CN216227416U - Automatic micropore polishing device and automatic micropore polishing system - Google Patents
Automatic micropore polishing device and automatic micropore polishing system Download PDFInfo
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- CN216227416U CN216227416U CN202122920464.2U CN202122920464U CN216227416U CN 216227416 U CN216227416 U CN 216227416U CN 202122920464 U CN202122920464 U CN 202122920464U CN 216227416 U CN216227416 U CN 216227416U
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Abstract
The utility model relates to the technical field of micropore processing, in particular to an automatic micropore polishing device and an automatic micropore polishing system; the device comprises a processing tank, wherein conductive seats are distributed on the inner wall of the processing tank at intervals in the circumferential direction, and electrodes parallel to the bottom of the processing tank are arranged on each conductive seat; a polishing clamping piece is arranged above the processing groove and connected with a polishing lifting mechanism, and the polishing lifting mechanism is connected with a polishing reciprocating mechanism fixed on the suspension; the bottom of the processing groove is provided with a heating mechanism, the processing groove is communicated with a liquid circulation mechanism, the conductive seat and the polishing clamping piece are respectively electrically connected with a power supply, and the bottom of the processing groove is fixed in the insulating box through the supporting legs. The utility model aims to provide an automatic micropore polishing device and an automatic micropore polishing system, and the technical problem that the existing plasma nanometer polishing processing technology in the prior art cannot process a micropore metal workpiece is solved through the micropore polishing processing method.
Description
Technical Field
The utility model relates to the technical field of micropore processing, in particular to an automatic micropore polishing device and an automatic micropore polishing system.
Background
Polishing is always an important link in the production and manufacturing process of metal products, the currently common polishing method mainly adopts mechanical or manual polishing, the mechanical polishing can obtain a relatively flat surface but cannot be used for polishing workpieces with complex shapes, and metal dust is generated in the processing process and harms human health; the chemical polishing has high processing efficiency, can polish workpieces with complex shapes, but the polishing solution used by the chemical polishing is mostly corrosive liquid and has great environmental pollution. The ultrasonic polishing, abrasive flow polishing and magnetic grinding costs are too high, and the application range is small.
The plasma nano polishing technology is a green polishing method aiming at metal workpieces, can effectively polish workpieces with complex shapes, can not generate waste liquid which is difficult to treat in the polishing process, can replace traditional polishing methods such as mechanical polishing, chemical polishing and electrolytic polishing, solves the problems that the workpieces with complex shapes are difficult to treat by mechanical polishing and the waste liquid which is difficult to treat by chemical polishing and electrolytic polishing and does not have macroscopic force in the polishing process, can not leave microcracks and residual stress on the surfaces of the workpieces to influence the service life of the workpieces, and effectively reduces adverse effects on the environment and human health while solving the problem of efficient deburring and polishing of the surfaces of the metal workpieces. The plasma nano polishing technology uses a low-concentration salt solution as a working medium, uses clean electric energy as power, and removes burrs on the metal surface by utilizing the characteristic that plasma discharge is preferentially generated at the tip convex part. Compared with the traditional polishing method, the technology solves the problem that dust and corrosive waste liquid in a production workshop are discharged to pollute the environment, reduces the equipment cost and simplifies the operation process and the processing procedure.
The inner hole machining accounts for 33% of the metal workpiece machining, and the traditional polishing method is difficult to polish the surface with the tiny hole diameter of the workpiece. At present, few researches on inner hole polishing of metal workpieces are carried out by a plasma nano polishing processing technology. Patent CN107779943A discloses a metal inner hole plasma polishing device and a processing method thereof, and although the idea of solving the plasma nano polishing processing technology is proposed, how to process a metal workpiece with a micro-hole is not disclosed.
Therefore, the present invention is directed to an automatic micro-hole polishing apparatus and an automatic micro-hole polishing system.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an automatic micropore polishing device and an automatic micropore polishing system, and the technical problem that the existing plasma nanometer polishing processing technology in the prior art cannot process a micropore metal workpiece is solved through the micropore polishing processing method.
The utility model provides an automatic micropore polishing device which comprises a processing tank, wherein conductive seats are distributed on the inner wall of the processing tank at intervals in the circumferential direction, and electrodes parallel to the bottom of the processing tank are arranged on each conductive seat; a polishing clamping piece is arranged above the processing groove and connected with a polishing lifting mechanism, and the polishing lifting mechanism is connected with a polishing reciprocating mechanism fixed on the suspension; the bottom of the processing groove is provided with a heating mechanism, the processing groove is communicated with a liquid circulation mechanism, the conductive seat and the polishing clamping piece are respectively electrically connected with a power supply, and the bottom of the processing groove is fixed in the insulating box through the supporting legs.
