CN216213325U

CN216213325U - LED chip support transfer device for LED die bonder

Info

Publication number: CN216213325U
Application number: CN202122555557.XU
Authority: CN
Inventors: 董路兵
Original assignee: Shenzhen Fengxiang Photoelectronics Co ltd
Current assignee: Shenzhen Fengxiang Photoelectronics Co ltd
Priority date: 2021-10-23
Filing date: 2021-10-23
Publication date: 2022-04-05
Anticipated expiration: 2031-10-23

Abstract

The utility model discloses an LED chip support transfer device for an LED die bonder, which comprises a bottom frame, wherein first through holes are formed in two ends of the bottom frame, the inner walls of the first through holes are connected with driven shafts through bearings, one ends of the driven shafts are connected with a rotary table through bolts, a driving mechanism is arranged between the other ends of the driven shafts, pin rods are welded at one ends of the outer walls of the opposite sides of the rotary table, pushing rods are sleeved on the outer walls of the pin rods, the top ends of the pushing rods are connected with the same feeding plate through bolts, an object placing groove is formed in the top of the feeding plate, and an inlet groove and an outlet groove are formed in one end of the object placing groove. The feeding plate and the LED chips are pushed to enter the die bonder to effectively form a support transfer device of the LED chips, the bearing plate is driven to gradually enter the in-out groove through the threaded action of the threaded rod and the movable sleeve, the object placing groove is conducted at the moment, and the LED chips fall into a jig of the die bonder to form an effective feeding structure.

Description

LED chip support transfer device for LED die bonder

Technical Field

The utility model relates to the technical field of LED die bonder, in particular to an LED chip support transfer device for an LED die bonder.

Background

The LED die bonder is a special die bonder for LED products, is controlled by a computer and is provided with a CCD image sensing system, a CCD system scans the LED die bonder to determine a correct path, a set programming program is input, and a button is pressed easily, so that the whole working process can be realized: firstly, fixing the product to be fixed on the jig, dispensing red glue, sucking the LED through the suction nozzle, and then fixing the LED on the product. It should be noted that the product after solidification is preferably solidified within 1 to 2 hours.

At present, when an LED die bonder works, an LED chip needs to be transferred to a working position on a clamp by a feeding mechanism, a dispensing mechanism firstly dispenses a position of a PCB (printed circuit board) needing to be bonded with a wafer, and then a bonding arm moves to a wafer sucking position from an original position. In this process, the transfer device is one of the essential devices, and therefore, it is necessary to design the transfer device for the LED chip holder of the LED die bonder to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art, and provides an LED chip support transfer device for an LED die bonder.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a LED chip support transfer device for solid brilliant machine of LED, including the underframe, first through-hole has all been opened at the both ends of underframe, and the inner wall of first through-hole all is connected with the driven shaft through the bearing, and the one end of driven shaft all has the carousel through bolted connection, is provided with actuating mechanism between the other end of driven shaft, the pin rod has all been welded to the one end of the relative one side outer wall of carousel, and the outer wall of pin rod has all cup jointed the pushing ram, and there is same delivery sheet on the top of pushing ram through bolted connection, open at the top of delivery sheet and put the thing groove, and the one end of putting the thing groove is opened and is had business turn over the groove, and the inside in business turn over groove and the inside of putting the thing groove are pegged graft and are had the loading board, and the top one end of loading board is provided with advancing mechanism.

Preferably, advancing mechanism is including seting up the guide way in business turn over groove top intermediate position, and the welding of the top one end of loading board has the movable sleeve that passes the guide way, and open top one side of delivery sheet has the mounting groove, and the inner wall of mounting groove has positive reverse motor through bolted connection, and the output shaft of positive reverse motor has the threaded rod through bolted connection, the outer wall of threaded rod and the inner wall threaded connection of movable sleeve.

Preferably, actuating mechanism is including the welding at the L type frame of underframe bottom one end intermediate position, and there is the rotation motor top one side of L type frame through bolted connection, the riser has all been welded in the bottom both sides of underframe, and one side bottom of riser has all opened the second through-hole, and the inner wall of second through-hole is connected with same driving shaft through the bearing, is provided with the tooth subassembly between the outer wall of driving shaft and the output shaft that rotates the motor, the outer wall both ends of driven shaft and the outer wall both ends of driving shaft all have the drive wheel through bolted connection, and are located two drive wheel outer wall transmissions on the same perpendicular line and are connected with the drive belt.

Preferably, the gear-driven assembly comprises a first gear connected to the outer wall of the output shaft of the rotating motor through a bolt and a second gear connected to the outer wall of the driving shaft through a bolt, and the top of the second gear is meshed with the bottom of the first gear.

Preferably, both sides of the top of the bottom frame are provided with guide grooves, one ends of the inner walls of the guide grooves are connected with sliding blocks in a sliding mode, and Z-shaped frames are welded between the tops of the sliding blocks and one end of the bottom of the feeding plate.

