CN216217728U

CN216217728U - Small-size ultrathin high-frequency circuit board

Info

Publication number: CN216217728U
Application number: CN202122658285.6U
Authority: CN
Inventors: 王永兵; 王萱
Original assignee: Shenzhen Assunny Precision Circuit Scien Tech Co ltd
Current assignee: Shenzhen Assunny Precision Circuit Scien Tech Co ltd
Priority date: 2021-11-02
Filing date: 2021-11-02
Publication date: 2022-04-05
Anticipated expiration: 2031-11-02

Abstract

The utility model discloses a small-size ultrathin high-frequency circuit board which comprises a high-frequency circuit board, wherein a protection mechanism is clamped between the left part and the right part of the outer surface of the high-frequency circuit board, two positioning blocks are fixedly connected to the front part and the rear part of the upper end of the high-frequency circuit board, heat dissipation mechanisms are clamped between the outer surfaces of the two positioning blocks on the left side and the outer surfaces of the two positioning blocks on the right side, fixing holes are formed in the middles of the front ends of the four positioning blocks, fixing pins are inserted and connected into the four fixing holes, the four fixing pins are arranged in a T-shaped structure, and straight holes are formed in four corners of the upper end of the high-frequency circuit board. According to the small-size ultrathin high-frequency circuit board, the protection effect is improved and the quality of the circuit board is ensured by arranging the protection mechanism and the fixing mechanism, the heat dissipation effect is enhanced and the service life of the circuit board is prolonged by arranging the heat dissipation mechanism.

Description

Small-size ultrathin high-frequency circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a small-size ultrathin high-frequency circuit board.

Background

At present, with the rapid development of the electronic industry, the integrated circuit technology and the microelectronic technology are also greatly developed, the change of electronic products is more and more gradual, and the electronic products continuously tend to be light, thin, short, small and high-frequency development, so that the requirements on a bearing circuit board are higher and higher, the traditional medium circuit board is gradually replaced by a high-speed and high-reliability high-frequency circuit board, and the traditional high-frequency circuit board has at least the following defects in the using process of the traditional high-frequency circuit board: 1. the existing high-frequency circuit board has poor protection effect, and the circuit boards are easily scratched when being stacked together, so that the circuit boards are easily affected with damp, and the quality of the circuit boards is influenced; 2. the existing high-frequency circuit board is poor in heat dissipation effect, the problem that the circuit is damaged due to excessive concentration of heat is easy to occur, the service life of the circuit board is influenced, and therefore a small-size ultrathin high-frequency circuit board is provided.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a small-size ultrathin high-frequency circuit board which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides an ultra-thin high frequency circuit board of small-size, includes the high frequency circuit board, common joint has protection machanism between the surface left part of high frequency circuit board and the surface right part, two locating pieces of the equal fixedly connected with in upper end front portion and the upper end rear portion of high frequency circuit board, two in the left side equal common joint has heat dissipation mechanism, four between the surface of locating piece and between the surface of two locating pieces on the right side the front end middle part of locating piece all opened the fixed orifices, four all alternate in the fixed orifices and be connected with the fixed pin, and four fixed pins all set up to T type structure, the straight hole has all been opened in the upper end four corners of high frequency circuit board.

Preferably, the protection machanism includes the fixed plate, the fixed plate is provided with two, two the draw-in groove has all been opened at the opposite face middle part of fixed plate, two the mounting groove has all been opened with the opposite face lower part on the opposite face upper portion of fixed plate, and the upside is two all install fixed establishment, two jointly between the mounting groove and between two mounting grooves of downside the upper end front portion and the upper end rear portion and the lower extreme front portion and the lower extreme rear portion of fixed plate all alternate the first magnetic path of fixedly connected with, two joint has high frequency circuit board jointly between the draw-in groove.