Further, the heating mechanism comprises a heating pipe positioned at the bottom of the machining groove, and the heating pipe is electrically connected with a power supply.
Further, the polishing lifting mechanism comprises a cylinder which is longitudinally arranged, and one end of a telescopic rod of the cylinder is provided with a connecting part which is used for being connected with the polishing clamping piece; the polishing clamping piece is detachably connected with the connecting part.
Further, polishing reciprocating device includes the lead screw and is fixed in the movable block on the lead screw, and the cylinder is fixed in on the movable block, and lead screw one end is connected with the motor.
Furthermore, a water outlet is formed in the bottom of the processing tank and is communicated with a liquid circulating pump through a pipeline, the liquid circulating pump is also communicated with a liquid storage tank, and the water outlet of the liquid storage tank is communicated with a water inlet of the processing tank.
Further, the polishing clamping piece is electrically connected with the positive electrode of the power supply, and the conductive seat is electrically connected with the negative electrode of the power supply.
Furthermore, the vertical distance between the electrode and the bottom of the machining groove is 20-50 cm.
The utility model also provides an automatic micropore polishing system which comprises the automatic micropore polishing device, an automatic cleaning device and an automatic drying device.
Furthermore, the automatic cleaning device comprises a cleaning tank, a cleaning clamping piece is arranged above the cleaning tank, the cleaning clamping piece is connected with a cleaning lifting mechanism, and the cleaning lifting mechanism is connected with the suspension through a cleaning reciprocating mechanism; and a spray head is arranged on the side wall of the cleaning tank and is communicated with the water pumping mechanism.
Further, the automatic drying device comprises a drying groove, a drying clamping piece is arranged above the drying groove and connected with a drying lifting mechanism, and the drying lifting mechanism is connected with the suspension through a drying reciprocating mechanism; the inner side wall of the drying groove is provided with an air nozzle which is communicated with the air blower.
Compared with the prior art, the automatic micropore polishing device and the automatic micropore polishing system provided by the utility model have the following advantages:
the automatic micropore polishing device comprises a processing tank, wherein conductive seats are distributed on the inner wall of the processing tank at intervals in the circumferential direction, and electrodes parallel to the bottom of the processing tank are arranged on each conductive seat; a polishing clamping piece is arranged above the processing groove and connected with a polishing lifting mechanism, and the polishing lifting mechanism is connected with a polishing reciprocating mechanism fixed on the suspension; the bottom of the processing tank is provided with a heating mechanism, the processing tank is also communicated with a liquid circulation mechanism, the conductive seat and the polishing clamping piece are respectively electrically connected with a power supply, and the bottom of the processing tank is fixed in the insulating box through the support legs, so that the workpiece with micropores can be polished by adopting ionic liquid, burrs of the workpiece can be removed, the processing tank can be used for polishing micro holes with the diameter of 1-5 mm, and the technical problem that the existing plasma nano polishing processing technology cannot process metal workpieces with the micro holes is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of a micro-hole polishing apparatus according to the present invention;
FIG. 2 is a schematic diagram of an automated micro-polishing system according to the present invention.
Description of reference numerals:
1. an electrode; 2. processing a tank; 3. polishing the clamping piece; 5. an automatic cleaning device; 51. a cleaning tank; 52. cleaning the clamping piece; 53. cleaning the lifting mechanism; 54. cleaning the reciprocating mechanism; 55. a water pumping mechanism; 511. a spray head; 6. an automatic drying device; 61. a drying tank; 62. drying the clamping piece; 63. a drying lifting mechanism; 64. a drying reciprocating mechanism; 65. a blower; 611. a gas showerhead; 7. a polishing lifting mechanism; 8. a suspension; 9. a support leg; 10. an insulating case; 11. a conductive seat; 12. a polishing reciprocating mechanism; 121. a lead screw; 122. a moving block; 71. a cylinder; 72. a connecting portion.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the embodiment provides an automatic micro-hole polishing device, which includes a processing tank 2, conductive bases 11 are circumferentially distributed on the inner wall of the processing tank 2 at intervals, and an electrode 1 parallel to the bottom of the processing tank 2 is mounted on each conductive base 11; a polishing clamping piece 3 is arranged above the processing groove 2, the polishing clamping piece 3 is connected with a polishing lifting mechanism 7, and the polishing lifting mechanism 7 is connected with a polishing reciprocating mechanism 12 fixed on a suspension 8; the bottom of the processing tank 2 is provided with a heating mechanism, the processing tank 2 is also communicated with a liquid circulation mechanism, the conductive seat 11 and the polishing clamping piece 3 are respectively electrically connected with a power supply, and the bottom of the processing tank 2 is fixed in the insulating box 10 through the supporting legs 9.
