CN216253367U - Connecting device - Google Patents

Abstract

The application discloses a connecting device, which comprises a printed circuit board, wherein the printed circuit board comprises a first power supply welding spot, and the first power supply welding spot is used for being electrically connected with a chip power supply welding spot of a storage device to be tested; the second power supply welding spot is electrically connected with an equipment power supply welding spot of external equipment, and the second power supply welding spot is electrically connected with the first power supply welding spot; and the leading-out end is electrically connected with the first power supply welding point and the second power supply welding point and is connected between the first power supply welding point and the second power supply welding point in series. By adopting the connecting device, signals between the external equipment and the storage equipment to be tested can be led out, the working signals of the storage equipment to be tested can be simply obtained, and the special flying operation on specific welding spots is not needed.

Description

Connecting device

Technical Field

The application relates to the technical field of circuit boards, in particular to a connecting device.

Background

In order to achieve miniaturization and function maximization of an electronic component such as an eMMC chip and a Flash memory chip, a great number of micro components are integrated in a small-sized component, so that a large number of pins or solder joints are led out in a packaging process, regardless of a commonly used packaging form such as TSOP (thin small package) or BGA (ball grid array).

In the subsequent verification or test process of the components, the pins or the welding points are connected by copper wires through flying wires to lead specific signals to external equipment such as a test board and the like so as to perform other operations.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides a connection device to solve the problem that in the prior art, the number of pins or solder joints of a component is large and dense, and it is difficult to extract signals.

The embodiment of the application provides a connecting device, which comprises a printed circuit board, wherein the printed circuit board comprises a first power supply welding spot, and the first power supply welding spot is used for being electrically connected with a chip power supply welding spot of a storage device to be tested; the second power supply welding spot is electrically connected with an equipment power supply welding spot of external equipment, and the second power supply welding spot is electrically connected with the first power supply welding spot; and the leading-out end is electrically connected with the first power supply welding point and the second power supply welding point and is connected between the first power supply welding point and the second power supply welding point in series.

Optionally, the printed circuit board further includes a first surface, and the first power supply pad is located on the first surface; and the first surface and the second surface are arranged oppositely, and the second power supply welding spot is positioned on the second surface.

Optionally, the terminals include a first terminal and a second terminal, and the first terminal is connected in series and electrically with the second terminal.

Optionally, the connection device includes a control switch, and the control switch is connected in series between the first terminal and the second terminal.

Optionally, the printed circuit board includes a plurality of first signal pads, and the plurality of first signal pads are located on the first surface and electrically connected to pads of the memory chip to be tested.

Optionally, the memory chip to be tested further includes chip signal pads, where the chip signal pads include eight chip data pads, one chip clock pad and one chip command pad; the plurality of first signal pads includes eight first data pads, one first clock pad and one first command pad for corresponding electrical connection with the die signal pads.

Optionally, the printed circuit board further includes a plurality of second signal pads, and the plurality of second signal pads are located on the second surface and electrically connected to pads of the external device.

Optionally, the external device further includes device signal pads, where the device signal pads include eight device data pads, one device clock pad, and one device command pad; the second signal pads include eight second data pads, one second clock pad and one second command pad for corresponding electrical connection with the device signal pads.

Optionally, the plurality of first signal pads and the plurality of second signal pads are correspondingly electrically connected.

The connecting device provided by the embodiment of the application is used for providing a connecting effect for the storage equipment to be tested and the external equipment, wherein the connecting device is provided with two opposite surfaces, and welding spots on the two surfaces are respectively welded with the welding spots on the storage equipment to be tested and the external equipment, so that the signal interaction between the storage equipment to be tested and the external equipment is realized. And a leading-out terminal is arranged between welding points corresponding to the power supply signals, and the power supply signals provided by the equipment for the storage equipment to be tested are led out, so that the working power supply information of the storage equipment to be tested is simply obtained, and the special flying operation on the specific welding points is not needed.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a perspective view of a storage device under test according to an embodiment of the present application;

FIG. 2 is a diagram illustrating a definition of a pad of a chip of a memory device under test according to an embodiment of the present disclosure;

