invention. The heat pipe comprises a flat copper pipe 10, a containing cavity 100 is arranged in the flat copper pipe 10, two pairs of side edges in the containing cavity 100 along the width direction of the flat copper pipe 10 are respectively provided with a first sintering copper powder layer 20, an evaporation through cavity 11 which extends through along the length direction of the flat heat pipe is reserved between the first sintering copper powder layers 20 on the two pairs of side edges, and the conducting liquid is arranged in the evaporation through cavity 11. Preferably, the cross-section of the evaporation through cavity 11 is more than 4 times the cross-section of the first sintered copper powder layer 20. When one end of the ultrathin heat pipe filled with copper powder on the inner side is heated, the conducting liquid is rapidly evaporated in the evaporation through cavity 11 under negative pressure, heat conduction begins to occur at the heated high-temperature position, and the transferred heat passes through the first sintered copper powder layer 20 and the evaporation through cavity 11 and then is taken to the other end low-temperature position. Meanwhile, the conducting liquid is evaporated in the evaporation through cavity 11 under negative pressure, and the gas generated by evaporation flows from one end of the accommodating cavity 100 to the other end under a small pressure difference, because the first sintering copper powder layer 20 is arranged in the accommodating cavity 100 of the flat copper pipe 10 along two pairs of side edges of the width direction of the flat copper pipe 10, so that: the gas generated by evaporation fully contacts the first sintered copper powder layer 20 in the accommodating cavity 100, thereby improving the heat conduction performance of the ultra-thin heat pipe filled with copper powder on the inner side.
In addition, the accommodating cavity 100 of the flat copper tube 10 is provided with a first inner side surface 101 and a second inner side surface 102 which are arranged on opposite sides and are equal in size, the first inner side surface 101 and the second inner side surface 102 are parallel to the width direction of the flat copper tube 10, the flat copper tube 10 is provided with a third inner side surface 103 and a fourth inner side surface 104 which are arranged on the other opposite sides and are equal in size, the third inner side surface 103 and the fourth inner side surface 104 are parallel to the thickness direction of the flat copper tube 10, and the thickness of the flat copper tube 10 is smaller than the width; the first sintered copper powder layer 20 is disposed on the third inner side surface 103 and the fourth inner side surface 104, respectively. Meanwhile, the first sintered copper powder layer 20 is arranged on two pairs of side edges (the third inner side surface 103 and the fourth inner side surface 104) in the width direction of the flat copper pipe 10, the arrangement of the first sintered copper powder layer 20 and the space design of the evaporation through cavity 11 are considered, and the accommodating cavity 100 is compact in internal structure, ingenious in design and suitable for a thin heat pipe.
Fig. 4 is a partially enlarged view showing a second specific structure according to the second embodiment of the present invention, in which a second sintered copper powder layer 30 is added to the accommodating chamber 100 according to the second embodiment. Specifically, the second sintered copper powder layer 30 is disposed at both ends of the length direction of the flat copper tube 10 in the accommodating cavity 100. The second sintered copper powder layer 30 is in a honeycomb block shape, and the second sintered copper powder layer 30 is sintered outside the flat copper pipe 10 to be in a honeycomb block shape and then is inserted into the accommodating cavity 100 of the flat copper pipe 10 to achieve connection and positioning. When one end of the ultrathin heat pipe filled with copper powder on the inner side is heated, the conducting liquid is rapidly evaporated under negative pressure, heat conduction begins to occur at the heated high-temperature position, the transferred heat passes through the second sintered copper powder layer 30 at one end, then the heat passes through the first sintered copper powder layer 20 and the evaporation through cavity 11, then the heat is transferred to the second sintered copper powder layer 30 at the other end, and finally the heat is taken to the low-temperature position at the other end. The second sintered copper powder layer 30 is honeycomb-shaped, so that the conducting liquid and the evaporated gas thereof can form better heat transfer with the second sintered copper powder layer 30 with a honeycomb structure, and the heat conducting performance of the heat pipe is further improved.