Preferably, the top of the bearing plate is provided with transverse grooves distributed at equal intervals, movable rollers are connected between the inner walls of the two ends of each transverse groove through pin shafts, and the movable rollers are made of rubber.

The utility model has the beneficial effects that:

1. through setting up the actuating mechanism on the underframe, at first place the LED chip on the loading board in the delivery sheet, utilize the rotation motor in the actuating mechanism to drive tooth and move subassembly and driving shaft and rotate, drive driven shaft and two carousels through the drive belt and rotate, make and form crank structure between carousel and the pushing ram, promote delivery sheet and LED chip and enter into solid brilliant built-in, and at this in-process, can make Z type frame slide on the guide way, stability when keeping the delivery sheet and removing can, the effectual support transfer device who forms the LED chip.

2. Through the advancing mechanism who sets up on the delivery sheet, when the LED chip got into solid brilliant built-in, usable advancing mechanism's positive reverse motor drove the threaded rod and rotates, drove the inside that the loading board entered into the business turn over groove gradually through the screw action of threaded rod and movable sleeve, put the thing groove and will switch on this moment to fall into LED chip into the tool of solid brilliant machine, form effectual pay-off structure, convenient operation.

Drawings

Fig. 1 is a schematic view of an overall structure of an LED chip holder transfer device for an LED die bonder in embodiment 1;

fig. 2 is a schematic structural view of an object placing pulling plate and a guide groove of the LED chip support transfer device for the LED die bonder in embodiment 1;

fig. 3 is a schematic structural view of a turntable and a pushing rod of the LED chip holder transfer device for the LED die bonder in embodiment 1;

fig. 4 is a schematic structural view of a rotating motor and a first gear of the LED chip holder transfer device for the LED die bonder in embodiment 1;

fig. 5 is a schematic structural view of a transverse groove and a movable roller of the LED chip holder transfer device for the LED die bonder in embodiment 2.

In the figure: 1. a feeding plate; 2. a threaded rod; 3. a positive and negative rotation motor; 4. a Z-shaped frame; 5. a bottom frame; 6. a transmission belt; 7. a drive shaft; 8. a second gear; 9. a turntable; 10. a guide groove; 11. a storage groove; 12. a carrier plate; 13. a slot is arranged in and out; 14. a guide groove; 15. a push rod; 16. an L-shaped frame; 17. rotating the motor; 18. a first gear; 19. a driven shaft; 20. a transverse groove; 21. a movable roller.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1

Referring to fig. 1-4, a LED chip support transfer device for solid brilliant machine of LED, including underframe 5, first through-hole has all been opened at the both ends of underframe 5, and the inner wall of first through-hole all is connected with driven shaft 19 through the bearing, the one end of driven shaft 19 all has carousel 9 through bolted connection, be provided with actuating mechanism between the other end of driven shaft 19, the pin rod has all been welded to the one end of the relative one side outer wall of carousel 9, and the outer wall of pin rod has all cup jointed propeller strut 15, the top of propeller strut 15 has same delivery sheet 1 through bolted connection, open at the top of delivery sheet 1 has and to put thing groove 11, and the one end of putting thing groove 11 is opened and is gone into groove 13, it has loading board 12 to peg graft in the inside of groove 13 and the inside of putting thing groove 11, the top one end of loading board 12 is provided with advancing mechanism.

Wherein, advancing mechanism is including offering the guide way 14 at business turn over groove 13 top intermediate position, and the welding of the top one end of loading board 12 has the movable sleeve that passes guide way 14, and open top one side of delivery sheet 1 has the mounting groove, and the inner wall of mounting groove has just reversing motor 3 through bolted connection, and just reversing motor 3's output shaft has threaded rod 2 through bolted connection, the outer wall of threaded rod 2 and the inner wall threaded connection of movable sleeve.

Wherein, actuating mechanism is including welding the L type frame 16 at 5 bottom one end intermediate positions in underframe, and there is rotation motor 17 top one side of L type frame 16 through bolted connection, the riser has all been welded in the bottom both sides of underframe 5, and one side bottom of riser all opened the second through-hole, the inner wall of second through-hole is connected with same driving shaft 7 through the bearing, be provided with the tooth subassembly between the outer wall of driving shaft 7 and the output shaft that rotates motor 17, there is the drive wheel all through bolted connection at the outer wall both ends of driven shaft 19 and the outer wall both ends of driving shaft 7, and be located two drive wheel outer wall transmissions on the same perpendicular line and be connected with drive belt 6.

Wherein, the tooth moves the subassembly and includes first gear 18 of bolted connection in the outer wall of the output shaft of rotating motor 17 and second gear 8 of bolted connection in the outer wall of driving shaft 7, and the top of second gear 8 meshes with the bottom of first gear 18.

Wherein, the both sides of the top of underframe 5 all have guide slot 10, and the equal sliding connection of inner wall one end of guide slot 10 has the slider, and the welding has Z type frame 4 between the top of slider and the bottom one end of delivery sheet 1.