FIG. 3 is a perspective view of an external device shown in an embodiment of the present application;

fig. 4 is a connection block diagram of an external device, a connection apparatus, and a storage device under test according to an embodiment of the present application;

FIG. 5 is a schematic assembly diagram of an external device, a connection device, and a storage device under test according to an embodiment of the present disclosure;

FIG. 6 is a perspective view of a connection device shown in an embodiment of the present application;

FIG. 7 is a front view of a connection device shown in an embodiment of the present application;

FIG. 8 is a rear view of the connection device shown in an embodiment of the present application;

FIG. 9 is a cross-sectional view of the interior of a printed circuit board of the connector apparatus shown in an embodiment of the present application;

FIG. 10 is a schematic diagram of an apparatus for performing voltage measurements according to an embodiment of the present application;

fig. 11 is a schematic view of an apparatus for current measurement according to an embodiment of the present application.

In the figure: 100-eMMC memory chips; 110-chip pads;

200-a test board; 210-a PCB board; 220-a controller; 230-DC power supply connector; 240-USB interface; 250-a mounting position; 260-equipment welding points;

300-a connecting means; 310-a printed circuit board; 311-a first surface; 312 — a second surface; 320-a first solder joint; 321-a first power supply pad; 330-second solder joint; 331-a second power supply pad; 341-first terminal; 342-a second terminal; 350-control the switch.

Detailed Description

The technical solutions of the present application are described below clearly and completely by way of examples, and it is obvious that the described examples are only a part of the examples of the present application, and not all of the examples. The following embodiments and their technical features may be combined with each other without conflict.

The embodiment of the application uses the eMMC memory chip as the memory device to be tested, provides a connecting device, and can simply realize the power consumption test of the memory chip to be tested through the connecting device. The eMMC memory chip 100 is internally integrated with a Flash memory grain and a control grain, and the control grain controls operations in the memory chip, and may be used for data storage, read-write, verification and other operations. As shown in fig. 1, the eMMC memory chip 100 is in a BGA package form, and 153 chip pads 110 are arranged on one surface of the chip, electrically connected to an internal control die and a flash memory die, and the eMMC memory chip 100 can be soldered to pads of an external device by the chip pads, so as to realize signal interaction between the memory chip and the external device.

The chip pads on the memory chip have various transmission signal definitions and can be classified into chip signal pads and chip power pads by category. The specific signal definitions are as shown in fig. 2, the chip signal pads at least include 8 chip data pads DAT0-7, 1 chip clock pad CLK and 1 chip command pad CMD; the eMMC memory chip has a high voltage mode of operation and a dual voltage mode of operation, such that the chip bond pads include at least one chip power bond pad. In the present embodiment, the chip power pads include VCC pads of E6, F5, J10, K9 in the table; VCCQ welding points of C6, M4, N4, P3 and P5; VSS pads of A6, E7, G5, J5, K8;

VSSQ solder joints of C4, N2, N5, P4, P6; VDDi pad of C2, etc. And the 8 chip data pads are respectively a DAT0 pad of A3, a DAT1 pad of a4, a DAT2 pad of a5, a DAT3 pad of B2, a DAT4 pad of B3, a DAT5 pad of B4, a DAT6 pad of B5, a DAT7 pad of B6; 1 chip clock pad is the CLK pad of M6; the 1 chip command pad is the CMD pad of M5. As can be seen from FIG. 2, the same data signal may have multiple pad correspondences, e.g., VCC for E6, F5, J10, K9 pad, but each data signal actually corresponds to one data line in the interior of the actual memory chip. That is, the VCC pads correspond to the same power supply circuit, and the pads for the same signal are actually different points on the same circuit, so that the current and voltage of the VCC pads are the same, for example, E6, F5, J10, and K9, and the same applies to VCCQ pads and the like.