The automatic micropore polishing device comprises a processing tank 2, conductive seats 11 are distributed on the inner wall of the processing tank 2 at intervals in the circumferential direction, and electrodes 1 parallel to the bottom of the processing tank 2 are mounted on the conductive seats 11; a polishing clamping piece 3 is arranged above the processing groove 2, the polishing clamping piece 3 is connected with a polishing lifting mechanism 7, and the polishing lifting mechanism 7 is connected with a polishing reciprocating mechanism 12 fixed on a suspension 8; the bottom of the processing tank 2 is provided with a heating mechanism, the processing tank 2 is also communicated with a liquid circulation mechanism, the conductive seat 11 and the polishing clamping piece 3 are respectively electrically connected with a power supply, and the bottom of the processing tank 2 is fixed in the insulating box 10 through the supporting legs 9, so that the polishing of a workpiece with micropores by adopting ionic liquid can be realized, burrs of the workpiece can be removed, the processing tank can be used for polishing micro holes with phi 1-phi 5mm, and the technical problem that the existing plasma nano polishing processing technology cannot process the micro-hole metal workpiece is solved.
Specifically, a to-be-polished piece is immersed into a processing tank 2 containing polishing liquid through a clamping piece 3, the micropores of the to-be-polished piece 4 are arranged opposite to the head part of an electrode 1 in the processing tank 2 or the head part of the electrode 1 penetrates into the micropores of the to-be-polished piece, and when the head part of the electrode 1 penetrates into the micropores of the to-be-polished piece, a certain gap is ensured between the outer wall of the electrode 1 and the micropores; after the polishing solution in the tank 2 to be processed is heated, starting a power supply to polish the workpiece to be polished; the electrode 1 is electrically connected with a power supply cathode, and the clamping piece 3 is electrically connected with a power supply anode; the diameter of the head of the electrode 1 is smaller than the inner diameter of the micro-hole.
The heating mechanism comprises a heating pipe positioned at the bottom of the processing tank 2, and the heating pipe is electrically connected with a power supply; the heating tube is common knowledge of those skilled in the art, and is not shown in the drawings and will not be described herein.
As shown in fig. 1, the polishing lifting mechanism 7 of the present embodiment includes a cylinder 71 disposed longitudinally, and one end of a telescopic rod of the cylinder 71 is provided with a connecting portion 72 for connecting with the polishing holder 3; the polishing holder 3 is detachably connected to the connecting portion 72.
The polishing lifting mechanism 7 comprises a cylinder 71 which is longitudinally arranged, and one end of a telescopic rod of the cylinder 71 is provided with a connecting part 72 which is used for connecting with the polishing clamping piece 3; the polishing clamping piece 3 and the connecting part 72 can be detachably connected, the polishing clamping piece 3 can be driven by the air cylinder 71 and the connecting part 72 to move up and down, and the polishing piece to be treated can be moved to the corresponding position of the electrode 1.
As shown in fig. 1, the polishing reciprocating mechanism 12 of the present embodiment includes a lead screw 121 and a moving block 122 fixed on the lead screw 121, the air cylinder 71 is fixed on the moving block 122, and one end of the lead screw 121 is connected to a motor.
According to the utility model, the polishing reciprocating mechanism 12 comprises a lead screw 121 and a moving block 122 fixed on the lead screw 121, the air cylinder 71 is fixed on the moving block 122, and one end of the lead screw 121 is connected with a motor, so that the left and right movement of the polishing clamping piece 3 can be realized.
The bottom of the processing tank 2 is provided with a water outlet which is communicated with a liquid circulating pump through a pipeline, the liquid circulating pump is also communicated with a liquid storage tank, and the water outlet of the liquid storage tank is communicated with a water inlet of the processing tank 2; the polishing cycle in the processing tank 2 can be also realized.
The polishing clamping piece 3 is electrically connected with a positive electrode of a power supply, and the conductive seat 11 is electrically connected with a negative electrode of the power supply.
The vertical distance between the electrode 1 and the bottom of the processing tank 2 is 20-50 cm; and polishing the workpiece.
As shown in fig. 2, the present embodiment further provides an automatic micro-hole polishing system, comprising the automatic micro-hole polishing apparatus according to any one of the above embodiments, an automatic cleaning apparatus 5 and an automatic drying apparatus 6; the automatic polishing, cleaning and drying can be realized, the batch production can be realized, the pollution is avoided, the application field of the plasma nano polishing technology is further expanded, and the application value of the technology is further improved.
As shown in fig. 2, the automatic cleaning device 5 of the present embodiment includes a cleaning tank 51, a cleaning holder 52 is disposed above the cleaning tank 51, the cleaning holder 52 is connected to a cleaning lifting mechanism 53, and the cleaning lifting mechanism 53 is connected to the suspension 8 through a cleaning reciprocating mechanism 54; the side wall of the cleaning tank 51 is provided with a spray head 511, and the spray head 511 is communicated with the water pumping mechanism 55, so that the workpiece can be cleaned.