During actual processing, the length is fixed, the pipe is contracted and the spot welding is carried out according to the front section process of the normal heat pipe, then the symmetrical two sides of the flat copper pipe 10 are filled with copper powder through a set special powder filling jig, then the flat copper pipe is returned to a furnace for high-temperature sintering so as to be fastened, and then the rear end forming procedure is completed according to the conventional manufacturing procedure of the heat pipe.
The utility model is mainly characterized in that first sintering copper powder layers are arranged in two pairs of side edges of the accommodating cavity of the flat copper pipe along the width direction of the flat copper pipe, an evaporation through cavity which extends through along the length direction of the flat heat pipe is reserved between the first sintering copper powder layers on the two pairs of side edges, the conducting liquid is arranged in the evaporation through cavity, and the heat conducting performance of the heat pipe is improved by means of the first sintering copper powder layers. Meanwhile, the first sintering copper powder layer is arranged on the two pairs of side edges in the width direction of the flat copper pipe, so that the first sintering copper powder layer and the space design of the evaporation through cavity are considered, and the thin heat pipe is suitable for the thin heat pipe.
Secondly, through set up the second sintering copper powder layer at the length direction's of flat copper pipe both ends in the holding chamber, especially, the second sintering copper powder layer is the honeycomb bulk, and the gaseous state homoenergetic after conducting liquid and evaporation and the second sintering copper powder layer formation of honeycomb structure are better heat transfer, has further promoted heat pipe heat conductivility.
Claims (5)
1. The ultrathin heat pipe with copper powder filled inside is characterized in that: including flat copper pipe, conduction liquid, wherein, the holding chamber has in the flat copper pipe, the holding intracavity all is provided with first sintering copper bisque along the two pairs of sides of the width direction of flat copper pipe, and, remains between the first sintering copper bisque of two pairs of sides and extends the evaporation that link up and lead to the chamber that runs through along the length direction of flat heat pipe, the conduction liquid sets up in evaporating and leads to the intracavity.
2. The ultra-thin heat pipe with copper powder filled inside as claimed in claim 1, wherein: the accommodating cavity of the flat copper pipe is provided with a first inner side face and a second inner side face which are arranged on opposite sides and are equal in size, the first inner side face and the second inner side face are parallel to the width direction of the flat copper pipe, the flat copper pipe is provided with a third inner side face and a fourth inner side face which are arranged on the other opposite sides and are equal in size, the third inner side face and the fourth inner side face are parallel to the thickness direction of the flat copper pipe, and the thickness of the flat copper pipe is smaller than the width; the first sintered copper powder layer is arranged on the third inner side face and the fourth inner side face respectively.
3. The ultra-thin heat pipe with copper powder filled inside as claimed in claim 1, wherein: and second sintered copper powder layers are arranged at two ends of the accommodating cavity in the length direction of the flat copper pipe.
4. The ultra-thin heat pipe with copper powder filled inside as claimed in claim 3, wherein: the second sintered copper powder layer is in a honeycomb block shape, and is filled into the containing cavity of the flat copper pipe to achieve connection and positioning after being sintered outside the flat copper pipe in the honeycomb block shape.
5. The ultra-thin heat pipe with copper powder filled inside as claimed in claim 1, wherein: the cross section of the evaporation through cavity is more than 4 times of the cross section of the first sintering copper powder layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122274362.8U CN216282939U (en) | 2021-09-18 | 2021-09-18 | Ultrathin heat pipe with copper powder filled inside |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122274362.8U CN216282939U (en) | 2021-09-18 | 2021-09-18 | Ultrathin heat pipe with copper powder filled inside |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216282939U true CN216282939U (en) | 2022-04-12 |
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ID=81065065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122274362.8U Active CN216282939U (en) | 2021-09-18 | 2021-09-18 | Ultrathin heat pipe with copper powder filled inside |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216282939U (en) |
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2021
- 2021-09-18 CN CN202122274362.8U patent/CN216282939U/en active Active
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