An external device connects the eMMC memory chip 100 to perform various operations on the eMMC chip 100. Fig. 3 shows an overall block diagram of a specific test system in this embodiment, in which the test board is used as an external device. In the test board, a power supply circuit receives an external power supply to supply power to the controller and the memory chip, wherein VCCQ supplies a high voltage, such as 3.3V, and VCC supplies a normal voltage, such as 1.8V. The controller is electrically connected with the power supply circuit and the connecting device, and the connecting device is electrically connected with the eMMC memory chip, so that the controller on the test board performs data interaction with the eMMC memory chip through the adapter.

Referring to fig. 3, the test board 200 of the present embodiment includes a main body, which is a square PCB 210. A Controller (CPU)220 is disposed on the board, and can control the actions on the board, such as reading and writing of data, on/off of power supply, and the like; a DC power connector 230 for connecting an external power source to supply power to the entire apparatus; the USB connector 240 is used for connecting an external host computer and transmitting commands and data on the external host computer into the test board. A mounting location 250 is also provided on the PCB board, in which there are a plurality of device pads 260. The test board interacts with the eMMC memory chip through the device pad 260, and thus, similarly, the device pads are divided into device signal pads and device power pads according to the type, the device signal pads include at least 8 device data pads DDAT0-7, 1 device clock pad DCLK, and 1 device command pad DCMD, and the device power pads include at least 1 power pad DVCC. In the embodiment of the present application, the number of the device pads 260 at the test board mounting position 250 is 153, which is the same as the number of the chip pads on the eMMC memory chip, and the device pads and the chip pads can correspond to each other one by one, and are used for connecting each chip pad and performing signal transmission.

As shown in fig. 4, the signals from the eMMC memory chip 100 include at least a CLK clock signal, a CMD command signal, a DAT0-7 data signal, and a VCCQ power signal. Correspondingly, the signals from the controller 220 on the test board include at least the CLK clock signal, the CMD command signal, the DAT0-7 data signal, and the VCCQ power signal. In order to realize control over the eMMC memory chip, signals on the controller correspond to signals on the eMMC flash memory chip one to one and are electrically connected with the signals on the eMMC flash memory chip.

The CLK clock signal is used for outputting the clock signal from the test board end, and carrying out synchronization of data transmission and driving of equipment operation. By adjusting the clock frequency, the power saving or data flow control function can be realized. In some scenarios, the test board end may also turn off the clock, e.g., the eMMC memory chip is in Busy state, etc. The CMD Command signal is mainly used for sending a Command to the eMMC memory chip by the test board end and sending a corresponding Response to the test board end by the eMMC memory chip. The DAT0-7 data signal is mainly used for data transmission between the test board end and the eMMC memory chip, only the DAT0 can perform data transmission after the eMMC is powered on or is in soft reset, and after the data transmission is completed, the DAT0-3 or the DAT0-7 can be configured to perform data transmission, namely, a data bus can be configured to be in a 4-bit or 8-bit mode. The VCCQ power supply signal is mainly used for providing high working voltage for the eMMC memory chip by the test board end, the VCC power supply signal is mainly used for providing working voltage for the eMMC memory chip by the test board end, and the VSS power supply signal is mainly used for grounding.

The embodiment of the application provides a connecting device, which provides a connecting function between an eMMC memory chip and a test board and can simply lead out a power supply welding spot signal in the eMMC memory chip. The connection device 300 will be described in detail with reference to fig. 6 to 8. The main body of the connecting device 300 is a printed circuit board 310 in a sheet shape. The printed circuit board has two oppositely disposed mounting surfaces and divides the two mounting surfaces into a first surface 311 and a second surface 312.

The first surface and the second surface are both provided with a plurality of welding spots, in the embodiment of the application, the number of the first welding spots 320 on the first surface 311 is 153, and is the same as that of the chip welding spots 110 of the eMMC memory chip; the second surface 312 also has 153 second pads 330. As shown in fig. 5, in the testing process, to achieve the connection function between the eMMC memory chip and the testing board, the eMMC memory chip 100 is mounted on the first surface 311 of the connecting device, and 153 chip pads 110 on the eMMC memory chip are correspondingly soldered to 153 first pads 320 on the first surface; the connecting device 300 is mounted in the mounting position 250 of the test board 200, and 153 second pads 330 on the second surface 312 of the connecting device 300 are soldered corresponding to 153 device pads 260 in the mounting position.