Preferably, the fixed establishment includes the guard plate, the equal fixedly connected with stopper in upper end four corners of guard plate, the left side two the spout has all been opened, four to the lower extreme right part of the lower extreme left part of stopper and two stoppers on the right side the last cell wall middle part of spout all alternates fixedly connected with second magnetic path, the surface left part and the surface right part of guard plate respectively with two corresponding mounting groove sliding connection.

Preferably, heat dissipation mechanism includes the heat-conducting plate, open at the right-hand member middle part of heat-conducting plate has a plurality of louvre, the upper end middle part fixedly connected with a plurality of fin of heat-conducting plate, the locating hole has all been opened at the upper end front portion and the upper end rear portion of heat-conducting plate, two the locating hole is respectively in two corresponding locating piece joints.

Preferably, the magnetic pole of the second magnetic block is opposite to the magnetic pole of the first magnetic block, the rear slot wall of the left slot is communicated with the rear end of the left fixing plate, and the front slot wall of the right slot is communicated with the front end of the right fixing plate.

Preferably, the positioning holes and the positioning blocks are both arranged to be polygonal structures, and the upper end faces of the radiating fins are lower than the lower end face of the protection plate on the upper side.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, by arranging the protection mechanism and the fixing mechanism, two protection plates can be respectively fixed above and below the high-frequency circuit board through the suction force between the first magnetic block and the second magnetic block, so that the protection effect on the high-frequency circuit board is improved, the problem that the circuit boards are scratched when stacked together is avoided, the ventilation of the circuit boards is also facilitated, the quality of the circuit boards is improved, and the quality of the circuit boards is ensured;

2. according to the utility model, the heat dissipation mechanism is arranged, heat generated during the working of the high-frequency circuit board can be rapidly led out through the heat conduction of the heat conduction plate, and then the heat dissipation effect on the circuit board is enhanced through the heat dissipation of the plurality of heat dissipation holes and the plurality of heat dissipation fins, so that the problem of circuit damage caused by excessive concentration of heat can be avoided, and the service life of the circuit board is prolonged.

Drawings

FIG. 1 is a schematic view of an overall structure of a small-sized ultra-thin high frequency circuit board according to the present invention;

FIG. 2 is a schematic view of the overall structure of a protection mechanism for a small-sized ultra-thin high-frequency circuit board according to the present invention;

FIG. 3 is a schematic view of the overall structure of a fixing mechanism for a small-sized ultra-thin high-frequency circuit board according to the present invention;

fig. 4 is a schematic view of the overall structure of the heat dissipation mechanism of the small-sized ultra-thin high-frequency circuit board according to the present invention.

In the figure: 1. a high-frequency circuit board; 2. a protection mechanism; 3. positioning blocks; 4. a fixing hole; 5. a fixing pin; 6. a heat dissipation mechanism; 7. a straight hole; 21. a fixing plate; 22. a card slot; 23. mounting grooves; 24. a fixing mechanism; 25. a first magnetic block; 241. a protection plate; 242. a limiting block; 243. a chute; 244. a second magnetic block; 61. a heat conducting plate; 62. heat dissipation holes; 63. a heat sink; 64. and (7) positioning the holes.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

Referring to fig. 1-4, the present invention provides a technical solution:

the utility model provides an ultra-thin high frequency circuit board of small-size, including high frequency circuit board 1, common joint has protection machanism 2 between the surface left part of high frequency circuit board 1 and the surface right part, two locating pieces 3 of the equal fixedly connected with in upper end front portion and the upper end rear portion of high frequency circuit board 1, equal common joint has heat dissipation mechanism 6 between the surface of two locating pieces 3 on the left side and between the surface of two locating pieces 3 on the right side, fixed orifices 4 have all been opened at the front end middle part of four locating pieces 3, all alternate in four fixed orifices 4 and be connected with fixed pin 5, and four fixed pins 5 all set up to T type structure, straight hole 7 has all been opened in high frequency circuit board 1's upper end four corners.