As shown in fig. 2, the automatic drying device 6 of the present embodiment includes a drying tank 61, a drying clamping member 62 is disposed above the drying tank 61, the drying clamping member 62 is connected to a drying lifting mechanism 63, and the drying lifting mechanism 63 is connected to the suspension 8 through a drying reciprocating mechanism 64; the inner side wall of the drying groove 61 is provided with an air nozzle 611, and the air nozzle 611 is communicated with the air blower 65, so that the workpiece can be dried.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An automatic micropore polishing device which is characterized in that: the device comprises a processing tank (2), conductive seats (11) are distributed on the inner wall of the processing tank (2) at intervals in the circumferential direction, and electrodes (1) parallel to the bottom of the processing tank (2) are mounted on each conductive seat (11); a polishing clamping piece (3) is arranged above the processing groove (2), the polishing clamping piece (3) is connected with a polishing lifting mechanism (7), and the polishing lifting mechanism (7) is connected with a polishing reciprocating mechanism (12) fixed on a suspension (8); the bottom of the processing tank (2) is provided with a heating mechanism, the processing tank (2) is also communicated with a liquid circulation mechanism, the conductive seat (11) and the polishing clamping piece (3) are respectively electrically connected with a power supply, and the bottom of the processing tank (2) is fixed in an insulating box (10) through supporting legs (9).
2. The automated micro-hole polishing apparatus of claim 1, wherein: the heating mechanism comprises a heating pipe positioned at the bottom of the processing tank (2), and the heating pipe is electrically connected with a power supply.
3. The automated micro-hole polishing apparatus of claim 2, wherein: the polishing lifting mechanism (7) comprises a cylinder (71) which is longitudinally arranged, and one end of a telescopic rod of the cylinder (71) is provided with a connecting part (72) which is used for being connected with the polishing clamping piece (3); the polishing clamping piece (3) is detachably connected with the connecting part (72).
4. The automated micro-hole polishing apparatus of claim 3, wherein: the polishing reciprocating mechanism (12) comprises a lead screw (121) and a moving block (122) fixed on the lead screw (121), the air cylinder (71) is fixed on the moving block (122), and one end of the lead screw (121) is connected with a motor.
5. The automated micro-hole polishing apparatus of claim 4, wherein: the bottom of the processing tank (2) is provided with a water outlet which is communicated with a liquid circulating pump through a pipeline, the liquid circulating pump is also communicated with a liquid storage tank, and the water outlet of the liquid storage tank is communicated with the water inlet of the processing tank (2).
6. The automated micro-hole polishing apparatus of claim 5, wherein: the polishing clamping piece (3) is electrically connected with the positive electrode of the power supply, and the conductive seat (11) is electrically connected with the negative electrode of the power supply.
7. The automated micro-hole polishing apparatus of claim 6, wherein: the vertical distance between the electrode (1) and the bottom of the processing tank (2) is 20-50 cm.
8. An automatic micropore polishing system, characterized in that: comprising an automatic micro-hole polishing device according to any one of claims 1 to 7, an automatic cleaning device (5) and an automatic drying device (6).
9. The automated micro-hole polishing system of claim 8, wherein: the automatic cleaning device (5) comprises a cleaning tank (51), a cleaning clamping piece (52) is arranged above the cleaning tank (51), the cleaning clamping piece (52) is connected with a cleaning lifting mechanism (53), and the cleaning lifting mechanism (53) is connected with the suspension (8) through a cleaning reciprocating mechanism (54); the side wall of the cleaning tank (51) is provided with a spray head (511), and the spray head (511) is communicated with a water pumping mechanism (55).
10. The automated micro-hole polishing system of claim 8, wherein: the automatic drying device (6) comprises a drying groove (61), a drying clamping piece (62) is arranged above the drying groove (61), the drying clamping piece (62) is connected with a drying lifting mechanism (63), and the drying lifting mechanism (63) is connected with a suspension (8) through a drying reciprocating mechanism (64); the inner side wall of the drying groove (61) is provided with an air nozzle (611), and the air nozzle (611) is communicated with the air blower (65).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122920464.2U CN216227416U (en) | 2021-11-23 | 2021-11-23 | Automatic micropore polishing device and automatic micropore polishing system |
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| CN202122920464.2U CN216227416U (en) | 2021-11-23 | 2021-11-23 | Automatic micropore polishing device and automatic micropore polishing system |
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| CN216227416U true CN216227416U (en) | 2022-04-08 |
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| CN202122920464.2U Active CN216227416U (en) | 2021-11-23 | 2021-11-23 | Automatic micropore polishing device and automatic micropore polishing system |
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