It will be appreciated that the first bond pad 320 on the first surface 311 needs to be connected to the chip bond pad 110 on the eMMC memory chip, and thus may be divided into a first power supply bond pad and a first signal bond pad depending on the type of signal to be transferred. The first power pad is configured to be electrically connectable to a corresponding chip power pad on the eMMC memory chip; the first signal pad is configured to be electrically connectable to a corresponding chip signal pad on the eMMC memory chip. In order to completely transmit signals in the eMMC memory chip 100 to the test board 200, the second pad 330 on the second surface 312 corresponds to the first pad 320 on the first surface 311, and is electrically connected to the circuit board through a conductive wire, so that the second pad 330 on the second surface can be divided into a second power pad and a second signal pad according to different signals to be transmitted.

The first welding spots 320 on the first surface include at least 1 first power supply welding spot corresponding to the welding spots of the eMMC memory chip and electrically connected with the chip power supply welding spot on the eMMC memory chip; at least 8 first data welding spots which correspond to and are electrically connected with 8 chip data welding spots on the eMMC memory chip; at least 1 first clock welding spot which corresponds to and is electrically connected with 1 chip clock welding spot on the eMMC memory chip; at least 1 first command pad corresponding to and electrically connected to 1 chip command pad on the eMMC memory chip. The second pads 330 on the second surface include at least 1 second power pad, corresponding to and electrically connected to the device power pads on the test board; at least 8 second data welding points which correspond to and are electrically connected with the 8 equipment data welding points on the test board; at least 1 second clock welding point which corresponds to and is electrically connected with 1 equipment clock welding point on the test board; and the at least 1 second command welding point corresponds to and is electrically connected with the 1 equipment command welding point on the test board.

In testing, the eMMC memory chips 100 are soldered to the first surface 311 of the connecting device 300, and the chip pads 110 are soldered to the first pads 320 on the first surface one by one, thereby achieving an electrical connection. The connection device 300 is soldered to the mounting position 260 of the test board 200, and the second pads 330 on the second surface 312 are soldered to the device pads 260 one by one, thereby achieving the electrical connection.

The first pads 320 on the first surface 311 are electrically connected to the second pads 330 on the second surface 312 in a one-to-one correspondence manner, specifically, the first power pads are electrically connected to the second power pads, the 8 first data pads are electrically connected to the 8 second data pads in a one-to-one manner, the first clock pads are electrically connected to the second clock pads, and the first command pads are electrically connected to the second command pads. Referring to the cross-sectional view of the connecting device in fig. 9, a plurality of conductive wires 410 are provided in the printed circuit board, a first end of each conductive wire is connected to a solder joint on the first surface, and a second end of each conductive wire is correspondingly connected to a solder joint on the second surface, so as to realize the electrical connection.

The connection device provides a connection transmission function between the eMMC memory chip and the test board, and a plurality of leading-out terminals are arranged on the connection device and used for leading out partial signals in the eMMC memory chip to carry out test operation. In the embodiment of the application, in order to extract the power supply information of the eMMC memory chip in the operating state for specific power consumption confirmation, 2 extraction terminals are provided on the first surface and used as extraction terminals of the power supply signal. Referring to fig. 6 to 8, the first terminal 341 is disposed at an edge of the first surface 311, electrically connected to the first power supply pad and the second power supply pad, and connected in series between the first power supply pad and the second power supply pad; the second terminal 342 is disposed at an edge of the first surface, electrically connected to the first power pad and the second power pad, and connected in series between the first power pad and the second power pad.

Specifically, the first leading-out terminal and the second leading-out terminal are electrically connected in the same line, and the first leading-out terminal and the second leading-out terminal are arranged between the first power supply welding point and the second power supply welding point in a series connection mode. Referring to fig. 9, the first and second terminals 341 and 342 are shown offset from each other for clarity of the drawing components. The first power supply welding point 321 is electrically connected with the first leading-out terminal 341 through a wire, the first leading-out terminal 341 is electrically connected with the second leading-out terminal 342 through a wire, and the second leading-out terminal 342 is electrically connected with the second power supply welding point 331 through a wire, so that the first leading-out terminal and the second leading-out terminal are connected in series between the first power supply welding point and the second power supply welding point. When the connection device is used normally, the connection device is welded with the eMMC memory chip and the test board, and welding spots on the first surface and the second surface cannot be exposed, so that the first leading-out end and the second leading-out end can play a role in simply leading out a power supply signal.