In this embodiment, the protection mechanism 2 includes two fixing plates 21, the two fixing plates 21 are provided, the middle parts of the opposite surfaces of the two fixing plates 21 are respectively provided with a clamping groove 22, the upper parts and the lower parts of the opposite surfaces of the two fixing plates 21 are respectively provided with a mounting groove 23, the two mounting grooves 23 on the upper side and the two mounting grooves 23 on the lower side are respectively and commonly provided with a fixing mechanism 24, the front parts of the upper ends and the rear parts of the upper ends and the front parts of the lower ends and the rear parts of the lower ends of the two fixing plates 21 are respectively and fixedly connected with a first magnetic block 25 in an inserting manner, and the high-frequency circuit board 1 is clamped between the two clamping grooves 22; the fixing mechanism 24 comprises a protection plate 241, limit blocks 242 are fixedly connected to four corners of the upper end of the protection plate 241, sliding grooves 243 are formed in the left parts of the lower ends of the two limit blocks 242 on the left side and the right parts of the lower ends of the two limit blocks 242 on the right side, second magnetic blocks 244 are fixedly connected to the middle parts of the upper groove walls of the four sliding grooves 243 in a penetrating manner, and the left part and the right part of the outer surface of the protection plate 241 are respectively in sliding connection with the two corresponding mounting grooves 23; the magnetic pole of the second magnetic block 244 is opposite to that of the first magnetic block 25, and the second magnetic block 244 and the first magnetic block 25 are attracted together by the principle that the magnetic pole is opposite, the rear groove wall of the left clamping groove 22 is communicated with the rear end of the left fixing plate 21, so that the high-frequency circuit board 1 can be clamped and fixed conveniently, and the front groove wall of the right clamping groove 22 is communicated with the front end of the right fixing plate 21; the protection plate 241 can protect the high-frequency circuit board 1, and the high-frequency circuit board 1 can be effectively protected from being damaged.

In this embodiment, the heat dissipation mechanism 6 includes a heat conduction plate 61, the middle of the right end of the heat conduction plate 61 is provided with a plurality of heat dissipation holes 62, the middle of the upper end of the heat conduction plate 61 is fixedly connected with a plurality of heat dissipation fins 63, the front part and the rear part of the upper end of the heat conduction plate 61 are provided with positioning holes 64, and the two positioning holes 64 are respectively clamped with the two corresponding positioning blocks 3; the positioning holes 64 and the positioning blocks 3 are both polygonal structures, so that the heat conducting plate 61 can be fixed more stably, the upper end surfaces of the plurality of radiating fins 63 are lower than the lower end surface of the protective plate 241 on the upper side, the radiating fins 63 are not in contact with the protective plate 241, and the protection of the protective plate 241 on the high-frequency circuit board 1 is not influenced; through the heat conduction of heat-conducting plate 61, can accelerate the radiating rate of high frequency circuit board 1, improve the radiating efficiency, and the thickness of heat-conducting plate 61 equals the distance between the lower pore wall of fixed orifices 4 to high frequency circuit board 1 to make heat-conducting plate 61 and high frequency circuit board 1 in close contact with, be favorable to heat-conducting plate 61 to the heat conduction of high frequency circuit board 1.

It should be noted that, in the use process, when the high-frequency circuit board 1 needs to be stacked and stored, the left part and the right part of the outer surface of the high-frequency circuit board 1 are respectively inserted into the two corresponding slots 22, then the protection plate 241 is inserted into the installation groove 23, so that the limit block 242 slides on the fixing plate 21, when the second magnetic block 244 contacts with the first magnetic block 25, the two protection plates 241 can be respectively fixed above and below the high-frequency circuit board 1 by the suction force generated between the first magnetic block 25 and the second magnetic block 244, thereby achieving the purpose of protecting the high-frequency circuit board 1, strengthening the protection effect of the high-frequency circuit board 1, avoiding the problem of scratching caused by stacking the high-frequency circuit board 1, being beneficial to ventilation and heat dissipation of the high-frequency circuit board 1, and avoiding the high-frequency circuit board 1 from being affected with damp, thereby the quality of high frequency circuit board 1 has been improved, the quality of high frequency circuit board 1 has been ensured, when needs dispel the heat to high frequency circuit board 1, fix a