The working principle is as follows: when the LED chip fixing machine is used, a user firstly places an LED chip on a bearing plate 12 in a feeding plate 1, a rotating motor 17 in a driving mechanism is used for driving a tooth moving component and a driving shaft 7 to rotate, a driven shaft 19 and two turntables 9 are driven to rotate through a driving belt 6, a crank structure is formed between each turntable 9 and a pushing rod 15, the feeding plate 1 and the LED chip are pushed to enter the crystal fixing machine, in the process, a Z-shaped frame 4 can slide on a guide groove 10, the stability of the feeding plate 1 during movement is kept, a support transfer device of the LED chip is effectively formed, when the LED chip enters the crystal fixing machine, a positive and negative rotating motor 3 of the pushing mechanism can be used for driving a threaded rod 2 to rotate, the bearing plate 12 is driven to gradually enter the inside of an inlet and outlet groove 13 through the threaded action of the threaded rod 2 and a movable sleeve, at the moment, a material containing groove 11 is conducted, and the LED chip falls into a jig of the crystal fixing machine, an effective feeding structure is formed, and the operation is convenient.

Example 2

Referring to fig. 5, in the present embodiment, compared to embodiment 1, the top of the bearing plate 12 is provided with the transverse grooves 20 distributed equidistantly, the inner walls of the two ends of the transverse groove 20 are connected to the movable rollers 21 through the pin shafts, and the movable rollers 21 are made of rubber.

The working principle is as follows: when the loading plate 12 enters the access slot 13, the friction between the bottom of the LED chip and the loading plate 12 can be reduced by the movable roller 21, so that the loading plate 12 can better enter the access slot 13, and the loading plate 12 is prevented from causing large friction damage to the LED chip.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. An LED chip bracket transfer device for an LED die bonder comprises a bottom frame (5), it is characterized in that both ends of the bottom frame (5) are provided with first through holes, the inner walls of the first through holes are connected with driven shafts (19) through bearings, one end of each driven shaft (19) is connected with a turntable (9) through a bolt, a driving mechanism is arranged between the other ends of the driven shafts (19), one end of the outer wall of one side, opposite to the turntable (9), is welded with a pin rod, and the outer wall of the pin rod is sleeved with a push rod (15), the top end of the push rod (15) is connected with the same feeding plate (1) through a bolt, the top of the feeding plate (1) is provided with a storage groove (11), and one end of the object placing groove (11) is provided with an inlet and outlet groove (13), the interior of the inlet and outlet groove (13) and the interior of the object placing groove (11) are inserted with a bearing plate (12), and one end of the top of the bearing plate (12) is provided with a propelling mechanism.

2. The LED chip support transfer device for the LED die bonder according to claim 1, wherein the pushing mechanism comprises a guide groove (14) formed in the middle of the top of the inlet and outlet groove (13), a movable sleeve penetrating through the guide groove (14) is welded at one end of the top of the bearing plate (12), an installation groove is formed in one side of the top of the feeding plate (1), a forward and reverse motor (3) is connected to the inner wall of the installation groove through a bolt, a threaded rod (2) is connected to an output shaft of the forward and reverse motor (3) through a bolt, and the outer wall of the threaded rod (2) is in threaded connection with the inner wall of the movable sleeve.

3. The LED chip support transfer device for the LED die bonder of claim 2, wherein the driving mechanism comprises an L-shaped frame (16) welded at the middle position of one end of the bottom frame (5), a rotating motor (17) is connected to one side of the top of the L-shaped frame (16) through a bolt, vertical plates are welded to two sides of the bottom frame (5), a second through hole is formed in the bottom of one side of each vertical plate, the inner wall of each second through hole is connected with the same driving shaft (7) through a bearing, a gear assembly is arranged between the outer wall of the driving shaft (7) and the output shaft of the rotating motor (17), driving wheels are connected to two ends of the outer wall of the driven shaft (19) and two ends of the outer wall of the driving shaft (7) through bolts, and driving belts (6) are connected to the outer walls of the two driving wheels on the same vertical line in a transmission manner.

4. The LED chip support transfer device for the LED die bonder according to claim 3, wherein the gear moving assembly comprises a first gear (18) connected to the outer wall of the output shaft of the rotating motor (17) through a bolt and a second gear (8) connected to the outer wall of the driving shaft (7) through a bolt, and the top of the second gear (8) is meshed with the bottom of the first gear (18).

5. The LED chip support transfer device for the LED die bonder according to claim 4, wherein the two sides of the top of the bottom frame (5) are provided with guide grooves (10), one end of the inner wall of each guide groove (10) is slidably connected with a sliding block, and a Z-shaped frame (4) is welded between the top of each sliding block and one end of the bottom of the feeding plate (1).

6. The LED chip support transfer device for the LED die bonder according to any one of claims 1 to 5, wherein the top of the bearing plate (12) is provided with transverse grooves (20) distributed at equal intervals, the inner walls of two ends of each transverse groove (20) are connected with movable rollers (21) through pin shafts, and the movable rollers (21) are made of rubber.