A control switch 350, which may be a miniaturized switch such as a micro switch, is connected in series between the first terminal 341 and the second terminal 342. The control switch 350 may control the opening and closing of the path between the first power supply pad and the second power supply pad. With reference to fig. 10 and 11, when the voltage in the eMMC memory chip needs to be measured, the control switch is closed, and one end of the voltage measuring device is electrically connected to the first lead-out terminal or the second lead-out terminal, and the other end is electrically connected to the ground, so that the actual operating voltage in the eMMC memory chip is measured. And when measuring the current in the eMMC memory chip, the control switch is switched off, one end of the current measuring device is electrically connected to the first leading-out end, and the other end of the current measuring device is electrically connected to the second leading-out end, so that the current measuring device is connected between the first leading-out end and the second leading-out end in series, and the actual working current in the eMMC memory chip is measured. By controlling the on-off of the switch, simple measurement of voltage and current on the eMMC memory chip is achieved, and therefore specific power consumption of the eMMC memory chip is confirmed.

Different from the prior art, the switching device provided in the embodiment of the application comprises a printed circuit board, wherein a first power supply welding spot is arranged on the printed circuit board and is used for being electrically connected with a chip power supply welding spot of a storage device to be tested; and the second power supply welding spot is used for being electrically connected with the equipment power supply welding spot of the external equipment. The first power supply welding spot is electrically connected with the second power supply welding spot; and the leading-out end is electrically connected with the first power supply welding point and the second power supply welding point and is connected between the first power supply welding point and the second power supply welding point in series. By the mode, the leading-out end can lead out a power supply signal provided by the external equipment to the storage equipment to be tested, so that the working power supply information of the storage equipment to be tested can be simply obtained, and the special flying operation on a specific welding spot is not needed.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; within the idea of the utility model, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the utility model as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (9)

1. A connection device comprising a printed circuit board, wherein the printed circuit board comprises:

the first power supply welding spot is used for being electrically connected with a chip power supply welding spot of the storage equipment to be tested;

the second power supply welding spot is electrically connected with an equipment power supply welding spot of external equipment, and the second power supply welding spot is electrically connected with the first power supply welding spot;

and the leading-out end is electrically connected with the first power supply welding point and the second power supply welding point and is connected between the first power supply welding point and the second power supply welding point in series.

2. The connection device of claim 1, wherein the printed circuit board further comprises:

a first surface, said first power pad being located on said first surface;

and the first surface and the second surface are arranged oppositely, and the second power supply welding spot is positioned on the second surface.

3. The connection device of claim 1, wherein the pigtails include a first pigtail and a second pigtail, the first pigtail being in series and electrically connected with the second pigtail.

4. The connection device of claim 3, further comprising a control switch connected in series between the first and second outlets.

5. The connecting device of claim 2, wherein the printed circuit board includes a plurality of first signal pads on the first surface for electrical connection with pads of the memory chip under test.

6. The connecting device according to claim 5, wherein the memory chip under test further comprises chip signal pads, the chip signal pads comprising eight chip data pads, one chip clock pad and one chip command pad; the plurality of first signal pads includes eight first data pads, one first clock pad and one first command pad for corresponding electrical connection with the die signal pads.

7. The connection device of claim 6, wherein the printed circuit board further comprises a second plurality of signal pads on the second surface for electrical connection with pads of the external device.

8. The connection apparatus according to claim 7, wherein the external device further comprises device signal pads, the device signal pads comprising eight device data pads, one device clock pad, and one device command pad; the second signal pads include eight second data pads, one second clock pad and one second command pad for corresponding electrical connection with the device signal pads.

9. The connection device of claim 8, wherein the first plurality of signal pads are electrically connected in correspondence with the second plurality of signal pads.

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