position locating hole

64 and 3 joint of locating piece earlier, then fix a position in inserting fixed pin 5 fixed orifices 4, can install high frequency circuit board 1 with heat-conducting plate 61 on, then the heat conduction through heat-conducting plate 61, the heat that can be quick produces high frequency circuit board 1 during operation is derived, the heat dissipation of rethread a plurality of louvre 62 and a plurality of fin 63, the radiating effect to high frequency circuit board 1 has been strengthened, can avoid the problem that the heat excessively concentrates and lead to the circuit to damage, thereby the life of this high frequency circuit board 1 has been prolonged.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A small-sized ultra-thin high-frequency circuit board includes a high-frequency circuit board (1), characterized in that: common joint has protection machanism (2) between the surface left part of high frequency circuit board (1) and the surface right part, the upper end front portion and two locating pieces of the equal fixedly connected with in upper end rear portion (3) of high frequency circuit board (1), two on the left side equal common joint has heat dissipation mechanism (6), four between the surface of locating piece (3) and between the surface of two locating pieces on the right side (3) the front end middle part of locating piece (3) all opened fixed orifices (4), four all interlude in fixed orifices (4) and be connected with fixed pin (5), and four fixed pin (5) all set up to T type structure, straight hole (7) have all been opened in the upper end four corners of high frequency circuit board (1).

2. A small-sized ultra-thin high-frequency circuit board according to claim 1, characterized in that: protection machanism (2) are including fixed plate (21), fixed plate (21) are provided with two, two draw-in groove (22), two are all opened at the opposite face middle part of fixed plate (21) the opposite face upper portion and the opposite face lower part of fixed plate (21) have all opened mounting groove (23), and the upside is two between mounting groove (23) and between two mounting groove (23) of downside all install fixed establishment (24), two the upper end front portion and the upper end rear portion of fixed plate (21) all alternate first magnetic path (25) of fixedly connected with lower extreme front portion and lower extreme rear portion, two joint has high frequency circuit board (1) jointly between draw-in groove (22).

3. A small-sized ultra-thin high-frequency circuit board according to claim 2, characterized in that: fixed establishment (24) are including guard plate (241), the equal fixedly connected with stopper (242) in upper end four corners of guard plate (241), the left side two spout (243) have all been opened to the lower extreme left part of stopper (242) and the lower extreme right part of two stopper (242) on the right side, four fixedly connected with second magnetic path (244) all alternate in the last cell wall middle part of spout (243), the surface left part and the surface right part of guard plate (241) respectively with two corresponding mounting grooves (23) sliding connection.

4. A small-sized ultra-thin high-frequency circuit board according to claim 1, characterized in that: heat dissipation mechanism (6) include heat-conducting plate (61), open the right-hand member middle part of heat-conducting plate (61) has a plurality of louvre (62), a plurality of fin (63) of the upper end middle part fixedly connected with of heat-conducting plate (61), locating hole (64), two have all been opened to the upper end front portion and the upper end rear portion of heat-conducting plate (61) locating hole (64) are respectively in two corresponding locating piece (3) joints.

5. A small-sized ultra-thin high-frequency circuit board according to claim 3, characterized in that: the magnetic pole of the second magnetic block (244) is opposite to that of the first magnetic block (25), the rear groove wall of the left clamping groove (22) is communicated with the rear end of the left fixing plate (21), and the front groove wall of the right clamping groove (22) is communicated with the front end of the right fixing plate (21).

6. The small-sized ultra-thin high-frequency circuit board as claimed in claim 4, wherein: the positioning holes (64) and the positioning blocks (3) are both arranged to be polygonal structures, and the upper end faces of the radiating fins (63) are lower than the lower end face of the protective plate (241) on the upper side.