CN216213537U

CN216213537U - Board circuit structure for overcoming micro-space two-in-one RGB lead wire metal migration

Info

Publication number: CN216213537U
Application number: CN202122697700.9U
Authority: CN
Inventors: 羊鹏; 杜尚昆
Original assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Current assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Priority date: 2021-11-05
Filing date: 2021-11-05
Publication date: 2022-04-05
Anticipated expiration: 2031-11-05

Abstract

The utility model belongs to the technical field of LEDs (light emitting diode), and particularly relates to a plate circuit structure for overcoming metal migration of a micro-space two-in-one RGB (red, green and blue) lead wire, which comprises a substrate, wherein a three-color lamp group is arranged on the upper surface of the substrate, Ring rings and lead wires are also arranged on the upper surface of the substrate, an embedded hole is formed in each Ring, the Ring rings are positioned on the inner side of the upper surface of the substrate, the upper end, the lower end, the left end and the right end of each group of the substrate can be continuously connected with the same substrate line group, the lead wires are used for connecting a plurality of substrate line groups, the Ring rings in the two-in-one middle are changed into the embedded holes, cutting is not needed, the number of the lead wires at the edges is reduced, the lead wire distance is indirectly enlarged, the risk of the lead wires due to metal migration short circuit is reduced, and metal migration generated by lead short circuit does not occur through a plurality of experiments.

Description

Board circuit structure for overcoming micro-space two-in-one RGB lead wire metal migration

Technical Field

The utility model belongs to the technical field of LEDs, and particularly relates to a plate circuit structure for overcoming micro-space two-in-one RGB lead metal migration.

Background

With the gradual market acceptance of LED small-spacing display screens, all large LED packaging enterprises successively release all-in-one packages to meet the requirements of display screen factories. When having promoted screen factory SMT's efficiency in the appearance of unifying RGB more, increased the welding area between granule and the drive circuit board for whole screen is dismantling the handling, and the granule is more firm difficult for droing.

The two-in-one RGB is a typical one of the all-in-one RGB, the two-in-one product is logically the combination of two single RGB, four corner copper foils of the single RGB are obtained by cutting four Ring rings, the two-in-one product is not only provided with the copper foils at four corners, but also provided with the Ring rings at two long edges, and the layout of the two-in-one internal circuit is compact, so that the edge lead distance is short, and metal migration is easy to generate to cause short circuit; the two-in-one RGB cut edge line lead has short distance and is easy to generate metal migration.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems in the prior art, the utility model provides a plate circuit structure for overcoming the metal migration of a micro-space two-in-one RGB lead, which has the characteristics of no need of cutting, reduction of the number of leads at the edge, indirect extension of the lead distance and reduction of the risk of short circuit of the leads due to metal migration.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an overcome panel circuit structure of two unification RGB lead wire metal migration of fine pitch, includes the base plate, the base plate upper surface is provided with the tristimulus banks, the base plate upper surface still is provided with Ring Ring and lead wire, every buried via hole in the Ring is inside all seted up.

As a preferable technical scheme of the plate circuit structure for overcoming the micro-space two-in-one RGB lead metal migration, the Ring Ring is positioned on the inner side of the upper surface of the substrate.

As a preferable technical scheme of the plate line structure for overcoming the metal migration of the micro-space two-in-one RGB lead, the upper end and the lower end and the left end and the right end of the substrate line group can be continuously connected with the same substrate line group.

As a preferable technical scheme of the plate circuit structure for overcoming metal migration of the micro-space two-in-one RGB lead, the lead is used for connecting a plurality of substrate wire groups.

Compared with the prior art, the utility model has the beneficial effects that: ring Ring becomes the buried hole in the middle of two unifications, need not cut part A Ring in figure 1, reduces the quantity that the lead wire appears in the edge, draws big part B lead wire distance in current figure 1 relatively, reduces the lead wire because the risk of metal migration short circuit, does not appear the metal migration that the lead wire short circuit produced through many times of experiments.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a prior art forming scheme;

FIG. 2 is a schematic structural view of a front view of the present invention;

FIG. 3 is a schematic top view of the present invention;

in the figure: 1. a substrate; 2. a three-color lamp set; 3. a Ring; 4. and (7) leading wires.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-2, the present invention provides the following technical solutions: the utility model provides an overcome panel circuit structure of two unification RGB lead wire metal migration of microspur, including

base plate

1, 1 upper surface of base plate is provided with three-

colour banks

2, 1 upper surface of base plate still is provided with Ring 3 and

lead wire

4, 3 inside buried holes in all seting up of every Ring, Ring becomes buried holes in the middle of the two unifications in this embodiment, need not cut, reduce the quantity that the lead wire appears in the edge, draw the lead wire distance greatly indirectly, reduce the lead wire because the risk of metal migration short circuit, the metal migration that the lead wire short circuit produced does not appear through experiments many times.

Specifically, the Ring 3 is positioned inside the upper surface of the substrate 1.

Specifically, the same substrate 1 line group may be continuously connected to both the upper and lower sides and the left and right sides of the substrate 1 line group.

Specifically, the lead wires 4 are used for connection of a plurality of substrate 1 wire groups.

The working principle and the using process of the utility model are as follows: and cutting the Ring Ring copper foils on the four corners during production, and setting the middle four Ring rings as inner counter bores.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a overcome two unification RGB lead wire metal migration's of fine pitch panel line structure which characterized in that: including base plate (1), base plate (1) upper surface is provided with three-colour banks (2), base plate (1) upper surface still is provided with Ring Ring (3) and lead wire (4), every buried via hole in Ring (3) inside all seting up.

2. The board circuit structure for overcoming fine pitch two-in-one RGB lead metal migration as claimed in claim 1, wherein: the Ring Ring (3) is positioned on the inner side of the upper surface of the substrate (1).

3. The board circuit structure for overcoming fine pitch two-in-one RGB lead metal migration as claimed in claim 1, wherein: the upper end, the lower end, the left end and the right end of the substrate (1) line group can be continuously connected with the same substrate (1) line group.

4. The board circuit structure for overcoming fine pitch two-in-one RGB lead metal migration as claimed in claim 1, wherein: the leads (4) are used for connecting a plurality of substrate (1) line groups.